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1
ST
Global presence
Front-End
Back-End
Research & Development
Main Sales & Marketing
3
Longevity
https://www.st.com/content/st_com/en/about/quality-and-reliability/product-longevity.html
4
Where to buy ST ?
5
Agenda
1 Energy trends
2 Gan Technology
3 Topologies improvement
4 ST-ONE
5 MasterGAN family
6 Evalboards
7 Takeaways
8 Q&A
6
Energy trends
Growth in USB charging market
Strong market growth in USB-PD market
Source: Transparency Market Research
AC-DC adapters, USB-PD
0
10
20
30
40
50
60
70
80
90
2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031
Market
Size
($billion)
Year
USB Charger Market
9.6%
CAGR
Considerable market growth with wide
adoption of USB Type-C
Medical power delivery
8
GaN technology
Silicon & wide-bandgap
power devices positioning
10 W
100 W
1 kW
10 kW
100 kW
1 MW
1 W
1 Hz 10 Hz 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz
Higher power is achieved through modular
deployment or paralleling devices
Operating frequency
System
power
level
IGBT
Si MOSFET
SiC MOSFET
GaN Transistor
10
• Bandgap is the energy the electrons need to jump
from the top of the valence band to the bottom of the
conductive band
• Materials with Wide BandGap (WBG)
• can withstand higher electrical fields
→ higher voltage can be applied
• electrons have a higher mobility and saturation velocity
→ transistors switch faster
→ devices can be smaller for a given on resistance and breakdown
voltage
Wide BandGap Materials (WBG)
Si GaN 11
GaN has dramatically lower gate charge
Gate charging is process of charging input capacitance of transistor from the voltage
source through gate resistors. This process generate losses on this resistors. Losses are
given by equation:
STO67N60DM6
SCTH35N65G2V-7
▪ PGateDrive = fsw * VCC * QG
▪ QG : extracted from datasheet
▪ VCC: supply voltage of gate driver
▪ fsw : switching frequency of the transistor
Rectangle ef energy
34x higher
28x higher
Gate charge chart
GaN 650V/ 50mΩ
GaN MOSFET offers at the same Rdson
~30x lower gate charge compared to Si/SiC,
which result in lower gate driver losses
SiC
Si
12
GaN reduces output capacitance energy
Output capacitance energy value is important parameter for many topologies where Coss
energy is dissipating. During the hard switching, energy of output capacitance is being
dissipated to the heat.
STO67N60DM6
▪ PLossCoss = fsw * EOSS (VDS)
▪ EOSS : output capacitor stored energy
▪ fsw : switching frequency of the transistor
Nonlinear Output capacitance - Coss stored energy
SCTH35N65G2V-7
GaN 650V/ 50mΩ
At typical bus voltage 400V, Si and
SiC MOSFETs has ~2x higher Eoss
than equivalent GaN
13
Topology improvements
ISEC
Schematic of flyback topology
Vout
Vin
Leakage
CTRL
PWM
VDS
IMOS
IMOS
VDS
IClamp
PWM
IClamp
ISEC
• Advantages:
• Simple to design & simple to control
• Disadvantages:
• Energy of transformer leakage is
dissipated to the heat (limited power)
• MOSFET switch-on with non zero voltage
→ dissipating Coss stored energy
No ZVS
turn-on
To heat
at TVS
15
ISEC
Schematic of active clamp flyback topology
Vout
Vin
Leakage
CTRL
LS
IMOS
IMOS
VDS
IClamp
LS
IClamp
ISEC
HS
VDS
• Advantages:
• Energy of transformer leakage is not
dissipated, but is used for achiaving ZVD
condition for MOSFET
• Higher efficiency
• Disadvantages:
• More complex to design & control
• Higher cost (two switches, floating driver)
Waveforms
simplified
ZVS
turn-on
Energy
stored Energy
discharged
RMS current in HS is lower than in LS
→ HS transistor can be smaller
(asymmetrical half-bridge)
16
Introducing ST-ONE
4xsmaller
3xlighter
20% lower PLOSS
ST-ONE
Active clamp flyback with digital controller and galvanic isolation
USB Power Delivery
SPGND
ISEN
SSGND
SRVDS
HV
Line sense
Start-up
X-cap
Active
Clamp
Flyback
Galvanic
isolation
SR
Cortex
M0+
Flash
Memory
USB-PD
OVP
PVCC
POTP
Digital Controller
ST-ONE All-in-One
Digital Controller
USB PD
Type-C
18
Why ST-ONE?
