Over the past 60 years, Epec has emerged as a leading provider of time-critical, high performance printed circuit board solutions. Our more than 1000 active customers represent a wide range of leading original equipment manufacturers (OEM) and electronics manufacturing services (EMS) companies, in the medical, electronics, industrial, communications, access controls, automotive, computing, and military sectors. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper and production tolerances allow us to provide our customers exactly what they need for their end product.

1.  Printed Circuit Board
Overview
 DELIVERING QUALITY SINCE 1952.

2. America's Oldest,
A History of Innovation
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Privately held company, established in 1952.
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Estimated 2013: Sales: US$40 Million
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100+ Employees Worldwide
(70 – North America, 30 – Asia, 3 – Europe)
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Design and manufacture customized, built-to-print,
performance-critical products for all sectors of the
electronics industry.
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Leading provider of printed circuit boards, membrane switches, graphic
overlays, silicone rubber products, electronic heaters, fans, motors and
custom battery packs.
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Integrated supply chain management solutions to handle the complexity of
today’s global marketplace while making sure that every order is being
manufactured at the “right” factory.
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3. Global Operations
Significant Investment in People and
Facilities across the globe.
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4. Our Customers - The Top Global
OEM’s In Growth Industries
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5. Quickturn PCB Capabilities
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Up to 18 Layers
Laminate – FR-4 (All Tg & Td Ranges), CEM-1, Teflon, Ceramic, Polyimide
Finished Thickness Up to .300”
Minimum Dielectric Spacing = .003”
Green, Blue, Red, Black, Clear and White Solder Masks and Legend Inks
Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold
Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG
Minimum Lines & Spaces =.003”
Blind & Buried Vias
Maximum Panel Size = 24” x 36”
Minimum Finished Hole Size = .005” +/- .003”
Maximum Hole Aspect Ratio = 15:1
Maximum Copper Weight = 6 oz. (UL Approved)
Laser Direct Imaging and Laser Drilling
Controlled Impedance +/- 10%
Carbon Ink
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6. Heavy Copper PCB’s
Epec has been building heavy copper
circuit boards with traces and copper
planes of up to 6 ounces for over 20
years.
Heavy Copper Production Capabilities
 Maximum Number of Layers = 16
 Laminate – FR-4 (All Tg
Ranges), Teflon, Ceramic, Polyimide
 Finished Thickness = .020" - .275"
 Minimum Soldermask Clearance – 6 mils
 Minimum Solderdam Width – 5.5 mils
 Hot Air Solder Leveling (HASL)
 Immersion Gold (ENIG) & Immersion Silver
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Blind & Buried Vias
Minimum Drill Bit Hole Size = .012"
Minimum Holes Size - .008" +.005"/-.008"
Maximum Hole Aspect Ratio = 10:1
Maximum Copper Weight = 6 oz. (UL App)
Controlled Impedance +/- 10%
Minimum Silkscreen Line Width – 8 mils
Green, Blue, Red, Black, Clear & White Solder
Masks & Legend Inks
Check out our web site for heavy copper production minimums
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7. Flex & Rigid Flex PCB’s
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SS, DS & Multi-Layer Flex Circuits
Rigid Flex up to 10 Layers
Installation of connectors & contacts
Materials: Kapton, Mylar, Teflon
Adhesives: Acrylic, flame
retardant, epoxy, polyimide, phenolic
Stiffeners: FR-4, polyimide, aluminum
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Quickturn Prototypes
Production Quantities
Design for Manufacturability
Reviews & Assistance
Different coverlay options
available
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8. HDI – High Density Interconnect PCB
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HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than
conventional PCB’s.
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HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
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To produce HDI boards, laser direct imaging and laser drilling equipment is a must along with
investment in other high tech equipment to ensure high quality production.
HDI Production Capabilities
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Laser Microvias
Blind and Buried Via’s
Sequential Lamination
Via-In-Pad Technology
2/2 lines and spacing
Copper filled stacked microvia’s
Up to 18 Layers
Down to 2 mil dielectrics
Tight Impedance Control
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9. PCB Services
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Delivery
STANDARD LEAD TIME - 20 Working Days
Technology
1 Day
2 Day
3 Day
5 Day
7 Day
10 Day
1 - 4 Layers
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6 - 10 Layers
> 10 Layers
Both Prototype and Production Quantities
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10. Value Added Capabilities
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Castellated Edges
Counter Sinks/Counter Bores
– Plated/Non-Plated
Standoff’s, Spacers & Pem Nuts Installed
Connectors (Soldered/Press Fit)
Aluminum Clad Boards
Silver Thru Hole Volume Production
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FR-4 Custom Board Spacers
Ultra Clean Ionic Cleanliness
Eyelets
Peelable Solder Mask
Edge Plating
MIL-55110 & 31032
Back Planes
 Hole Tolerance +/- .002”
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11. Industry’s Leading Online Tools
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Sign up today and try InstantPCBQuote™, the most
flexible and user friendly internet quoting and ordering
tool in the PCB industry.
