1. Specification
For Silicon MEMS Microphone
Customer
Customer P/N
BeStar Model Name SMOOO 3A-42
Product No. S A 0812006
Issue No.
Issue Date 08/09/18
Approval:
1.Characteristics
2.Drawing
3.Reliability Test
4.Packing
5.History Change Record
Drawn by Checked by Approved by Customer approved
For conform to the European Union Directive on the Restriction of Hazardous Substances(RoHS), this type of
productions forbid use all the hazardous substances as follow:
Lead Cadmium Mercury
Hexavalent chromium
Polybrominated biphenyls (PBB)
Polybrominated diphenyl ethers (PBDE)
Worldwide Sales Factory 1 Location
BeStar Acoustic Asia Corporation HK Ltd. BeStar Electronics (Changzhou) Industry Co., Ltd.
Unit 10-18, 32/F, Tower 1, Millennium City 1 No. 199 Huang He West Road, New District
388 Kwun Tong Road, Kwun Tong, Changzhou Jiangsu Province, PR China 213022
Kowloon Hong Kong SAR 汉得利（常州）电子有限公司
ma@be-star.com, Tel.: +852-3972-2050
HU UH 213022 中国 江苏省常州市新北区黄河西路199号
博士達國際有限公司 Factory 2 Location:
港香 九龍 觀 塘 道 388城 之 紀 號創 1 第 期 BeStar Electronics (Shenzhen) Industry Co., Ltd.
座32樓十至十八室 Floor 2 A22 Building, Benkang Industry Park,
Kuichong Town, Longgang Zone Shenzhen, Guangdong Province
深圳市 漢 得 利 電 子 科 技 有 限 公 司
深圳市龙岗区葵涌镇奔康工业区A22栋二楼
2. M E M S M I C R O P H O N E
1 . M o d e l d e f i n a t i o n : S M O 0 3 A - 4 2
S M O A
4 2 : Silicon B Microphone.
d ：Omnidirectional 03：Serise No. ：appearance
2 . E l : c -42±3 c h a r a c t e r i s t i c s :
e t r i c a l
2 .
1 Directivity :Omni-directional
d B
2.2 Sensitivity （0dB=1V/Pa，1KHz） :-42±3
2.3 Output impedance :Max 100Ω
2.4 Operating voltage range :1.5V-3.6V
2.5 Current consumption :Max e 200μA d B
: M o r t h a n
2.6 S/N Ratio ( S P L = 1 , 1 K 55 , A - w e i g h t i n g )
H z
2 . Pa
7 Max Input Sound Level :At 120dB SPL, THD＜5%
3 . F r e q u e n c y R e s p o n s e a n d S c h e m a t i c D i a g r a m :
3 . 1 T y p i c a l F r e q u e n c y R e s p o n s e C u r v e :
dB
+20
Relative Response(dB)
+15
+10
+6 +6
+3 +3
0
-3 -3
-4
-10
-11 -11
-20 HZ
100 200 500 1K 2K 5K 10K 20K
3 . 2 S c h e m a t i c D i a g r a m :
Proposed Application Circuit
Vcc (Note:Customer Defined)
C O u t p u t
Power S Output
M E M M I C
GND GND
Rin
4 . M e c h a n i c a l c h a r a c t e r i s t i c s :
4 . 1 W e i g h t : L e s s t h a n 0 . 3 g
4 . 2 D i m e n s i o n :
1.32±0.1
1.25±0.1
U n i t : m m 3.76±0.1
0.15±0.05
2.22±0.1
0.15±0.1
1.87±0.1
2.97±0.1
4.72±0.1
0.84±0.1
-0.05
1.4+0.1
1.24±0.1
3. 5 . 1 R e e l T a p e
16
80±0.5
12.4
13.0-0.2
+0.5
(8.0±0.1)
(1.75±0.1)
(4±0.1) (?1.5+0.1)
(2±0.05) (5.5±0.05)(12.0±0.3) (0.3±0.05)
-0
(5.1±0.1)
10°
(?1.5 MIN)
10° COVER TAPE
1.55±0.1
165°
-180
°
0.1-0.7N Force
4.2±0.1
CARRIER TAPE LOADING DIRECTION
TRAILER (63 holes) LEADER(32 holes)
504mm 32000mm 256mm 248mm
9.3mm
Microphone Cover Tape
5.2 Packing Quantity:4000 pieces per reel ,5 reels per carton(total 20000
pieces)
5.3 Packup Tool Pick location 0.5
2.6
Recommended are for
vacuum nozzle pick
0.5 2.77 up location
4. 5 . 4 R e e l i n s t a ll a ti o n
Foam
Foam(5)
LABEL ON THE TOP
WATERPROOF BAG(4) )
PACKAGE CRITERION:
1.PUT A PIECE OF FOAM AT THE BOTTOM OF
OUTER BOX.
