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Integrated Photonics Advances in Optical
Transmission: An Industry View
Júlio César R.F. de Oliveira, Ph.D
18 de Maio de 2016
2
Confidential and Proprietary Information2
3
Confidential and Proprietary Information
BrPhotonics Location and Facilities
CPqD Campus, Campinas, Brazil  Production
Facility
• for Thin Film Polymer on
Silicon (TFPS) Modulators
and Packaging
 Cleanrooms
• Class 100
• Class 10000
 Labs
• Optical Transmission
• Packaging
• Qualification
4
Confidential and Proprietary Information4
Long Haul/Metro Transceiver Market Dynamics
SFF, Integration, Low Power Consumption, Low Cost
100Gbps
1Tbps 400Gbps
200Gbps
100Gb/s200Gb/s400Gb/s1Tb/s
LineRateEvolution
Form Factor Reduction
MSA CFP CFP2 CFP4 QSFP
5
Confidential and Proprietary Information5
6
Confidential and Proprietary Information6
Microfabrication – Thin Film Polymer on Silicon
TFPS process for high-speed optical modulators
7
Confidential and Proprietary Information7
Manufacturing of TFPS Modulators Chips
Top clad
Electro-optic polymer
End of waveguide
Waveguide trench
Bottom clad
Ground plane
Silicon substrate
Top electrode
Ground pads
• BrPhotonics has a 200m2, class 10 cleanroom in
Seattle (In transfer to Campinas)
• Team of chemists, process, RF, and optical
engineers
• Specialized in the manufacture of EO polymer
modulators
• Capacity of 200 wafers/year
8
Confidential and Proprietary Information8
Photonic Packaging
9
Confidential and Proprietary Information9
Photonic Packaging – TOSA Process
10
Confidential and Proprietary Information10
TOSA Evaluation Kit
Evaluation Board (EVB)
TOSA Carrier PCB
TOSA on carrier
TOSA EVK assembled
11
Confidential and Proprietary Information11
Real-time 100/200 G CFP2-ACO TOSA validation
ClariPhy CL20010
Coherent ASIC
BrPhotonics 100G
CFP2-ACO TOSA
12
Confidential and Proprietary Information12
100G/200G real-time OSNR validation
 Required OSNR @ SD-FEC (2.4e-2)
– BrPhotonics ACO-TOSA: 11.6 dB
 Penalty with respect to theory: 1.6 dB.
– LiNbO3 reference transmitter: 11.6 dB
 BrP ACO-TOSA compliant with LiNbO3
reference.
10 15 20 25 30
-8
-7
-6
-5
-4
-3
-2
OSNR [dB/0.1 nm]
log10(BER)
3.8e-3 BER
2.0e-2 BER
2.4e-2 BER
100G Theory
LiNbO3
TOSA #19 (1)
TOSA #19 (2)
TOSA #20 (3)
16 18 20 22 24 26 28 30 32
-4
-3.5
-3
-2.5
-2
-1.5
OSNR [dB/0.1 nm]
log10(BER)
2.0e-2 BER
2.4e-2 BER
200G Theory
LiNbO3 (Literature)
TOSA #20 (Real-Time)
TOSA #19 (Real-Time)
 Required OSNR @ SD-FEC (2.0e-2):
– BrPhotonics ACO-TOSA: 19.0 dB
 Penalty with respect to theory 2.2 dB.
– LiNbO3 reference transmitter: 19.0 dB
(literature)
 BrP ACO-TOSA compliant with LiNbO3
reference.
