This document provides an overview of QTA Service HDI Backplane High-End Server 2-40L Rigid PCB Lead-Free, a printed circuit board manufacturing company. It discusses the company's facilities, technologies, customers, markets, expansion plans and financial performance. Key details include 11 PCB factories located in China and Thailand, advanced HDI and microvia capabilities, a focus on high-end server, communication and medical equipment, and plans to increase annual production capacity to over 58 million square feet by 2008.

1. Dec 2008 C o r p o r a t e P r o f i l e QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE Share Passion Create Harmony

2. General Information QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE

3. Corporate Milestone Further expansion in Kaiping South site which is especially designed for HDI products. Expansion of GZ East VI is under progress. Established our 1 st oversea PCB plant in Thailand Established our 1 st China PCB plant in Kaiping Established a PCB plant in Guangzhou, China PCB Group was listed on Singapore main board Acquired a PCB plant in Nanjing, China and established a PCB material plant in Thailand and China respectively Elec & Eltek was founded as a double-sided PCB maker in Hong Kong Construction of a new PCB plant in Guangzhou East HDI manufacturing expansion in Kaiping plant Expansion of Guangzhou East Plant was completed E&E Group became a family member of Kingboard Chemical Holdings Began Multilayer PCB manufacturing Expansion of KP III E was completed and production was commenced. Construction of KPPIC phase I was completed. 2008 1988 1992 1993 1994 1995 1972 2001 2004 2005 2004 1980 2006

4. Company Snapshot - China (Shenzhen, Kaiping) - Thailand (Rojana) Material Factory Locations: - China (Hong Kong, Guangzhou, Kaiping, Nanjing) - Thailand (Pathumthani) PCB Factory Locations: 11,692 (As of 29 Nov, 2008) No. of Employees: Listed on Singapore Main Board in 1994 Public Listing: HDI, High Layer Count, High Speed/Low Loss Materials, High Aspect Ratio, Sequential Lamination, High Reliability Advanced Technologies: 2-40 layers rigid PCBs , Backplanes, HDI Product Types: 1972 (Headquartered in Hong Kong) Found: Elec & Eltek International Company Limited Company Name:

5. Shareholding Structure Listed on Singapore Main Board As of 5 Dec , 2008 Listed on The Main Board of Hong Kong Exchange Kingboard Chemical Holdings Ltd PCB PCB Raw Material Listed on The Main Board of Singapore Exchange Elec & Eltek International Company Ltd 71.33 %

6. Organization Structure Group Sales Supply Chain Management Group Market Research H/L & HDI Business Development KP Site Standard & Advanced Product KPPIC Guangzhou Site Thailand Site TLPCB / PIM SZ PIC Group Technology Nanjing Site (Nanjing) Group Finance / Group IT / Company Secretarial Service Group Human Resource & training Group Quality Group Procurement Chadwick Mok Vice-Chairman Philip Chan Executive Director Thomas Li Executive Director Clement Sun Executive Director Chadwick Mok Executive Director Procurement Council Technical Center KB PCB Group HK plant & QTA KP Site General Support Alen Chan Executive Director CC Li Executive Director

8. Pathumthani Plant, Thailand Guangzhou West Plant, China Guangzhou East Plant, China Hong Kong Plant, China Kaiping Plant, China Nanjing Plant, China Production Facilities - PCB

9. PIC – Shenzhen, China PIM – Rojana, Thailand Production Facilities – PCB Materials PIC – Kaiping, China

10. Sales Performance & Marketing Strategy We Are Growing Continuously

12. Target End Market Server Medical Equipment Computer & Peripherals Consumer Electronics Automotive Communication

13. Sales Performance

14. Source: NT Information Worldwide Top 10 PCB Enterprises *FPC Maker -0.5 1803 1794 Japan Ibiden 1 10.7 1471 1629 Japan Nippon Mektron* 2 20.8 1250 1510 Taiwan Unimicron 3 7.2 1187 1272 Korea Samsung E-M 4 12.5 1099 1236 Japan CMK 5 9.0 1115 1215 Taiwan Nanya PCB 6 5.0 969 1017 Japan Shinko Electric 7 9.2 870 950 Japan NTK 8 20.0 760 912 Hong Kong Kingboard Group/ Elec & Eltek 9 33.1 632 841 Taiwan Tripod 10 Growth (%) 2006 (US$M) 2007 (US$M) Country Maker Rank

