Yole igbt market_and_technology_trends_july_2015_sample

© July 2015
From Technologies
to Market
IGBT market and
technology trends
2015 report
Sample
FromTechnologies to Market

2
TABLE OF CONTENTS
• Glossary 4
• What we got right, what we got wrong 5
• Changes for the 2015 report 6
• Companies cited in the report 7
• Executive Summary 8
• Preliminary Definitions 30
• Market segmentation 35
• Introduction 36
• Market metrics and forecasts 43
Update on power electronics market
IGBT market metrics and forecasts
ASP and associated market analysis
Applications analysis
IGBT for motor drives
IGBT for PV inverters
IGBT for Electric and Hybrid cars
IGBT for rail traction
IGBT for wind turbines
IGBT for UPS
Secondary IGBT markets
• Supply-chain and players analysis 136
Main players and market shares
IGBT in China
• Technology analysis 153
IGBT history and positioning
Wafer trends and market
Architectures of IGBT and analysis
Case studies and technology evolution
Packaging for IGBT
• Conclusions 218
• Yole Développement Presentation 221
©2015 | www.yole.fr | IGBT 2015

3
CHANGES FOR THE 2015 REPORT
New content in respect to previous edition
What’s new?
o 2nd IGBT Technologies and market report fromYole Développement
o New forecasts, extended from 2014 to 2020
o Market metrics and forecasts in Units (considering bare dies, discrete components or modules depending on the
application)
o Segmentation modifications, stronger focus on evolution depending on the voltage
o Update on business models for IGBT manufacturing
o Focus on Chinese players and their business model and technologies
o Focus on IGBT technologies and architectures by player, with evolution from 1st generation to current generation
o Roadmap and future evolutions for IGBT architectures
o Focus on future evolutions for IGBT packaging

4
MARKET SEGMENTATION
We focus on
6 key
applications
for power
electronics
and other
ones with
large volume
market
Segment Applications
Automotive EV/HEV powertrains and chargers
UPS Data centers, hospitals, industries
Rail Trains, metros and subways powertrains
Photovoltaics Photovoltaics inverter and micro-inverters
Wind Wind turbines inverters (on-shore and off-shore)
Motor drives
Industrial applications (lifts, HVAC, pumps, fans…),
commercial motor drives
Industrial
Welding, Induction heating, Medical,Avionics and marine
propulsion, Heavy duty vehicles…
Commercial Consumer,White goods, Lighting, Cameras…
6 key
applications
for power
electronics

5
YOLE METHODOLOGY
• Yole Développement uses mainly three different sources to best carry on this report:
• Internal knowledge: Yole has been working in the power electronics industry for years now and we have
acquired a deep understanding of the market and its trends and evolutions.We have created a rich internal
data-base of figures and key contacts in the industry.
• Interviews:We carry on an important number of interviews during the report production with key players of
the industry all along the supply chain (dies and modules manufacturers, tiers 1 and 2, end users…).
• WSTS: World Semiconductor Trade Statistics => access to raw data
Internal knowledge Interviews Raw data
IGBT market
figures
MULTI-SOURCING

6
POWER ELECTRONICS BUSINESS UPDATE
2014 – 2020 value chain analysis: system, device, wafer
Yole’s 2015
expectations
for 2020
power
electronics
market are
similar to
2014
expectations
Electronics Systems
$--- B
Power Inverters
$--- B
Semiconductor power
devices (discrete and
modules)
$--- B
Power
wafers
$--- B
Electronics Systems
$--- B
Power Inverters
$--- B
Semiconductor power
devices (discrete and
modules)
$--- B
Power
wafers
$--- B
2014 2020
CAGR: +4.7%
CAGR: +6.9%
CAGR: +2%
CAGR: +6.1%

7
IGBT MARKET METRICS & FORECASTS
Evolution of the split by application between 2014 and 2020, in volume, for IGBT dies
packaged as power modules
IGBT power
module
market
growth will be
driven mainly
by EV/HEV
Yole Développement – July 2015
Those charts represent the split of bare dies packaged as power modules by application,thus depend
on the amount of devices used by module. Split of IGBT power module by application is different.

