The document discusses IBM's POWER7 technology and Power 755 server. It provides details on the POWER7 processor including its 8 cores, 32 threads per chip, and 32MB on-chip memory. It compares POWER7's performance against Intel's Nehalem and Westmere processors, noting POWER7's advantages in core count, cache size, memory bandwidth, and scalability. The Power 755 server is highlighted as delivering high performance for HPC workloads with better performance and efficiency than competitors.
10. “ Mainframe-class”, a term used by Intel to describe processor enhancements, is derived from the IBM innovations that built the legendary RAS mainframes provide #1,2,3 - See “POWER6 RAS” in backup; See the following URLs for addition details:http://www-03.ibm.com/systems/migratetoibm/systems/power/availability.html http://www-03.ibm.com/systems/migratetoibm/systems/power/virtualization.html The same people who develop mainframes develop Power Systems RAS Feature POWER7™ SPARC Integrity Xeon Application/Partition RAS Live Partition Mobility Yes No No Yes Live Application Mobility Yes No No No Partition Availability priority Yes No No No System RAS OS independent First Failure Data Capture Yes No No No Memory Keys Yes No No No Processor RAS Processor Instruction Retry Yes Yes No No Alternate Processor Recovery Yes No No No Dynamic Processor Deallocation Yes Yes Yes No Dynamic Processor Sparing Yes Yes 2 Yes 2 No Memory RAS Chipkill Yes Yes Yes Yes Survives Double Memory Failures Yes No No No Selective Memory Mirroring Yes No No No Redundant Memory Yes Yes Yes Yes I/O RAS Extended Error Handling Yes No No No
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13. Security PowerVM has never had a single reported security vulnerability. Source: National Vulnerability Database, http://nvd.nist.gov/
14. POWER7 Has Clear Performance Leadership On Major Workloads PER SOCKET vs. Best Published (4/18/2010) Intel Offering * Source: http://www.spec.org/ IBM p570 POWER6 results to be submitted on 5/21/07: All other results as of 04/27/07; ** Source: www.tpc.org/ IBM p570 POWER6 result to be submitted on5/21/07; All other results as of 04/27/07 See next page for full detail
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16. POWER 7 Dominates Intel’s Offerings POWER 7 vs. Nehalem-EX (Xeon 7560) POWER 7 vs. Westmere-EP (Xeon 5680) POWER 7 vs. Nehalem-EP (Xeon 5570) POWER 7 vs. Tukwila (Itanium 9350) Core Count = 1.33x 2x 2x Micro-Architecture ++ ++ ++ ++++ Frequency 1.7x 1.16x 1.3x 2.25x # of Threads / Core 2x 2x 2x 2x (+ SMT vs. HMT) Cache 1.33x (+ DRAM advantage) 2.67x (+ DRAM advantage) 4x (+ DRAM advantage) 1.1x (+ DRAM advantage) Memory Bandwidth 3x 5x 5x 3x SMP Bandwidth 3.5x (+coherency advantage) 7x (+coherency advantage) 7x (+coherency advantage) 3.5x (+coherency advantage) Max Glueless SMP 4x (32 vs. 8) 16x (32 vs. 2) 16x (32 vs. 2) 4x (32 vs. 8)
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18. IBM Power 755 Server High Performance Computing with POWER7 Smarter Systems for a Smarter Planet
19. Focus Application Areas for IBM Power HPC Systems Weather & Environmental models Medical and Life Sciences Basic Research Engineering / Scientific and emerging technologies Predicting the path of the next hurricane Modeling the Human Brain Discovering the secrets of the Universe Tomorrow’s technologies today BRINGING OUR STRENGTH TO BEAR
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22. Power Systems HPC Roadmap Power 755, Blue Gene, Power 575 Mid Range Departmental & Divisional Systems Extreme Scaling Mid to High-end Capability 2010 2012 2011 Blue Gene/Q Power 575 (POWER6™) Blue Gene/P POWER7 (P7 IH) Power 755 Power 755 For information only – subject to change without notice
30. Power 755 HPC Cluster Node Support IB-DDR Interconnect Up to 10 Nodes per Rack GA Levels XLF v13.1 VAC/C++ v11.1 Compilers Beta (GA 06/2010) ESSL v5.1 ESSL xCAT v2.3.x GPFS v3.3 PESSL v3.3 LL v4.1 PE v5.2.x HPC Stack Levels AIX 6.1 H Linux Operating Systems 64 nodes (32 Cores/node) 54 TFlops Scaling
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32. 44 Power your planet. Smarter Systems for a Smarter Planet.