13
Confidential and Proprietary Information13
14
Confidential and Proprietary Information14
15
Confidential and Proprietary Information15
16
Confidential and Proprietary Information16
ASIC 100G (10x10) OTN 40 nm
 OTN ASIC
– Single chip solution Mapper/Framer/Criptography/FEC for 100G
40nm TSMC Test Chip
17
Confidential and Proprietary Information17
ASIC DSP 400G 16nm
 DSP ASIC
– Single chip 400G 64 to 16 QAM/QPSK up to 45GBd
16nm FF+ TSMC Test Chip
Line
Modem
(DSP)
OTU4
Framer
Client
Mapper
Line 2
Host
Line
AFE
Register File
Embedded
µP
Real-Time
Capture RAM
SPI
HI
HQ
VI
VQ
MDIO
20 x 25G
10 x 50G
HostSerdes
CrossbarSwitchandGearbox
OTUx
Line
Modem
(DSP)
OTUx
HI
HQ
VI
VQ
Line 1
Line
AFE
25G Serial
FEC
FEC
OTU4
Framer
Client
Mapper
OTU4
Framer
Client
Mapper
OTU4
Framer
Client
Mapper
OTU4
Framer
Client
Mapper
ADC_I
ADC_Q
DAC_I
DAC_Q
AFE
INTERFACE DSP
DAC_I 128X8
DAC_Q 128X8
ADC_I 128X8
ADC_Q 128x8
DSP_I_IN 128X8
DSP_Q_IN 128X8
DSP_OUT 64X4
AHB MASTER
SPIIF
ADC_I CNTRL/STATUS
ADC_Q CNTRL/STATUS
ADC_I_CLK
ADC_Q_CLK
DAC_I CNTRL/STATUS
DAC_Q CNTRL/STATUS
DAC_I_CLK
DAC_Q_CLK
AFE_AHBL_IF
/32
/32
DSP_RX_CLK
DSP_TX_CLK
TST_BUSI_OUT_128X8
AFE_RST_N
DSP_RST_N
PMONPMON IF
AFE
ADC_HI_P
ADC_HI_N
ADC_QI_P
ADC_QI_N
DAC_HI_P
DAC_HI_N
DAC_HQ_P
DAC_HQ_N TST_BUSQ_OUT_128X8
Osc
(Need to
Spec)
CSR_INTERFACE
SCLK
OSC_P
OSC_N
700MHz
RX
PLL
TX
PLL
16GHz
16GHz
700MHz
DIV32_BYPASS
DIV32_BYPASS
PLL_BYPASS
PLL_BYPASS
Full ASIC Arch.
DSP Test Chip IPs
- TR
- PE
- Demapper
- MUX
18
Confidential and Proprietary Information18
External Cavity Tunable Laser
19
Confidential and Proprietary Information19
100G/200G Polymer DP-IQ Modulator
20
Confidential and Proprietary Information20
Silicon Photonics – Tapeout timeline
March
2013
October
2013
March
2014
October
2014
DP-QPSK
Modulator v1
OpSIS/IME
5x5 mm²
DP-QPSK
Receiver v1
OpSIS/IME
2.5x5 mm²
DP-QPSK
Modulator v2
OpSIS/IME
5x5 mm²
Si/TFPS Modulator
External Cavity Laser
IME
3x16 mm²
DP-QPSK
Receiver test
blocks
IME
3x16 mm²
Feb
2016
DP-QPSK
Receiver v2
IMEC
5x1.15 mm²
DP-QPSK
Modulator v2
IMEC
3.6x2. mm²
Characterizationn
21
Confidential and Proprietary Information21
Silicon Photonics – Coherent Receiver
22
Confidential and Proprietary Information22
Silicon Photonics – DP-IQ Modulator
23
Confidential and Proprietary Information23
24
Confidential and Proprietary Information24
Highlights
 BrPhotonics is currently shipping high bandwidth
modulators, mainly exporting (US Army, Duisburg
Univ/Corning, Tyndall, Mackenzie Univ., OeSolutions,
Menara Networks)
 BrPhotonics is currently exporting deep submicron
(16nm) ASIC IPs and services (partnership with CPqD)
 BrPhotonics is involved with LNLS in development of
state of art Sirius large area detectors (PiMega)
 BrPhotonics just finish second round of investment (last
week), and now, CPqD, GigPeak and FINEP are
shareholders
25
Confidential and Proprietary Information25
BrPhotonics Investment Cicle
 Joint Venture CPqD/GigOptix - Fev’14
 Business plan Submission Third Investor – Aug’14
 Valuation Fev’15
 Negotiation Mar’15
 MoU Signature May’15
 Due Diligence (PwC/CEPEDA) July’15
 Intangible Valuation Aug’15
 Shareholders and Investment Agreements Nov’15 (Legal Issues)
 Investiment Initial plan 15/Set....Closed May’16
26
Confidential and Proprietary Information26
Entrepreneurship
Biz Enviroment
VC’s
27
Confidential and Proprietary Information27
Entrepreneurship
Nós somos aquilo que fazemos repetidamente.
Excelência, então, não é um ato, mas um hábito.
(Aristóteles)
28
Confidential and Proprietary Information28
Conclusions
 BrPhotonics is promoting the convergence between
photonics and microelectrônics in agreement with its
original plans.
 We have demonstrated our current efforts on the
development of key technologies to accomplish
such challenging roadmap.
