11136442.ppt

© 2010 IBM Corporation
IBM Power Systems
Power a Smarter Planet with POWER7
Smarter Systems for a Smarter Planet
John Sheehy
Systems Architect
jes@e-techservices.com

IBM Power Systems
2
IBMVision
Designed, integrated systems
are part of the transformational story
of the next decade.

IBM Power Systems
3
IBM Systems & Technology lay the foundation
Workload
Optimization
Deep Understanding
of Client Needs
Approach challenge from
the client’s perspective
A Comprehensive Portfolio
A family of “fit-for-purpose”
servers, storage & system
software
Technology Leadership
Investing in future technology
for differentiation and sustained
leadership

IBM Power Systems
4
Smarter Money
Power Systems performance, security and availability are capabilities that
provide the world’s largest banks with the ability to move today’s money -
intangible, invisible information - from a paycheck to a bank to a retailer and
back into another business account.
Smarter Cities
Cities large and small depend on the ability of Power Systems to sift through
the data needed to not only solve crimes and respond to emergencies, but to
help prevent them. Power Systems help manage traffic, share information
across city agencies, keep citizens informed and give them access to services.
Smarter Telecom
Telcos are using Power Systems to deliver new services dynamically to an
exploding number of devices - and Power’s scalability means that new
services can be added quickly, new clients can be billed accurately, and costs
can be reduced with consolidation.

IBM Power Systems
5
Organizations are moving from “what” to “how”
How do I infuse intelligence into a system for which no one
enterprise or agency is responsible?
How do I bring all the necessary constituents together?
How do I make the case for budget?
How do I get a complex solution through procurement?
How do I coalesce support with citizens?
Where should I start?
How fast should I move?
“
”

IBM Power Systems
6
Transformations to “smarter” solutions require
smarter systems that:
Scale quickly and efficiently
Optimize workload performance
Flexibly flow resources
Avoid downtime
Save energy
Automate management tasks

IBM Power Systems
7
Power your planet.
Smarter systems for a Smarter Planet.

IBM Power Systems
8
Source: IDC Quarterly Server Tracker Q309 release, November 2009
UNIX Server Rolling Four Quarter Average Revenue Share
POWER4
Dynamic LPARs
POWER6
Live Partition
Mobility
POWER5
Micro-Partitioning
Customers are moving to higher value
…as shown by the largest shift of customer spending in UNIX History

IBM Power Systems
9
successful Power Migration Factory migrations to date.
There were over 500 Power migrations during 2009, with more than
90% from Sun and HP customers (including x86 consolidation). In
4Q09 alone, Power achieved nearly 200 competitive migrations.
2,100

IBM Power Systems
•POWER7 Processor
•POWER7 Servers
–Power 750
–Power 755
–Power 770
–Power 780
•Active Memory Expansion
•Upgrades
•I/O Update
Agenda….

IBM Power Systems
•Balance System Design
– Cache, Memory, and IO
•POWER7 Processor
Technology
– 6th Implementation of multi-
core design
– On chip L2 & L3 caches
•POWER7 System
Architecture
– Blades to High End offerings
– Enhances memory
implementation
– PCIe, SAS / SATA
POWER7 System Highlights

IBM Power Systems
Operating Systems
Power Systems Portfolio (Feb 2010)
Major Features:
Modular systems with linear scalability
PowerVM Virtualization
Physical and Virtual Management
Roadmap to Continuous Availability
Binary Compatibility
Energy / Thermal Management
Power 755
Power 750
520
BladeCenter
JS12 / JS22
JS23 / JS43
595
575
Power 770
Power 780

IBM Power Systems
POWER7 Systems Technology Value…
•Technology
–Roadmap
–Processor Instruction Retry
–Green Technology built in
–Common architecture from Blades to High-
end
•Performance
–Power Systems scalability from blades to
high end systems
–Performance leadership in a variety of
workloads
–Best Performance per core
–Memory and IO bandwidth
Hypervisor
Virt I/O Server
Shared I/O
Single SMP Hardware System

IBM Power Systems
POWER7
Processor
POWER7 Processor

IBM Power Systems
Processor Technology Roadmap
2001
 Dual Core
 Chip Multi Processing
 Distributed Switch
 Shared L2
 Dynamic LPARs (32)
2004
Dual Core
Enhanced Scaling
SMT
Distributed Switch +
Core Parallelism +
FP Performance +
Memory bandwidth +
Virtualization
2007
Dual Core
High Frequencies
Virtualization +
Memory Subsystem +
Altivec
Instruction Retry
Dyn Energy Mgmt
SMT +
Protection Keys
2010
Multi Core
On-Chip eDRAM
Power Optimized Cores
Mem Subsystem ++
SMT++
Reliability +
VSM & VSX (AltiVec)
Protection Keys+
POWER8
Concept Phase
POWER4
180 nm
POWER5
130 nm
POWER6
65 nm
POWER7
45 nm

IBM Power Systems
POWER5 POWER5+ POWER6 POWER7
Technology 130 nm 90 nm 60 nm 45 nm
Size 389 mm2 245 mm2 341 mm2 567 mm2
Transistors 276 M 276 M 790 M 1.2 B
Cores 2 2 2 4 / 6 / 8
Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz
L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core
L3 Cache 36 MB 36 MB 32 MB 4 MB / Core
Memory Cntrl 1 1 2 / 1 2
LPAR 10 / Core 10 / Core 10 / Core 10 / Core
Processor Designs

IBM Power Systems
POWER7 Processor Chip •Cores : 8 ( 4 / 6 core options )
•567mm2 Technology:
–45nm lithography, Cu, SOI, eDRAM
•Transistors: 1.2 B
–Equivalent function of 2.7B
–eDRAM efficiency
•Eight processor cores
–12 execution units per core
–4 Way SMT per core – up to 4 threads per core
–32 Threads per chip
–L1: 32 KB I Cache / 32 KB D Cache
–L2: 256 KB per core
–L3: Shared 32MB on chip eDRAM
•Dual DDR3 Memory Controllers
–90 GB/s Memory bandwidth per chip
•Scalability up to 32 Sockets
–360 GB/s SMP bandwidth/chip
–20,000 coherent operations in flight
Binary Compatibility with
POWER6
POWER7
CORE
L2 Cache
POWER7
CORE
L2
Cache
POWER7
CORE
L2 Cache
POWER7
CORE
L2
Cache
POWER7
CORE
L2 Cache
POWER7
CORE
L2
Cache
POWER7
CORE
L2 Cache
POWER7
CORE
L2
Cache
L3 Cache and
Chip Interconnect
MC1
MC0
Local SMP Links
Remote SMP & I/O Links
F
A
S
T
L3 REGION

IBM Power Systems
eDRAM technology
IBM’s eDRAM technology benefits: Greater density, Less power
requirements, Fewer soft errors, and Better performance
Enables POWER7 to provide 32MB of internal L3 Cache
L3 Cache critical to balanced design / performance:
 6:1 Latency improvement for L3 accesses vs external L3
 2X Bandwidth improvement with on chip interconnect. 32B busses
to and from each core
 No off chip driver or receivers in L3 access path.
eDRAM is nearly as fast as conventional SRAM but requires far less
space
 1/3 the space of conventional 6T SRAM implementation
 1/5 the standby power
 Soft Error Rate 250x lower than SRAM ( Better availability )
 1.5 Billion reduction in transistors
IBM is effectively doubling microprocessor performance beyond what
classical scaling alone can achieve,” said Dr. Subramanian Iyer, DE
(Distinguished Engineer)
DT
EDRAM Cell

IBM Power Systems
POWER7 Core
64-bit PowerPC architecture v2.07
Execution Units
•2 Fixed Point Units
•2 Load Store Units
•4 Double Precision Floating Point Units
•1 Branch
•1 Condition Register
•1 Vector Unit
•1 Decimal Floating Point Unit
•6 Wide Dispatch
•Units include distributed Recovery Function
Out of Order Execution
Modes: POWER6, POWER6+ and POWER7
L2 Cache
IFU
CRU/BRU
ISU
DFU
FXU
VSX
FPU
LSU
•POWER7 continues to support VMX / Extends SIMD support with
VSX
–2 VSX units that can each handle 2 Double-Precision FP instructions
–8 FLOPS per cycles
–VSX units can also handle 4 Single Precision instructions per cycle
–VSX instruction set support for vector and scalar instructions