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43. Save up to 93% in annual energy costs! By consolidating nine 64-core HP Superdomes into ONE Power 780 system --Reduce floor space required by 91% --Reduce processing cores by 88% One Power 780 (@ 75% utilization) 576 total cores @ 1.6 GHz 9 HP Superdomes (@ 25% utilization ) 64 total cores @ 3.8 GHz Only 1 Rack – 7.6 sq. ft of floor space Up to $139k in energy savings per year! See Power 780 comparisons in backup for full substantiation details.
44. POWER7 continues to deliver more Performance per Watt rPerf per KWatt >3X increase in performance per watt over POWER6+ >30X increase in performance per watt since POWER4 >10 years of changing the UNIX landscape POWER6™ Power 570 4.2 GHz rPerf: 193.25 KWatts: 5.6 POWER6™ Power 570 4.7 GHz rPerf: 134.35 KWatts: 5.6 POWER7™ Power 780 3.8 GHz rPerf: 685.09 KWatts: 6.4 POWER5+™ p570 1.9 GHz rPerf: 85.20 KWatts: 5.2 POWER5™ p5-570 1.65 GHz rPerf: 68.4 KWatts: 5.2 POWER4+™ p670 1.5 GHz rPerf: 46.79 KWatts: 6.71 POWER4™ p670 1.1 GHz rPerf: 24.46 KWatts: 6.71
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47. Move up to Enterprise Class Features Power 750 Power 770 IBM Installed Two dedicated high speed GX++ adapter slots Six dedicated PCI Express adapter slots Up to 32 GB POWER7 memory per core Up to 16 GB standard memory per core Five PCI adapter slots (two PCI X and three PCI Express - two shared) One high speed GX++ adapter and one standard GX adapter slots shared with two PCI Express slots Integrated split backplane support and dedicated media controller Client Installed Capacity on Demand processors start at four cores
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49. Move up to enterprise class RAS Optional Standard Not available * Requires two or more nodes ** Planned for 4Q 2010 Alternate Processor Recovery Hot GX Adapter Repair * * Hot-node Repair / Hot-memory Add for all nodes ** * * Dynamic Service Processor and System Clock Failover Memory Sparing * * * * Power 780 Storage Keys Processor Instruction Retry Dual disk controllers (split backplane) PowerVM™/Live Partition Mobility/Live Application Mobility * Redundant System Clocks * Redundant Service Processors Redundant / Hot Swap Power Supplies Concurrent Firmware Update Hot Swap DASD / Media / PCI Adapters * Hot-node Repair / Hot-memory Add Power 750 * Hot-node Add / Cold-node Repair POWER7 Enhanced Memory Redundant / Hot Swap Power Regulators Dynamic Processor Sparing Redundant / Hot Swap Fans & Blowers Hot GX Adapter Add and Cold Repair Power 770 RAS Item
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53. “We recently completed an analysis of ESA on POWER6 processor-based Power 595 systems. One finding was dramatic: clients who didn’t activate ESA account for 70 percent of unexpected machine outages.” Ross Mauri General Manager IBM Power Systems
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55. IBM Power Systems Comparisons * Planned availability in 4Q 2010 No 9 x 5 Standard 1 Up to 11 0.9GB/s 30 GB/s 1 per processor 8.5 GB/s 273 GB/s 8GB Up to 256GB 4 byte 3.3 GHz 32 One Power 755 8 byte 8 byte 4 byte SMP buses 2 per processor 2 per processor 1 per processor Memory controllers Up to four Up to four One Nodes Up to 2 TB* Up to 2 TB* Up to 512 GB System memory 3.8, 4.1 GHz 3.1, 3.5 GHz 3.0, 3.3, 3.55 GHz Frequency Yes 24 x 7 P7 Enhanced Memory Dynamic FSP & clocks Up to 640* Up to 13 3.6 or 7.3 GB/s 236 GB/s 17 or 34 GB/s 1088 GB/s 32 or 64 GB 4 – 64 Power 780 3.6 or 4.9 GB/s 0.9GB/s I/O Bandwidth per core (peak) 17 or 22 GB/s 8.5 GB/s Memory Bandwidth per core (peak) No 9 x 5 P7 Enhanced Memory Dynamic FSP & clocks Up to 640* Up to 11 236 GB/s 1088 GB/s 32 or 42 GB 4 – 64 Power 770 Up to 320* Maximum LPARs No 9 x 5 Standard Up to 11 30 GB/s 273 GB/s 16 or 21 GB 6, 12, 18, 24 or 8, 16, 24, 32 Power 750 Memory Bandwidth (peak) I/O Bandwidth (peak) Cores (single system image) Memory per core rPerf per core RAS Warranty PowerCare
