Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth! TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020 Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into: - Conformable substrate: the flexible substrate will be shaped in a definitive way after processing - “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs) - “Unused” flexibility: in the end, the flexibility is not an added value to the customer We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates. However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2). We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications. A WIDE, EXCITING RANGE OF NEW APPLICATIONS Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon. More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/

1. Market & Technology Trends
in Materials & Equipement for
Printed & Flexible Electronics
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2. Key Objectives of the Report
•
This report, done in collaboration by Yole Développement and DayDream companies, aims at
giving insights on:
–
The market and applications for Printed & Flexible electronics
–
The timeline by applications (displays, lighting, solar cells, sensors, system-in-foil)
–
The different production processes and technical challenges
–
Equipment forecast
–
Technical requirements & challenges for materials
–
Cost structure material
–
Material forecast
–
Main players status
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3. Who Should Be Interested in This Report?
•
Chemical & tools companies
–
•
Devices makers
–
Identify what the technical hurdles
Identify and evaluate printed
for printed electronics are
–
electronics markets with market size
Analyze the threads and
& growth
–
opportunities
–
opportunities
Quantify the market opportunities for
–
tools and chemistry
–
•
–
Understand the potentialities of the
Monitor and benchmark your
competitor’s advancements
Benchmark your competitors
Systems makers
Analyze the threads and
•
Financial & Strategic investors
–
Understand the main market
printed electronics market
–
dynamics and main technological
Understand the technical challenges
trends
–
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Get the list of the key players

4. Introduction
•
Flexible Electronics using printing processes is a new field of technologies with great
expectations in terms of market and business. However, it also means a whole new
supply chain and industrial infrastructure needs to be set up.
•
Our report describes for Flexible Electronics the applications, market trends and
technologies used today, as well as printing processes that could be used in the
future.
•
Today flexible applications exist, but not using printing processes. However, we
believe this will change in the future and that printing processes for flexible
electronics will be a growing market sector.
•
The main motivations to go flexible are to achieve better shock resistance (e.g. for a
display), and to allow new applications. Printing processes will bring lower
manufacturing costs and possibly aid growth in some market sectors.
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5. Application Landscape
•
Market drivers for flexible and printed electronics are different, even though
manufacturing processes and end applications share similarities.
•
Main market drivers for flexible electronics are:
–
The possibility to add new functionalities:
•
•
Conformability for OPV (energy harvesting)
•
–
Conformability for OLED lighting (for the automotive industry),
Robustness for small OLED displays (for smart phones & tablets)
The possibility to create new applications:
•
–
Wearable electronics.
Flexible electronics is NOT meant to be low-cost, and usually uses expensive processes
(MOCVD, evaporation)
•
The main market driver for printed electronics is:
–
Cost reduction due to high volume (roll-to-roll) manufacturing or by using fewer expensive
manufacturing processes (MOCVD, evaporation):
•
Potentially lower cost OLED TVs could be built if solution-based manufacturing is mastered and
potentially low cost OPV could appear if technical challenges are leveraged
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6. Time to market
Legend
Flexible
Roadmaps below show the time-to-market for the different applications
with the split Flex vs. Print functionalities.
Printed
E-Paper
DISPLAYS
Small OLED Diplays
Large OLED Diplays
?
?
LIGTHING
OLED lighting for automotive & luxury lighting
OLED lighting for general lighting
2013
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2016
2018
2020+

7. Time to Market
Legend
Flexible
Printed
PV
Inorganic Photovoltaic
OPV
SUBSTRATES
SENSING
Sensors
Systems on Foils / Polytronics
2013
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2014
2016
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2018
2020+

8. Example of process roadmap
Printed
OLED Lighting: What Is to Be Printed?
Current Material /
technology
Structure
Glass
Encapsulation
Current status
Short / Midterm evolution
Long-term
evolution
Printed organic
barrier
Not Printed
Cathode
Different materials
(metal etc.)
Electron Injection Layer
(EIL)
Evaporation
Printed
Electron Transport Layer
(ETL)
Emissive Layer (EML)
Organic materials
Hole Transport Layer
(HTL)
Evaporation
Printed
Both printed /
not printed
Printed
Hole Injection Layer (HIL)
ITO / Organic
materials
Anode
Glass
Substrate / Encapsulation
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Not Printed
Printed organic
barrier

9. Example of process roadmap
Not flexible
OLED Lighting: What Is to Be Flexible?
Current Material /
technology
Structure
Current status
Short / Midterm evolution
Long-term
evolution
Glass
Encapsulation
Rigid glass / rigid
metal foil
Flexible glass /
flexible metal foil
Flexible organic
barrier
Cathode
Different materials
(metal etc.)
Electron Injection Layer
(EIL)
Flexible evaporated material
Flexible and
Solution based
Electron Transport Layer
(ETL)
Emissive Layer (EML)
Organic materials
Hole Transport Layer
(HTL)
Flexible
evaporated
material
Flexible and Solution based material
Hole Injection Layer (HIL)
ITO / Organic
materials
Anode
Rigid ITO /
Flexible Organic
material
Glass
Substrate / Encapsulation
Rigid glass
Flexible and Printed organic material /
graphene / Metal grid / carbon nanotube /
silver nanowire etc…
Flexible glass
Flexible organic
barrier
Encapsulation is the limiting factor for flexible OLED lighting
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10. Equipment forecast 2013-2020 in value
(Million USD)
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11. Material value for printed and/or flexible
electronics
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12. About the Authors of This Report
Dr. Eric Mounier, Senior Analyst, YOLE DEVELOPPEMENT
Since 1998, he is a cofounder of Yole Développement. Eric is in charge of market analysis for
MEMS, equipment & material, photonics and Printed Electronics. He is Chief Editor of
MEMSTrends & Micronews magazines. Before joining Yole Développement, Eric worked as a
market analyst at CEA Leti. He has a PhD in microelectronics from the INPG in Grenoble.
Contact: mounier@yole.fr
Antoine Bonnabel, Market & Technology Analyst, YOLE DEVELOPPEMENT
Antoine works as market & technology analyst for MEMS devices and technologies at Yole
Développement. He holds a M.Sc. in microelectronics and microsystems from Grenoble Institute of
Technologies and a M.Sc. in marketing and business management from Grenoble Graduate School
of Business.
Contact: bonnabel@yole.fr
Wenquan Zhang, Business Analyst, DAYDREAM
Wenquan works as business analyst for Daydream in Shanghai. He holds two Masters of Science,
one in Engineering from the Tongji University (China) and one in Sustainable Development from the
Uppsala University (Sweden). Before joining Daydream, Wenquan has worked at the Stockholm
Environment Institute and the Asian Development Bank.
Contact: wenquan.zhang@daydream.eu
Dr. Fabrice Lacombe, Associate Director, DAYDREAM
Fabrice joined Daydream in 2005 and is Associate Director in charge of the German subsidiary
since 2010. Fabrice has performed and managed over 40 projects in chemistry, materials and life
science and has a PhD in Chemistry from the Dortmund University (Germany).
Contact: fabrice.lacombe@daydream.eu
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