BGA Cleaning and Inspection
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This is one slide set in a multi part series on the BGA rework process. In this section the BGA cleaning and inspection process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
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BGA Cleaning and Inspection
- 1. BGA Rework-Cleaning and Inspection Rework and Repair of PCBs Solder/Assembly Training Rework/Repair Soldering Tools www.solder.net
- 2. BGA Rework I. II. III. Why Rework Scope of Material Covered BGA Rework Process A. B. C. D. E. F. IV. Removal Site Dressing Placement Reflow Cleaning Inspection Materials Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 3. BGA Rework-the process Cleaning Objective remove soils that will impact product reliability of a PCB based on the end use environment and/or provide for surface that will accept a subsequent coating. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 4. BGA Rework-the process Cleaning Objective remove soils Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 5. BGA Rework-the process Inspection-Visual Objective assure that the rework process performed meets the inspection criteria applicable Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 6. BGA Rework-the process Inspection - endoscope Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 7. BGA Rework-the process Inspection- Transmissive X-ray Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 8. BGA Rework-the process Inspection- Laminographic X-ray or CT scanning Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 9. BGA Rework-the process BGA XRAY inspection-3D http://www.youtube.com/watch?v=7AQzccfwS Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 10. BGA Rework-the process Inspection- Inspection Criteria •May involve visual assessment only (Table 1-2 ) •Process validation can be used in lieu of XRay/Visual inspection provided objective evidence is available •Outside rows through visual inspection when practical •Alignment in both X and Y w/corner markers on PCB (if present) Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 11. Inspection- Inspection Criteria8.3.12 Surface Mount Area Array (cont.) IPC-A-610 (collapsing balls) Feature Clause Classes 1,2 and 3 Alignment 8.3.12.1 No violation of minimum electrical clearance Solder Ball Spacing 8.3.12.2 No violation of minimum electrical clearance Soldering Connections 8.3.12.3 Voids 8.3.12.4 No bridging. Solder balls contact and wet to the land forming connection of right shape 25% or less voiding of any ball in the xray image area Underfill or staking material 8.3.12.5 S8-11 Present and completely cured Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 12. BGA Rework-the process Inspection- Inspection Criteria Target 1,2,3 -Uniform size and shape Acceptable 1,2,3-No bridging, continuous elliptical Process Indicator 1,2,3 –Non uniform size, color, shape Defect 1,2,3- solder bridging, waste showing paste did not flow together, fractured solder connection, no connect between ball and solder Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 13. BGA Rework-the process Macrovoids Planar Microvoids (<1-2 mils) Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 14. BGA Rework-the process Microvia Voids Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 15. BGA Rework-Materials Flux • • • RoHS Issues Higher processing temperatures Longer time above liquidus Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
- 16. BGA Rework-Materials Solder RoHS Issues •Lower wettability •Higher reflow temperatures •Specialty rheology formulations for dipping Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
Notas do Editor
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- Need to be able to get underneath Need to get mechanical energy to “break the dam” Need cleaning agent to be able to break down the soil dam
- Other method is hand cleaning-soft bruch plus isoporpyl or other favored cleaning solution
- Typically and by default using the IPC A 610 inspection criteria Magnification as found in table XX in 610 at the beginning of the book May augment with 7095 or customer specific criteria
- Evidence of wetting, solder joint shape, solder joint texture, any contaminants, solder joints anomalies like shorts, opens or cold solder Discuss lite source, lens and camera and SW as key elements of the system
- 3.6 minute video
- Review quickly the imnpsection criteria for BGAs Must be bale to see those utisde rows for inspection Absence of solder ball is a defect
- Incoming inspection balls may have voids-do NOT want there to be a dramatic reduction in X-sectional area Not an a reliability concern that they aret here BUT changes in void size or frequency are a process indicator Entrapped fluxes are the cause of voids Original solder balls can be a cause of voids Entrapped air fluxes during reflow process-need time to escape Lower heat txfr and lower current carrying capacity May need to Xsection along with 2D to determine location and size of the void Void Types per 7095 Type A within the ball as received “”B at the ball/package interface upon receipt “”C within the ball after reflow “”D At ball/package interface post reflow “”E at ball/board interface post reflow Control voids VIA stencil design, flux type and application, solder paste formulation, reflow profile, reflow atmosphere