15. Turnover By Layer Count CY2006 YTD Q3 CY2008 CY2007 4% 13% 14% 69% 14% 67% 16% 3% 70% 16% 4% 10%

16. Turnover By Industry Sector CY2006 YTD Q3 CY2008 CY2007 11% 9% 13% 22% 45% 49% 12% 15% 9% 15% 19% 41% 11% 18% 11%

17. Turnover By Region CY2006 YTD Q3 CY2008 CY2007 5% 8% 21% 18% 48% 1% 4% 57% 3% 20% 1% 14% 51% 20% 1% 6% 18% 4%

18. Our Key Customers WESTERN DIGITAL IBM DELL LENOVO PANASONIC VALEO PHILIPS MOTOROLA I XXX L ALCATEL ERICSSON SONY ERICSSON SIEMENS JOHNSON CONTROL S HITACHI NVIDIA

19. Production

20. Plant Snapshot Mobile Phone / Digital Products 85 HDI / 2L-10L 18,000 EEKP IIIE Automotive / Communication / Instrumentation 215 2L-12L 26,400 EETL Thailand 60 2L – 8L 6,000 EENJ Consumer Electronics / Automotive / Instrumentation / Computer & Peripherals Nanjing Communication / Server 90 2 L -22L EEKP III Mother Board / Automotive / Consumer Electronics 245 2L-10L 21,000 EEKP I, II, V Kaiping All High-end Products / Server / Computer & Peripherals/ Medical & Instrumentation / Backplane 50 2L-32L/ Backplane/ HDI 10,900 EEGZ III Computer & Peripherals/ Consumer Electronics/ Medical 3 6 0 2L-18L 21,100 EEGZ I, II Guangzhou Communication & Networking / Computer & Peripherals / High-end Server / Instrumentation 20 2L-40L/ Backplane/ HDI/ QTA services 9,500 EEHK Hong Kong Segmentations Production Capacity (K sq ft/ week) Products & Services Floor Area (sq meters) Plant Location

21. Production Capacity Actual CY2007 Year End @ Around 56.0 Million Sq. Ft. Per Annum Projected CY2008 Year End @ Around 58.7 Million Sq. Ft Per Annum PCB with mass laminate 11.5 million sq. ft. 11.5 million sq. ft PCB raw materials Kaiping Guangzhou Nanjing Shenzhen China + Hong Kong 44.5 million sq. ft. 47.2 million sq. ft Thailand 11.5 million sq. ft. 11.5 million sq. ft 3.8 million sq. ft NJ PCB 3.8 million sq. ft. GZ + HK PCB with mass laminate 21.9 million sq. ft GZ + HK PCB with mass laminate 19.2 million sq. ft. PCB raw materials KP PCB with mass laminate 21.5 million sq. ft. KP PCB with mass laminate 21.5 million sq. ft PCB raw materials PCB raw materials

22. Technology & Capability

23. Capability - Conventional PCB +/-7% Impedance Control Photo imageable, Peelable type Solder Mask 3 mil/ 3 mil Minimum Line Width/ Space 6 mil Minimum Hole Size Lead-free HASL, OSP, ENIG, Immersion Tin, Immersion Silver, Selective OSP/ ENIG, Electrolytic Gold, Carbon Ink Surface Finish 1/3 oz to 5 oz Copper Foil 2 mil Minimum Core Thickness FR-4, High Tg FR-4, BT, Rogers, Getek, Thermount, PTFE, Hybrid, Halogen free, Lead-free, Anti-CAF, Nelco-13, Arlon, High Speed/ Low Loss Base Materials Rigid multilayer PCB from 2L to 40L Layer Count 2008

24. Capability - Microvia +/ - 8% Impedance Control 1:1 Aspect Ratios Ink Plugging, Copper Plating Laser Via Filling Conformal Mask, Direct Drilling, Bare Resin Drill Laser Via Formation Method 2 mil/ 8 mil Minimum/ Maximum Laser Via Size 3 mil/ 3 mil (4/4 mil for via filling design) Minimum Line Width/ Spacing Up to 3+N+3 with IVH Up to 3 X IVH (microvia) Structure - Sequential Build-up - Sequential Lamination Aramid, BT, FR4, LD Prepreg, RCC Build up Materials 2008

25. Capability - Backplane +/-7% Impedance Control +/ -2 mil Press fit hole tolerance 2 36 mil (6mm) Maximum Board Thickness 2 4 ” X 3 6 ” Maximum Panel size 2 mil Minimum Core Thickness +/- 8% Thickness Tolerance 1 6 :1 Aspect Ratio 3mil / 3mil Minimum Line Width/ Space Up to 40 Layers Layer Count 2008