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57. Power is the innovation that will fuel the growth in 2010 Power is effortlessly balancing hundreds of workloads Power is operating at over 90% utilization Power is Management with Automation Power is Intelligent Energy Optimization Power is Virtualization without Limits Power is Resiliency without Downtime
59. IBM Power 780 comparisons Performance per watt is calculated by dividing the performance in the table above by the recommended maximum power for site planning. Actual power used by the systems will be less than this value for all of the systems. The maximum power requirement for the Power 780 is 6,400 Watts and is available at http://www-01.ibm.com/common/ssi/index.wss - search for Power 780. Power consumption figures of 6400 W for the IBM Power 780, 12,196 W / 24,392 W for the HP Superdome and 44,800 W for the Sun SPARC Enterprise M9000 were based on the maximum rates published by IBM, HP and Sun Microsystems, respectively. The information for the HP Integrity Superdome is in “QuickSpecs HP Integrity Superdome Servers 16- processor, 32-processor, and 64- processor Systems” available at www.hp.com. The information for the Sun SPARC Enterprise M9000 is in the "Sun SPARC Enterprise M9000 Servers Site Planning Guide" available at www.sun.com.
60. IBM Power 780 comparisons The virtualized system count and energy savings were derived from several factors: A performance ratio factor was applied to the virtualization scenario based on SPECint_rate2006. The performance factor is simply the SPECint_rate2006 result per core of the Power 780 divided by the per core result of the HP or Sun system. Power 780 (64-core, 8 chips, 8 cores per chip, 3.8 GHz) SPECint_rate2006 2,530 peak as of 2/8/2010. HP Superdome (64-core, 32 chips, 2 cores per chip) 1.6 GHz, SPECint_rate2006 824 peak published October 2006. Sun SPARC Enterprise M9000 (256-core, 64 chips, 4 cores per chip) 2.88 GHz, SPECint_rate2006 2,586 peak published October 2009. SPEC® results available at: www.spec.org A virtualization factor of 3.157X was applied to the virtualization scenario using utilization assumptions derived from an Alinean white paper on server consolidation. The tool assumes 19% utilization of existing servers and 60% utilization of new servers. Source - www.ibm.com/services/us/cio/optimize/opt_wp_ibm_systemp.pdf. Air conditioning power requirement estimated at 50% of system power requirement. Energy cost of $.1031 per kWh is based on 2009 YTD US Average Retail price to commercial customers per US DOE at http://www.eia.doe.gov/cneaf/electricity/epm/table5_6_b.html as of 1/27/2010. The reduction in floor space, power, cooling and software costs depends on the specific customer, environment, application requirements, and the consolidation potential. Actual numbers of virtualized systems supported will depend on workload levels for each replaced system. System data for HP from the HP Superdome Datasheet and HP Integrity Superdome Server — specifications both available at www.hp.com. System data for Sun from the Sun SPARC Enterprise M9000 Tech Specs available at www.sun.com. Data is current as of January 27, 2010.