8
IGBT market forecasts till 2020, in value and split by application
IGBT dies are
used in a wide
range of
applications

9
Split of IGBT dies per voltage in 2014, in volume and in value

10
Geographical point of view
IGBT are sold
all over the
world, but
high voltages
are mainly
present in
Japan and
Europe
• IGBT market is leaded by
Asia, which represented
more than 70% of the
whole market in revenue in
2014
• Japan is still the leader, but
followed closely by China
• Americas (including US)
represented only 8% of
whole IGBT market,
despite their strong
position in power
electronics
• For high voltage IGBT
(2.5kV and more), main
markets are Europe and
Japan Yole Développement – July 2015

11
ASP AND ASSOCIATED MARKET ANALYSIS
Evolution of market sizes and ASP with the time, depending on the voltage
1,200V and
650V IGBTs
are expected
to be the
biggest
markets by
2020, while
400V remains
a niche
market

12
IGBT FOR EV/HEV
Different options to develop electrified vehicles
Functions SSV Mild HEV Full HEV
PHEV
(with EREV)
EV
(BEV or FCV)
Start/stop: Stop engine idles
when a vehicle slows down and
comes to a stop
X X X X X
Regenerate braking X X X X
Additional power for a few
seconds (electric motor)
X X X X
Additional power for mid
distance (city traffic)
X X X
Power for long distance
(10 to 40 miles)
X X X
Recharge of battery on the grid
or with a generator
X X
Energy savings 5-10%
(up to 25% in city
traffic)
10- 25% 25 – 50% 50 – 100% 100%
Electric power 3-8 kW 4 - 20 kW 30 - 75 KW 70 – 100 kW 70 – 100 kW
Car example PSA C2 Honda civic Toyota Prius GMVolt Nissan leaf

13
IGBT FOR EV/HEV
IGBT for EV/HEV market forecasts, in value
IGBT market
for EV/HEV
will be
multiplied by
3 between
2014 and
2020

14
IGBT FOR WIND TURBINES
Supply chain
for wind
turbines is
already well
established
IGBT
Power
module
Stack
assembly
Converter
assembly
Wind turbine
makers
(DHC: JV of Hitachi and DEC)

15
Chinese IGBT players
With a very
strong local
market,
Chinese
companies are
entering the
die
manufacturing
market
Nowadays, 1/3 of overall IGBTs are
sold in China, which represents a
$1B market.
However, near 97% of IGBTs and
related products are imported
from abroad. Local manufacturers
are trying to catch up with the
technology gap between the
leaders in the market and to make
up with the increasing demand.
For now their products are mainly
used in low power applications
such as air-conditioning or
inductive heating
SUPPLY-CHAIN

16
Evolution of IGBTs voltage with time
IGBTs are
now covering
a wide range
of voltage
VCE (V)
6500
3300
2500
1700
1000
400
600
1985 1990 1995 2000 2005 2010 2015
IGBT devices progressively entered all the voltage ranges and are now
available from 400V to 6.5kV.
At high voltage limit, IGBTs are facing wide band-gap devices
competition.With strong developments of those technologies and their
benefits, it seems thatWBG have more advantages than IGBTs. Moreover,
to achieve higher voltages, many IGBTs can be used in series. That’s why
we don’t expect maximum IGBT voltage to increase in the future.
Small voltage IGBTs have been developed in order to compete with
SJMOSFET. Below 400V, IGBTs are starting to loose their advantages, and
mainly MOSFETs are used.
IGBT HISTORY AND POSITIONING

17
TECHNOLOGY ANALYSIS
IGBT technology evolution and players involved
PT(planar)
1988
1995
1985
NPT(planar)
1997
Trench gate
Thin wafer
technologies
2002
FS (planar)
Trench FS
(thin wafer)
2008
2011
CSTBT
Trench FS
LPT-
CSTBT
Advanced
trench FS
2014
Trench
enhanced FS
LPT-CSTBT
(thin wafer)
SPT+
2007

18
TECHNOLOGY ANALYSIS
Non-punch through IGBT
N-Channel Non-Punch-Through IGBT Cross Section
The NPT IGBTs have a similar
structure as power MOSFETs,
except the fact that they have an
injection P+ layer instead of a N
substrate. On conduction state,
this layer returns a reverse
injection of minor carriers(holes
move from the injection layer to
drift region and emitter).
According to the neutrality
principal of the electricity, this
allows more electrons in the
base, which means a better
conductivity.
The name NPT is because the
base (drift region) are profound
enough to prevent depletion
region from reaching in a cut-off
state.
-E

