The document describes a paradigm shift in alternative lower cost, high performance, light weight, high density electronics cooling.

1. HTE Associates, Inc.
PUMPED REFRIGERENT AS AN
ALTERNATIVE TO LIQUID COOLING
High Density Cooling for Electronic Package
Martin Pitasi
12/23/2008
1

2. INTRODUCTION
POSITION STATEMENT
Over the last 10 years HTE, Inc. has developed pumped liquid refrigeration cooling (PLRC) technology
that has the potential of replacing conventional water based designs.
Briefly, for the same cooling specifications, the advantages of a PLRC over a similar water based system
are: (1) smaller package envelop, (2) lower overall weight, (3) reduced parasitic power requirements, (4)
less hardware, (5) simpler assembly, (6) no glycol or deionization water treatment required, (7) lower
costs, and (8) higher returns on your investment.
VALUE STATEMENT
PLRC COP values range from ~17 to ~70 for air cooled and water cooled condensers, respectively. These
values will establish higher benchmarks for future global GREEN markets.
Our goal is to jump start PLRC technology by targeting key industries in market segments that find this
technology is a value added proposition that will improve their bottom line and provide a competitive
advantage.
PROPOSAL STATEMENT
HTE proposes an equitable agreement that includes, but is not limited to, the following:
 Partnership
 Exclusive consulting and licensing
 Licensing only
 Ownership
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3. HTE PUMPED LIQUID REFRIGERENT COOLING (PLRC) SYSTEMS
are:
• Patent and trade secret protected from direct easy competition.
• Environmentally GREEN:
 Operate with 80/90% power savings over pumped water or water/glycol systems.
 Save 40/50% on system weight, size, and assembly over pumped water or water/glycol
systems.
• Applicable to most products that currently use liquids or wish to use liquids for cooling purposes
 Large server farms  Semiconductor lasers
 Plasma welding & cutting  High power LED’s
 Motor controllers  Large power supplies
 Phased array radars  Submarine electronics
 High density routers  High power computers
 High power IGBTs  Microwave
 Electro-optics  Precision alignment and control
• A very competitive replacement for existing liquid cooling systems that currently use chillers
and liquid sensible heat cooling technology.
3

4. HTE IS SEEKING A PARTNER TO TAKE ADVANTAGE OF THE
MARKET OPPORTUNITIES THAT THESE MARKETS PRESENT
• This partner should have a compatible manufacturing and production control facility to produce
systems in both small and large sized lots. [that is to say, take piping systems and components and
put them into a workable system, test, package, and ship.]
• This partner should have a compatible marketing, sales, and distribution network to present and
service PLRC systems without a major disruption/training period for this new approach to cooling
industrial systems.
• As a PLRC partner, a company will have an investment with the potential of eliminate competition in
many product sectors. Also, by integrating the PLRC technology into its strategic plans a company will
avoid playing the costly competitive catch-up game and provide sales and marketing with a new and
different strategy.
• The trend today in all types of electrical/electronic packaging is to shrink the envelope and increase the
dissipated power. This trend is the driving force that will make liquid cooling more and more acceptable
as the only viable approach available.
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5. HTE CAN PROVIDE PROSPECTIVE PARTNERS WITH EVERYTHING THAT IS
NECESSARY TO BE SUCCESSFUL IMMEDIATELY WITH THIS NEW PLRC LINE
OFFERING
• The patent protection developed over eight years of design and experimentation can be provided to the
partner.
• The details of the trade secrets developed over eight years work in the area of component selection
and cold plate designs utilizing micro-channels can be provided to the partner to assure competitive
designs for the future.
• Up to full time engineering development and liaison support is available from HTE Laboratory which
currently produces all of the required ‘proof of concept’ equipment to support the current field support
effort.
• Complete availability of all data, test reports, curves, charts on application work already completed that
would assist in the preparation of marketing and sales sheets.
• HTE can support any field work reasonable away from their base of operations in Newbury, MA, with
OOP expenses paid.