 Try it Now!
www.epectec.com/instantpcbquote
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12. PCB Design and Layout
Our Capabilities Encompass The Full Design Flow From Start To
Finish Including:
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Micro BGA / Micro Via / Blind and Buried Vias
Rules Driven Designs
Schematic Capture
Library Development
Database Construction and Verification
Signal Integrity/Design Verification
EMI Checking
Full Document Package Creation
Electrical Engineering Expertise
We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor
Expedition, Mentor's PADS, Altium, Valor for DFM Analysis.
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13. World Class Quality Assurance &
Engineering
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US Based QA Capabilities Include:
– Full Cross Section/Microsection Reporting and Ionic
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Testing Equipment
X-Ray Fisherscope for all Metal Thickness & Purity
Measurement on every lot.
Scienscope DMP-1000 stereo zoom microscope with
digital picture capability up to 100x
Vision Engineering Mantis Elite for 10X full range
visual inspection.
World Class Electronics Test Lab
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Epec’s superior on-time delivery rates are the
result of our significant, dedicated engineering
resources and processes.
– Perform all DRC, DFM, Graphic Art and Engineering reviews
at our Engineering Center outside of Boston, MA
– Documentation of all manufacturing and detailed planning
processes, for all special requirements,
– Consistent documentation and tooling at all manufacturing
locations to ensure seamless prototype through production
manufacturing.
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14. The Epec Value Added Operation
The Broker
Customer
Delivery in
5-8 weeks
Send order
to the
factory
broker
works with
Receive
Customer
Order
80% On-Time
80% Quality
The Epec Operation
Receive
Customer
Order
Production
Planning
matches
order with
our optimal
domestic or
Asian
facility
Complete
Epec Eng
Analysis,
work with
customer
to resolve
all
technical
and build
issues.
Continual
process and
on-site
technical
improvement
Manufacturing
program, to
Begins
optimize
delivery and
quality
performance
Epec US &
Asian
Operations
groups
manages
order
status, onsite; daily
WIP analysis
through ERP
System
On-site QA
Inspection
at factory
by Epec
employees.
Product
arrives at
Epec, is reinspected, f
inal QA is
completed
before
shipping to
customer.
Customer
Delivery in
as little as 1
day.
98%
On-Time
99.5%
Quality
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15. Our Products
Battery Packs
Flex & Rigid-Flex PCB’s
User Interfaces
Fans & Motors
Cable Assemblies
Printed Circuit Boards
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16. Inventory Management
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Customer requirements are always unique and customized, therefore
our inventory management system must accommodate for this type of
environment.
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We Offer:
– Kanban
– Consignment
– JIT Programs
– Blanket Orders
– Customer Fulfillment
– Bonded Warehousing
– Kitting
– Safety Stock
– Other flexible solutions
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17. The Difference is Quality and Delivery
1.
Quicker Delivery - Epec's technology infrastructure and people, including the
Asian and US based operations and engineering teams, enable jobs to get started the
same day the order data is electronically received by our factory.
2.
Accurate Information - Epec's on-site personnel provide accurate daily Work
In Process reports so customers can receive immediate order status information, along
with in person verification of all daily reports by Epec staff.
3.
Better Quality - Epec ensures higher levels of quality through three key additional
processes. On-site QA inspectors at each facility provide an additional audit before it
leaves Asia, Epec maintains dual UL approval at each facility with quarterly audits, and
perform QA audits at our headquarters in Boston, MA.
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Flexibility - Each of our manufacturing facilities have been selected for their
best-in-class niche product and delivery solutions, ensuring our optimal facility is
building every order.
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18. 
If you require additional information please contact us with any
questions or requests.
North American Headquarters
174 Duchaine Blvd.
New Bedford, MA 02745
Tel: (508) 995-5171
Fax: (508) 998-8694
Contact Us By Email:
Sales
Quotes
Engineering
sales@epectec.com
quoting@epectec.com
engineering@epectec.com
Visit Our Website For More Information
www.epectec.com
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