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Career Without Limits
TSMC will be in USA for recruitment…
If you are interested in reaching your career summit
together with TSMC, send us your resume now!
Date & Location
• Register your account on tsmc cloud (click here), preferably uploading
your resume after the registration or email your resume directly to
srhsub@tsmc.com before March 31st
• Video interview can be arranged for people who are unable to meet
our delegates in person
• Concise job information could be found in the following pages; visit our
official website for details
Interview Arrangement
Come talk with us to see how tsmc can shape your career in a positive way!
4/17 - 18 Portland, OR 4/22 Caltech*
4/18 San Jose, CA 4/22 Cornell U*
4/19 Phoenix, AZ 4/24 - 26 Albany, NY
4/20 Arizona State U* 4/27 Columbia U*
4/20 Purdue U* 4/29 UPenn*
4/21 USC*
Gathering Event
Come learn the world’s leading semiconductor company and enjoy complimentary food
with our exceptional managers!
• Gathering event includes career talk and Q&A
• Click here to sign up for gathering event!
* Gathering event available
Job Openings
Function # Job Title Job Description Location
R&D
1
Process Engineering
Manager
(Etch/Litho/Metal/CM
P/Diffusion/Wet
Clean/Epi/Dry
Removal)
Take charge of the process optimization and development of advanced nodes (10nm &
beyond)
Taiwan
(Hsinchu)
2
Advanced
Lithography Engineer
1. Advanced lithography module process development and baseline sustaining
2. Process stability/manufacturability improvement for yield and reliability qualification
3. Process/tool transfer to volume manufacturing
3
Extreme Ultraviolet
Lithography (EUV)
Mask Engineer
1. Technology development of Mask inspection
2. Verify the Extreme ultraviolet lithography (EUV) mask inspection critera
3. Reach and development E-beam inspection tool for mask defect detection
4. Optical inspection tool verification
4 Device Engineer
1. Device architecture definition
2. Wafer Acceptance Test (WAT) analysis
3. Transactions on Computer Aided Design (TCAD) co-work
4. Simulation Program with Integrated Circuit Emphasis (SPICE) targeting
5 Integration Engineer
1. Front End of Line (FEOL)/Mid End of Line (MEOL) Process integration
2. Design rule and Logic cell layout/density evaluation
3. Wafer Acceptance Test (WAT) data analysis and test pattern design
4. Process reliability improvement
6
Process Engineer
(Litho/ CMP/ Wet
Clean/ Epi/ Metal/
Dielectrics)
1. Enlarge process window and defect reduction
2. Know hardware well and deliver CIPs for defect reduction
3. Define roadmaps and drives improvements on device, quality, reliability, cost, yield, process
stability, capability, and productivity for a new technology process
7
Lithography (OPC/ E-
beam) Engineer
1. Recipe development for Optical proximity correction (OPC) recipes and multiple patterning
decomposition recipes
2. Optical proximity correction (OPC) taped-out layer sponsors
3. Resolution enhancement technology development
4. Familiar with Unix, Linux system, Python, Perl, C++ and programming is preferred; CAD,
EDA, Programming, Algorithm is also a plus
Job Openings
Function # Job Title Job Description Location
R&D
8 MEMS Engineer Model and simulate the MEMS devices to verify the device performance
Taiwan
(Hsinchu)
9
Electro-Static
Discharge (ESD)
Engineer
1. Low Voltage/High Voltage (LV/HV) ESD/Latch-up design/characterization
2. LV/HV ESD/Latch-up rule writing/maintenance, device exploration/development ,
device/process simulation
10
Diffusion Process
Engineer
Work on diffusion process research & development
Taiwan
(Hsinchu/
Tainan)
IC Design
11
Standard Cell Library
Design Technical
Manager/ Director
1. Standard Cell Circuit Design for low power or high speed chip implementation
2. Standard Cell Library Silicon Validation
3. Standard Cell Test Architecture Development
Taiwan
(Hsinchu)
12
EDA Technical
Marketing Manager
1. Manage EDA ecosystem partners for both development and marketing collaboration
2. Develop and implement EDA strategies to maximize the value to customers through
ecosystem collaboration
13
Automatic Placement
and Routing (APR)
Technical Manager/
Engineer
1. ASIC block-level implementation and/or full-chip integration projects
2. Duties will include synthesis, place-and-route, timing convergence, clock tree synthesis,
noise, RV and ERC compliance, power grid assembly, and final database cleanup
3. TSMC design methodology build-up
Taiwan
(Hsinchu)
US
(San Jose/
Austin)
14
Emerging memory
Design Manager
1. Evaluating variety of emerging memories
2. Participate in memory circuit design and implementation
3. Test and verify test chip design
Taiwan
(Hsinchu)15
Digital Design
Manager/ Engineer
1. Digital Design, including verilog coding, synthesis, STA, verification
