Chong Leong Gan
4 SlideShares 19 Seguidores 30 Seguindos
Personal Information
Organização/Local de trabalho
Malaysia Malaysia
Cargo
PDE Director
Setor
Electronics / Computer Hardware
Sobre
Specialties: statistical softwares i.e JMP, Minitab, reliability prediction softwares i.e. ALTA, Weibull, FA tools i.e curve tracer, TDR, oscilloscopes, HAST board/lifeboards designs, reliability life calculation and field life extrapolations, package metallurgy, phase diagram interpretation, Microsoft Project software for reliability qualification, supplier quality auditing & AEC-Q100 automotive qualifications.
Marcadores
engineering semiconductor microelectronics electronics reliability materials model stress mathematics physics soldering bonding packaging
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Documentos

(4)
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Book Review Article

Há 8 anos • 186 Visualizações

Evolutions of bonding wires used in semiconductor electronics perspective over 25 years

Há 8 anos • 1215 Visualizações

Book review

Há 8 anos • 143 Visualizações

Book review copper wire bonding

Há 8 anos • 767 Visualizações
Personal Information
Organização/Local de trabalho
Malaysia Malaysia
Cargo
PDE Director
Setor
Electronics / Computer Hardware
Sobre
Specialties: statistical softwares i.e JMP, Minitab, reliability prediction softwares i.e. ALTA, Weibull, FA tools i.e curve tracer, TDR, oscilloscopes, HAST board/lifeboards designs, reliability life calculation and field life extrapolations, package metallurgy, phase diagram interpretation, Microsoft Project software for reliability qualification, supplier quality auditing & AEC-Q100 automotive qualifications.
Marcadores
engineering semiconductor microelectronics electronics reliability materials model stress mathematics physics soldering bonding packaging
Ver mais