 BrPhotonics is focused on the domain of such
technologies to successfully reach the global market
based on the following view:
– Reduce the cost per bit and power consumption
– Increase the transceiver ports density with
miniaturization
Thank you!
www.brphotonics.com

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Integrated Photonics Advances in Optical Transmission: An Industry View

  • 1. Integrated Photonics Advances in Optical Transmission: An Industry View Júlio César R.F. de Oliveira, Ph.D 18 de Maio de 2016
  • 3. 3 Confidential and Proprietary Information BrPhotonics Location and Facilities CPqD Campus, Campinas, Brazil  Production Facility • for Thin Film Polymer on Silicon (TFPS) Modulators and Packaging  Cleanrooms • Class 100 • Class 10000  Labs • Optical Transmission • Packaging • Qualification
  • 4. 4 Confidential and Proprietary Information4 Long Haul/Metro Transceiver Market Dynamics SFF, Integration, Low Power Consumption, Low Cost 100Gbps 1Tbps 400Gbps 200Gbps 100Gb/s200Gb/s400Gb/s1Tb/s LineRateEvolution Form Factor Reduction MSA CFP CFP2 CFP4 QSFP
  • 6. 6 Confidential and Proprietary Information6 Microfabrication – Thin Film Polymer on Silicon TFPS process for high-speed optical modulators
  • 7. 7 Confidential and Proprietary Information7 Manufacturing of TFPS Modulators Chips Top clad Electro-optic polymer End of waveguide Waveguide trench Bottom clad Ground plane Silicon substrate Top electrode Ground pads • BrPhotonics has a 200m2, class 10 cleanroom in Seattle (In transfer to Campinas) • Team of chemists, process, RF, and optical engineers • Specialized in the manufacture of EO polymer modulators • Capacity of 200 wafers/year
  • 8. 8 Confidential and Proprietary Information8 Photonic Packaging
  • 9. 9 Confidential and Proprietary Information9 Photonic Packaging – TOSA Process
  • 10. 10 Confidential and Proprietary Information10 TOSA Evaluation Kit Evaluation Board (EVB) TOSA Carrier PCB TOSA on carrier TOSA EVK assembled
  • 11. 11 Confidential and Proprietary Information11 Real-time 100/200 G CFP2-ACO TOSA validation ClariPhy CL20010 Coherent ASIC BrPhotonics 100G CFP2-ACO TOSA
  • 12. 12 Confidential and Proprietary Information12 100G/200G real-time OSNR validation  Required OSNR @ SD-FEC (2.4e-2) – BrPhotonics ACO-TOSA: 11.6 dB  Penalty with respect to theory: 1.6 dB. – LiNbO3 reference transmitter: 11.6 dB  BrP ACO-TOSA compliant with LiNbO3 reference. 10 15 20 25 30 -8 -7 -6 -5 -4 -3 -2 OSNR [dB/0.1 nm] log10(BER) 3.8e-3 BER 2.0e-2 BER 2.4e-2 BER 100G Theory LiNbO3 TOSA #19 (1) TOSA #19 (2) TOSA #20 (3) 16 18 20 22 24 26 28 30 32 -4 -3.5 -3 -2.5 -2 -1.5 OSNR [dB/0.1 nm] log10(BER) 2.0e-2 BER 2.4e-2 BER 200G Theory LiNbO3 (Literature) TOSA #20 (Real-Time) TOSA #19 (Real-Time)  Required OSNR @ SD-FEC (2.0e-2): – BrPhotonics ACO-TOSA: 19.0 dB  Penalty with respect to theory 2.2 dB. – LiNbO3 reference transmitter: 19.0 dB (literature)  BrP ACO-TOSA compliant with LiNbO3 reference.