26. Capability - High-end Server 1/3 oz to 5 oz Copper Foil +/-7% Impedance Control +/-2 mil Press fit hole tolerance 2 36 mil (6mm) Maximum Board Thickness 2 4 ” X 3 6 ” Maximum Panel size 2 mil Minimum Core Thickness +/- 8% Thickness Tolerance 18:1 Aspect Ratio 3 mil/ 3 mil Minimum Line Width/ Space Up to 40 Layers Layer Count 2008

27. Capability – QTA Service Photo Imageable Soldermask +/- 10% Impedance Control 30 mil Min. Micro BGA Pitch Size 3 mil/ 4 mil Min. Line Width/ Spacing High Aspect Ratio (15:1), PTH, Blind Via, Buried Via Via Hole 8 mil Min. Hole size (Drill Size) Inner: 1/2 oz – 5 oz; Outer: 1/3 oz – 2 oz Copper Foil 2 mil Min. Core Thickness Low CTE/ High Tg FR-4, Halogen-free, BT Epoxy, Getek ML200, Nelco N4000-13, Rogers RO4000, Arlon 25FR, IS620HT, FR408 Base Materials Up to 30 Layers Layer Count 2008

28. Multi-Sites Manufacturing Capability FR4 High Tg FR4 Imm Silver +/-7% 10:1 3mil/3mil 8mil 2mil EEKP IIIE FR4 High Tg FR4 Halogen Free Anti-CAF Carbon Ink ENIG HASL Imm Silver Imm Tin OSP Gold finger Peelable S/M +/-7% 6.67:1 4 mil / 4 mil 10 mil 2 mil EETL CEM 3 FR4 High Tg FR4 Lead-free Halogen Free HASL OSP Lead-free OSP Electrolytic Gold Finger +/-10% 6:1 4 mil / 4 mil 6 mil 4mil EENJ FR 4 High Tg FR4 RCC Aramid Halogen Free BT Getek / Megtron Rogers Anti-CAF High Speed/Low Loss Microwave FR 4 High Tg FR4 BT Anti-CAF Lead-free Halogen-free FR4 High Tg FR4 Nelco-13 BT Arlon Rogers Halogen Free Anti-CAF, High speed/ Low loss, Mircrowave Lead-free FR4 High Tg FR4 Rogers Halogen Free (High Tg and Mid Tg) Anti-CAF Lead-free Low Dk/Low Df Mircrowave FR4 High Tg FR4 Halogen-Free Anti-CAF Base Material ENIG HASL OSP / Sel OSP Imm Tin Imm Silver Lead-free HASL Imm. Gold Imm Silver OSP/ Sel. OSP Carbon Ink ENIG Lead-free HASL Imm. Silver Imm. Tin OSP / Sel OSP Electrolytic Gold Carbon Ink ENIG HASL Imm. Silver Imm. Tin OSP / Sel OSP ENIG HASL Imm Silver Imm Tin OSP / Sel.OSP Surface Finish +/-7% +/-7% +/-7% +/-7% +/- 7% Impedance Control 14:1 1:1 14:1 18:1 0.7:1 15:1 12:1 Aspect Ratio -Mechanical -Microvia 3 mil / 3 mil 3 mil / 3 mil 3 mil / 3 mil 3 mil / 3 mil 3 mil / 3 mil Minimum Line/Space 8 mil 4 mil 8mil 8 mil 4 mil 6 mil 8 mil Minimum Finished Drill Hole -Mechanical -Microvia 2 mil 2 mil 2 mil 2 mil 2 mil Minimum Dielectric Thickness EEKP III EEKP I, II & V EEHK EEGZ III EEGZ I&II

29. Technology Roadmap 2 mil/ 2 mil 3 mil/ 2 mil 3mil/ 3 mil Minimum Line Width/ Spacing (Outer) 5 oz Isola IS620HT, FR408, BT Nelco N4000- 13EP Roger RO4300 +/ -4 mil @ 20-mil hole, 100-mil drill depth 3mil/ 3 mil 3 mil/ 3 mil 15:1 10 mil 236 mil 40 24” X 3 6 ” 2008 5 oz +/ - 4 mil @ 16-mil hole, 160-mil drill depth 3 mil/ 2 mil 3 mil/ 2 mil 18:1 8 mil 236 mil 42 2 4 ” X 3 6 ” 2009 5 oz Maximum Copper Thickness Low-loss Materials Application +/ - 4 mil @ 12-mil hole, 160-mil drill depth Backdrill Depth Tolerance 2 mil/ 2 mil Minimum Line Width/ Spacing (Inner) 2 mil/ 2 mil Minimum Line Width/ Spacing (Outer) 20:1 PTH Aspect Ratio 8mil Minimum PTH Size 236 mil Maximum Board Thickness 48 Maximum Layer Count 2 4 ” X 3 6 ” Maximum Board Size 2010 Mass Production Capability (Mechanical)