ST-ONE
• Advanced ZVS non-complementary ACF controller
with synchronous rectification
• USB 3.1 PPS interface
• ARM® 32-bit Cortex®-M0+ MCU with 64 kB with
flash memory for digital power control
• Reinforced galvanically isolated dual
communication channel
• Fully Integrated USB-PD PHY
Features
• Lighter and smaller PCB
• Higher power density
• Minimized magnetic components and EMI
filter
• Cost-effective BoM
• Higher efficiency
Benefits Applications
Charger &
adapters
Medical
power
19
ST-ONE: All-In-One Solution
• Light weight
• High frequency
• GaN transistors
• Planar transformers
High Power density
• Soft switching
• Low standby
• Multimode operation
High Efficiency
• Single or multi-port
• Flash memory
• Protocol management
Flexibility
• All-in-one
• Embedded
Galvanic isolation
BOM saving
Primary + Secondary digital programmable controller with Galvanic
Isolation
20
Typical configuration
VOSNS
ORGD
CSP
CSM
SVCC
CC1/2
GPIO0/1
PUMP
SVDRV
SV3V
SPGND
SRGD
ISEN
LON
HON
HV
OVP
PVCC
PGND
OSC
POTP
SSGND
SRVDS
LEB
P3V3
SVCC
DT
EN_OUT
SVCC
SS
V1V2
ST-ONE
USB PD
Thermal sensor /
custom functions
3.3V – 21V DC
90V – 265V AC
DRIVER
ST-ONE + MASTERGAN minimize the total BOM
21
Power Delivery mode
22
SEVERAL SMART FEATURES
POTP Primary side overtemperature protection
SS Soft-start setting
OVP Ax winding sense for overvoltage protection
PVCC Primary side supply voltage
ISEN Current sense (PWM comparator) input
VOSNS Output voltage sense
SVCC Secondary side VCC
CSN Output current sense
ST-ONE pin-out
ST-ONE
23
ST-ONE Block Diagram
HV Start up,
Primary side protections
Primary OVP
Primary OTP Soft Start,
Primay Current sense
Voltage
sense
OTP,
Output Current sense
USB-PD
Sync Rect
Load SW
24
• Fault Modes
• Auto-restart;
• Latched;
• Conditioned restart;
• Primary and Secondary side
protections
Fault management
Extensive protections for the ST-ONE
25
• USB-PD module
• One USBPD power SOURCE channel
• UPBPD REV 3.1.1.2 specification
• PPS (Programmable Power Supply) with Constant Current mode
• Overcurrent management
• Temperature management
• Programmable WTP, OTP points
USB-PD protocol
USB-PD protocol management and protections
26
ST-ONE FW architecture
ST-ONE
Main scheduler
USB-PD
protocol stack
Control Loop Real time
debug
GUI interface
Flexible FW architecture
• Complete PPS USB-PD protocol
with configurable PDOs and
APDOs
• No-protocol mode available for
fixed output applications and simple
power debugging
• Wide parameter set for application
setting, control loop tuning and
efficiency tuning
• GUI interface to ease the
application development and board
tuning
• Management of IC sleep modes
for no-load conditions with wake
up from USB-PD events
• Communication between modules
through system calls for flexibility
• GUI interface can be disabled to
protect FW and parameters setup
Protections
and power
management
MCU controls both USB-PD interface and power stage
UART peripheral
SMED & power
peripherals
USB-PD PHY
peripheral
HON/LON
SRGD/ORGD
CC1/CC2
27
ST-ONE GUI
Basic
features
Program Flash
Memory
Handle automatic
industrial ST-ONE
programming
Special
features
Read
Instantaneous
Information
Calculate main
board
components
Gloop study
SW tool to help the customer from the beginning to the production
phase of the application based on ST-ONE device
28
ST-ONE GUI
29
Ecosystem
PCC020V2 connected to ST-ONE based board
through CC pin (typeC port)
PCC020V2 connected to ST-ONE based
board through GPIO pin (deb port)
GUI runs on PC
PCC020V2
30
MasterGaN family overview
MasterGaN* platform
The world first solution combining 600 V half-bridge driver
with GaN HEMT: compact, robust & easy to design
* registered and/or unregistered trademarks of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere
MasterGaN1
Up to 400W
MasterGaN3
Up to 45 W
MasterGaN2
Up to 65 W
MasterGaN5
Up to 100 W
MasterGaN4
