Review of Appendix D in latest revision H version of the IPC J-STD-001. Further info on J-STD-001 certification resources at solder.net

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What’s in the J-STD-001H regarding X-Ray
inspection and through hole inspection?

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• What content for through hole solder connections not visible by any
other method but x-ray
• NO REQUIREMENTS!!!!!!
• Compilation of guidelines for through hole;silent on SMT
Appendix “D” X-Ray Guidelines An Overview
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• Internal solder void in solder fillet around entire lead wire and PTH
• No continuous flow of solder between source and destination fillet
(refer to 6.2.1 Solder Application)
Appendix “D” D-2.1
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Courtesy IPC

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• Absence of solder inside of solder fillet in a plated throughhole
Appendix “D” D-2.2
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• Absence of solder inside of solder fillet in a plated throughhole
Appendix “D” D-2.2
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• Anyone using the x-ray tool for analysis should be proficient
• Demonstrated proficiency
Appendix “D” D-3 Personnel Proficiency
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• Voids will be there
• When using x-ray for inspection of PTHs should be continuous fill from
solder source side to solder destination side
• Voids should not be added together in the continuous solder fill
volume and subtracted from the fill percentage
• NO continuous 360 degree circumferential voids
D-5 Assessing Solder Fill in PTH. See 6.2 supported holes and Table 6-6
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8. Constraints
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• Sometimes hole fill cannot be achieved due to PCB thickness, internal
copper layers, ground planes, hole obstructions, insufficient thermal
relief
• Cannot make adjustments in the soldering process to get a
compliant hole fill
• Testing will be required to see if assembly will survive in applicable
operating environments
D-6 Hole Fill with Design Constraints
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More to Come ….SMT , etc
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