31. Quality Quality People. Quality Products. Quality Services.

33. Quality Accreditation ISO14001 Pathumthani Thailand Nanjing Kaiping Guangzhou Hong Kong China ISO/TS16949 ISO 9001:2000 UL PCB Plants Kaiping Rojana Thailand Shenzhen China ISO14001 ISO 9001:2000 UL PCB Raw Material Plants

35. D elivery

36. Technology on Delivery MRP Material Resource Planning GIS Geographical Information System CIM Computer-integrated Manufacturing EDI Electronic Data Exchange CFM Continuous Flow Manufacturing FMS Flexible Manufacturing Systems

37. Services Global Services. Instant Response.

39. Cost Competitive cost through vertical integration

40. Cost Competitiveness Cost Competitiveness Early Supplier Involvement Vertical Integration China Factors

41. Expansion Project Exploring Opportunities. Expanding Business

42. Our Expansion Plan – China & Hong Kong Guangzhou + HK Kaiping Nanjing 3,800K sq.ft./ year 2008 Capacity 2 1 , 5 00K sq. ft./ year 2008 Capacity 33,000K sq. ft./year 2009 Capacity 21,500K sq.ft./ year 2008 Capacity

43. Pathumthani Our Expansion Plan - Thailand 11,500K sq.ft./ year 2008 Capacity 15,000K sq.ft./year 2009 Capacity

44. Contact Info Tel: 662-975-3001-15 Fax: 662-975-3022-3 134 Moo 2, Tambon Bang Khayang, Amphur Muang, Pathumthani Province, 12000, Thailand Pathumthani Plant, Thailand Tel: 86-25-85803800 Fax: 86-25-85803886 Heng Tong Road 3#, Nanjing Economic & Technological Development Zone, Jiangsu Province, PRC Nanjing Plant, China Tel: 86-750-2218428 Fax: 86-750-2210993 No. 318 Siqian Xi Road, Shagang, Kaiping City, Guangdong Province, PRC Kaiping Plant, China Tel: 86-20-82266328 Fax: 86-20-82216218 No.388 Lianvun Road, Guangzhou Economic& Technological Development District Guangzhou, PRC Guangzhou East Plant, China Tel: 86-20-82212222 Fax: 86-20-82216218 No.3 LinJiang Road, Bei Wei Industrial Section, Guangzhou Economic & Technological Development District, Guangzhou, PRC Guangzhou West Plant, China Tel: 852-27653888 Fax: 852-23347979 2/F, Block A, Merit Industrial Center, 94 Tokwawan Road, Kowloon, Hong Kong Hong Kong Plant Tel: 86-755-82022155 Fax: 86-755-82022150 Flat F&G, 24/F, Noble Center, No.1006, Fu Zhong 3rd Road, Futian District, Shenzhen 518026, PRC Macao Commercial Offshore (Shenzhen Office) Tel: 853-28389471 Fax: 853-28389470 Av. Da Praia Grande No. 599, Edificio Comercial Rodrigues, 3rd Andar E, Macao Macao Commercial Offshore (Macao Office) Tel: 852-29543333 Fax: 852-29543111 1/F, Habour View 1, No.12 Science Park East Avenue, phase II, Hong Kong Science Park, Shatin, N.T., Hong Kong Hong Kong Office PCB General Offices & Plants

45. Contact Info Tel: 66-35-330-772 Fax: 66-35-330-775 1/68, Moo 5, Rojana Industrial Park, Rojana Road, Uthai District, Phrana-komsriayutthaya Province, 13210, Thailand Rojana Plant, Thailand Tel: 86-750-2206998 Fax: 86-750-2203090 No.318 Siqian Xi Road, Shagang, Kaiping City, Guangdong Province, PRC Kaiping Plant Tel: 86-755-26619698 Fax: 86-755-26619047 Oi-Lin Ave, Bei Huan Road, Nanshan District, Shenzhen, PRC Shenzhen Plant PCB Raw Material Plants

46. Contact Info Tel: 44-1628-531-000 United Kingdom Tel: 1-408-727-4223 United States Tel: 604-390-2288 Fax: 604-390-1688 Malaysia Tel: 662-975-3001 Thailand Tel: 65-6226-0488 Singapore Tel: 886-3426-6477 Taiwan Tel: 86-21-5172-7988 Shanghai, China Tel: 86-20-8221-2222 Fax: 86-20-82216218 Guangzhou, China PCB Sales Representative Offices

47. T h a n k Y o u