2. System simulation, modelling of communication and high speed systems
3. Communicate with memory PHY team, firmware engineer and 3rd party
4. LPDDR2/DDR3/DDR3L/DDR3U controller implementation
5. LDDPR2/DDR3/DDR3/DDR3U system verification
16
Process Design Kit
(PDK) Engineer
1. Process design kit development/maintenance
2. Development/qualification flow automation
Manufacturing 17
Advanced Hardware
Remodeling Program
Director
1. Hands-on experience on advanced semiconductor manufacturing hardware tool redesign
2. Program schedule control and resource arrangement
Taiwan
(Tainan)
Job Openings
Function # Job Title Job Description Location
Manufacturing
18 Big Data Manager
1. Lead the team on the use of chosen technologies to design Big Data analysis solutions for
semiconductor manufacturing, per current and emerging industry trends and standards
2. Communicate directly with internal partners and users; gathering requirements, ensuring
appropriate solutions
3. Manage multiple projects including analysis methodology design, solution development and
technical infrastructure
Taiwan
(Hsinchu)19
N16/N10 FinFET
Device Technical
Manager
1. FinFET device design and yield ramp-up
2. Involve and work with R&D in early stage to develop N16/N10 FinFET device
20
Materials Project
Manager
(CMP Slurry/
Precursors/
Analytical/ Chemical)
1. Take charge of the manufacturing material development and management
2. Build material defense strategy and quality system
21
Process Engineering
Manager
(Etch/ Litho/ PVD/
CVD/ CMP/ Diffusion/
Wet Clean/ Epi)
1. Enlarge process window and defect reduction
2. Know hardware well and deliver CIPs for defect reduction
3. Define roadmaps and drives improvements on device, quality, reliability, cost, yield, process
stability, capability, and productivity for a new technology process
4. Improve process and equipment operational indicators - quality, cycle-time, capacity & cost
5. Set up line defense system and meet tool and process matching requirements throughout
start-up and ramp of new technology transfer
Taiwan
(Hsinchu/
Taichung/
Tainan)
22
Process Integration
Manager
(Logic/ CIS/ MEMS/
BCD/HV/ e-flash)
1. Lead the team for the process integration and new product develop and ramp up
2. New technology or customized technology transfer, installation, qualification, volume
production ramping and sustaining smooth production
3. Responsible for WAT trouble shooting, yield improvement & cost reduction driving
23
Advanced/ Specialty
Packaging
Technology Manager
Advanced Packaging Technology and Business Program Management
Taiwan
(Hsinchu)
Job Openings
Function # Job Title Job Description Location
Manufacturing
24
Failure Analysis
Technical Manager
Involve and work with R&D/ Process integration/Process engineering team for yield
improvement by Failure Analysis expertise
Taiwan
(Hsinchu)
25
Metrology Quality
Engineer/ Manager
1. Fab metrology quality gating/enhancement and change control
2. R&D new metrology develop assessment
3. R&D to Fab / Fab to Fab metrology transfer management
4. Develop metrology quality improvement project
26
Process / Process
Integration Engineer
1. Develop and sustain process technologies for flash memory and logic products
2. Sustaining ownership such as day-to-day operations, equipment troubleshooting and
mentoring technicians
3. Maintain and control Inline defect baseline and excursion
4. Responsibility for Technology yield/defect problem
5. New technology defect study and early detection
Taiwan
(Hsinchu/
Taichung/
Tainan)
27 Reliability Engineer
1. Co-work with R&D to solve the reliability related issues and qualify the new More-Than-
Moore technology
2. Co-work and resolve reliability related issues for eFlash customers
3. Reliability characterization and methodology development
Taiwan
(Hsinchu)
Business
28
Patent Engineer/
Technical Manager
1. Work with technical and legal team to develop favor positions on legal disputes
2. Do IP assessment and technology analysis for patent acquisition
3. Provide report on technology valuation and competitor analysis
4. Coach inventors to understand the technology cycle and generate valuable intangible assets
timely
5. Draft patent application and related patent prosecution
Taiwan
(Hsinchu)
29
IT Software
Developer/ Engineer
1. Development and integration of Factory Automation Systems
2. Development and integration of Advanced Technology Developing Support Systems
3. Development and integration of Office Automation Systems
4. Development and integration of Cloud Computing and BigData Analytics Systems
Taiwan
(Hsinchu/
Taichung/
Tainan)
30
Hadoop Expertise
Engineer
1. Work closely with team to build customers’ big data architecture, building Hadoop platform,
and modules on top of Hadoop into solutions that are useful to the users
