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MEMS-BASED
MEMS BASED FLUID FLOW
      SENSOR




           by Jean P. Cortes
                   P
Outline

  Senior Design
  S i D i #1
     Objective
     Applications
     Design
          Flow
          Pressure/Vacuum

  Senior Design #2
     Fabrication
          approaches
     Testing
          Pressure/Vacuum sensor
                                   Micro gears.
                                         gears

  Summary
Senior design #1
Design and evaluate a MEMS sensor with
capabilities in measuring parameters, such as:


   • Pressure/vacuum
   • Fluid Flow rates
   • Velocity/direction




based on thermal convection.
Applications
   Aerospace,
   Aerospace velocity measurements
  Medical, respirators for pre-matured born, &
diagnostics of asthmatic attacks
   Automotive industry,
   Education,
   Education related experiments
   Semiconductor industry,
   Control of home environment
                   environment,
Current technology: Bulky instruments




 Flow meter that uses a mechanical principle.   Bourdon Gage that uses a mechanical principle.
Hotwire principle: Low-power Micro-scale capability


                                             B)
A)

     Flow




            HEATER



                           Rw= Rref [1 + TCR (Tw-Tref)]



 A) Hotwire: flow rate depends on the loss of heat at the heater

 B) H t i anemometry: fl
    Hotwire      t    flow rates and di
                             t     d direction can b measured.
                                          ti       be       d

               For flow measurement one or three elements can be used.
Example of MAF in a car




 Rw= Rref [1 + TCR (Tw-Tref)]




      Schematic representation of the Hotwire anemometry.
Pressure measurement
                                              R= impingement Rate




                                                              P
       Vacuum Chamber


                                                             Heater


                                                                      Pumping
                              Gas Molecules




Schematic representation of the application to measure pressure.
       For pressure measurement one element is needed.
Design - flow (1)




                                        250 μm
3.5 mm




                      the three resistor for flow measurement.
Design – pressure (1)
                              Small heater




8mm




                                  1.5 mm


                              Large heater
      1.5 mm


      Fast response
      Miniture
      Economical
      Low power consumption
      less thermal mass
      More accurate                   2 mm
Fabrication of Al-based sensor

    Wafer
    Wf                         Cleaning the processed samples




 Piranha cleaning
 Pi   hl      i
  and Oxidation




      Al-
   deposition
                                                                Spin Coater used for PR




   PR, UV-light,
    developing




                    PR strip
   Al-
   Al etching
Fabrication of Ni/Cr based sensor


   Glass




   Ni/Cr
 deposition




 PR, UV-light,
     UV light,
  developing




 Nichrome        PR strip
  etching
Fabrication summary
                                          Hot Wire Principle


                   Flow                                                      Pressure


   Magnitude                   Direction                                       Vacuum


                Nichrome                                           Al                   Nichrome

                                                          RAl_large = 15 Ω          RNiCr           = 53 kΩ
RNiCr small heater = 7.8 kΩ                                                                 large
 NiCr_small_heater
                                                          RAl_small = 18 Ω
RNiCr_small_detectors = 80 Ω                                                        RNiCr_small = 7 kΩ
                                                          RAl_large_2 = 55 Ω
RNiCr_large_heater = 3 kΩ
RNiCr large detectors = 50 Ω
 NiCr_large_detectors




      t = 500 Å of thickness on glass
                       TCR = 120 ppm/oC

      This t affects TCR!
Testing



                                            Vacuum Chamber and probes.




“Special” probe station with sensor on it




Dr. Hashmi on the probe station                                          Vacuum Chamber and probes.
Results

                                                                                                Resistance vs. Pressure
                               Resistance vs Pressure
                                                                                        0.135
                   80.0

                                                                                        0.134
                   75.0

                   70.0                                                                 0.133




                                                                       Resistan (Ohm)
                                                         Resistance…                                                  Resistance…
Resistance (Ohm)




                   65.0                                                                 0.132




                                                                              nce
                   60.0                                                                 0.131
           (




                   55.0                                                                 0.130
                   50.0                                                                 0.129
                   45.0                                                                 0.128
R




                   40.0                                                                 0.127
                          20   70        120       170    220                                   0   0.02    0.04   0.06   0.08   0.1
                                      Pressure (mTorr)                                                     Pressure (mTorr)



                   Al-small sensor:

                   P goes down      R goes up
Cost
                        Total Cost for making HOT MEMS
                                              HOT-MEMS


                   Total Tooling Total Labor                      Manufacturing
   Operation                                             Cost
                       cost                                        Cost/Wafer
                                    cost
Cleaning                   $21.00            $2.50       $23.50            $0.94
Oxidation                  $23.00            $2.50       $25.50            $0.51
Metal Deposition          $260.00            $2.50 $262.50                $17.50

Mask creation              $35.00           $50.00       $85.00            $3.74
Photolithography           $25.80            $5.00       $30.80           $30.80

Metal Etch                  $4.20            $2.50        $6.70            $6.70
Dicing                     $10.50            $5.00       $15.60           $15.50
Total                     $369.50           $70.00 $439.60                *$75.69


                 1800 devices…….so the final price is ~ $         0.045
   • 6‘’ wafer
Conclusion

 A hot wire based flow and pressure sensor was designed
   hot-wire
and fabricated
 A single element hotwire was used for pressure
measurement
  A three component: hotwire + 2 sensors was used for
flow measurement
 Two style of sensors were fabricated: Large and small
 Two materials system were used: Al and NiCr
 Testing showed considerable change in resistance with
change in pressure
Acknowledgements

  D Mh
  Dr. Mohamed-Ali H
            d Ali Hasan ( d i   )
                        (advisor)
  Dr. Asghar Hashmi
  Mr. John Hudak
  Tanya Dias
     y
  Dr. Terry Xu
THAT’S ALL FOLKS!