IBM Power Systems
AIX
Release/TL
Max Cores
& Threads
Supported
POWER6
Mode
POWER7
Mode
AIX 5.3
(All TLs
Supported
64 / 128 N/A
AIX 6.1 TL2,
TL3
64 / 128 N/A
AIX 6.1 TL4 64 / 128 64 / 256
AIX 6.1 TL5 64 / 128 64 / 256
AIX 7.1 64 / 128 256 / 1024
POWER7 Modes: IBM i and AIX
IBM i
Release
Max
Cores
& Threads
Supported
POWER6
Mode
POWER7
Mode
IBM i 6.1 32 / 64 32 / 128
Special
Support
64/128 32 / 128
IBM i 7.1 32 / 64 32 / 128
Special
Support
64/128 64 / 256

IBM Power Systems
21
Linux Max
Processors
& Threads
Supported
POWER6
Mode
POWER7
Mode
RHEL 5 ( Updates newer than U4) 64 / 128 N/A
SLES 10 SP# and newer 64 / 128 N/A
SLES 11 ( All Service Packs) 64 / 128 256 / 1024
RHEL 6 (Next major RHEL version) 64 / 128 256 / 1024
POWER7 Modes: Linux

IBM Power Systems
POWER7 Design
Physical Design:
•8 cores with integrated cache and
memory controllers
•4 / 6 / 8 Core options
•45nm technology
Features:
•4th Generation SMP Fabric Bus
•3rd Generation Multi-Threading
•New Power Bus
•Energy Optimized Design
•Multiple Memory Controllers
•DDR3 memory support
•Enhanced GX System Buses
•On-Chip L2/L3 Cache
•eDRAM L3 Cache
•Industry Standard IO
Core
L2
Core
L2
Memory
Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
P
O
W
E
R
B
U
S
S
M
P
F
A
B
R
I
C
L3 Cache

IBM Power Systems
Transition from POWER6
POWER6
Memory+
GX+
Bridge
Memory+
GX Bus Cntrl
Memory
Cntrl
Memory
Cntrl
Fabric Bus
Controller
Core
Alti
Vec
L3
Ctrl L3
L3
Ctrl
L3
Core
Alti
Vec
4 MB
L2
4 MB
L2
Core
L2
Core
L2
Memory
Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
S
M
P
F
A
B
R
I
C
P
O
W
E
R
B
U
S
POWER7
Memory++
L3 Cache

IBM Power Systems
Memory Channel Bandwidth Evolution
DDR2 @ 553 / 667 MHz
Effective Bandwidth:
2.6 GB/sec
DDR3 @ 1066 MHz
6.4 GB/sec
DDR2 @ 553 MHz
1.1 GB/s
POWER5 POWER6 POWER7
Memory Performance:
2x DIMM
Memory Performance:
4x DIMM
Memory Performance:
6x DIMM
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3

IBM Power Systems
Multi-threading Evolution
Thread 1 Executing
Thread 0 Executing
No Thread Executing
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
Single thread Out of Order
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
S80 Hardware Multi-thread
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
POWER5 2 Way SMT
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
POWER7 4 Way SMT
Thread 3 Executing
Thread 2 Executing

IBM Power Systems
POWER7 TurboCore Mode
• TurboCore Chips: 4
available cores
• Aggregation of L3 Caches
of unused cores.
•TurboCore chips have a 2X
the L3 Cache per Chip
available
–4 TurboCore Chips L3 = 32 MB
• Performance gain over
POWER6.
–Provides up to 1.5X per core to core
• Chips run at higher
Unused
Core
TurboCores
Core
L2
Core
L2
Memory
Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
S
M
P
F
A
B
R
I
C
P
O
W
E
R
B
U
S
32 MB
L3 Cache
POWER7 Chip
Power 780 TurboCore Chip

IBM Power Systems
Core
L2
Core
L2
Memory
Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
S
M
P
F
A
B
R
I
C
P
O
W
E
R
B
U
S
24 MB L3 Cache
POWER7 Core / Cache options
6-Core Chip
Power 750 & Power 770

IBM Power Systems
POWER7 SMT4
•Standard Cache Option
•All cores active
•Requires POWER7 Mode
– POWER6 Mode supports SMT1 and SMT2
•Operating System Support
– AIX 6.1 and AIX 7.1
– IBM i 6.1 and 7.1
– Linux
•Dynamic Runtime SMT scheduling
– Spread work among cores to execute in
appropriate threaded mode
– Can dynamical shift between modes as
required: SMT1 / SMT2 / SMT4
•LPAR-wide SMT controls
– ST, SMT2, SMT4 modes
– smtctl / mpstat commands
•Mixed SMT modes supported within same
LPAR
– Requires use of “Resource Groups”
0
0.5
1
1.5
2
SMT1 SMT2 SMT4

IBM Power Systems
POWER7 Multi-threading Options
•TurboCore
option
•50% of the
cores active
0
0.5
1
1.5
2
2.5
SMT4 SMT2 Single
0
0.5
1
1.5
2
2.5
SMT4 SMT2 Single
•MaxCore option
•All cores active
Based of rPerf workload

IBM Power Systems
Fully Optimized POWER7 Module Packaging
•Distributed Enterprise/SMB, Infrastructure Consolidation
–Low-cost organic module designed for 2/4 socket platforms
–Targets infrastructure consolidation, distributed enterprise and SMB
–Targets sweet spot of performance, scalability and reliability
–High-density, low-power options
•Large Scale Enterprise and Server Consolidation
–Glass ceramic targets leadership performance, scalability and reliability
–Designed for enterprise database, ERP, CRM and decision support
–Ideal for mission-critical and highly virtualized environments
–Supports scalability up to 32 sockets
•Massive Scale-Out
–Quad-chip MCM targets high octane MFLOP engines
–Targets unparalleled capacity for modeling complex systems and compute-intensive research
–Scales up to 256 w eight-core processors per server and networked clusters of thousands of
servers driving >PFLOP capability
2/4s Blades and Racks
Single Chip Organic
High-End and Mid-Range
Single Chip Glass Ceramic
Compute Intensive
Quad-chip MCM

IBM Power Systems
POWER7 Offerings…
Power 750
Power 755 Power 770
Power 780

IBM Power Systems
High-End / Mid-Range Packaging
High-End and Mid-Range
Single Chip Glass Ceramic (61mm)
3363 Pins

IBM Power Systems
POWER7
Core Offerings

IBM Power Systems
Processor Offerings for Blades / Rack / HPC
POWER7 Processor
Offerings
Cores / Socket 4 6 8
PS700 / 701 / 702 Yes - Yes
Power 750 - Yes Yes (3)
Power 755 - - Yes
Configuration
Options
Sockets 1 2 3 4
6 Core Chips 6 Cores 12 Cores 18 Cores 24 Cores
1-4 Socket System

IBM Power Systems
Processor Offerings for Modular Systems
POWER7
TurboCore /
CoD Processor
Offerings
Cores / Socket 4 TurboCore 6 8 Base 8 Enhanced
Power 770 - Yes Yes -
Power 780 Yes - - Yes
Configuration
Options
Enclosures 1 2 3 4

IBM Power Systems
Energy
Management

IBM Power Systems
EnergyScale
•EnergyScale is IBM Trademark. It consists of a
built-in Thermal Power Management Device
(TPMD) card and Power Executive software.
•IBM Systems Director is also required to manage
Energy-Scale functions.
•EnergyScale is used to dynamically optimizes
the processor performance versus processor
power and system workload.
•IBM Systems Director is also required to manage
AEM functions and supports the following
functions:
37

IBM Power Systems
Definition of Terms
•Energy Trending
–EnergyScale provides continuous
collection of real-time server energy
consumption. This energy usage data
may be displayed or exported by IBM
Systems Director Active Energy
Manager.
–Administrators may use such
information to predict data center 38

IBM Power Systems
Definition of Terms (continued)
•StaticEnergy Saver Mode
–Static Energy Saver lowers the processor
frequency and voltage on an Power 750 a
fixed amount, reducing the energy
consumption of the system while still
delivering predictable performance.
–This percentage is predetermined to be
within a safe operating limit and is not user
configurable.
–Active Energy Manager is the 39