• HTE has available a sales demo and can provide electronic copies of many typical application data
sheets,
• HTE can provide a reasonably up-to-date status on the competitive picture in the marketplace.
• The fee for this program is a paid in full license for all markets of interest …….
-Or-
An option paid in monthly installments, again related to the anticipated market coverage needed and
certain other features. HTE expects to be able to support this agreement for up
to five years or so.
[Further details will require the execution of an NDA]
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6. SELECTED APPLICATION WHERE PLRC’S ADVANTAGES ARE
DEMONSTRATED
 Large commercial and military systems such as phased array radar (page 7), data, and
telecommunication centers, computer farms, motor controls for smelting and mine ventilation, etc.
 Electro-optics, high power lasers and laser diodes (page 8), LEDs, etc.
 Stand alone computer and telecommunication cabinets, desktop computers and workstations, and
computers on a chip (page 9), etc.
 High performance cold plates (pages 10 & 11) and evaporators for cooling high power electronic
components and systems, including IGBTs, microprocessors, plasma cutting torch nozzles, etc.
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7. COOLING COMARISON BETWEEN EGW
AND PLRC PHASED ARRAY RADAR
4
Reference Items Design Constraints System Design % Change
H.T.E.
System Performance
Single Phase EGW2
Cooling Media Two Phase R-134a
Quality (%) NA 50 NA
Heat Load (kw) 54.4 54.4 NA
Flow Rate (gpm) 50.0 8.2 -84
Coolant Temperature ( C ) 30.0 30.0 0
Max. Pressure (psig) 125.0 112.3 -10
Pressure Drops (psid) 105.0 9.4 -91
EDA Manifold
Load (kw) 6.8 6.8 NA
Coolant Temp ( C ) 30 in / 35 out 32 in / 32 out NA
Flow Rate (gpm) 6.3 1.0 -84
Critical Temperatures ( C ) 38.0 34.0 NA
Pressure Drops (psid) 100.0 8.9 -91
3
Heat Exchanger
Type EGW Vapor NA
Size (Tons) 15.5 15.5 NA
Flow Rate (gpm) 50.0 50.0 NA
Supply Pressure (psig) 20.0 20.0 NA
Supply Temperature ( C ) 15.0 15.0 NA
Pump (centrifugal)
HP 10.0 0.2 -98
Wt (Lb) 300.0 25.0 -92
Envelope (in) TBD 26quot; x 16quot; x 10quot; TBD
System Impact
Leakage1 Contamination Potenial None NA
Hardware Reliability (khrs) No Data 50 TBD
Size 60quot;L x 30quot;W x 60quot;H 25quot;L x 15quot;W x 45quot;H -84
Weight (Lb) 874.0 150.0 -83
Power (kw) 7.5 0.1 -98
Hardware $11,340.00 ~ $6500.00 -43
1. Impact on leakage on electrical circuits
2. Single Phase EGW (55/45 by Vol)
3. Water Cooled Heat Exchanger
4. Enviornmental demonsteration Array
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8. CURAMIC PLRC LASER COOLER TEST RESULTS
LASER COOLER THERMAL RESISTENCE TEST RESULTS
1.00
Notes: Red Laser Cooler / R-134a
1. Coolant………………… R-134a (sub-cooled)
0.90 Blue Laser Cooler / R-134a
2. Tv…………………………..35 C Published Data / Water
3. Tw…………………………..35 C
0.80
4. Q/A………………………. 1030 W/cm2
Thermal Resistance (deg C/W)
5. HTA………………………2mm x 10mm
0.70 6. Date…………………. …..12/19/2005
0.60
0.50
0.40
LASER COOLER TEST SET-UP 0.30
0.20
0.10
Retainer
0.00