2. Work closely with the professional services team to define the implementation of above
solutions, or solve operation issues
3. Achieve defined project goals within user deadlines; proactively communicate status and
escalate issues as needed
Job Openings
Function # Job Title Job Description Location
Business
31 HR Specialist
1. Employee champion to create the working environment with balanced of work life and
belonging
2. Change agent as identify issue, diagnostic situation, initiate idea and action plan to help the
organization execute the necessary change
3. Services provider on the daily basis to serve the employees and business partners
Taiwan
(Hsinchu/
Taichung/
Tainan)
32 Attorney
1. Advising on legal and regulatory matters
2. Conducting legal research and drafting legal/compliance documents as assigned
3. Coordinating or undertaking corporate compliance initiatives, programs and processes
Taiwan
(Hsinchu)
33
Corporate Finance
Associate
1. Rotate among 2~3 functions within a timeframe of 3 years+. Such functions include treasury
operations, Financial Planning, Customer Credit, Insurance, Financial Risk Management, SEC
Compliance and Investment Management
2. Job scope includes funding, risk management, debt/equity offerings, investment valuation,
various projects to support management decisions, credit risk management, multiple insurance
programs to reduce TSMC‘s operating risk, financial risk control/modeling, ROC/US SEC
compliance, and post-investment management
34
Financial Business
Analyst
1. Market and competitive intelligence data base
2. Financial and business analysis
35
Investor Relations
Specialist
1. Analyzing TSMC and other foundry players' financial performance, business and operating
conditions, conducting semiconductor industry analysis in terms of general trend and specific
factors that shape TSMC's business, following analysts' views on TSMC, its competitors, and
the industry
2. Preparing investors conference presentations, supporting materials and quarterly
management reports
3. Understanding and interacting with institutional investors (fund managers and technology
analysts) and sell-side semiconductor analysts both in Taiwan and overseas.
4. Understanding TSMC shareholder base and nature of its major institutional investors.
5. Analyzing TSMC's share price performance
6. Working on projects deemed useful to enhance the quality of the IR team and to support
management decisions

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台積電徵才

  • 1. Career Without Limits TSMC will be in USA for recruitment… If you are interested in reaching your career summit together with TSMC, send us your resume now! Date & Location • Register your account on tsmc cloud (click here), preferably uploading your resume after the registration or email your resume directly to srhsub@tsmc.com before March 31st • Video interview can be arranged for people who are unable to meet our delegates in person • Concise job information could be found in the following pages; visit our official website for details Interview Arrangement Come talk with us to see how tsmc can shape your career in a positive way! 4/17 - 18 Portland, OR 4/22 Caltech* 4/18 San Jose, CA 4/22 Cornell U* 4/19 Phoenix, AZ 4/24 - 26 Albany, NY 4/20 Arizona State U* 4/27 Columbia U* 4/20 Purdue U* 4/29 UPenn* 4/21 USC* Gathering Event Come learn the world’s leading semiconductor company and enjoy complimentary food with our exceptional managers! • Gathering event includes career talk and Q&A • Click here to sign up for gathering event! * Gathering event available
  • 2. Job Openings Function # Job Title Job Description Location R&D 1 Process Engineering Manager (Etch/Litho/Metal/CM P/Diffusion/Wet Clean/Epi/Dry Removal) Take charge of the process optimization and development of advanced nodes (10nm & beyond) Taiwan (Hsinchu) 2 Advanced Lithography Engineer 1. Advanced lithography module process development and baseline sustaining 2. Process stability/manufacturability improvement for yield and reliability qualification 3. Process/tool transfer to volume manufacturing 3 Extreme Ultraviolet Lithography (EUV) Mask Engineer 1. Technology development of Mask inspection 2. Verify the Extreme ultraviolet lithography (EUV) mask inspection critera 3. Reach and development E-beam inspection tool for mask defect detection 4. Optical inspection tool verification 4 Device Engineer 1. Device architecture definition 2. Wafer Acceptance Test (WAT) analysis 3. Transactions on Computer Aided Design (TCAD) co-work 4. Simulation Program with Integrated Circuit Emphasis (SPICE) targeting 5 Integration Engineer 1. Front End of Line (FEOL)/Mid End of Line (MEOL) Process integration 2. Design rule and Logic cell layout/density evaluation 3. Wafer Acceptance Test (WAT) data analysis and test pattern design 4. Process reliability