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Graphene MOSFET
Carbon Nanomaterials
Assignment II
Bang Pawan (16MCE0019),
Dept. of Communication Engg.,
VIT, Vellore
Introduction
• Graphene has changed from being the exclusive domain of condensed-
matter physicists to being explored by those in the electron-device
community.
• In particular, graphene-based transistors have developed rapidly and
are now considered an option for post-silicon electronics.
• However, many details about the potential performance of graphene
transistors in real applications remain unclear.
• Two principal divisions of semiconductor electronics are digital logic
devices and radiofrequency devices.
• The degree of readiness to introduce new device concepts is generally
higher for radiofrequency applications, in part because the fortunes of
digital logic depend almost entirely on the performance of a single type
of device: the silicon metal–oxide–semiconductor FET (MOSFET).
Graphene Properties relevant to Transistors
• Single-layer graphene is a purely two-dimensional material. Its lattice
consists of regular hexagons with a carbon atom at each corner. The
bond length between adjacent carbon atoms, Lb, is 1.42 Å and the
lattice constant, a, is 2.46 Å.
Bandgap
• Because the bandgap is zero, devices with channels made of large-area
graphene cannot be switched off and therefore are not suitable for
logic applications.
• However, the band structure of graphene can be modified, and it is
possible to open a bandgap in three ways: by constraining large-area
graphene in one dimension to form graphene nanoribbons, by biasing
bilayer graphene and by applying strain to graphene.
Bandgap
• It has been predicted that both armchair nanoribbons and zigzag
nanoribbons (the two ideal types of nanoribbon) have a bandgap that
is, to a good approximation, inversely proportional to the width of the
nanoribbon.
• However, it should be noted that real nanoribbons have rough edges
and widths that change along their lengths.
• Even modest edge disorder obliterates any difference in the bandgap
between nanoribbons with different edge geometries, and edge
functionalization and doping can also affect the bandgap.
• To open a bandgap useful for conventional field-effect devices, very
narrow nanoribbons with well-defined edges are needed.
• Recently, nanoribbons that were uniform in width and had reduced
edge roughness were produced by ‘unzipping’ carbon nanotubes.
Schematic drawing of various methods to fabricate GNRs by unzipping CNTs.
Bandgap
• However, the larger the bandgap that opens in a nanoribbon, the more
the valence and conduction bands become parabolic (rather than cone-
shaped): this decreases the curvature around the K point and increases
the effective mass of the charge carriers, which is likely to decrease the
mobility.
 Large area graphene
 Graphene nanoribbons
 Unbiased bilayer graphene
 Bilayer graphene with an
applied perpendicular
field.
Bandgap
• Bilayer graphene is also gapless, and its valence and conduction bands
have a parabolic shape near the K point.
• If an electric field is applied perpendicular to the bilayer, a bandgap
opens and the bands near the K point take on the so-called Mexican-hat
shape.
• Theoretical investigations have shown that the size of the bandgap
depends on the strength of the perpendicular field.
• The bandgap of large-area single-layer epitaxial graphene is at present
the subject of controversy.
• The transfer characteristics of epitaxial-graphene MOSFETs show no
switch-off, which suggests a zero bandgap. However, a bandgap is
consistently observed for epitaxial bilayer graphene.
Mobility
• The most frequently stated advantage of graphene is its high carrier
mobility at room temperature.
• In early graphene MOS structures, the mobility was affected by the use
of a top-gate dielectric.
• However, the recent demonstration of mobilities of around 23,000 cm2
V−1 s−1 in top-gated graphene MOS channels and the observation of
similar mobilities before and after top-gate formation show that high-
mobility graphene MOS channels can be made with a proper choice of
the gate dielectric and optimization of the deposition process.
• A general trend for conventional semiconductors is that the electron
mobility decreases as the bandgap increases, and a similar trend has
been predicted for carbon nanotubes (CNTs) and graphene
nanoribbons.