IBM Power Systems
•Dynamic Energy Saver Mode
–Dynamic Energy Saver varies processor frequency and
voltage based on the utilization of the Power 750
POWER7 processors.
–The user must configure this setting from Active Energy
Manager.
–Processor frequency and utilization are inversely
proportional for most workloads, implying that as the
frequency of a processor increases, its utilization
decreases, given a constant workload.
–Dynamic Energy Saver takes advantage of this
relationship to detect opportunities to save power, based
on measured real-time system utilization. 40

IBM Power Systems
•Energy Capping
–Power Capping enforces a user specified
limit on energy consumption.
–The user must set and enable an energy
cap from the Active Energy Manager user
interface.
–In most data centers and other installations,
when a machine is installed, a certain
amount of energy is allocated to it.
41

IBM Power Systems
•“Soft” Energy Capping
–There are two power ranges into which the
power cap may be set .
–When a power cap is set in the guaranteed
range (described above), the system is
guaranteed to use less energy than the cap
setting.
–Setting a energy cap in this region allows
for the recovery of the margined power, but
in many cases cannot be used to save 42

IBM Power Systems
•Processor Nap
–The IBM POWER7 processor uses a low-
power mode called Nap that stops processor
execution when there is no work to do on
that processor core.
–The latency of exiting Nap falls within a
partition dispatch (context switch) such that
the Hypervisor firmware can use it as a
general purpose idle state.
–When the Operating System detects that a 43

IBM Power Systems
•Processor Nap
–If the processor core is in a shared
processor pool (the set of cores being used
for micro-partition dispatching) and there is
no micro-partition to dispatch, the
Hypervisor puts the second thread into Nap
mode.
–By entering Nap mode, it allows the
hardware to clock off most of the circuits
inside the processor core.
44

IBM Power Systems
•Energy-Optimized Fan Control and Altitude Input
–On the Power 750, firmware will dynamically
adjust fan speed based on energy
consumption, altitude, ambient temperature, &
energy savings modes.
–Systems are designed to operate in worst-
case environments, in hot ambient
temperatures, at high altitudes, & with high
power components.
–In a typical case, one or more of these 45

IBM Power Systems
•Processor Folding
–Processor Folding is a consolidation
technique that dynamically adjusts, over the
short-term, the number of processors
available for dispatch to match the number
of processors demanded by the workload.
–As the workload increases, the number of
processors made available increases; as the
workload decreases, the number of
processors made available decreases.
46

IBM Power Systems
POWER7
TPMD

IBM Power Systems
TPMD: Thermal Power Management Device
• TPMD card is part of the base hardware configuration.
• Residing on the processor planar
• TPMD function is comprised of a risk processor and data acquisition
• TPMD monitor power usage and temperatures in real time
• Responsible for thermal protection of the processor cards
• Can adjust the processor power and performance in real time.
• If the temperature exceeds an upper (functional) threshold, TPMD actively
reduces power consumption by reducing processor voltage and frequency or
throttling memory as needed.
• If the temperature is lower than upper (functional) threshold, TPMD will allows
POWER7 cores to “Over clock” if workloads demands are present.

IBM Power Systems
POWER7 “Over Clock” Uplift

IBM Power Systems
Active Energy Manager Benefits:
•Monitor energy consumption to allow better
utilization of available energy resources.
•Can trend actual energy consumption and
corresponding thermal loading of IBM Systems
running in their environment with their applications. :
–Allocate less power and cooling infrastructure to IBM
servers
–Lower power usage on select IBM servers
–Plan for the future by viewing trends of power usage over
time
–Determine power usage for all components of a rack
50

IBM Power Systems
POWER7
Model 750
POWER7
Model 750

IBM Power Systems
Power 750 Product Features
•Features of the Power 750:8233-E8B…
–POWER7 processor with multiple cores
•32-ways (8 cores/processor card x 4 processor cards)
–Industry Standard RDIMM, DDR3 1066 Mbps with
enhanced memory RAS features including 64-byte marking
ECC code, and ChipKill detection and correction.
•512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4
processor cards)
–8 hot plug and front access SFF SAS DASD.
–1 slim media bay for DVD.
–1 half high bay for tape drive.
–Hot plug 3 PCIe slots and two PCIX slots with Enhanced
Error Handling.
–One GX+ slot and one GX++ slot (not hot pluggable) 52

IBM Power Systems
Power 750 System 8233-E8B
POWER7 Architecture 6 Cores @ 3.3 GHz
8 Cores @ 3. 0, 3.3, 3.55 GHz
Max: 4 Sockets
DDR3 Memory Up to 512 GB
System Unit SAS SFF
Bays
Up to 8 Drives (HDD or SSD)
73 / 146 / 300GB @ 15k (2.4 TB)
(Opt: cache & RAID-5/6)
System Unit
IO Expansion Slots
PCIe x8: 3 Slots (2 shared)
PCI-X DDR: 2 Slots
1 GX+ & Opt 1 GX++ 12X cards
Integrated SAS / SATA Yes
System Unit
Integrated Ports
3 USB, 2 Serial, 2 HMC
Integrated Virtual
Ethernet
Quad 10/100/1000
Optional: Dual 10 Gb
System Unit Media
Bays
1 Slim-line DVD & 1 Half Height
IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX
Cluster 12X SDR / DDR (IB technology)
Redundant Power and
Cooling
Yes (AC or DC Power)
Single phase 240 VAC or -48 VDC
Certification (SoD) NEBS / ETSI for harsh
4U
Depth: 28.8”

IBM Power Systems
Power 750 System Overview
•8 SFF Bays
•(Disk or SSD)
•Dual Power
Supplies
•Half-High Bay
•(tape or removable disk
•Up to 4
•Processor /
Memory
Cards
•3 PCIe & 2 PCI-X
•Slots
•Fans
•TPMD
•DVD

IBM Power Systems
55
Power
Supplies
Tape Drive
Remove DASD Bay
DVD Drive
Operator Panel
8 SFF DASD / SSD
Power 750 Front View

IBM Power Systems
56
SAS Port
System
Port 1
System
Port 2
USB
Ports
HMC
Ports
IVE
Ethernet
PCIe
Slot 1
or
GX++ Slot
PCIe
Slot 2
or
GX+ Slot
PCIe
Slot 3
PCIX
Slot 5
PCIX
Slot 4
Power 750 Rear View
SPCN

IBM Power Systems
57
POWER7
chip Enhanced Buffer controller
4 DIMM Slots
4 DIMM Slots
Processor Card
Processor Cards
6-core 3.3 GHz #8335 – 1 to 4 per server
8-core 3.55 GHz #8336 – 4 per server
All processor cards on the same server must be identical feature code
Processor
VRM
Memory VRM

IBM Power Systems
58
Power 750 System Layout
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
Power
Supply 1
Power
Supply 2
8 SFF / SSD
DASD
SLIM
DVD
Tape Drive
Anchor Card
Cache RAID Card (opt)
Aux Write Cache (opt)
SPCN1
SPCN2
HMC1
HMC2
S1
S2
GX++ Slot
TPMD
SAS
Controller
DASD
&
Media
Back
Plane
IO Controller
USB
USB
RJ45
RJ45
ENET
PHY
RJ45
RJ45
ENET
PHY
PCI-X S4
PCIe S3
PCI-X S5
PCIe S2
PCIe S1
USB
MUX
GX+ Slot
FSP
Op-Panel
Ext SAS
USB
2nd Proc / Memory
Card required for
GX++ Bus

IBM Power Systems
Memory Options for Power 750 / 755
Feature
Size (2 DIMM)
DIMM
Size
Memory
Speed
750 Max
Memory
8 GB 4 GB 1066 MHz 128 GB
16 GB 8 GB 1066 MHz 256 GB
32 GB 16 GB 1066 MHz 512 GB
Power 755
Power 750
Feature
Size (2 DIMM)
DIMM
Size
Memory
Speed
755 Max
Memory
8 GB 4 GB 1066 MHz 128 GB
16 GB 8 GB 1066 MHz 256 GB

