About DAETEC

Diversified Applications
Engineering Technologies

Company Profile – www.daetec.com 1

Technology has many barriers
Most are Internal
• Ability to change
with the markets
• Ability to react
• Ability to find
answers
• Ability to assemble
resources
• All at low cost

How Does One Cross to a
New Market, Reach a New
Customer, or Find Answers?
Will it be one or more of these?
•Increase investment –
testing & applications
•New product
development
•New tool design
•New process design
•Modification or ancillary
•Bundling


What’s the right
level of
resources?
What is needed to…
•Stay on schedule
•Overcome challenges
•Acquire IP
•Ready for scale-up
•Train staff
•Respond to customers
•Support the Market


What’s the
shortest path to
achieve your
objective?
How do you…

•Stay on-track
•Maintain revenue from
core business
•Avoid hitting road-blocks
•Keep on schedule
•Who will drive this effort?


DAETEC

We can be your bridge
into new markets


DAETEC is a Bridge
Between One Source to Another

•Suppliers •End-Users
•Wafer Fabs •Assemblers
•Manufacturers •Consumers
•New Products
•Solutions
•New Markets
•Ancillaries
•New Processes


Partner Facilities to Scale-Up
• R&D in Camarillo, CA
• Partner Fab in Santa Barbara, CA (30,000 sf)
• Access to Toll Mftg at six (6) locations in USA


History
Daetec lab designed and
‘95 John Moore founds ‘05 Moore founds Daetec, built, equipment
Moore Enviro-Chemical, Inc. resigns from GCC. capitalized.
(MEC)

’95-’00 Moore develops PR ‘00-’05 Moore starts
strippers, cleaners, specialty products division at
polymers for GCC and designs
semiconductors, GenSolveTM, GenTakTM,
aerospace, and GenCleanTM for top-tier
automotive. semiconductor firms.

‘99 Moore develops aqueous
‘00 General Chemical Corp
soluble polymers and
(GCC) purchases MEC,
cleaners at MEC for
Moore becomes Product
slicing/dicing – used to found
Development Director of
Aquabond technologies, ‘02
Electronic Chem Division.
sale to private investors.


Successful Commercialization
Product Application Industry
Spin-On Polymer High Temperature Wafer Bonding Semiconductor

Metal Safe PR Stripper Negative Tone and Acrylic Stripper Semiconductor

Dissolving Gel Cured Polysulfide Resin Stripper Aviation

EHS Safe Stripper Negative Tone Isoprene & Semiconductor
Bisbenzocyclobutene
Spin-On Thermoplastic Med Temperature Wafer Bonding Compound Semiconductor

Aqueous Etch Residue Cleaner Copper/Low k residue remover Semiconductor

Aqueous Based Spin-On Polymer Polishing, Slicing, Dicing Electronics/Semiconductor

Aqueous Based Polymer Remover Remover of Aqueous Based Polymer Electronics/Semiconductor

Spray Coat Polymer Wafer Protection/bonding Compound Semiconductor
Spin-On Protection Coating Acid Etch Protection Layer MEMS

Please contact us to see any pertinent publications and patents.


Markets Served
Microelectronics
•Silicon, GaAs & other compound semi,
FPD, data storage, MEMS
•Cleans - PR stripper & rinsing
•Coatings – cured polymers, adhesives
•Rinses – surface active agents, non-foam
•Inhibitors – substrate & metal protection


Markets Served
Aerospace/Aviation

•Polymer sealants & coatings – high temp,
low CTE, special engineering apps.
•Cleaners – dissolve & remove oils,
silicones, polysulfides, epoxies, others.


Markets Served
Industrial
•Automotive
•Construction, roofing, coating
•Metal working, machining
•EHS compliant coatings & cleans


Just a few of our past partners…


What We Do…
• Product Development
• Material Modification
• New Application
Development
• Process Design
• Tool Design Demo
• Ancillaries
• Yield Enhancement
• EHS Compliance Review

Technical Capabilities
 
Properties—physical and chemical Process modeling—screening testing
 Cleaning and residue characterization  New process demonstration

 Coating applications and processing  Etch rates

 Polymer compounding—  Electrical properties for I-V curves

 SEM & CD analysis
thermoplastics
 Curing—thermal & radiation  ESCA/XPS

 Properties—mechanical and adhesion  FIB

 Corrosion potential & evaluation  SIMS

 Thin film analysis & electrical

characterization

These and other tests allows us to immediately focus on those areas with the most
potential to improve the customers processes and applications.


Program Planning with Market Targets
Successful commercialization depends upon market experience
installed into your development schedule

Flat Panel Mftg

Company Profile – www.daetec.com

Intellectual Property
•IP Assigned to
Customer
•Greater Value to
Investment
•Greater Flexibility
on Business Model


Creativity to New Heights!
• Creative ideas are the core of our
business and we continually push
those limits to new levels;
• Your objective represents an
important part of our growth. This
interdependency fuels our program;
• Creating new answers often
provides new business options,
leading to greater market capture.


