5G Packaging Trends for the Smartphones 2021 - Sample

From Technologies to Markets
© 2021
From Technologies to Markets
5G Packaging
Trends for the
Smartphones
Market and Technology
Report 2021 Sample

2
2
5G Packaging Trends for the Smartphones | Sample | www.yole.fr | ©2021
TABLE OF CONTENTS
• Glossaries 2
• Table of contents 4
• Report objectives 5
• Scope of the report 7
• Report methodology 8
• About the authors 9
• Companies cited in this report 10
• Definitions 11
• Who should be interested by this report 13
• Yole Group of Companies related reports 14
• 3 pages summary 15
• Executive summary 19
• 5G Market Drivers & Dynamics 48
o Evolution of 5G networks, applications, implementation timeline,
disruptions and opportunities
• 5G packaging trends 70
o Technology & trends, RFFEM SiP architectures, requirements,
challenges, roadmap, interconnection trends
o 5G Packaging Market Forecasts 92
o Cellphone forecast by type & air standards, 5G RF component
packaging market at wafer-level & SiP level, RF SiP forecasts in
units & market by type of SiP modules
o Packaging for 5G mmWave including AiP 113
o AiP trends, antenna key parameters, design for mmW & sub6Ghz,
,AiP markets forecast, technology challenges, Flip-chip vs fan-out
o Players and supply chain 138
o Player landscape and positioning, company strategies, packaging
supply chain of key RFFEM suppliers
o 5G Packaging Technology trends by players 157
o 5G packaging Substrate Material Trends 169
o Technology trends, suppliers, market forecast
o EMI Shielding trends for 5G packaging 197
o Summary & Outlook 206
o Appendix 209

3
3
5G Packaging for Smartphones 2021 is a new report which focuses on the modules and components packaging
for the 5G Sub6Ghz and 5G mmWave.The objectives of this new report are as follows:
o Discuss drivers and dynamics for 5G varieties: 5G mmWave and 5G sub-6 GHz, and investigate the
disruptions and opportunities thereof
o Focus on various SiP architectures in the RF Front end of cellphones, for both cellular and connectivity
o RF front-end SiP market forecast in revenue, wafers, and units by:
o Interconnects trends forecast for RF SiP
o Analyze various developing RF SiP architectures for sub-6 GHz and mmWave frequencies, advantages and
suitability thereof
o RF front-end multi-die SiP roadmap, challenges, and technology requirements for 5G sub-6 GHz and 5G
mmWave (>24 GHz) bands, including antenna-in-package (AiP) trends
o Analyze supply chain changes and opportunities for 5G in smartphones, focusing on RF SiP manufacturing
and assembly, including package substrate
REPORT OBJECTIVES

4
4
SCOPE OF THE REPORT (1/2)
Yours needs are
out of the report’
scope?
Contact us for a custom study:
RF Front-End modules and components
5G sub 6 GHz and 5G mmWave modules and components
including AiP
Modems, transceivers, baseband processors
Topics NOT included in the report
Main focus

5
5
SCOPE OFTHE REPORT (2/2)
Yours needs are
out of the report’
scope?
Contact us for a custom study:
Cellular
Baseband
SoC
Cellular RF
Transceiver
RF
Front-End
RF signal amplification,
filtering and rooting
up/down to the antennas
Analog
Up/Down
conversion
Digital
Signal coding
Report scope
The focus of the report is on the RF Front-End and Antenna in Package (AiP) packaging for the 5G mobile
applications covering sub 6Gz and mmWave.The 5G cellular baseband and the RF transceiver are not
covered in this report from the package point of the view, except for the mmWave RF module, where RF
transceiver is integrated in the package

6
6
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information

7
7
Santosh KUMAR
Santosh Kumar is currently working as Senior Director & Principal Analyst in the Semiconductor & Software division at Yole Développement, part of
Yole Group of Companies. His main interest areas are advanced electronic packaging materials and technology including TSV and 3D packaging,
modeling and simulation, reliability and material characterization, wire bonding and novel solder materials and process etc. He received bachelor and
master degrees in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than
40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums
related to advanced microelectronics packaging.
santosh.kumar@yole.fr
Biographies & contact
ABOUT THE AUTHORS