IBM Power Systems
Power 750 Memory
•8 DDR3 DIMM slots per processor card
•DIMMS: 4GB, 8GB and 16GB
•Plugged in pairs. 1 feature code = 1 pair
•Min = 1 feature per SERVER, but min 1 feat per
Proc card recommended
•Can NOT mix different size DIMMs on same
processor card
•Can have different size DIMMs on same server.
One proc card GB memory
capacity with
DIMM
size
1 Pair 2 Pair 3 Pair 4 Pair
4 GB 8 16 24 32
8 GB 16 32 48 64
16 GB 32 64 96 128
Feature
Code
Feature
GB
#4526 16
#4527 32
#4528 64
The following is for ONE processor card in the Power 750
# Proc
card
1 2 3 4
DIMM
slots
8 16 24 32
Min/Max
GB
8 /
128
8 /
256
8 / 384 8 / 512

IBM Power Systems
POWER7 Memory Bandwidth (750 / 755 / Blades )
POWER7
Mem
Cntrl
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
Nova
Max Read Bandwidth: 51.168 GB/sec
Max Write Bandwidth: 25.584 GB/sec
Max Combined Bandwidth: 68.224 GB/sec
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
Nova
Nova
Nova
Each Nova Chip
(Read/Write Buffer)
supports two DIMMS
Chip Bandwidth

IBM Power Systems
Memory Bandwidth
L1 ( Data ) 170.4 GB/sec
L2 170.4 GB/sec
L3 113.6 GB/sec
Memory 68.224 GB/sec per Socket
272.896 GB/sec per System
Intra-Node
Buses
6.4 GB/sec
GX++ Bus (12X DDR)
GX+ Bus (12X SDR)
20 GB/sec
10 GB/sec ( Shared )
GX Bus Slot 1
GX Bus Slot 2
Internal IO Slots
Total IO Bandwidth
20 GB/sec
5** GB/sec
5** GB/sec
30 GB/sec
Power 750 Bandwidth @ 3.55 GHz
** Pass thru bus

IBM Power Systems
Power 750 Information….
•Physical Specifications:
–Width: 440 mm (17.3 in)
–Depth: 730.8 mm (28.8 in)
–Height: 175 mm (6.89 in)
–Weight: 54.4 kg (120 lb)
•Operating voltage:
–200 to 240 V
•Operating Frequency: 50/60 Hz
•Power Consumption: 1950 watts
(maximum)
•Power Factor: 0.97
•Thermal Output: 4778 Btu/hour (maximum)

IBM Power Systems
Functional Differences
Power 550 Power 750
Up to 8 Cores (4 sockets) Up to 32 Cores (4 sockets)
Up to 256 GB Memory
32 DIMM slots
Up to 512 GB Memory
32 DIMM slots
DDR2 DIMMS DDR3 DIMMs
6 3.5 in or 8 SFF SAS disk/SSD 8 SFF SAS disk/SSD
3 PCIe & 2 PCI-X slots 3 PCIe & 2 PCI-X slots
Commercial focus Commercial & HPC focus
GX Bus & GX Passthru Slots GX Bus & GX Passthru Slots
IVE: Dual Gb
Optional: Quad Gb, or 10 Gb
IVE: Quad Gb
Optional: Dual 10 Gb
TPMD Enhanced TPMD
Guiding Light Light Path

IBM Power Systems
Comparative Information….

IBM Power Systems
Bandwidth Properties…
0
10
20
30
40
50
60
70
Memory Intra IO
Power 550 Power 750

IBM Power Systems
POWER7 / POWER6 Comparison
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
Energy Consumption Thermal
Power 750 Power 550 Power 560
Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active

IBM Power Systems
Power 750 vs Power 550 / 560
Performance* / KW Performance* / K BTU
* Calculated on rPerf, CPW results siimilar

IBM Power Systems
POWER7
Model 755

IBM Power Systems
Power 755 HPC: 8236-E8C
•Power 755 / Power 750 Differences:
1.Only an 8-core 3.3GHz will be offered
2.Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards).
3.No 16GB DIMM - Maximum memory is 256GB.
4.No IBM i O/S support
5.No PowerVM features (i.e. no LPAR or DLPAR)
6.No RAID feature (CCIN 57B7 & 57B8)
7.No Split Disk feature
8.No tape drive
9.No external I/O Drawers (e.g. Tres 19 Drawers)
10.No IB 12x SDR adapter (CCIN 1817)
71

IBM Power Systems
5.3 / 6.1 RHEL / SLES
Power 755 4-Socket HPC System
8236-E8C
POWER7
Architecture
4 Processor Sockets = 32 Cores
8 Core @ 3.3 GHz
DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots
System Unit
SAS SFF Bays
Up to 8 disk or SSD
73 / 146 / 300GB @ 15K (up to
2.4TB)
System Unit
Expansion
PCIe x8: 3 Slots (1 shared)
PCI-X DDR: 2 Slots
GX++ Bus
Integrated Ports 3 USB, 2 Serial, 2 HMC
Integrated
Ethernet
Quad 1Gb Copper
(Opt: Dual 10Gb Copper or Fiber)
System Unit Media
Bay
1 DVD-RAM ( No supported tape
bay )
Cluster Up to 64 nodes
Ethernet or IB-DDR
Redundant Power Yes (AC or DC Power)
Single phase 240vac or -48 VDC
Up to 8.4 TFlops per Rack
( 10 nodes per Rack )
4U x 28.8” depth

IBM Power Systems
73
Power 755 System Layout
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Core
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
DIMM
DIMM
SN
POWER7
Chip
Power
Supply 1
Power
Supply 2
8 SFF / SSD
DASD
SLIM
DVD
Anchor Card
SPCN1
SPCN2
HMC1
HMC2
S1
S2
GX++ Slot
TPMD
SAS
Controller
DASD
&
Media
Back
Plane
IO Controller
USB
USB
RJ45
RJ45
ENET
PHY
RJ45
RJ45
ENET
PHY
PCI-X S4
PCIe S3
PCI-X S5
PCIe S2
PCIe S1
USB
MUX
FSP
Op-Panel
Ext SAS
USB

IBM Power Systems
1H / 2010
Scaling 64 nodes (32 Cores/node)
54 TFlops
Operating Systems AIX 6.1 TL 04 / 05
Linux
HPC Stack Levels xCAT v2.3.x
GPFS v3.3.x
PESSL v3.3.x
LL v4.1.x
PE v5.2.x
ESSL Beta (GA 06/2010)
ESSL v5.1
Compilers GA Levels
XLF v13.1
VAC/C++ v11.1
Power 755 HPC Cluster Node
IB-DDR
Interconnect
Data Center in a Rack
Up to 10 Nodes per Rack
Air cooled

IBM Power Systems
POWER5+ 575
(1.9GHz)
Power 575
(4.7GHz)
Power 755
(3.3GHz)
Latency (cycles/ns) 220 cycles / 110ns 420 cycles / 90ns 336 cycles / 102ns
Bus 2 X DRAM Freq 4 X DRAM Freq 6 X DRAM Freq
Memory Controllers
per chip
1 per chip 1 (2 in HE) 1
Peak Bandwidth
per chip
25GB/s 34GB/s 68 GB/s
DRAM Technology DDR2 DDR2 DDR3
Power 755 Memory

IBM Power Systems
Power 755 Power 575
Cores/chip 8 4
Total cores 32 32
Frequency 3.3 GHz 4.7 GHz
Memory (max) 256 GB 256 GB
Performance / TFlops .84 .6
Cooling Air Water
Cores/rack
Rack type
320
19”
448
24”
Power (Watts) 1650 5400
755 offers the same core count per node
40% better performance per node (Linpack)
1/3 the power per node
37% less floor space for a 64 node configuration.
Power 755 vs Power 575

IBM Power Systems
Feature 755 750
Processors 32-core @ 3.3 GHz 32-core @ 3.55 GHz
6 / 12 / 18 / 24-core @ 3.3 GHz
8 / 16 / 24 / 32-core @ 3.0 GHz
Memory 128GB OR 256GB
4GB & 8GB DIMMS
512GB Max.
4GB, 8GB, 16GB DIMMS
GX slot support Yes – IB clustering Yes
I/O Drawer support No Yes
DASD Backplane No Split Backplane Split Backplane support
Integrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbE
Virtualization No PowerVM support PowerVM Std and Ent
DASD / Bays 8 SFF SAS HDD / SDD
10k and 15K SFF drives
8 SFF SAS HDD / SDD
10k and 15K SFF drives
Optional RAID
Internal Tape No Yes
Performance Metric TFLOPS rPerf
Misc. No IBM i Support IBM i Support
Power 755 vs. 750 Offering Structures

