SUSS MicroTec
2 SlideShares 6 Seguidores
Personal Information
Organização/Local de trabalho
Garching Germany
Site
www.suss.com
Sobre
SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.
Marcadores
wafer bonding karl suss metal bonding hybrid bonding semiconductor 3d integration 3d bonding suss microtec bond metal bonding wafer bonder suss microtec karl semi
Ver mais

Apresentações

(2)

Metal bonding alternatives to frit and anodic technologies for wlp

Há 13 anos • 3522 Visualizações

Hybrid bonding methods for lower temperature 3 d integration 1

Há 13 anos • 4244 Visualizações
Personal Information
Organização/Local de trabalho
Garching Germany
Site
www.suss.com
Sobre
SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.
Marcadores
wafer bonding karl suss metal bonding hybrid bonding semiconductor 3d integration 3d bonding suss microtec bond metal bonding wafer bonder suss microtec karl semi
Ver mais