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Senior Design#2 Cortes

  • 1. MEMS-BASED MEMS BASED FLUID FLOW SENSOR by Jean P. Cortes P
  • 2. Outline Senior Design S i D i #1 Objective Applications Design Flow Pressure/Vacuum Senior Design #2 Fabrication approaches Testing Pressure/Vacuum sensor Micro gears. gears Summary
  • 3. Senior design #1 Design and evaluate a MEMS sensor with capabilities in measuring parameters, such as: • Pressure/vacuum • Fluid Flow rates • Velocity/direction based on thermal convection.
  • 4. Applications Aerospace, Aerospace velocity measurements Medical, respirators for pre-matured born, & diagnostics of asthmatic attacks Automotive industry, Education, Education related experiments Semiconductor industry, Control of home environment environment,
  • 5. Current technology: Bulky instruments Flow meter that uses a mechanical principle. Bourdon Gage that uses a mechanical principle.
  • 6. Hotwire principle: Low-power Micro-scale capability B) A) Flow HEATER Rw= Rref [1 + TCR (Tw-Tref)] A) Hotwire: flow rate depends on the loss of heat at the heater B) H t i anemometry: fl Hotwire t flow rates and di t d direction can b measured. ti be d For flow measurement one or three elements can be used.
  • 7. Example of MAF in a car Rw= Rref [1 + TCR (Tw-Tref)] Schematic representation of the Hotwire anemometry.
  • 8. Pressure measurement R= impingement Rate P Vacuum Chamber Heater Pumping Gas Molecules Schematic representation of the application to measure pressure. For pressure measurement one element is needed.
  • 9. Design - flow (1) 250 μm 3.5 mm the three resistor for flow measurement.
  • 10. Design – pressure (1) Small heater 8mm 1.5 mm Large heater 1.5 mm Fast response Miniture Economical Low power consumption less thermal mass More accurate 2 mm
  • 11. Fabrication of Al-based sensor Wafer Wf Cleaning the processed samples Piranha cleaning Pi hl i and Oxidation Al- deposition Spin Coater used for PR PR, UV-light, developing PR strip Al- Al etching
  • 12. Fabrication of Ni/Cr based sensor Glass Ni/Cr deposition PR, UV-light, UV light, developing Nichrome PR strip etching
  • 13. Fabrication summary Hot Wire Principle Flow Pressure Magnitude Direction Vacuum Nichrome Al Nichrome RAl_large = 15 Ω RNiCr = 53 kΩ RNiCr small heater = 7.8 kΩ large NiCr_small_heater RAl_small = 18 Ω RNiCr_small_detectors = 80 Ω RNiCr_small = 7 kΩ RAl_large_2 = 55 Ω RNiCr_large_heater = 3 kΩ RNiCr large detectors = 50 Ω NiCr_large_detectors t = 500 Å of thickness on glass TCR = 120 ppm/oC This t affects TCR!
  • 14. Testing Vacuum Chamber and probes. “Special” probe station with sensor on it Dr. Hashmi on the probe station Vacuum Chamber and probes.
  • 15. Results Resistance vs. Pressure Resistance vs Pressure 0.135 80.0 0.134 75.0 70.0 0.133 Resistan (Ohm) Resistance… Resistance… Resistance (Ohm) 65.0 0.132 nce 60.0 0.131 ( 55.0 0.130 50.0 0.129 45.0 0.128 R 40.0 0.127 20 70 120 170 220 0 0.02 0.04 0.06 0.08 0.1 Pressure (mTorr) Pressure (mTorr) Al-small sensor: P goes down R goes up
  • 16. Cost Total Cost for making HOT MEMS HOT-MEMS Total Tooling Total Labor Manufacturing Operation Cost cost Cost/Wafer cost Cleaning $21.00 $2.50 $23.50 $0.94 Oxidation $23.00 $2.50 $25.50 $0.51 Metal Deposition $260.00 $2.50 $262.50 $17.50 Mask creation $35.00 $50.00 $85.00 $3.74 Photolithography $25.80 $5.00 $30.80 $30.80 Metal Etch $4.20 $2.50 $6.70 $6.70 Dicing $10.50 $5.00 $15.60 $15.50 Total $369.50 $70.00 $439.60 *$75.69 1800 devices…….so the final price is ~ $ 0.045 • 6‘’ wafer
  • 17. Conclusion A hot wire based flow and pressure sensor was designed hot-wire and fabricated A single element hotwire was used for pressure measurement A three component: hotwire + 2 sensors was used for flow measurement Two style of sensors were fabricated: Large and small Two materials system were used: Al and NiCr Testing showed considerable change in resistance with change in pressure
  • 18. Acknowledgements D Mh Dr. Mohamed-Ali H d Ali Hasan ( d i ) (advisor) Dr. Asghar Hashmi Mr. John Hudak Tanya Dias y Dr. Terry Xu