IBM Power Systems
POWER7
Model 770
Model 780

IBM Power Systems
Power 770 Power 770
Processor Technology 6 Cores @ 3.55 GHz
8 Cores @ 3.1 GHz
L3 Cache On Chip
Redundant Power &
Cooling
Yes
Redundant Server
Processor
Yes / Two
Enclosure minimum
Redundant Clock Yes / Two
Enclosure minimum
Concurrent Add Support Yes
Concurrent Service Yes
System Unit Single Enclosure 4 Enclosures
Processors Up to 2 Sockets 8 Sockets
DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB
SAS/SSD SFF Bays 6 24
DVD-RAM Media Bays 1 Slim-line 4 Slim-line
SAS / SATA Controller 2 / 1 8 / 4
PCIe bays 6 PCIe 24 PCIe
GX++ Slots (12X DDR) 2 8
Integrated Ethernet Std: Quad 1Gb
Opt: Dual 10Gb +
Std: Four Quad 1Gb
Opt: Four x Dual 10Gb +
Maint Coverage: 9 x 5
4U x 32 inches Depth

IBM Power Systems
Power 780
Power 780
Processor Technology 4 Cores @ 4.1 GHz
TurboCore
8 Cores @ 3.8 GHz
L3 Cache On Chip
Redundant Power & Cooling Yes
Redundant Server Processor Yes / Two Enclosure
minimum
Redundant Clock Yes / Two Enclosure
minimum
Concurrent Add Support Yes
Concurrent Service Yes
System Unit Single Enclosure 4 Enclosures
Processors 2 Sockets 8 Sockets
DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB
SAS/SSD SFF Bays (CEC) 6 24
DVD-RAM Media Bays 1 Slim-line 4 Slim-line
SAS / SATA Controller 2 / 1 8 / 4
PCIe (CEC) 6 PCIe 24 PCIe
GX++ Slots (12X DDR) 2 8
Integrated Ethernet Std: Quad 1Gb Std: Four Quad 1Gb
Maint Coverage
24 X 7
PowerCare Support

IBM Power Systems
POWER7
Processor
Chip
16 DIMM slots
PCIe
Slots
FSP
GX
Slots
6 SFF
Bays
POWER7
Processor
Chip
Interconnect
TPMD
POWER7 Modular Layout

IBM Power Systems
POWER7 Modular Front View
Fabric
Interconnects
6 SFF Bays
DVD
Fans
Op Panel

IBM Power Systems
POWER7 Modular Rear View
Two GX++ Bays
IVE
Ports
Two Power
Supplies
FSP
Connectors
HMC
Ports
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
SPCN
Ports
HMC
Ports
Serial
Port
USB
Ports

IBM Power Systems
POWER7 Modular System View
Socket
Socket
Fan
Fan
Fan
Fan
Fan
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
FSP & Clock
Regulator
Memory DIMMs
Qty: 8
Memory DIMMs
Qty: 4
Memory DIMMs
Qty: 4
TPMD
Power
GX++ (12X)
SFF
16 DIMM cards

IBM Power Systems
Power 770 and Power 780 Processor Options
Socket
Socket
Memory
Memory
Memory
Power 780 Processor Options (2 Sockets per enclosure )
 8-core 4.14 GHz #4982 – 1 to 4 per server - Turbo Core
Power 770 Processor Options (2 Sockets per enclosure )

IBM Power Systems
Modular Block Diagram…..
RAID
Battery
RAID
Battery
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
8 SN
Dimms
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PSI
Media
X Bus
A/B Buses
8 SN
Dimms
Write Cache
Y Bus
Z Bus
CPU CARD
DASD Backplane
PSI
I/O
Backplane
PWR7
Ext
SAS
GX++
A/B Buses
GX++
Write Cache
FSP
Card
SAS
SAS EXP
EXP
PCIe Buses
PCIe
Buses
SATA
4 x 1Gb Eth
2 x HMC
Anchor
Card
PWR7
GX++
Busses
GX++
Busses
IVE
IVE
USB
PCI-X
Serial
PCI-X
IVE
USB Serial
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
TPMD
IOC2
IOC2

IBM Power Systems
Cooling Domains
Air Flow Domain 1
Fans (5)
Power Supply Fans
(built-in)
Front Rear
POWER7 Modular supports Hot-Plug and Redundant cooling.
There are five fans across the front of the box drawing in room air and is the primary cooling domain.
Cool the processors, memory and I/O sub-system.
TPMD controls this domain through the FSP.
Control algorithm uses the processor, memory and I/O subsystem temperatures as input for fan control.
Second cooling domain, that uses fans inside of each power supply
Cools the power supplies and DASD.
SPCN controls the fan speed on the power supplies.
If the DASD/SSD cage is not installed, SPCN relinquishes control of the fans to the power supplies.
Power supplies control fan speed based on internal power supply temperatures.
Fan redundancy is limited to 1 fan fault per domain.
More than one failing fan in each domain will force a drawer shutdown.

IBM Power Systems
POWER7 Modular Memory Card Options
Feature
Size (4 DIMM card)
DIMM
Size
Memory
Speed
Max
Memory
32 GB 8 GB 1066 MHz 512 GB
64 GB 16 GB 1066 MHz 1 TB
128 GB 32 GB 800 MHz 2 TB
4Q10 planned

IBM Power Systems
POWER7
Chip
DIMM 1 SN
DIMM 2 SN
DIMM 3 SN
DIMM 4 SN
DIMM 5 SN
DIMM 6 SN
DIMM 7 SN
DIMM 8 SN
Mem
Ctrl 1
Mem
Ctrl 0
D
C
B
A
A
B
C
D
POWER7 Modular Memory Layout

IBM Power Systems
POWER7 Modular Memory Bandwidth
POWER7
Mem
Cntrl
DRAMs…
DRAMs…
Mem
Cntrl
Max Read Bandwidth: 102.336 GB/sec
Max Write Bandwidth: 51.168 GB/sec
Max Combined Bandwidth: 136.448 GB/sec
Nova
Nova
Nova
Nova
Nova
Nova
Nova
Nova

IBM Power Systems
Two Enclosure Fabric Topology
2
1
FC #3711 FC #3712

IBM Power Systems
Three Enclosure Fabric Topology
3 2
3
FC #3713
Two cables
FC #3712

IBM Power Systems
Four Enclosure Fabric Topology
2
4
4
3
3
4
FC #3712
FC #3713
Two cables
FC #3714
Three cables

IBM Power Systems
CEC Enclosure 1
FSP/ Clock
CEC Enclosure 2
FSP/ Clock
CEC Enclosure 3
Drw to Drw
Connection
CEC Enclosure 4
Drw to Drw
Connection
Drw to Drw
Connection
Point to Point Cabling
 Three cables
Hot Drawer Add Support
Add cables to live systems
No disruptions
Hot Failover support
FSP
Clock
Concurrent Service Support
FSP Cabling Configuration ( Logical View )
Front
Rear
Drw to Drw
Connection

IBM Power Systems
FSP 4 Enclosure Configuration
Enclosure 1
Enclosure 2
Enclosure 3
Enclosure 4
Cable 2
Cable 1
Cable 3

IBM Power Systems
19-inch Rack Considerations
2
1
Cables wider than CEC
Multi-enclosure configurations
supported in IBM “Enterprise”
racks:
IBM 7014-T00, -T42, #0551, #0553
No problemS with a front door
(regular or acoustic), but if use rack
trim, need new #6247 trim kit
For a Power 780 door with the pretty 780 label, order as feat code of 7014-T42 rack.