improvement 6 Process Engineer (Litho/ CMP/ Wet Clean/ Epi/ Metal/ Dielectrics) 1. Enlarge process window and defect reduction 2. Know hardware well and deliver CIPs for defect reduction 3. Define roadmaps and drives improvements on device, quality, reliability, cost, yield, process stability, capability, and productivity for a new technology process 7 Lithography (OPC/ E- beam) Engineer 1. Recipe development for Optical proximity correction (OPC) recipes and multiple patterning decomposition recipes 2. Optical proximity correction (OPC) taped-out layer sponsors 3. Resolution enhancement technology development 4. Familiar with Unix, Linux system, Python, Perl, C++ and programming is preferred; CAD, EDA, Programming, Algorithm is also a plus
  • 3. Job Openings Function # Job Title Job Description Location R&D 8 MEMS Engineer Model and simulate the MEMS devices to verify the device performance Taiwan (Hsinchu) 9 Electro-Static Discharge (ESD) Engineer 1. Low Voltage/High Voltage (LV/HV) ESD/Latch-up design/characterization 2. LV/HV ESD/Latch-up rule writing/maintenance, device exploration/development , device/process simulation 10 Diffusion Process Engineer Work on diffusion process research & development Taiwan (Hsinchu/ Tainan) IC Design 11 Standard Cell Library Design Technical Manager/ Director 1. Standard Cell Circuit Design for low power or high speed chip implementation 2. Standard Cell Library Silicon Validation 3. Standard Cell Test Architecture Development Taiwan (Hsinchu) 12 EDA Technical Marketing Manager 1. Manage EDA ecosystem partners for both development and marketing collaboration 2. Develop and implement EDA strategies to maximize the value to customers through ecosystem collaboration 13 Automatic Placement and Routing (APR) Technical Manager/ Engineer 1. ASIC block-level implementation and/or full-chip integration projects 2. Duties will include synthesis, place-and-route, timing convergence, clock tree synthesis, noise, RV and ERC compliance, power grid assembly, and final database cleanup 3. TSMC design methodology build-up Taiwan (Hsinchu) US (San Jose/ Austin) 14 Emerging memory Design Manager 1. Evaluating variety of emerging memories 2. Participate in memory circuit design and implementation 3. Test and verify test chip design Taiwan (Hsinchu)15 Digital Design Manager/ Engineer 1. Digital Design, including verilog coding, synthesis, STA, verification 2. System simulation, modelling of communication and high speed systems 3. Communicate with memory PHY team, firmware engineer and 3rd party 4. LPDDR2/DDR3/DDR3L/DDR3U controller implementation 5. LDDPR2/DDR3/DDR3/DDR3U system verification 16 Process Design Kit (PDK) Engineer 1. Process design kit development/maintenance 2. Development/qualification flow automation Manufacturing 17 Advanced Hardware Remodeling Program Director 1. Hands-on experience on advanced semiconductor manufacturing hardware tool redesign 2. Program schedule control and resource arrangement Taiwan (Tainan)
  • 4. Job Openings Function # Job Title Job Description Location Manufacturing 18 Big Data Manager 1. Lead the team on the use of chosen technologies to design Big Data analysis solutions for semiconductor manufacturing, per current and emerging industry trends and standards 2. Communicate directly with internal partners and users; gathering requirements, ensuring appropriate solutions 3. Manage multiple projects including analysis methodology design, solution development and technical infrastructure Taiwan (Hsinchu)19 N16/N10 FinFET Device Technical Manager 1. FinFET device design and yield ramp-up 2. Involve and work with R&D in early stage to develop N16/N10 FinFET device 20 Materials Project Manager (CMP Slurry/ Precursors/ Analytical/ Chemical) 1. Take charge of the manufacturing material development and management 2. Build material defense strategy and quality system 21 Process Engineering Manager (Etch/ Litho/ PVD/ CVD/ CMP/ Diffusion/ Wet Clean/ Epi) 1. Enlarge process window and defect reduction 2. Know hardware well and deliver CIPs for defect reduction 3. Define roadmaps and drives improvements on device, quality, reliability, cost, yield, process stability, capability, and productivity for a new technology process 4. Improve process and equipment operational indicators - quality, cycle-time, capacity & cost 5. Set up line defense system and meet tool and process matching requirements throughout start-up and ramp of new technology transfer Taiwan (Hsinchu/ Taichung/ Tainan) 22 Process Integration Manager (Logic/ CIS/ MEMS/ BCD/HV/ e-flash) 1. Lead the team for the process integration and new product develop and ramp up 2. New technology or customized technology transfer, installation, qualification, volume production ramping and sustaining smooth production 3. Responsible for WAT trouble shooting, yield improvement & cost reduction driving 23 Advanced/ Specialty Packaging Technology Manager Advanced Packaging Technology and Business Program Management Taiwan (Hsinchu)