8
8
Amkor (J-Devices, Nanium),Acco,Ajinomoto Fine-Techno,Apple,Applied Materials,ASE Group,ASMPT (NEXX),
AT&T,AT&S,AvagoTechnologies, Besi, Broadcom, Cavendish, Daeduck Electronics, DecaTechnologies, Dupont,
Ericsson, Evatec, Foxconn, GLOBALFOUNDRIES, Google, Henkel, HiSilicon, Hitachi Chemical, Huawei, Huatian,
Ibiden, Infineon, Intel, JCET/STATS ChipPAC, Kinetics, Kinsus, Kyocers, Kulicke & Soffa, Lenovo, LG Electronics, LG
Innotek, Marvell, MediaTek, Mitsubishi Materials, Mitsui Kinzoku, Murata, Nepes, NXP Semiconductors (Freescale),
NGK/NTK, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech
Technology, Qorvo (RFMD,Triquint), Qualcomm (RF360), Rogers, Samsung Electronics, Samsung Electromechanics
(SEMCO), SJSemi, Shinko, Skyworks Solutions, Soitec, Spreadtrum, SPIL, Sprint,TDK-EPCOS,Tongfu
Microelectronics,Towa,TSMC, Unimicron, Unisem, USI,Wisol, Xiaomi,Yamada, ZTE and more…
COMPANIES CITED IN THIS REPORT

9
9
WHO SHOULD BE INTERESTED IN THIS REPORT
RF component manufacturers
• Evaluate market potential of future technologies and products
• Understand the differentiated value of your products and
technologies in this market
• Build a roadmap for modules: which type of modules?When?
• Identify new business opportunities
• Identify potential strategic partners or technology providers
• Monitor and benchmark your competitor’s advancements
RF foundries, material and equipment suppliers,
packaging houses
• Understand what the components and technologies that will drive
the volumes in 2025
• Identify new business opportunities and prospects
RF and component specialists (manufacturers,
fabless), transceiver, modem, software vendors…
• Spot new opportunities and define diversification strategies linked
to RF components
Mobile phone OEMs
• Evaluate market potential of future technologies and products to
differentiate your products
• Evaluate the benefits of using these new technologies in your end
system, design architectures for the next generation of systems
• Screen potential new suppliers able to provide new functionalities,
or cost and size savings
R&D centers
• Assess market potential and trends about future technologies and
products
• Identify the best candidates for technology transfer
Financial & strategic investors
• Understand the structure and value chain of RF cellular
technology
• Estimate the potential of new technologies such as SOI, RF
MEMS,…
• Get the list of the main key players and emerging start-ups of this
industry worldwide

10
AIR STANDARD EVOLUTION
Toward network standard unification
Standard
unification has
been followed
by an
explosion in
mobile
applications
1G
AMPS
TACS
ETACS
NMT450
NTT/JTACS/NTACS
C-Netz
Radiocom 2000
RTMI
GSM
CDMA
D-AMPS
PDC
PHS
WCDMA
CDMA2000
TD-SCDMA
WiMAX
FDD-LTE (A)
TDD-LTE (A)
NR NR
2G 3G 4G 5G 6G
1980 1990 2000 2010 2020 2030

11
5G COMMERCIAL AVAILABILITY
Worldwide 5G network launches
Multiple 5G
networks have
been launched
worldwide.
North East
Asia is quickly
adopting 5G
with more
than 75 M
subscribers as
of June 2020
<5 M subscribers
<1 M subscribers
> 75 M subscribers
<1 M subscribers
<1 M subscribers
Fully launched
Multiple launches
Single launch