IBM Power Systems
POWER7 770 Bandwidth @ 3.1 GHz
Memory Bandwidth
L2 148.8 GB/sec
L3 99.2 GB/sec
Memory
4 Nodes
136.448 GB/sec per socket
1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2
4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2
4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec

IBM Power Systems
Memory Bandwidth
L2 185.28GB/sec
L3 123.52 GB/sec
Memory
4 Nodes
136.448 GB/sec per Socket
1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2
4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2
4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec

IBM Power Systems
Memory Bandwidth
L2 198.72 GB/sec
L3 132.48 GB/sec
Memory
4 Nodes
136.448 GB/sec per Socket
1091.584 GB/sec
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
Int GX Bus 1 & 2
4 Enclosures
19.712 GB/sec
78.848 GB/sec
Ext GX Bus 1 & 2
4 Enclosures
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec

IBM Power Systems
POWER7 Modular Information….
Physical Specifications (4 EIA units)
Width: 483 mm (19.0 in.)
Depth: 863 mm (32.0 in.)
Height: 174 mm (6.85 in)
Weight: 70.3 kg (155 lb)
Operating voltage:
200 to 240 V
Operating Frequency: 50/60 Hz
Power Consumption: 1600 watts (maximum)
Per enclosure with 16 cores active
Power Factor: 0.97
Thermal Output: 5461 Btu/hour (maximum)
 Per enclosure with 16 cores active
Power-source Loading
 1.649 kva (maximum configuration)
Noise Level and Sound
One enclosure with 16 active cores:
6.8 bels / 6.3 bels with acoustic rack doors (operating/idle)
Four enclosures with 64 active cores:
7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)

IBM Power Systems
Power 770 & 780 vs Power 570 Differences
Power 570 Power 770 & 780
Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores
Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB)
DDR2 DIMMS DDR3 DIMMS
Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure
4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure
No write cache or RAID-5/6 support Write cache & RAID-5/6 support
Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers
Optional Split Backplane Standard Split backplane
Optional Tri-Split Backplane
No Power & Management Thermal Power & Thermal management
TPMD support
Clock Cold Failover
No Concurrent Maintenance of FSP/Clock
Concurrent Drawer Maint restrictions
Concurrent Drawer Add cable restrictions
Clock Hot Failover
Planned Concurrent Maintenance
No Restrictions ( 4Q / 2010 )
No Restrictions

IBM Power Systems
Power 570/32 vs 770 Bandwidth Properties…
0
200
400
600
800
1000
1200
Memory Inter Intra IO
POWER6 POWER7

IBM Power Systems
POWER7 / POWER6 Enclosure Comparison
0
1000
2000
3000
4000
5000
6000
Power Consumption Thermal
Power 770 Power 570
POWER7: 16 Cores active / POWER6: 8 Cores Active

IBM Power Systems
rPerf / KW rPerf / KBTU
Power 780/770 vs Power 570/32

IBM Power Systems
rPerf Performance

IBM Power Systems
770 780 595
POWER6
Nodes 4 4 8
Processors 12 - 48 / 16 - 64 8 – 32 / 16 - 64 8 – 64
( Upgradeable to 256 Cores)
Frequency 3.1 GHz
3.5 GHz ( 6 Core )
3.55 GHz
4.14 Core ( 4 Core )
4.2 GHz
5.0 GHz
Memory / core 21 / 16 GB 32 / 16 GB 64 GB
rPerf 493.37 / 579.39 418.64 / 685.09 553
Memory
Bandwidth
1088 GB/sec 1088 GB/sec 1376 GB / sec
IO Bandwidth 236 GB /sec 236 GB/sec 640 GB/sec
Warranty 9 x 5 24 x 7 24 x 7
PowerCare No Yes Yes
IBM Power 770 / 780 Positioning

IBM Power Systems
POWER7
Performance

IBM Power Systems
Simplify Web Facing Application Deployment
1 JVM
AIX TL4
64 bit
16 threads
1 JVM
Windows
64 bit
16 threads
3920
Transactions/sec
IBM Power 750
8 cores
3.55GHz
Nehalem EP
8 cores
2260
Transactions/sec
73% more work per JVM
image
Simpler configurations
Better scale for software
built on application server
Extend WebSphere Application Server to fully exploit up to 32 threads in a single
process, thereby reducing the number of images required
IBM WebSphere Application Server 7
Competitive application server

IBM Power Systems
Simplify SAP Infrastructure And Reduce Costs
Case Study - Support 15,000 Users
1
1
0
IBM Power 750 certification number not available at press time and can be found at sap.com/benchmarks. IBM Power System 750, 4p / 32–c / 128 – t, POWER7, 3.55 GHz, 256 GB memory, 15,600 SD users, dialog resp.: 0.98s, line items/hour:
1,704,330, Dialog steps/hour: 5,113,000, SAPS: 85,220, DB time (dialog/ update):0.015s / 0.028s, CPU utilization: 99%, OS: AIX 6.1, DB2 9.7;
IBM Power 570 16p / 32-c / 64 –t, 256 GB memory, 14,432 SD users, POWER6 4.2 GHz, AIX 6.1, DB2 9.5, cert# 2008057
All results are 2-tier, SAP EHP 4 for SAP ERP 6.0 (Unicode) and valid as of 2/9/2010.
DB2 on
Power 750
Oracle on
Sun T5440
Oracle on
Sun X4640
15,600
SD Users
32 cores
POWER7
4,720
SD Users
32 cores
UltraSPAR
C T2+
10,000
SD Users
48 cores
AMD
Opteron
SAP Sales and Distribution
ERP 6.0 EHP 2-Tier performance
Support 3.3x more users on DB2
and Power 750 than Oracle on SPARC
Infrastructure costs per user
DB2 on Power 750 $100/user
Oracle on Sun T5440 $185/user
Oracle on Sun x4640 $123/user
SAP and DB2 on
Power 750

IBM Power Systems
Power Systems rPerf Performance

IBM Power Systems
POWER4™
p670
1.1 GHz
rPerf: 24.46
KWatts:
6.71
3.64
POWER4+
™ p670
1.5 GHz
rPerf: 46.79
KWatts:
6.71
6.97
POWER5™
p5-570
1.65 GHz
rPerf: 68.4
KWatts: 5.2
13.15
POWER5+
™ p570
1.9 GHz
rPerf: 85.20
KWatts: 5.2
16.38
POWER6™
Power 570
4.7 GHz
rPerf:
134.35
KWatts: 5.6
23.99
POWER6™
Power 570
4.2 GHz
rPerf:
193.25
KWatts: 5.6
34.56
POWER7™
Power 780
3.8 GHz
rPerf:
685.09
KWatts: 6.4
107.04
Performance per Watt

IBM Power Systems
POWER7
Odds and Ends

IBM Power Systems
POWER7 Virtualization Support
Maintain 1 to 10 ratio for Physical cores to LPARs.
Power 750: Up to 160 (320) LPARS
Power 755 Not Supported
Power 770 / 780: Up to 160 (640) LPARs
PS700 Up to 40 LPARS
PS701 Up to 80 LPARs
PS702 Up to 160 LPARs
Active Memory Expansion
Active Memory Expansion compresses in-memory data to fit more data
into memory
Increases the effective amount of memory capacity
Managed by the OS and hypervisor
OS compresses and decompress data based on memory accesses
Is transparent to applications

IBM Power Systems
HMC Support
 HMC V7 R710 is the minimum level for POWER7 support
 HMC used to manage any POWER7 processor based server, must be a
CR3 or later model rack-mount HMC or C05 or later deskside HMC.
 If IBM Systems Director is used to manage an HMC or if the HMC manages
more than 254 partitions, the HMC should have 3GB of RAM minimum and
be a CR3 model or later rack-mount, or C06 or later deskside.

IBM Power Systems
POWER7
OS Support

IBM Power Systems
POWER7 OS Software Support
 AIX 5.3 with the 5300-11 Technology Level and SP2, or later
 AIX 6.1 with the 6100-04 Technology Level and SP3, or later
 IBM i 6.1 with 6.1.1 machine code, or later
 SUSE Linux Enterprise Server 10 with SP3 for POWER
 SUSE Linux Enterprise Server 11 for POWER, or later
 RHEL SoD
 VIOS 2.1.2.12 with Fix Pack 22.1 and Service Pack 2, or later

IBM Power Systems
POWER7 Hardware Support
TL9
TL8
TL10
TL11
TL12
2009 – 2011 AIX TL Roadmap
04/2010 10/2010
AIX 6.1
AIX 5.3
04/2011 10/2011
10/2009
AIX 7.1
TL0
TL1
TL2
SP
Service Pack
POWER7 Support
TL2
TL1
TL3
TL4
TL5
TL6
TL7
TL8
TL12
TL5
TL9
TL10
TL2
TL3
TL11
TL4
SP
SP
SP
SP
SP
SP

IBM Power Systems
Partition Mobility
POWER6
POWER6+
POWER7
Binary Compatibility between POWER6 and POWER7
Leverage POWER6 / POWER6+ Compatibility Mode
Migrate partitions between POWER6 and POWER7 Servers
 Forward and Backward