Mobility
• This means that the mobility in nanoribbons with a bandgap similar to
that of silicon (1.1 eV) is expected to be lower than in bulk silicon and
no higher than the mobility in the silicon channel of a conventional
MOS device.
• Therefore, although the high mobilities offered by graphene can
increase the speed of devices, they come at the expense of making it
difficult to switch devices off, thus removing one of the main
advantages of the CMOS configuration—its low static power
consumption.
High-field transport
• The mobility describes carrier transport in low electric fields; the short
gate lengths in modern FETs result in high fields in a sizeable portion of
the channel, reducing the relevance of mobility to device performance.
• To illustrate this, let us consider a FET with a gate 100 nm long and a
drain–source voltage of 1 V.
• If we assume a voltage drop of 0.3 V across the series resistances, the
average field in the channel is 70 kV cm−1.
• At such high fields, the steady-state carrier velocity saturates, and this
saturation velocity becomes another important measure of carrier
transport.
High-field transport
• Moreover, at high fields the velocity in graphene and the nanotube does
not drop as drastically as in the III–V semiconductors.
• Thus, regarding high-field transport, graphene and nanotubes seem to
have a slight advantage over conventional semiconductors.
Structure of Graphene MOSFET
(a) Back-gated MOSFET
(c) Top-gated MOSFET with a channel of
exfoliated graphene or of graphene
grown on metal and transferred to a
SiO2-covered Si wafer
(b) Top-gated MOSFET with
an epitaxial-graphene channel
Structure of Graphene MOSFET
• A 300-nm SiO2 layer underneath the graphene served as a back-gate
dielectric and a doped silicon substrate acted as the back-gate (Fig. a).
• Such backgate devices have been very useful for proof-of-concept
purposes, but they suffer from unacceptably large parasitic
capacitances and cannot be integrated with other components.
Therefore, practical graphene transistors need a top-gate.
• Top-gated graphene MOSFETs (Fig. b & c) have been made with
exfoliated graphene, graphene grown on metals such as nickel and
copper, and epitaxial graphene; SiO2, Al2O3, and HfO2 have been used
for the top-gate dielectric.
• The channels of these top-gated graphene transistors have been made
using large-area graphene, which does not have a bandgap, so they
have not been able to switch off.
Structure of Graphene MOSFET
(a) Graphene Nano-ribbon FET
(c) MOSFET based on GNR array
(b) Graphene nanomesh FET
Fabrication of Graphene MOSFET
• Graphene was exfoliated from natural graphite and transferred onto
the proper Si/SiO2 substrate with 99 nm thick oxide layer in order to
have more contrast under optical microscope.
• Before graphene transfer, a round of photolithography, tungsten
deposition and lift-off was done to form EBL alignment marks.
• Two steps of electron beam lithography were applied for source/drain
and gate electrodes.
• Ti/Au was deposited using PVD and followed by lift-off for all metal
contacts in different steps.
• High k Al2O3 was applied as gate dielectric and deposited by ALD.
• EBL = Electron beam lithography
• PVD = Physical vapour deposition
• ALD = Atomic layer deposition
• PMMA = Polymethyl methacrylate  A transparent and rigid plastic.
Transfer Characteristics
• Large-area-graphene transistors have a unique current–voltage
transfer characteristic.
• The carrier density and the type of carrier (electrons or holes) in the
channel are governed by the potential differences between the channel
and the gates (top-gate and/or back-gate).
• Large positive gate voltages promote an electron accumulation in the
channel (n-type channel), and large negative gate voltages lead to a p-
type channel.
• This behaviour gives rise to the two branches of the transfer
characteristics separated by the Dirac point.
• The position of the Dirac point depends on several factors: the
difference between the work functions of the gate and the graphene,
the type and density of the charges at the interfaces at the top and
bottom of the channel, and any doping of the graphene.
Transfer Characteristics
• The on–off ratios reported for MOSFET devices with large-area-
graphene channels are in the range 2–20.
