This document discusses open innovation case studies of companies implementing open innovation strategies. It profiles Primo1D, a startup spun off from a research center to commercialize an electronic thread technology. Primo1D uses open innovation models like licensing the technology, collaborating with customers on product development, and outsourcing R&D. The document outlines Primo1D's technology, product applications, ecosystem partners, industrialization plan, and how it engaged in a push-pull process of technology development and market identification.
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Case Studies on
Open Innovation
in ICT : Primo1D
Dominique Vicard
CTO
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Founded August 2013
Spin-off from CEA-Leti research center (France)
Exclusive licensee for E-Thread® technology
Our know-how : embedding electronics in a unique form factor
A technology breakthrough at the crossroads of proven
technologies, with a competitive industrial model
A strong ecosystem to boost adoption of smart objects
A strong financial situation with a first VC round of 3M€
RFID product industrialization in progress for first volumes by
second half of 2016.
Company profile
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The seasoned founding team
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The E-Thread® of Primo1D
A disruptive innovation from the
CEA, strongly protected by patents
Electronics embedded into a textile
yarn, in a unique form factor
Invisible, inseparable, durable, easy
to integrate into textiles and plastics
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The RFID E-Thread®
E-Thread®
Traceability
Fast and secure reading
Anti counterfeiting
Anti theft
After sales services
Recycling
Commercial
laundries
Apparel
A unique, invisible and durable authentification:
« Fitted for life »: from cradle to grave
Inseparable and imperceptible: integrated into your textile
« All in One »: traceability, anti-theft et anti-counterfeiting with one device
Standard: UHF EPC Gen2, compatible with all existing infrastructure
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Application Fields
Function is defined by the chip
RFID Chip (existing):
RFID applications (traceability, inventory, possibly anti-
counterfeit/anti-theft, process automation, web-link)
LED Chip (existing):
Security, Visibility, Visual signaling, Fashion
ASIC Chip (project):
Unlimited applications (sensing, actuating, monitoring) under the
following constraint :
2 wires only for data and power
Specific Chip and/or Cover layout
like : SHM, Sensing Materials, In-Situ process monitoring
Unique advantages are :
Capacity to be “buried” in materials (instead of being glued)
Material Process Friendly (small modification of tooling only)
Material Structure Friendly (weak interaction with material structure)
Several Potential Application Fields Identified
Tires, Pipes, Cables, Composites, Geo-textiles, Home textiles
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A world of opportunities
Traceability
Supply Chain optimization
Inventory management
Anti-theft
Anti-counterfeiting
Production control
Customer shopping
experience
Decoration
LED’s lighting effects
In Situ
Monitoring
Health and Sport
monitoring
Preventive maintenance
Source: IdTechEx « RFID in Apparel 2012-2020 » and Primo1D
FuturePresent
HighSmall
Market
Barrierforadoption Sensors in textiles, plastics,
cables, … (sport, health,
automotive, aeronautics,..)
LED’s decoration in high
end textiles and plastics
(luxury, automotive)
Applications :
RFID tags for Laundry
17M$, 65 Millions tags
Luxury
Fashion
Retail
RFID tags for textile retail
690M$, 12 Billions tags
RFID tags for Textile
Production control
RFID tags in Industry
plastics, rubber, tires,…
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The E-Thread® technology
A competitive and low capex technology
for high volume manufacturing
Smart packaging
~ 100 000 E-Thread chips
per 8 inches wafer
Micromechanics
High throughput
assembly line
Textile
Component integration
within a textile spool
« Make / license »« Buy »
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Industrial Plan
R&D
2014 2015 2016 2017
Financing Round A Financing Round B
Customer Pilot Run
(100K- 1M+)
Market
Penetration
Commercial
Development
(10M+)
Customer Integration
Tests
(1K – 10K+)
License
Agreement
CEA
Technology Building Blocks
Development
Prototyping
(100+)
2018
RFID v1 Product
Development
Industrialization
Design Pilot Line
Setup
Mass Production
Pilot Line Production
First Semi-automated Assembly Tooling
RFID V2 Product
Development Active Products (Sensors) Development
Advanced Assembly Tooling Prototype
(singularized, 4-wires, high-throughput)
Design Equipment
Supply Production
Design Equipment
Supply
Assembly Line V1
Assembly Line V2
Assembly Line V3
Textile
Integration
Automated IntegrationManual Integration Semi-Automated Integration
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Open Innovation for Primo1D
“Open innovation is a paradigm that assumes that firms can
and should use external ideas as well as internal ideas, and
internal and external paths to market, as the firms look to
advance their technology” - Chesbrough, Henry William
Models of Open Innovation used by CEA / Primo1D
CEA :
Spin-Off
Licensing
Collaborative product design and development
Primo1D
Customer immersion
Collaborative product design and development
R&D outsourcing
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Ecosystem
Assembly equipment
& know-how
R&D Lab,
Semi-
Conductor
Fab in Leti
End user
Know-how,
Early
Adopters,
European
Programs.
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Push/Pull Process
2016
2015
2014
2013
2012
2011
2010
2009
2008
2007
2006
2005
2004
Techno Push Business Pull
CEA-Leti enters METIS Association ▪ ▪ METIS Members search « technological differentiators »
Idea and Patent : “Diabolo” micro-packaging technology ▪
▪ First Market study : what usage can “Diabolo” serve?
▪ CEA-Leti Spin-Off process - 18 Months - Business plan
secures technological developments ▪ FP7 PASTA Project ▪ identifies a LED usage for decoration
RFID Application Patented «
“Diabolo” Portfolio reaches 20 patents «
Laundry RFID Product Developments «
Creation of Primo1D
Round A of Financing
First Production
▪ Teaming with Laundry RFID solution provider
Primo1D enters PASTA ▪
» Industrial Laundry and Textile Distribution sectors identified
»Traceability and Sensing identified
▪ Laundry RFID solution provider cooperation exit
Primo1D buys equipment from PASTA partner ▪
» “Diabolo” becomes E-Thread™
» Cable, Ropes and Composites sectors identified
▪ Business Development
End of PASTA
Industrialization ▪
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Thanks for your attention!
Winner 2012 « Emergence »
Winner 2013 « Créa/Dév »
Best Business Plan
Challenge + 2012-2