IBM Power Systems
POWER7
Active Memory
Expansion
POWER7 Processor

IBM Power Systems
POWER7 Advantage
Expand memory beyond physical limits
More effective server consolidation
Run more application workload / users per partition
Run more partitions and more workload per server
Expanded
Memory
True
Memory Effectively up
to 100% more
memory
True
Memory
True
Memory
True
Memory
True
Memory
True
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory

IBM Power Systems
Active Memory Expansion & Active Memory Sharing
Effectively gives more memory
capacity to the partition using
compression / decompression of
the contents in true memory
AIX partitions only
Active Memory Sharing
Moves memory from one partition
to another
Best fit when one partition is not
busy when another partition is
busy
AXI, IBM i, and Linux partitions
Active Memory Expansion Active Memory Sharing
Supported, potentially a very nice option
Considerations
Only AIX partitions using Active Memory Expansion
Active Memory Expansion value is dependent upon compressibility of data
and available CPU resource
0
5
10
15
#10
#9
#8
#7
#6
#5
#4
#3
#2
#1

IBM Power Systems
Innovative POWER7 technology
For AIX 6.1 or later
For POWER7 servers
Uses compression/decompression to effectively expand the true physical
memory available for client workloads
Often a small amount of processor resource provides a significant increase in
the effective memory maximum
Processor resource part of AIX partition’s resource and licensing
Actual expansion results dependent upon how “compressible” the data being
used in the application
A SAP ERP sample workload shows up to 100% expansion,
Your results will vary
Estimator tool and free trial available

IBM Power Systems
Active Memory Expansion – Client Deployment
1
Planning Tool
A.Part of AIX 6.1 TL4
B.Calculates data
compressibility &
estimates CPU overhead
due to Active Memory
Expansion
C.Provides initial
recommendations
2
60-Day Trial
A.One-time, temporarily
enablement
B.Config LPAR based on
planning tool
C.Use AIX tools to
monitor Act Mem Exp
environment
D.Tune based on actual
results
3
Deploy into Production
A.Permanently enable
Active Memory
Expansion
B.Deploy workload into
production
C.Continue to monitor
workload using AIX
performance tools
Memory Expansion
CPU
Utilizatio
Estimated Results
CPU
Utilization
Memory Expansion
App.
Performa
Memory Expansion Time
Performance
Actual Results

IBM Power Systems
Active Memory Expansion - Planning Tool
Tool included in AIX 6.1 TL4 SP2
Run tool in the partition of interest for memory expansion.
Input desired expanded memory size. Tool outputs different real memory
and CPU resource combinations to achieve the desired effective memory.
Active Memory Expansion Modeled Statistics:
-----------------------
Modeled Expanded Memory Size : 8.00 GB
Expansion True Memory Modeled Memory CPU Usage
Factor Modeled Size Gain Estimate
--------- -------------- ----------------- -----------
1.21 6.75 GB 1.25 GB [ 19%] 0.00
1.31 6.25 GB 1.75 GB [ 28%] 0.20
1.41 5.75 GB 2.25 GB [ 39%] 0.35
1.51 5.50 GB 2.50 GB[ 45%] 0.58
1.61 5.00 GB 3.00 GB [ 60%] 1.46
Active Memory Expansion Recommendation:
---------------------
The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
This sample partition
has fairly good
expansion potential
A nice “sweet” spot for
this partition appears
to be 45% expansion
•2.5 GB gained memory
•Using about 0.58 cores
additional CPU resource

IBM Power Systems
Active Memory Expansion: Partition On / Off
With HMC, check Active Memory
Expansion box and enter
True and max memory
Memory expansion factor
To turn off expansion, unclick box
Partition IPL required to turn on or off
Active Memory Expansion Modeled Statistics:
-----------------------
Modeled Expanded Memory Size : 8.00 GB
Expansion True Memory Modeled Memory CPU Usage
Factor Modeled Size Gain Estimate
--------- -------------- ----------------- -----------
1.21 6.75 GB 1.25 GB [ 19%] 0.00
1.31 6.25 GB 1.75 GB [ 28%] 0.20
1.41 5.75 GB 2.25 GB [ 39%] 0.35
1.51 5.50 GB 2.50 GB [ 45%] 0.58
1.61 5.00 GB 3.00 GB [ 60%] 1.46
Active Memory Expansion Recommendation:
---------------------
The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
5.5 true
8.0 max

IBM Power Systems
Upgrades
POWER7 Processor

IBM Power Systems
Upgrades from POWER6 and POWER6+
Power 780
3.8 GHz / 4.1 GHz
POWER6+ 570/32
4.2 GHz
POWER6 570
3.5, 4,2, 4.7 GHz
9117-MMA
9117-MMB
All existing POWER6 570 systems can upgrade to POWER7
Power 770
3.5 GHz
POWER6+ 570
4.4, 5.0 GHz
9179-MHB
POWER6 upgrades to POWER7
POWER6+ upgrades to POWER7
Power 570/32 upgrades to POWER7
POWER7 System Upgrades

IBM Power Systems
POWER6+ 570/32
9117-MMA 4.2 GHz
POWER6+ 570
9117-MMA 4.4, 5.0 GHz
POWER6 570
9117-MMA 3.5, 4.2, 4.7 GHz
POWER6 570
9406-MMA 4.7 GHz
POWER7 780
9179-MHB 3.8 / 4.1 GHz
POWER7 770
9117-MMB 3.5 GHz
POWER7 770
9117-MMB 3.1 GHz
•No direct POWER5 upgrades to POWER7.
Use 2-step upgrade, first to POWER6 then
to POWER7.
•Upgrades to POWER6 570 available as
long as new box sales of POWER6 570
available
•Withdrawal planned end 2010
Power 770 and Power 780 Upgrades

IBM Power Systems
I/O Upgrade Considerations
All the newer IBM I/O drawers, disk, SSD and PCI adapters used on POWER6
supported on POWER7 servers
May need to move 3.5-inch SAS drives and PCI-X adapters
Older I/O on POWER6 servers, but not on POWER7 servers
RIO / RIO2 / HSL I/O drawers
SCSI disk smaller than 69GB or SCSI drives slower than 15k rpm
QIC tape drives
IOPs and IOP-based PCI adapters (IBM i)
2749, 5702, 5712, 2757, 5581, 5591, 2790, 5580, 5590, 5704, 5761, 2787,
5760, 4801, 4805, 3709, 4746, 4812, 4813
Older LAN adapters: #5707, 1984, 5718, 1981, 5719, 1982
Older SCSI adapters: #5776, 5583, 5777
Telephony adapter: #6412
See planning web page www.ibm.com/systems/power/hardware/sod2.html

IBM Power Systems
Power 520 SoD for Upgrade
SoD provided in February
For Power 520 (8203-E4A) 2-core or 4-core servers
Upgrade to a POWER7 product preserving the serial number

IBM Power Systems
RAS
POWER7 Processor

IBM Power Systems
Power Systems: Hardware & OS RAS Leadership
Ref: ITIC 2009 Global Server Hardware and Server OS Reliability Survey

IBM Power Systems
Availability / Reliability by Design for POWER7
Processors
Dynamic De-Allocation
Packaging
Instruction Retry
Alternate Processor Recovery
First Failure Data Capture
Help eliminates intermittent failures
Hot Plug / Removal
Fans & Power Supplies
Hot Plug / Removal
PCI-X & PCIe Adapters
IO Drawers
Hot Plug / Removal
Disks
Memory
Chip Kill technology
with Bit-steering
Passive backplane
No active components
Hypervisor
Mainframe technology
Mobility
Partition Mobility
WPAR Mobility
Operating System
Hot patch Kernel
Storage Keys
Concurrent Add: 770/780
Eliminates Upgrade outages
Concurrent Service{ 770/780
Eliminates Repair Outages
Hot Add
I/O racks
Dual Clocks
770/780

IBM Power Systems
POWER7 Instruction Retry
Recovery Capability
Array error
Error correction (ECC)
Arrays with parity
oProcessor restarts
Instruction flow and Data flow Error
Processor restarts
Control Error
Processor restarts
System Resiliency
Processor states are check pointed and protected with ECC
Processor states can be moved from one processor to another
upon unsuccessful recovery restart (CP Sparing)
Core
Recovery
Unit
Core restart
Core error collection
Execution Units
Load/
Store
Instruction Fetch
Decode