Results in Record Time

Compatibility Applications

DAETEC prefers screening tests over large DOEs.
Screening tests = many options + statistics
Options = less challenges + faster results
Fast results = less cost


Cost Effective
We Stretch Our Resources to Reduce Costs
• Screening tests are
inherently less costly
• Require a creative
approach
• Multi-tasked
experiments using
abbreviated number
of specimens


Applications
Coatings Technologies
Coating Optimization
Understanding PR Polymers
Coatings Electrical Testing
Substrate Thinning
Inhibitors for Corrosion Control

CLEANING
Materials and Processing
Wafer Bumping
Panels (Solar/FPD)

PLATING
Electrolytic/less

Etchants and Surface Finishing
Process Optimization


Coatings Technologies
• Spin-Coating
• Spray Coating
• Slit/Brush/Roll
Cured Water
Cleans (2 steps)

• Films Coating Rinse
1 X Puddle + 1 X Spin

• Molding
• Photo initiated
• Thermal/Electrical
Conductive
• Temporary/Permanent


Coating Optimization
State-of-the-art characterization techniques
Conformal

Planarize


Understanding PR Polymers

DNQ Ketene Acid
Non-polar Polar Polar


Coatings Electrical Testing
•Hg Probe – Sensitive for Thin Films
•Rapid Measurement
•IV curves, Dielectric Const., Loss
Tangent

Hg-Probe I-V Plots of Triazoles on Cu

60.0
Triazoles, 0.5% Aqueous Solns
RT 30sec Exposure
50.0
TTA
Current (uAmps)

40.0

•Hg dot contact is non-destructive
30.0
BTA
Triazole
•Used for Epi-layers and films
20.0
Mix

<50Angstroms
10.0

•Ideal for Oxide Layers, Inhibitors,
0.0
0 0.1 0.2 0.3 0.4 0.5 0.6
and Used for Residue Detection
Voltage (volts)


Substrate Thinning
•Substrates to <20um
•Protection for Backside Processing
•Simple Application & Removal
•Permanent Systems
•High Temps >400C & Low CTE

•Wide Range of Process Options
•Coating Over Bumps
•Applicable to MEMS
•Aqueous Cleans Available
•Cleans for Single Wafer & Batch
Many Polymer Options


Inhibitors for Corrosion Control
Pourbaix Diagrams & Tafel Plots to Correct Corrosion

Feature Inhibitor
Corrosion Added


Cleaning – Materials & Processing
• Polymers & Residue
• Cured Systems: Silicone,
Urethane, Acrylic,
Epoxy, Rubber, Sulfides
• Insulators: Polyimide, Etch Residue, Before Clean Via

BCB, PBO, Silicates
• Hydrocarbons: Oils,
Greases
• Aqueous Cleans Polyimide, Before Polyimide Removal


Cleaning – Wafer Bumping
Plated Solder
Before Strip After Strip
Wet PR

Wet PR App.

Exposure & Develop

Solder Plating

PR Strip/Cleans
Alkali + Solvent
Minor Issues in Cleans

Flux Reflow to 220C


Cleaning – Panels (Solar/FPD)


Plating – Electrolytic/less
• Cu + Alloy Processes
• Co Electroless
Capping
• Ni Hypophos
• NiFe/NiFeCo Heads
• Sn and Alloys
• Au Processes
• Exchange Processes
• Initiating/Striking

Etchants & Surface Finishing
• Au Etch (aqueous &
Irregular Etch
solvent)
• Buffered Oxide Etch
(BOE)
• Chrome Etch
• Si Etch (acid & base)
• Mixed Acid Etch (MAE)
• Phos Acid Etch PAE)
• Surfactanated Etchants

Process Improvement
Isolating Factors in the Process Step


Process Improvement
Factors Affecting Performance
•Process Flow
•Residue Removal
•Cleans Improvement
•Yield Improvement
•Monitoring & Controls Survey Process Materials, Stability, Life
•Product Development

Simple, On-Site Eliminate
Monitor & Process
Controls Excursions


Process Improvement
Studying Interactions Between Process Steps

2. Resist 3. Exposure
1. Substrate
Coating
Cleaning

Plasma

6. Resist 5. Etching 4. Develop
Stripping


Fab Equipment Optimization
How Materials Work in a Specific Tool


EHS Compliant Development
• Solvent Replacement • Eliminate Toxic or
Regulated Items
with Aqueous Agents
• Eliminate Haz Waste
• Green Coatings
• Green Cost Reduction
• Green Cleaners
• Reduced Energy Use


Draft Plan to Contract
2-Objective
3-Plan
1-Contact * Solution Need
* New Product
* Deliverables
Daetec * Complementary
* Timing
& Product
* IP
Customer * Bundle Option
* Costs
* New Technology

Adjust

5-Action
4-Contract
6-Completion * Progress Reports
* Written
* Deliverables
* Customer Meets
Document
* Payment for
Objective
* Work Plan –
Services
* Customer has IP
* Completion – Same as (3)
most in 6mos


To implement a new and innovative
plan, contact us!
John Moore Technical Director
jmoore@daetec.com

Daetec, LLC
Diversified Applications Engineering Technologies

www.daetec.com

1227 Flynn Rd., Unit 310 Camarillo, CA 93012-8551
Phone: 805-484-5546 Fax: 805-484-5556


About DAETEC

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