  • 5. Job Openings Function # Job Title Job Description Location Manufacturing 24 Failure Analysis Technical Manager Involve and work with R&D/ Process integration/Process engineering team for yield improvement by Failure Analysis expertise Taiwan (Hsinchu) 25 Metrology Quality Engineer/ Manager 1. Fab metrology quality gating/enhancement and change control 2. R&D new metrology develop assessment 3. R&D to Fab / Fab to Fab metrology transfer management 4. Develop metrology quality improvement project 26 Process / Process Integration Engineer 1. Develop and sustain process technologies for flash memory and logic products 2. Sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians 3. Maintain and control Inline defect baseline and excursion 4. Responsibility for Technology yield/defect problem 5. New technology defect study and early detection Taiwan (Hsinchu/ Taichung/ Tainan) 27 Reliability Engineer 1. Co-work with R&D to solve the reliability related issues and qualify the new More-Than- Moore technology 2. Co-work and resolve reliability related issues for eFlash customers 3. Reliability characterization and methodology development Taiwan (Hsinchu) Business 28 Patent Engineer/ Technical Manager 1. Work with technical and legal team to develop favor positions on legal disputes 2. Do IP assessment and technology analysis for patent acquisition 3. Provide report on technology valuation and competitor analysis 4. Coach inventors to understand the technology cycle and generate valuable intangible assets timely 5. Draft patent application and related patent prosecution Taiwan (Hsinchu) 29 IT Software Developer/ Engineer 1. Development and integration of Factory Automation Systems 2. Development and integration of Advanced Technology Developing Support Systems 3. Development and integration of Office Automation Systems 4. Development and integration of Cloud Computing and BigData Analytics Systems Taiwan (Hsinchu/ Taichung/ Tainan) 30 Hadoop Expertise Engineer 1. Work closely with team to build customers’ big data architecture, building Hadoop platform, and modules on top of Hadoop into solutions that are useful to the users 2. Work closely with the professional services team to define the implementation of above solutions, or solve operation issues 3. Achieve defined project goals within user deadlines; proactively communicate status and escalate issues as needed
  • 6. Job Openings Function # Job Title Job Description Location Business 31 HR Specialist 1. Employee champion to create the working environment with balanced of work life and belonging 2. Change agent as identify issue, diagnostic situation, initiate idea and action plan to help the organization execute the necessary change 3. Services provider on the daily basis to serve the employees and business partners Taiwan (Hsinchu/ Taichung/ Tainan) 32 Attorney 1. Advising on legal and regulatory matters 2. Conducting legal research and drafting legal/compliance documents as assigned 3. Coordinating or undertaking corporate compliance initiatives, programs and processes Taiwan (Hsinchu) 33 Corporate Finance Associate 1. Rotate among 2~3 functions within a timeframe of 3 years+. Such functions include treasury operations, Financial Planning, Customer Credit, Insurance, Financial Risk Management, SEC Compliance and Investment Management 2. Job scope includes funding, risk management, debt/equity offerings, investment valuation, various projects to support management decisions, credit risk management, multiple insurance programs to reduce TSMC‘s operating risk, financial risk control/modeling, ROC/US SEC compliance, and post-investment management 34 Financial Business Analyst 1. Market and competitive intelligence data base 2. Financial and business analysis 35 Investor Relations Specialist 1. Analyzing TSMC and other foundry players' financial performance, business and operating conditions, conducting semiconductor industry analysis in terms of general trend and specific factors that shape TSMC's business, following analysts' views on TSMC, its competitors, and the industry 2. Preparing investors conference presentations, supporting materials and quarterly management reports 3. Understanding and interacting with institutional investors (fund managers and technology analysts) and sell-side semiconductor analysts both in Taiwan and overseas. 4. Understanding TSMC shareholder base and nature of its major institutional investors. 5. Analyzing TSMC's share price performance 6. Working on projects deemed useful to enhance the quality of the IR team and to support management decisions