9. Components of MEMS

11. Image of the hybrid telemetric MEMS.

13. Microscope image of interdigitated capacitor

15. Bent Beam structure .

17. Equivalent model of the interdigitated capacitor and an impedance diagram measured at 270 ◦C [(a) modulus and (b) phase].

18. Impedance module of the interdigitated capacitor measured at different Temperatures(100 ◦C to 330 ◦C.)

21. Microscope image of the inductor A1 realized by thick-film deposition on alumina.

22. Microscope image of the inductor B1 realized by photolithography

23. Equivalent model of the planar inductor and impedance diagrams at different temperatures.(23 ◦C to 340 ◦C)

28. BLOCK DIAGRAM OF INDUCTIVE TELEMETRY

31. Modulus and phase of the impedance measured from the terminals of the readout inductor.

35. Modules of hybrid sensor measured using impedance analyzer at different temperatures.

36. Phase of hybrid sensor measured using impedance analyzer at different temperatures

38. Capacitance sensor values directly measured and compared with the calculated ones.

39. Temperature values measured with the Pt100 and compared with the Min-Phase and 3-Resonances calculated values.