61. Special notices This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area. Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment. Revised September 26, 2006
62. Special notices (cont.) IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, CacheFlow, ClusterProven, DB2, ESCON, i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere, xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, Micro-Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER7, pureScale, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME 10, TurboCore, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries or both. Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both. Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both. AMD Opteron is a trademark of Advanced Micro Devices, Inc. Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC). SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC). NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both. AltiVec is a trademark of Freescale Semiconductor, Inc. Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc. InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others. Revised February 9, 2010
63. Notes on benchmarks and values The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html . All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. TPC http://www.tpc.org SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc VolanoMark http://www.volano.com STREAM http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/benchmark/ Oracle Applications http://www.oracle.com/apps_benchmark/ PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly Siebel http://www.siebel.com/crm/performance_benchmark/index.shtm Baan http://www.ssaglobal.com Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ Ideas International http://www.ideasinternational.com/benchmark/bench.html Storage Performance Council http://www.storageperformance.org/results Revised March 12, 2009
64. Notes on HPC benchmarks and values Revised March 12, 2009 The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html . All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3 or AIX 5L were used. All other systems used previous versions of AIX. The SPEC CPU2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc STREAM http://www.cs.virginia.edu/stream/ Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ AMBER http://amber.scripps.edu/ FLUENT http://www.fluent.com/software/fluent/fl5bench/index.htm GAMESS http://www.msg.chem.iastate.edu/gamess GAUSSIAN http://www.gaussian.com ANSYS http://www.ansys.com/services/hardware-support-db.htm Click on the "Benchmarks" icon on the left hand side frame to expand. Click on "Benchmark Results in a Table" icon for benchmark results. ABAQUS http://www.simulia.com/support/v68/v68_performance.php ECLIPSE http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest& MM5 http://www.mmm.ucar.edu/mm5/ MSC.NASTRAN http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm STAR-CD www.cd-adapco.com/products/STAR-CD/performance/320/index/html NAMD http://www.ks.uiuc.edu/Research/namd HMMER http://hmmer.janelia.org/ http://powerdev.osuosl.org/project/hmmerAltivecGen2mod
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Notas do Editor
POWER7 will deliver new features and functions to the Power family of Processors The enhancements include: Additional core density On chip cache using the energy saving technology developed in IBM Research Energy efficient core New on chip memory controller technology providing support for DDR3 memory. The memory will deliver more than 3X memory bandwidth of the POWER6 chip Support for both single and dual precision SIMD processing Support for additional Storage Protection Keys
Let’s take a closer look now at the POWER7 Chip. POWER7 is fabricated in IBMs 45nm Silicon on insulator technology using copper interconnect and embedded dram for the L3. The chip is 567mm square and contains 1.2B transistors. However if you consider each EDRAM cell has the function of a 6T SRAM cell the chip actually has the equivalent function of a 2.7B transistors chip. The chip as you can see has 8 processor cores each with 12 execution unit capable of running 4 way SMT. I’ll share some core details in a few slide. To feed the processor cores: We have two memory controllers one on each side of the chip. Each memory controller supports 4 channels of DDR3 memory. Combined these 8 channels provided 100GBs sustained memory bandwidth. On the top and bottom of the chip are our seven 8 byte multi-processor links providing 360GB/s bandwidth to make balanced SMP systems scalable to 32 sockets.
Next let’s take a closer look at the POWER7 core. The smaller P7 core provides additional performance over our previous generation Power6 core by: Having a shorter wider pipeline with better utilization leveraging SMT4 and Out of order execution The net is higher performance even with a smaller core in equivalent technology thus saving power. Taking a look at the chip floor plan you can see. Two fixed point pipelines. The two LSU pipes , The load store pipes are also capable executing simple fixed point instructions. FPU pipelines capable of 4 double precision multiply add operations per cycle or 8 flops/cycle. This unit also handles vector instructions. The instruction fetch unit which also executes branch and condition register instructions. The decimal floating point unit < A widened Instruction sequencing unit capable of dispatching 6 instructions per cycle including 2 branches and issuing up to 8 instructions per cycle. <click> In POWER7 we took advantage of the out of order execution to switch from a dedicated recovery unit to a distributed one using the flush and refetch capability in the OOO machine. The core caches on Power7 have been improved by making the L1 instruction and data cache 32KB and reducing the access time from 4 to 2 cycles and backing them with a 256KB L2 cache integrated with the core to be only 8 cycles away.