  • 16. 16 Confidential and Proprietary Information16 ASIC 100G (10x10) OTN 40 nm  OTN ASIC – Single chip solution Mapper/Framer/Criptography/FEC for 100G 40nm TSMC Test Chip
  • 17. 17 Confidential and Proprietary Information17 ASIC DSP 400G 16nm  DSP ASIC – Single chip 400G 64 to 16 QAM/QPSK up to 45GBd 16nm FF+ TSMC Test Chip Line Modem (DSP) OTU4 Framer Client Mapper Line 2 Host Line AFE Register File Embedded µP Real-Time Capture RAM SPI HI HQ VI VQ MDIO 20 x 25G 10 x 50G HostSerdes CrossbarSwitchandGearbox OTUx Line Modem (DSP) OTUx HI HQ VI VQ Line 1 Line AFE 25G Serial FEC FEC OTU4 Framer Client Mapper OTU4 Framer Client Mapper OTU4 Framer Client Mapper OTU4 Framer Client Mapper ADC_I ADC_Q DAC_I DAC_Q AFE INTERFACE DSP DAC_I 128X8 DAC_Q 128X8 ADC_I 128X8 ADC_Q 128x8 DSP_I_IN 128X8 DSP_Q_IN 128X8 DSP_OUT 64X4 AHB MASTER SPIIF ADC_I CNTRL/STATUS ADC_Q CNTRL/STATUS ADC_I_CLK ADC_Q_CLK DAC_I CNTRL/STATUS DAC_Q CNTRL/STATUS DAC_I_CLK DAC_Q_CLK AFE_AHBL_IF /32 /32 DSP_RX_CLK DSP_TX_CLK TST_BUSI_OUT_128X8 AFE_RST_N DSP_RST_N PMONPMON IF AFE ADC_HI_P ADC_HI_N ADC_QI_P ADC_QI_N DAC_HI_P DAC_HI_N DAC_HQ_P DAC_HQ_N TST_BUSQ_OUT_128X8 Osc (Need to Spec) CSR_INTERFACE SCLK OSC_P OSC_N 700MHz RX PLL TX PLL 16GHz 16GHz 700MHz DIV32_BYPASS DIV32_BYPASS PLL_BYPASS PLL_BYPASS Full ASIC Arch. DSP Test Chip IPs - TR - PE - Demapper - MUX
  • 18. 18 Confidential and Proprietary Information18 External Cavity Tunable Laser
  • 19. 19 Confidential and Proprietary Information19 100G/200G Polymer DP-IQ Modulator
  • 20. 20 Confidential and Proprietary Information20 Silicon Photonics – Tapeout timeline March 2013 October 2013 March 2014 October 2014 DP-QPSK Modulator v1 OpSIS/IME 5x5 mm² DP-QPSK Receiver v1 OpSIS/IME 2.5x5 mm² DP-QPSK Modulator v2 OpSIS/IME 5x5 mm² Si/TFPS Modulator External Cavity Laser IME 3x16 mm² DP-QPSK Receiver test blocks IME 3x16 mm² Feb 2016 DP-QPSK Receiver v2 IMEC 5x1.15 mm² DP-QPSK Modulator v2 IMEC 3.6x2. mm² Characterizationn
  • 21. 21 Confidential and Proprietary Information21 Silicon Photonics – Coherent Receiver
  • 22. 22 Confidential and Proprietary Information22 Silicon Photonics – DP-IQ Modulator
  • 24. 24 Confidential and Proprietary Information24 Highlights  BrPhotonics is currently shipping high bandwidth modulators, mainly exporting (US Army, Duisburg Univ/Corning, Tyndall, Mackenzie Univ., OeSolutions, Menara Networks)  BrPhotonics is currently exporting deep submicron (16nm) ASIC IPs and services (partnership with CPqD)  BrPhotonics is involved with LNLS in development of state of art Sirius large area detectors (PiMega)  BrPhotonics just finish second round of investment (last week), and now, CPqD, GigPeak and FINEP are shareholders
  • 25. 25 Confidential and Proprietary Information25 BrPhotonics Investment Cicle  Joint Venture CPqD/GigOptix - Fev’14  Business plan Submission Third Investor – Aug’14  Valuation Fev’15  Negotiation Mar’15  MoU Signature May’15  Due Diligence (PwC/CEPEDA) July’15  Intangible Valuation Aug’15  Shareholders and Investment Agreements Nov’15 (Legal Issues)  Investiment Initial plan 15/Set....Closed May’16
  • 26. 26 Confidential and Proprietary Information26 Entrepreneurship Biz Enviroment VC’s
  • 27. 27 Confidential and Proprietary Information27 Entrepreneurship Nós somos aquilo que fazemos repetidamente. Excelência, então, não é um ato, mas um hábito. (Aristóteles)
  • 28. 28 Confidential and Proprietary Information28 Conclusions  BrPhotonics is promoting the convergence between photonics and microelectrônics in agreement with its original plans.  We have demonstrated our current efforts on the development of key technologies to accomplish such challenging roadmap.  BrPhotonics is focused on the domain of such technologies to successfully reach the global market based on the following view: – Reduce the cost per bit and power consumption – Increase the transceiver ports density with miniaturization