2.PUT FOAMS AROUND WATERPROOF BAG,
FOAM(6)
AND A TRIANGLE PAD AT EVERY INTERNAL
CONNER OF OUTER BOX(BETWEEN WATERPROOF
BAG AND FOAM).
3.STICK LABEL ON THE TOP
4.PUT 5 ROLLS OF PRODUCT INTO
FOAM AROUND WATERPROOF BAG WATERPROOF BAG,THEN PUT INTO OUTER
OUTER BOX(1) PACKAGE,2500×5/BOX.
TRIANGLE PAD(2)
5.PUT A FOAM AT THE FIRST LAYER.
6.STICK LABEL ON OUTER BOX.
LABEL(3)
Foam is installed
on the bottom
6 FOAM 340×120×10 4 PIECES/BOX
5 FOAM 350×350×10 2 PIECES/BOX
4 WATERPROOF BAG 350×350×280 1 PIECE/BOX
3 LABEL 6 PIECES/BOX
2 TRIANGLE PAD 120×95×95 4 PIECES/BOX
1 OUTER BOX 370×370×160 1 PIECE/BOX
NO description SPEC. Quantity
5. 6． Reliablity Test：
6.1.Simulated Reflow (Without solder): Samples for qualification testing require a
minimum of 3 passes of standard reflow solder profiles .2 hours of setting time
is required between each reflow profile test.
6.2.Static Humidity: Precondition at +25℃ for 1 hour.Then expose to +70℃ with 90 to
95% relative humidity for 120 hours.Finally dry at room ambient for 3±1 hours
before taking final measurement.
6.3.Temperature Shock: Each cycle shall consist of 15 minutes at -40℃,15 minutes at
+85℃ with a 20 seconds maximum transition time .Test duration is for 30 cycle ,
starting from cold to hot temperature.
6.4.ESD sensitivity: Perform ESD sensitivity threshold measurements for each contact
according to MIL-STD-883E,Method 3015 for Human Body Model and for Machine Model.
Identify the ESD threshold levels indicating passage of 2000V Human Body Model.
6.5.Random Vibrations: Vibrate randomly from 20 Hz to 2000Hz using the
Following Power Spectra Density(PSD) profile: It is a +3dB/octave .Starting with
0.01325g2/ Hz from 20Hz to 80Hz ,then 0.053g2/ Hz or 8g’s RMS level from 80Hz to
the PSD tolerance is ± 3dB from 20Hz to 1000Hz and ±6dB above 1000Hz .The
analyzer bandwidth to be set at 25Hz BW from 20Hz to 2000Hz , 50Hz BW to 1000Hz,and
finally 100Hz BW to 2000Hz ,The test time is 15 minutes per plane.
6.6.Mechanical Shock: Subject samples to half sine shock pulses(3000 g’s ±15% for
0.3ms )in each direction ,totally 6 shocks.
6.7.Operation Life: Subject samples to +85℃ for 168 hours under full rated power.
6.8. Solder Reflow: One pass through standard solder reflow profile.
6.9.Drop Test: Samples are fixed inside the fixture and droped naturally from the 2m
height onto a concrete plane in six direction for three times ,total 18 times .The
dimension of test fixture is 102（L）*54(W)*41(H)mm, and the weight is around 200g.
6.10.Sinusoidal Vibration: Vibrate randomly from 10Hz to 2000Hz ,1 octave/minute with
2mm amplitude (peak to peak) for 2 hours in each direction.
6.11.PC Board Solder Adhesion : Each test PC board shall contain only one part .Place
PC Board for testing upside down on two supports spaced 90mm apart centering the
part to within ±1mm of the span .Orient this part such that the longest dimension
is perpendicular between the two supports. Next using a force gauge ,also centering
to within ±1mm of the span’s center ,slowly apply a downward vertical force and
push with increasing force until the part’s terminations separate from the PC board.
Record at which deflection point mechanical failure occurs. Parts shall withstand
a minimum deflection as described below .Repeat for each test sample. Identify
precisely where termination stress failure(s) occur and include at least one
picture.
6. 7.Application：
7.1 A) Storage temperature range：-40℃~+100℃
B) Operation temperature range：-40℃~+100℃
7.2 Recommend Re-flow Prifile
7．3 PCB Layout
Top view Bottom view
7. 8.Measurement system:
8.1.Standard Frequency Response Test
Anechoic Room
8.2. S/N Rstio Test
Anechoic Room