Output Characteristics
• The output characteristics of many graphene MOSFETs either show a
linear shape without any saturation or only weak saturation, each of
which is a disadvantage with respect to device speed.
• However, some graphene MOSFETs have an unusual form of saturation-
like behaviour that includes a second linear region.
• For small values of VDS, the transistor operates in the linear region and
the entire channel is n-type (region I). As VDS is increased, the drain
current starts to saturate until the inflection point at VDS = VDS,crit is
reached (region II).
• At this point, the potential conditions at the drain end of the channel
correspond to the Dirac point. Once VDS exceeds VDS,crit, the conduction
type at the drain end of the channel switches from n-type to p-type and
the transistor enters a second linear region (region III).
Output Characteristics
• At sufficiently large values of VDS, the output characteristics for
different gate voltages may cross, leading to a zero or even negative
transconductance—a highly undesirable situation. This peculiar
behaviour is a consequence of these devices having gapless channels
and does not occur in FETs with semiconducting channels.
Progress in graphene MOSFET development compared with the
evolution of nanotube FETs
GNRFET Vs CNTFET
• The drain current increases only slightly with respect to temperature
for both FETs.
• The saturation current increases with respect to relative dielectric
constant for both FETs.
• For metallic FETs, gate voltage has very little control over the drain
current.
• The drain current is directly proportional to the diameter (for CNT)
and width (for GNR) for both semiconducting FETs.
• GNRFET has comparatively higher drain current than CNTFET.
References
• Frank Schwierz, “Graphene Transistors”, review article, Nature
Nanotechnology, 2010.
• http://pubs.rsc.org/en/content/chapterhtml/2014/9781782623380-
00001?isbn=978-1-78262-338-0
• Sam Vaziri, “Fabrication and Characterization of Graphene Field Effect
Transistors”, Project Thesis, Royal Institute of Technology, 2011.
• S. Z. Ahmed and M. S. Shawkat, “Performance of ballistic schottky
barrier Graphene Nanoribbon FET”, Project Thesis, BRAC University.
Thank you…!!!

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Graphene MOSFET Performance

  • 1. Graphene MOSFET Carbon Nanomaterials Assignment II Bang Pawan (16MCE0019), Dept. of Communication Engg., VIT, Vellore
  • 2. Introduction • Graphene has changed from being the exclusive domain of condensed- matter physicists to being explored by those in the electron-device community. • In particular, graphene-based transistors have developed rapidly and are now considered an option for post-silicon electronics. • However, many details about the potential performance of graphene transistors in real applications remain unclear. • Two principal divisions of semiconductor electronics are digital logic devices and radiofrequency devices. • The degree of readiness to introduce new device concepts is generally higher for radiofrequency applications, in part because the fortunes of digital logic depend almost entirely on the performance of a single type of device: the silicon metal–oxide–semiconductor FET (MOSFET).
  • 3. Graphene Properties relevant to Transistors • Single-layer graphene is a purely two-dimensional material. Its lattice consists of regular hexagons with a carbon atom at each corner. The bond length between adjacent carbon atoms, Lb, is 1.42 Å and the lattice constant, a, is 2.46 Å.
  • 4. Bandgap • Because the bandgap is zero, devices with channels made of large-area graphene cannot be switched off and therefore are not suitable for logic applications. • However, the band structure of graphene can be modified, and it is possible to open a bandgap in three ways: by constraining large-area graphene in one dimension to form graphene nanoribbons, by biasing bilayer graphene and by applying strain to graphene.
  • 5. Bandgap • It has been predicted that both armchair nanoribbons and zigzag nanoribbons (the two ideal types of nanoribbon) have a bandgap that is, to a good approximation, inversely proportional to the width of the nanoribbon. • However, it should be noted that real nanoribbons have rough edges and widths that change along their lengths. • Even modest edge disorder obliterates any difference in the bandgap between nanoribbons with different edge geometries, and edge functionalization and doping can also affect the bandgap. • To open a bandgap useful for conventional field-effect devices, very narrow nanoribbons with well-defined edges are needed. • Recently, nanoribbons that were uniform in width and had reduced edge roughness were produced by ‘unzipping’ carbon nanotubes.