IBM Power Systems
PCI Adapter
Fabric Bus Interface to other Chips and Nodes
ECC protected
Node hot add /repair
Core Recovery
Leverage speculative execution resources to
enable recovery
Error detected in GPRs FPRs VSR, flushed &
retried
Stacked latches to improve SER
Alternate Processor Recovery
Partition isolation for core checkstops
L3 eDRAM
 ECC protected
 SUE handling
 Purge and Line delete
 Spare rows and columns
GX IO Bus
 ECC protected
 Concurrent add/repair
InfiniBand® Interface
 Redundant paths
Retry/Freeze behavior options for
Internal I/O Hub Faults
PHB Errors
IO Hub
PCI
Bridge
 Advanced 64 Byte ECC on Memory
 Multiple chip chipkill detections and
sparings
HW assisted scrubbing
 SUE handling
 CRC with retry and
Dynamic data bit-line sparing on channel
interface
OSC0 OSC1
Dynamic Oscillator
Failover
Concurrent Repair
BUF
BUF
BUF
BUF
X8 Dimms
Fabric Interface
POWER7 770/780: RAS Features

IBM Power Systems
Power 750 / 755 Memory RAS Features
Memory RAS
Power 750 supports memory Scrubbing, 64-byte Marking ECC and Chipkill. Memory errors
are usually classified as either soft or hard.
Hard errors can be caused by defects within the DRAM
package among other reasons (e.g. defect in the silicon),
and are usually permanent once they occur.
Soft errors are caused by charged particles or radiation, and are usually transient.
Memory scrubbing corrects soft single bit errors in background while memory is idle
preventing multiple bit errors.
Memory ECC is able to detect and correct single bit memory errors, which make up the
majority of memory errors. It can also isolate a single Chipkill to a bad DRAM chip.
Memory Chipkill has the ability to correct the single bit errors that standard ECC memory
can correct but also multi-bit (2, 3, 4 bits) memory errors and by doing so it increases
server availability/reliability even further.
Selective Memory Mirroring is where an amount of memory is reserved and sections of
the memory to select for mirroring in the reserved memory are dynamically determined.
The selected sections of the memory contain critical areas. The selected sections of the
memory are mirrored in the reserved memory.
137

IBM Power Systems
Guiding Light vs. Light Path
User interface and repair action simplification
POWER6 Guiding light: Console Monitored System
Used in POWER6 systems
Technician used the HMC or ASMI to see what happened and what to replace
FRUs and their locations are found in the error log
Used HMC or ASMI to enter location code to activate identify LEDs from console to verify
where FRUs are
Exchange FRUs (CM or dedicated) per procedure instructions
System Attention LED is persistent after power cycle until cleared by technician.
POWER7 Light Path: Console-less HW service simplicity (fast and easy)
Used in POWER7 systems
No need to view logs, just replace the FRUs with their LED on
oLEDs are activated automatically when error is detected.
Friendly, color coded labels on Power 750 cover show how to pull and plug parts
External LED indicates a failure inside the unit
Internal LEDs per FRU indicate what to replace
oFRUs are either Hot Plug or system has to be powered off
oGold cap powers fault LEDs when system power is removed
Replacing a FRU automatically resets the fault LEDs
138

IBM Power Systems
POWER7 Processor
POWER7 Servers
Power 750
Power 755
Power 770
Power 780
I/O
Upgrades
Summary

IBM Power Systems
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other
countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings
available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on
the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any
license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785
USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees
either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results
that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and
conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to
qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options,
and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent
on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may
have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some
measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for
their specific environment.
Current: 1Q 2010
Special notices

IBM Power Systems
IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, CacheFlow, ClusterProven, DB2, ESCON,
i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink,
PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere,
xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise
Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, Micro-
Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER
Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4,
POWER4+, POWER5, POWER5+, POWER6, POWER7, pureScale, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME
10, TurboCore, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation
in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a
trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published.
Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at
"Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml
The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by
Power.org.
UNIX is a registered trademark of The Open Group in the United States, other countries or both.
Linux is a registered trademark of Linus Torvalds in the United States, other countries or both.
Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.
Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or
both.
AMD Opteron is a trademark of Advanced Micro Devices, Inc.
Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both.
TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).
SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and
SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC).
NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.
AltiVec is a trademark of Freescale Semiconductor, Inc.
Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.
InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association.
Other company, product and service names may be trademarks or service marks of others.
Current: 1Q 2010
Special notices (cont.)

IBM Power Systems
The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems.
Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting
application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized
reseller or access the Web site of the benchmark consortium or benchmark vendor.
IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .
All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded
systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and
Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and
upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL
FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC
CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-
Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and
Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.
For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.
TPC http://www.tpc.org
SPEC http://www.spec.org
LINPACK http://www.netlib.org/benchmark/performance.pdf
Pro/E http://www.proe.com
GPC http://www.spec.org/gpc
VolanoMark http://www.volano.com
STREAM http://www.cs.virginia.edu/stream/
SAP http://www.sap.com/benchmark/
Oracle Applications http://www.oracle.com/apps_benchmark/
PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly
Siebel http://www.siebel.com/crm/performance_benchmark/index.shtm
Baan http://www.ssaglobal.com
Fluent http://www.fluent.com/software/fluent/index.htm
TOP500 Supercomputers http://www.top500.org/
Ideas International http://www.ideasinternational.com/benchmark/bench.html
Storage Performance Council http://www.storageperformance.org/results
Notes on benchmarks and values
Current: 1Q 2010

IBM Power Systems
The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should
consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For
additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark
consortium or benchmark vendor.
IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .
All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX
Version 4.3 or AIX 5L were used. All other systems used previous versions of AIX. The SPEC CPU2000, LINPACK, and Technical Computing benchmarks were compiled
using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL
C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and
XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck &
Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL
for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.
For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.
SPEC http://www.spec.org
LINPACK http://www.netlib.org/benchmark/performance.pdf
Pro/E http://www.proe.com
GPC http://www.spec.org/gpc
STREAM http://www.cs.virginia.edu/stream/
Fluent http://www.fluent.com/software/fluent/index.htm
TOP500 Supercomputers http://www.top500.org/
AMBER http://amber.scripps.edu/
FLUENT http://www.fluent.com/software/fluent/fl5bench/index.htm
GAMESS http://www.msg.chem.iastate.edu/gamess
GAUSSIAN http://www.gaussian.com
ANSYS http://www.ansys.com/services/hardware-support-db.htm
Click on the "Benchmarks" icon on the left hand side frame to expand. Click on "Benchmark Results in a Table" icon for benchmark results.
ABAQUS http://www.simulia.com/support/v68/v68_performance.php
ECLIPSE http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest&
MM5 http://www.mmm.ucar.edu/mm5/
MSC.NASTRAN http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm
STAR-CD www.cd-adapco.com/products/STAR-CD/performance/320/index/html
NAMD http://www.ks.uiuc.edu/Research/namd
HMMER http://hmmer.janelia.org/
http://powerdev.osuosl.org/project/hmmerAltivecGen2mod
Current: 1Q 2010
Notes on HPC benchmarks and values

IBM Power Systems
Notes on performance estimates
rPerf for AIX
rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX
systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC
and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and
should not be reasonably used in that way. The model simulates some of the system operations such as CPU,
cache and memory. However, the model does not simulate disk or network I/O operations.
rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time
of system announcement. Actual performance will vary based on application and configuration specifics. The IBM
eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to
approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is
dependent upon many factors including system hardware configuration and software design and configuration.
Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems.
Variations in incremental system performance may be observed in commercial workloads due to changes in the
underlying system architecture.
All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM.
Buyers should consult other sources of information, including system benchmarks, and application sizing guides to
evaluate the performance of a system they are considering buying. For additional information about rPerf, contact
your local IBM office or IBM authorized reseller.
========================================================================
CPW for IBM i
Commercial Processing Workload (CPW) is a relative measure of performance of processors running the IBM i
operating system. Performance in customer environments may vary. The value is based on maximum
configurations. More performance information is available in the Performance Capabilities Reference at:
www.ibm.com/systems/i/solutions/perfmgmt/resource.html
Current: 1Q 2010

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