0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16
Compression Block/Insulator
Liquid Flow (gal/min)
Compression Pad (2)
Surface Thermocouple Load Stack
Compression Pad (1)
2mm x 10mm Load Interface
*Laser Cooler (1.5mm x 10mm x 27mm)
Interface Thermocouple
Gasket
LASER COOLER FLOW LOSSES TEST RESULTS
Test Head
100
Notes:
Blue Laser Cooler / R-134a
1. Coolant………………… R-143a (sub-cooled)
Red Laser Cooler / R-134a
2. Tv…………………………..35 C
Published Data / Water
3. Tw…………………………..35 C
4. Q/A………………………. 1030 W/cm 2
5. HTA………………………2mm x 10mm
Pressure Drop (psid)
6. Date…………………. ..12/19/2005
…
Vapor
Vapor
Liquid
10
* Curamik laser diode cooler 1
0.01 0.1 1
Liquid Flow (gal/min)
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9. SUN’S QUICKSILVER CPU MODULE TEST RESULTS
ROCK PLUS AIR FLOW LOSS
0.50
0.45
High Density Electronics OP
0.40
~100w/cm2
Notes:
0.35 1. Ambient………………20 °C
2. Altitude……………….0 kft
Loss (in wc)
0.30
0.25
0.20
0.15
QUICKSILVER PLRC CPU COOLING MODULE 0.10
0.05
0.00
Liquid
Reservoir
Vapor 0 20 40 60 80 100 120 140
< 4 gph
X< 50%
Flow Rate (cfm)
120 CFM @ 20°C
Condenser
& 0.45 in wc
Condenser
Condenser
Pump
ROCK PLUS SYSYEM THERMAL PERFORMANCE
0.060
Springs (4)
Cold Plate
37 °C
0.050
375w
375w
OP
0.045
Overall Resistance (deg C/w)
Envelop 9” x 5” x 8” 0.040
Notes:
1. Ambient………………20 °C
0.030
2. Altitude……………….0 kft
3. Coolant…………. ……R-134 a (Sub-Cooled)
4. Flow Rate……….… 120 SCFM
0.020
0.010
0.000
375
0.0 50.0 100.0 150.0 200.0 250.0 300.0 350.0 400.0 450.0
Load (w)
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10. COLD PLATE PERFORMANCE DATA
COLD PLATE POWER RESISTANCE RESULTS
Notes:
0.030
1. Psat……………….. 150 psig
2. Coolant…………....... R-134a (sub-cooled) 0.025
3. Load………………… As Noted
Thermal Resistanve (deg C/ w)
4. Source Size……...... 2.2 cm x 2.2 cm 0.020
5. PN………………...... 725073-x1
6. Cold Plate Mat’l…… OFC 0.015
7. FPI…………………. 70
8. Mat’l Thk’s………… 0.006” 0.010
Note:
0.005
Flow Rate………………4.7gph
0.000
0 50 100 150 200 250 300 350 400 450
Power / w
COLD PLATE FLOW LOSS
COLD PLATE THERMAL RESISTEANCE
COLD PLATE FLOW RESISTANCE RESULTS
10
0.040
0.035
0.030
Thermal Resistance (deg C/w)
Flow Resistance (psid)
0.025
0.020
0.015
0.010
Note: Note:
Load…………..450w Load……450w
0.005
0.000
1
0.0 1.0 2.0 3.0 4.0 5.0 6.0
1 10
Flow (gph)
Flow ( gph)
10

11. COLD PLATE PLRC (EVAPORATOR) PERFORMANCE
Thermal Resistance
0.06
Notes:
1. Coolant………..R-134a (sub-cooled)
0.05 2.Psat…………….185 psia
3. ColdPlate……..S48/2
Rsv (deg C/W)
4. Source Size….2.0 cm x 2.0 cm
0.04
0.03
0.02
0.01
0
1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM
R-134a Flow
7
6
5
Flow (GPH)
4
3 Notes:
1. Coolant………..R-134a (sub-cooled)
2 2.Psat…………….185 ps ia
3. ColdPlate……..S48/2
1 4. Source Size….2.0 cm x 2.0 cm
0
1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM
Load
900
Notes:
800 1. Coolant………..R-134a (sub-cooled)
2.Ps at…………….185 psia
700
3. ColdPlate……..S48/2
600
Power (W)
4. Source Size….2.0 cm x 2.0 cm
500
400
300
200
100
0
1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM
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