  • 6. Schematic drawing of various methods to fabricate GNRs by unzipping CNTs.
  • 7. Bandgap • However, the larger the bandgap that opens in a nanoribbon, the more the valence and conduction bands become parabolic (rather than cone- shaped): this decreases the curvature around the K point and increases the effective mass of the charge carriers, which is likely to decrease the mobility.  Large area graphene  Graphene nanoribbons  Unbiased bilayer graphene  Bilayer graphene with an applied perpendicular field.
  • 8. Bandgap • Bilayer graphene is also gapless, and its valence and conduction bands have a parabolic shape near the K point. • If an electric field is applied perpendicular to the bilayer, a bandgap opens and the bands near the K point take on the so-called Mexican-hat shape. • Theoretical investigations have shown that the size of the bandgap depends on the strength of the perpendicular field. • The bandgap of large-area single-layer epitaxial graphene is at present the subject of controversy. • The transfer characteristics of epitaxial-graphene MOSFETs show no switch-off, which suggests a zero bandgap. However, a bandgap is consistently observed for epitaxial bilayer graphene.
  • 9. Mobility • The most frequently stated advantage of graphene is its high carrier mobility at room temperature. • In early graphene MOS structures, the mobility was affected by the use of a top-gate dielectric. • However, the recent demonstration of mobilities of around 23,000 cm2 V−1 s−1 in top-gated graphene MOS channels and the observation of similar mobilities before and after top-gate formation show that high- mobility graphene MOS channels can be made with a proper choice of the gate dielectric and optimization of the deposition process. • A general trend for conventional semiconductors is that the electron mobility decreases as the bandgap increases, and a similar trend has been predicted for carbon nanotubes (CNTs) and graphene nanoribbons.
  • 10. Mobility • This means that the mobility in nanoribbons with a bandgap similar to that of silicon (1.1 eV) is expected to be lower than in bulk silicon and no higher than the mobility in the silicon channel of a conventional MOS device. • Therefore, although the high mobilities offered by graphene can increase the speed of devices, they come at the expense of making it difficult to switch devices off, thus removing one of the main advantages of the CMOS configuration—its low static power consumption.
  • 11. High-field transport • The mobility describes carrier transport in low electric fields; the short gate lengths in modern FETs result in high fields in a sizeable portion of the channel, reducing the relevance of mobility to device performance. • To illustrate this, let us consider a FET with a gate 100 nm long and a drain–source voltage of 1 V. • If we assume a voltage drop of 0.3 V across the series resistances, the average field in the channel is 70 kV cm−1. • At such high fields, the steady-state carrier velocity saturates, and this saturation velocity becomes another important measure of carrier transport.
  • 12. High-field transport • Moreover, at high fields the velocity in graphene and the nanotube does not drop as drastically as in the III–V semiconductors. • Thus, regarding high-field transport, graphene and nanotubes seem to have a slight advantage over conventional semiconductors.
  • 13. Structure of Graphene MOSFET (a) Back-gated MOSFET (c) Top-gated MOSFET with a channel of exfoliated graphene or of graphene grown on metal and transferred to a SiO2-covered Si wafer (b) Top-gated MOSFET with an epitaxial-graphene channel
  • 14. Structure of Graphene MOSFET • A 300-nm SiO2 layer underneath the graphene served as a back-gate dielectric and a doped silicon substrate acted as the back-gate (Fig. a). • Such backgate devices have been very useful for proof-of-concept purposes, but they suffer from unacceptably large parasitic capacitances and cannot be integrated with other components. Therefore, practical graphene transistors need a top-gate. • Top-gated graphene MOSFETs (Fig. b & c) have been made with exfoliated graphene, graphene grown on metals such as nickel and copper, and epitaxial graphene; SiO2, Al2O3, and HfO2 have been used for the top-gate dielectric. • The channels of these top-gated graphene transistors have been made using large-area graphene, which does not have a bandgap, so they have not been able to switch off.