Up to 200 W
Active Clamp Flyback mainly
200mΩ + 500mΩ
Asymmetrical HB
150mΩ + 200mΩ
Asymmetrical HB
500mΩ + 500mΩ
Symmetrical HB
200mΩ + 200mΩ
Symmetrical HB
150mΩ + 150mΩ
Symmetrical HB
LLC Resonant mainly
GQFN 9x9 mm2,
pin-to-pin scalable
32
MasterGaN block diagram
ri er
ri er
ogi
inter o ing
o erte p
e e i ter
e e i ter
CC
o
CC
CC
HS GaN
LS GaN
HS Gate driver
LS Gate driver
Logic part
33
MasterGaN: typical supply
ri er
ri er
ogi
inter o ing
o erte p
e e i ter
e e i ter
CC
o
CC
CC
5.0 - 6.5 V
(LDO)
~10R
AMR: -2V to 2V
34
Reverse conduction operation
STL28N60DM2
Reverse conduction chart for
MasterGaN1 and DM2
MasterGaN1 - 150 mΩ (25°C/3.2A)
STL28N60DM2 - 150 mΩ (25°C/3A)
MasterGaN1
• GaN transistor has no body diode, however
the conduction is possible and no external
free-wheeling diode is required.
• GaN transistor has much higher voltage
drop compare to Si MOSFET.
GaN transistor Si MOSFET
VSD VSD
35
Evaluation Tools
EVLONE65W:
65W Demo Board with MasterGaN
65W USB PD 3.1 Charger, ZVS Active Clamp Flyback
based on ST-ONE + MasterGaN4
• Features
• 65W USB-PD 3.1
• PPS support: 3.3V – 21V
• RM8 transformer
• Single PCB
• Input: 90Vac – 264Vac
• Switching Frequency 250kHz
• Peak Efficiency ~94%
Board size 2.28 x 1.25 x 0.78 in
Power density:
~30 W/in3
Efficiency vs. Output power
Available
37
Thermal performance - EVLONE65W
38
EVLONE65W Schematic
39
STDES-65ACFADP
40
STDES-65ACFADP – schematics 1/2
41
STDES-65ACFADP – schematics 2/2
42
Takeaways
ST-ONE introduces all-in-one USB-PD
solution
Designing with MasterGaN can increase
power density and efficiency for high voltage
converters
Rich set of features for robust power supply
design
Visit us at www.st.com for more details and
evaluation tools for ST-ONE!
Questions & Answers
stmicroelectronics.brasil@st.com
© STMicroelectronics - All rights reserved.
ST logo is a trademark or a registered trademark of STMicroelectronics International NV or its affiliates in the EU and/or other countries.
For additional information about ST trademarks, please refer to www.st.com/trademarks.
All other product or service names are the property of their respective owners.
Find out more at www.st.com

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Webinar: Fontes chaveadas digitais inteligentes com USB-PD

  • 1. 1
  • 2. ST
  • 3. Global presence Front-End Back-End Research & Development Main Sales & Marketing 3
  • 5. Where to buy ST ? 5
  • 6. Agenda 1 Energy trends 2 Gan Technology 3 Topologies improvement 4 ST-ONE 5 MasterGAN family 6 Evalboards 7 Takeaways 8 Q&A 6
  • 8. Growth in USB charging market Strong market growth in USB-PD market Source: Transparency Market Research AC-DC adapters, USB-PD 0 10 20 30 40 50 60 70 80 90 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 Market Size ($billion) Year USB Charger Market 9.6% CAGR Considerable market growth with wide adoption of USB Type-C Medical power delivery 8
  • 10. Silicon & wide-bandgap power devices positioning 10 W 100 W 1 kW 10 kW 100 kW 1 MW 1 W 1 Hz 10 Hz 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz Higher power is achieved through modular deployment or paralleling devices Operating frequency System power level IGBT Si MOSFET SiC MOSFET GaN Transistor 10
  • 11. • Bandgap is the energy the electrons need to jump from the top of the valence band to the bottom of the conductive band • Materials with Wide BandGap (WBG) • can withstand higher electrical fields → higher voltage can be applied • electrons have a higher mobility and saturation velocity → transistors switch faster → devices can be smaller for a given on resistance and breakdown voltage Wide BandGap Materials (WBG) Si GaN 11