19
TECHNOLOGY ANALYSIS
------ technology evolution
P+ Substrate
N+ buffer
N- basis
GateEmitter
Collector
N- basis
GateEmitter
Collector
N- basis
Gate
Emitter
Collector
1988 1997
PT NPT
Trench gate
Field stop
Trench gate
Field stop
Trench with
split gate
TrenchStop™ 5
TrenchStop™
2002 2008
N- basis
GateEmitter
Collector
Brand
name
Technology
Structure
High Speed ? High Speed 3 ?
2015
Trench gate
Field stop
Thin wafer
N- basis
Gate
Emitter
Collector
Al
N- basis
GateEmitter
Collector
Cu

20
TECHNOLOGY ANALYSIS
IGBT technology evolution forecast
Trench FS with split
gate
2015 SiC IGBT
P-ring FS+ Trench
Advanced HiGT
Superjunction IGBT

21
PACKAGING FOR IGBT
Roadmap of power module packaging design
In the future
power
modules will
have been
entirely
reshaped, with
the changes
depending on
the power
targeted
Bosch example
• Molded package
• Double side soldering
• Low inductance
Mitsubishi example
• Six Pack IGBT/Diode Package
• Cooling fin
• Thick copper layer for thermal
spreading
• Direct substrate cooling
Mid-power modules
Design evolution
Die on heatsink
• Die attach: film
sintering? Gold
sintering? Glue?
Silver oxalate?
• Ceramic heatsink?
• Ball bonding?
2018
2020
2014
2025
• Wide use of leadframe
• Over-molded package
• Top interconnections
• Ag sintering for die attach
• Encapsulation with parylene
• Ribbon bonding
• Silver (Ag) sintering for die
attach
• Pin-fin baseplate

22
Voltage (V)
Current(A)
1 10 100 1000 10000
0,1
1
10
100
1000
10000
PACKAGING FOR IGBT
Technology roadmap for embedded die, for power electronics
• There are two main focuses seen in
embedded technologies at the moment:
• Wireless/mobile market that created the
first volume and is always looking for the
best cost/form factor/performance trade-
off is seeing tough competition from other
packages.That is the market targeted by
many companies, such as Unimicron, hoping
to reach its very high volumes.This market
is using low-power applications.
• Mid- and high-power applications (starting
from 100W with Mosfets and going beyond
several kW for IGBTs) market which has
less volumes but has high needs for better
heat management and less parasitics.These
needs follow the trend of higher power
density and better performance (frequency,
power) of power devices, such as Mosfets,
IGBTs and wide band gap devices.
• In the mid-/high-power applications, small
dies packaging can have the same
technology strategies as low-power
applications (embedding at substrate level
like Infineon DrBlade) but large dies see
different strategies, such as Schweizer
approach of embedding large dies directly
at board level.The latter are very promising
and already see some volume in the
automotive market in Europe and USA.
Different types
of “power
applications”
with different
embedding
strategies and
players

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or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the non-
breaching Party shall be entitled to terminate all the pending
orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit
of the Seller itself, but also for its licensors, employees and agents.
Each of them is entitled to assert and enforce those provisions
against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions
or to any contract (orders) entered into in application of
these Terms and Conditions shall be settled by the French
Commercial Courts of Lyon, which shall have exclusive
jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the
Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES

24
MEMS
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
Packaging
PV
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
©2015 | www.yole.fr | About Yole Développement

25
4 BUSINESS MODELS
o Consulting and Analysis
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
www.yole.fr
o Reports
• Market Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
o Financial services
• MA (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication webcast services
• Events
www.i-Micronews.com

26
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
MA operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr

27
OUR GLOBAL ACTIVITY
Yole Japan
Yole Inc.
Yole
Korea
40% of our business is in
EU countries
North America
Asia

28
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plan along the
entire supply
chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
RD centers

29
CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Business Development Manager,Yole Inc
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan President,Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, President CEO,Yole Développement
Email: eloy@yole.fr
o Report business
• North America: Steve LaFerriere, Business Development Manager,Yole Inc
Email: laferriere@yole.fr
• Europe: Jérôme Azemar, Business Development Manager, European Office
Email: azemar@yole.fr
• Japan Asia:Takashi Onozawa, Sales Asia General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr
o General
• Email: info@yole.fr
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