  • 15. Structure of Graphene MOSFET (a) Graphene Nano-ribbon FET (c) MOSFET based on GNR array (b) Graphene nanomesh FET
  • 16. Fabrication of Graphene MOSFET • Graphene was exfoliated from natural graphite and transferred onto the proper Si/SiO2 substrate with 99 nm thick oxide layer in order to have more contrast under optical microscope. • Before graphene transfer, a round of photolithography, tungsten deposition and lift-off was done to form EBL alignment marks. • Two steps of electron beam lithography were applied for source/drain and gate electrodes. • Ti/Au was deposited using PVD and followed by lift-off for all metal contacts in different steps. • High k Al2O3 was applied as gate dielectric and deposited by ALD. • EBL = Electron beam lithography • PVD = Physical vapour deposition • ALD = Atomic layer deposition • PMMA = Polymethyl methacrylate  A transparent and rigid plastic.
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  • 18. Transfer Characteristics • Large-area-graphene transistors have a unique current–voltage transfer characteristic. • The carrier density and the type of carrier (electrons or holes) in the channel are governed by the potential differences between the channel and the gates (top-gate and/or back-gate). • Large positive gate voltages promote an electron accumulation in the channel (n-type channel), and large negative gate voltages lead to a p- type channel. • This behaviour gives rise to the two branches of the transfer characteristics separated by the Dirac point. • The position of the Dirac point depends on several factors: the difference between the work functions of the gate and the graphene, the type and density of the charges at the interfaces at the top and bottom of the channel, and any doping of the graphene.
  • 19. Transfer Characteristics • The on–off ratios reported for MOSFET devices with large-area- graphene channels are in the range 2–20.
  • 20. Output Characteristics • The output characteristics of many graphene MOSFETs either show a linear shape without any saturation or only weak saturation, each of which is a disadvantage with respect to device speed. • However, some graphene MOSFETs have an unusual form of saturation- like behaviour that includes a second linear region. • For small values of VDS, the transistor operates in the linear region and the entire channel is n-type (region I). As VDS is increased, the drain current starts to saturate until the inflection point at VDS = VDS,crit is reached (region II). • At this point, the potential conditions at the drain end of the channel correspond to the Dirac point. Once VDS exceeds VDS,crit, the conduction type at the drain end of the channel switches from n-type to p-type and the transistor enters a second linear region (region III).
  • 21. Output Characteristics • At sufficiently large values of VDS, the output characteristics for different gate voltages may cross, leading to a zero or even negative transconductance—a highly undesirable situation. This peculiar behaviour is a consequence of these devices having gapless channels and does not occur in FETs with semiconducting channels.
  • 22. Progress in graphene MOSFET development compared with the evolution of nanotube FETs
  • 23. GNRFET Vs CNTFET • The drain current increases only slightly with respect to temperature for both FETs. • The saturation current increases with respect to relative dielectric constant for both FETs. • For metallic FETs, gate voltage has very little control over the drain current. • The drain current is directly proportional to the diameter (for CNT) and width (for GNR) for both semiconducting FETs. • GNRFET has comparatively higher drain current than CNTFET.
  • 24. References • Frank Schwierz, “Graphene Transistors”, review article, Nature Nanotechnology, 2010. • http://pubs.rsc.org/en/content/chapterhtml/2014/9781782623380- 00001?isbn=978-1-78262-338-0 • Sam Vaziri, “Fabrication and Characterization of Graphene Field Effect Transistors”, Project Thesis, Royal Institute of Technology, 2011. • S. Z. Ahmed and M. S. Shawkat, “Performance of ballistic schottky barrier Graphene Nanoribbon FET”, Project Thesis, BRAC University. Thank you…!!!