  • 12. GaN has dramatically lower gate charge Gate charging is process of charging input capacitance of transistor from the voltage source through gate resistors. This process generate losses on this resistors. Losses are given by equation: STO67N60DM6 SCTH35N65G2V-7 ▪ PGateDrive = fsw * VCC * QG ▪ QG : extracted from datasheet ▪ VCC: supply voltage of gate driver ▪ fsw : switching frequency of the transistor Rectangle ef energy 34x higher 28x higher Gate charge chart GaN 650V/ 50mΩ GaN MOSFET offers at the same Rdson ~30x lower gate charge compared to Si/SiC, which result in lower gate driver losses SiC Si 12
  • 13. GaN reduces output capacitance energy Output capacitance energy value is important parameter for many topologies where Coss energy is dissipating. During the hard switching, energy of output capacitance is being dissipated to the heat. STO67N60DM6 ▪ PLossCoss = fsw * EOSS (VDS) ▪ EOSS : output capacitor stored energy ▪ fsw : switching frequency of the transistor Nonlinear Output capacitance - Coss stored energy SCTH35N65G2V-7 GaN 650V/ 50mΩ At typical bus voltage 400V, Si and SiC MOSFETs has ~2x higher Eoss than equivalent GaN 13
  • 15. ISEC Schematic of flyback topology Vout Vin Leakage CTRL PWM VDS IMOS IMOS VDS IClamp PWM IClamp ISEC • Advantages: • Simple to design & simple to control • Disadvantages: • Energy of transformer leakage is dissipated to the heat (limited power) • MOSFET switch-on with non zero voltage → dissipating Coss stored energy No ZVS turn-on To heat at TVS 15
  • 16. ISEC Schematic of active clamp flyback topology Vout Vin Leakage CTRL LS IMOS IMOS VDS IClamp LS IClamp ISEC HS VDS • Advantages: • Energy of transformer leakage is not dissipated, but is used for achiaving ZVD condition for MOSFET • Higher efficiency • Disadvantages: • More complex to design & control • Higher cost (two switches, floating driver) Waveforms simplified ZVS turn-on Energy stored Energy discharged RMS current in HS is lower than in LS → HS transistor can be smaller (asymmetrical half-bridge) 16
  • 18. 4xsmaller 3xlighter 20% lower PLOSS ST-ONE Active clamp flyback with digital controller and galvanic isolation USB Power Delivery SPGND ISEN SSGND SRVDS HV Line sense Start-up X-cap Active Clamp Flyback Galvanic isolation SR Cortex M0+ Flash Memory USB-PD OVP PVCC POTP Digital Controller ST-ONE All-in-One Digital Controller USB PD Type-C 18
  • 19. Why ST-ONE? ST-ONE • Advanced ZVS non-complementary ACF controller with synchronous rectification • USB 3.1 PPS interface • ARM® 32-bit Cortex®-M0+ MCU with 64 kB with flash memory for digital power control • Reinforced galvanically isolated dual communication channel • Fully Integrated USB-PD PHY Features • Lighter and smaller PCB • Higher power density • Minimized magnetic components and EMI filter • Cost-effective BoM • Higher efficiency Benefits Applications Charger & adapters Medical power 19
  • 20. ST-ONE: All-In-One Solution • Light weight • High frequency • GaN transistors • Planar transformers High Power density • Soft switching • Low standby • Multimode operation High Efficiency • Single or multi-port • Flash memory • Protocol management Flexibility • All-in-one • Embedded Galvanic isolation BOM saving Primary + Secondary digital programmable controller with Galvanic Isolation 20
  • 23. SEVERAL SMART FEATURES POTP Primary side overtemperature protection SS Soft-start setting OVP Ax winding sense for overvoltage protection PVCC Primary side supply voltage ISEN Current sense (PWM comparator) input VOSNS Output voltage sense SVCC Secondary side VCC CSN Output current sense ST-ONE pin-out ST-ONE 23
  • 24. ST-ONE Block Diagram HV Start up, Primary side protections Primary OVP Primary OTP Soft Start, Primay Current sense Voltage sense OTP, Output Current sense USB-PD Sync Rect Load SW 24
  • 25. • Fault Modes • Auto-restart; • Latched; • Conditioned restart; • Primary and Secondary side protections Fault management Extensive protections for the ST-ONE 25