EP – cut backs EX – enterprise ITF will die Itanic
Our RAS results are better because we start with a full systems view. We have very challenging for each element of RAS and we measure our systems performance. as we approach a new generation of Power, we attack those elements which have had the greatest impact on reliability, availability, or serviceability. we can do this because we design the HW, firmware and OS together. Just as an example, look at the way we address processor execution errors. before an instruction executes, we save status information about the processor. if the instruction fails for any reason, we reload that status and retry the instruction using Processor Intstruction Retry. Most of the time, the instruction will work because most problems are intermittent caused by events like bombardment of the chip by alpha particles flipping a bit. This kind of event becomes more common as we make technology denser and the size of the alpha particles becomes larger relative to the distance between bits in execution reguisters. Some of the time, retry doesn’t work on the processor because it has a hard failure. In that case, if another processor is available, we use Alternate Processor Recovery andload the status into the other processor and try there to avoid any application outage. Hardware Instruction Retry requires cooperation between HW and firmware. Alternate Processor Recovery requires the additional cooperation of the OS. We develop all of them so we include that cooperation. Itanium and x86 systems have neither. We have similar features throughout the system. As you can see in the chart above, if Xeon does get all the RAS features itanium has, it will be an improvement, but it will still leave Xeon based systems well behind Power systems.
Now let’s look at reliability, availability, and serviceability. A recent survey (independent - not vender funded) of 400 IT users worldwide by ITIC showed that the combination of AIX and Power Systems provides the best result in each of these categories. Our availability is 99.997% - 2 ½ times the next best UNIX alternative and 10 times better than Windows on x86. 54% of IT execs surveyed say they need 99.99% availability or better. With these kind of results it is no wonder that more and more of them are choosing Power systems. Note that Solaris on SPARC has better availability than Linux on x86. If your client moves to x86, they will be taking a step backward.
To really put balanced performance into perspective, however, we have placed four of the leading performance results on this one chart. The telling statistic, however, is that regardless of workload, POWER7 technology performs. This means that regardless of your workload, POWER7 systems can deliver industry leading performance for your business. This means that you no longer have to buy specialized systems for different workloads. This means that you can feel safe in consolidating multiple workloads onto the p770, knowing that you will get the best possible performance for each of your applications
Virtualization without Limits increases flexibility and reduces costs: Expanded system capability teamed with PowerVM’s performance, scalability and flexibility Workload-optimizing systems improve service levels with assured performance: PowerVM, Intelligent Threads and TurboCore mode enable you to optimize the performance of your workloads in a virtualized environment Consolidation that delivers exponential ROI: Industry’s leading performance, scalability and virtualization now unbounded with DB2 pureScale Dynamic Energy Optimization that balances performance and efficiency: >3X increased performance per watt, new EnergyScale features integrated with Active Energy Manager Resiliency without Downtime: Non-disruptive application upgrades from POWER6 and the improvements to the road for Continuous Availability
Good morning. This morning I am going to take you through a presentation that cover the POWER7 Express rack and tower roll out. With a focus on the products being announced in Feb.. I will talk about how there positioned and how they compared to legacy Power products as well as competitive servers. There will be a session with Patrick O’rourke tomorrow morning that will go into technical detail on all POWER7 offering and features.
Ian…FAST flash
The Power 755 is a 4 socket, 4U rack-optimized server supporting 8-core POWER7 processors and up to 256GB of memory. The Power 755 is a high performance compute node targeted at small to mid-size clusters. It delivers better than 3X improvement in power than current power offerings. POWER7 processors support AltiVec™ instruction set and extended VSX SIMD (single instruction multiple data) acceleration which can execute up to eight single-precision or double-precision floating point operations per clock cycle per core to improve fine-grained parallelism and accelerate data processing. IBM HPC software stack has the development tools, libraries, file systems and system management software necessary to administer a Power 755 server cluster. There will be a HPC technical session on the Power 755 on Wed..
On Slide 7, Clients will now be able to add the p520 and p550 to the list of POWER6 based servers that they can monitor and manage via IBM system director for active energy manager. The ability to collect and report power consumption and system themal data and leverage features such as power capping to control system power under a specified limit and power saving to reduce power when workload or policy allows. The POWER6 chip is also designed to conserve power and reduce heat generated by the server. A feature called “nap” mode enables processor clocks to be dynamically turned off when there is no useful work to be done and turned back on when there are instructions to be executed. This features is supported on all Power6 systems In summary, the POWER6 architecture with Acitve energy manager and POWER6 EnergyScale technology can help clients improve energy efficiency and reduce energy related costs .