12
12
5G PACKAGING ROADMAP (FROM 2G TO 5G AND FURTHER …)
Level
of
integration
=>
From
discrete
to
Highly
integrated
SiP
2G (GSM)
3G
(WCDMA)
4G(LTE)
5G Sub
6GHz
5G
mmWave
6G
Single-side SiP
Single side SiP
Double-side SiP
Enhanced double-
side SiP
AiP
Outside
phone body
2008 2013 2019 2020 >>2025
Phone
case
Flex PCB Package
Package or
wafer BEOL ??
Antenna
placement
Single /double side SiP
Enhanced double-side SiP
5G mm Wave onwards need disruptive
innovation in packaging for complex
interconnections
Discrete PA pkg
Low loss package
material: substrate,
dielectric, mold
Laminate/ceramic/glass
Flip-chip, fan-out
WLP/PLP
Thermal management
Heterogeneous package integration
with precision antenna arrays, low-
loss interconnects and waveguides
and active devices
Ultra low loss material
Sub THz antenna array
Optical interconnect
Thermal management
(>100W/cm2)
No FEM,
Discrete PA
Usually 1 FEM (Tx,Rx)
Discrete PA still main
3-5 FEM
PA + FEM integration
5-7 FEM
PA + FEM integration
7-9 FEM
PA + Antenna + RFIC+
FEM + PMIC integration
PA + Antenna + RFIC+
FEM + PMIC+ Modem
integration
Heterogeneous
integration
AiP/AoC

13
13
RF FRONT-END MODULE COMPONENT DESCRIPTION
Filter
Switches
PA
PMIC
Switches
PA
PMIC
PA
PMIC
PMIC
MMIC
PA
Antennas
Filter
Switches
LNA
Filter
Switches
Switches
Single radio support
2G, 3G, 4G or 5G
Multi radio support
2G & 3G, 3G & 4G, …
No Filter function
LNA
Filter
Switches
PA
PMIC
LNA
Duplexer
Filter
Switches
PA
PMIC
Multiple radio support
Filter and switches
Multiple radio support
Filter, switches and LNA
Multi radio support 3G & 4G, 4G & 5G, …
PA, Switch, Filter, Duplexer, Multiplexer, LNA
5G mmWave support
MMIC, antenna, eventually a PA

14
14
5G PACKAGING MARKET FOR MOBILE
Packaging at
both wafer
and SiP level
BAW
filters
SAW
filters
Power
Amplifier
Low Noise
Amplifier
Switches
IPDs
RF Transceivers for
AiP (mmWave FEM)
Bumped die Bare die
Coreless substrate
SMD Passives
WaferThinning,
Dicing, Probe
WLP capping,TSV,
Bumping,Thinning,
Dicing, Probe
SMT
Wire-
bond
Shielding
SMT
Various RF components considered for the 5G RF SiP assembly market

15
15
Air standard segmentation is quite complex as multiple generations can be mixed on a single
component
Cellular Front-End segmentation is more difficult as multiple air standards can be aggregated in a single
component.
PACKAGING MARKET FOR 5G
2G • Standalone 2G PAM
3G • MMMB PA aggregating 2G/3G and standalone 3G PAM
4G • MMMB PA aggregating 2G/3G/4G, 2G/4G, 3G/4G
4G • Components and modules ensuring 4G connectivity
5G
• Components and modules ensuring 5G connectivity (PAD Drx FEM,
LNA bank, discrete switch, standalone filter,…), as well as 4G modules
that include 5G components (For instance 5G PA, filter,… in a PAD)
Classification of RF
modules by air
standards for
packaging market
calculation
FOCUS OFTHE REPORT

16
16
5G PACKAGING MARKET FOR SMARTPHONE
5G packaging market
was $0.51B in 2020 and
is expected to grow at
31% CAGR to reach
~$4.8B in 2026
AiP assembly market
for the mmW
communication in
mobile will grow by
XX% to reach ~$XXM
in 2026. AiP market
share in the 5G
packaging market will
increase from 11% in
2020 to 17% by 2026
5G sub 6
RFFEM
48%
5G mmW
RFFEM
32%
mmW
AiP
15%
mmW
Discrete
antenna
5%
5G sub 6
RFFEM
49%
5G mmW
RFFEM
43%
mmW AiP
4%
mmW
Discrete
antenna
4%
2020
($
0.51B)
2026
($2.6B)