  • 26. • USB-PD module • One USBPD power SOURCE channel • UPBPD REV 3.1.1.2 specification • PPS (Programmable Power Supply) with Constant Current mode • Overcurrent management • Temperature management • Programmable WTP, OTP points USB-PD protocol USB-PD protocol management and protections 26
  • 27. ST-ONE FW architecture ST-ONE Main scheduler USB-PD protocol stack Control Loop Real time debug GUI interface Flexible FW architecture • Complete PPS USB-PD protocol with configurable PDOs and APDOs • No-protocol mode available for fixed output applications and simple power debugging • Wide parameter set for application setting, control loop tuning and efficiency tuning • GUI interface to ease the application development and board tuning • Management of IC sleep modes for no-load conditions with wake up from USB-PD events • Communication between modules through system calls for flexibility • GUI interface can be disabled to protect FW and parameters setup Protections and power management MCU controls both USB-PD interface and power stage UART peripheral SMED & power peripherals USB-PD PHY peripheral HON/LON SRGD/ORGD CC1/CC2 27
  • 28. ST-ONE GUI Basic features Program Flash Memory Handle automatic industrial ST-ONE programming Special features Read Instantaneous Information Calculate main board components Gloop study SW tool to help the customer from the beginning to the production phase of the application based on ST-ONE device 28
  • 30. Ecosystem PCC020V2 connected to ST-ONE based board through CC pin (typeC port) PCC020V2 connected to ST-ONE based board through GPIO pin (deb port) GUI runs on PC PCC020V2 30
  • 32. MasterGaN* platform The world first solution combining 600 V half-bridge driver with GaN HEMT: compact, robust & easy to design * registered and/or unregistered trademarks of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere MasterGaN1 Up to 400W MasterGaN3 Up to 45 W MasterGaN2 Up to 65 W MasterGaN5 Up to 100 W MasterGaN4 Up to 200 W Active Clamp Flyback mainly 200mΩ + 500mΩ Asymmetrical HB 150mΩ + 200mΩ Asymmetrical HB 500mΩ + 500mΩ Symmetrical HB 200mΩ + 200mΩ Symmetrical HB 150mΩ + 150mΩ Symmetrical HB LLC Resonant mainly GQFN 9x9 mm2, pin-to-pin scalable 32
  • 33. MasterGaN block diagram ri er ri er ogi inter o ing o erte p e e i ter e e i ter CC o CC CC HS GaN LS GaN HS Gate driver LS Gate driver Logic part 33
  • 34. MasterGaN: typical supply ri er ri er ogi inter o ing o erte p e e i ter e e i ter CC o CC CC 5.0 - 6.5 V (LDO) ~10R AMR: -2V to 2V 34
  • 35. Reverse conduction operation STL28N60DM2 Reverse conduction chart for MasterGaN1 and DM2 MasterGaN1 - 150 mΩ (25°C/3.2A) STL28N60DM2 - 150 mΩ (25°C/3A) MasterGaN1 • GaN transistor has no body diode, however the conduction is possible and no external free-wheeling diode is required. • GaN transistor has much higher voltage drop compare to Si MOSFET. GaN transistor Si MOSFET VSD VSD 35
  • 37. EVLONE65W: 65W Demo Board with MasterGaN 65W USB PD 3.1 Charger, ZVS Active Clamp Flyback based on ST-ONE + MasterGaN4 • Features • 65W USB-PD 3.1 • PPS support: 3.3V – 21V • RM8 transformer • Single PCB • Input: 90Vac – 264Vac • Switching Frequency 250kHz • Peak Efficiency ~94% Board size 2.28 x 1.25 x 0.78 in Power density: ~30 W/in3 Efficiency vs. Output power Available 37
  • 38. Thermal performance - EVLONE65W 38
  • 43. Takeaways ST-ONE introduces all-in-one USB-PD solution Designing with MasterGaN can increase power density and efficiency for high voltage converters Rich set of features for robust power supply design Visit us at www.st.com for more details and evaluation tools for ST-ONE!
  • 45. © STMicroelectronics - All rights reserved. ST logo is a trademark or a registered trademark of STMicroelectronics International NV or its affiliates in the EU and/or other countries. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Find out more at www.st.com