17
17
5G PACKAGING SUPPLY CHAIN
v
v
v
OSATS
IDMs
Packaging
/ Testing
Substrate suppliers
Mold
compound
v
Substrate
core,
prepeg,
build-up,
RDL
dielectric
v
Interconnect
materials
v
Thermal interface material (TIM)
Plating tool
v
EMI Shielding (sputter)
v
Die bonder
v
Molding equipment

18
18
5G RF SUPPLY CHAIN STATUS
Manufacturing/Foundry Packaging/Testing
Design
PA
Switch-LNA-Tuner
Filter
Despite a growing number of design company trying to enter the RF Front-End market, a few leaders have captured most of the
market. Foundries and packaging houses have an ever-stronger footprint in the RF Front-End market

19
SUBSTRATE MARKET FOR 5G PACKAGING
By 5G sub6GHz & mmWave SiP module
Substrate
market for 5G
mmWave SiP
grow by XX%
to reach
~XXM by
2026, while for
5G sub6GHz
SiP, it’ll grow by
XX% to reach
~$XXXM
2020 2021 2022 2023 2024 2025 2026 CAGR
5GmmWave
5G sub 6
5G packaging substrate market by 5Gsub6GHz & mmW module

20
SUBSTRATE MARKET FOR 5G PACKAGING
By different 5G RF modules (including Antenna)
Substrate market
for mmWave AiP
increase from
XX% of the total
5G substrate
market in 2020
to XX% of the
markt by 2026.
5G sub6GHz
modules account
for XX% of the
substrate market
by 2026
5G sub
6
5G
mmW
RFFEM
mmW
AiP
mmW
Discrete
antenna
5G sub 6
5G
mmW
RFFEM
mmW
AiP
mmW
Discrete
antenna
2020
($XM)
2026
($XM)

21
Contact our
SalesTeam
for more
information
21
Contact our
SalesTeam
for more
information
5G's Impact on RF Front-End for
Telecom Infrastructure 2021
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

22
Contact our
SalesTeam
for more
information
22
Contact our
SalesTeam
for more
information
Qualcomm’s Second Generation
5G mmWave Chipset, from
Modem to Antenna
Broadcom AFEM-8200 PAMiD
in the Apple iPhone 12 Series
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

23
23
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?
About Yole Développement | www.yole.fr | ©2021

24
CONTACTS
Western US & Canada
Steve Laferriere - steve.laferriere@yole.fr
+ 1 310 600 8267
Eastern US & Canada
Chris Youman - chris.youman@yole.fr
+1 919 607 9839
Europe and RoW
Lizzie Levenez - lizzie.levenez@yole.fr
+49 15 123 544 182
Benelux, UK & Spain
Marine Wybranietz - marine.wybranietz@yole.fr
+49 69 96 21 76 78
India and RoA
Takashi Onozawa - takashi.onozawa@yole.fr
+81 80 4371 4887
Greater China
Mavis Wang - mavis.wang@yole.fr
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - peter.ok@yole.fr
+82 10 4089 0233
Japan
Miho Ohtake - miho.ohtake@yole.fr
+81 34 4059 204
Japan and Singapore
Itsuyo Oshiba - itsuyo.oshiba@yole.fr
+81 80 3577 3042
Japan
Toru Hosaka – toru.hosaka@yole.fr
+81 90 1775 3866
FINANCIAL SERVICES
› Jean-Christophe Eloy - eloy@yole.fr
+33 4 72 83 01 80
› Ivan Donaldson - ivan.donaldson@yole.fr
+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
jerome.azemar@yole.fr - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
jcoulon@systemplus.fr - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy, Public Relations
sandrine.leroy@yole.fr - +33 4 72 83 01 89
› General inquiries: info@yole.fr - +33 4 72 83 01 80
Follow us on
REPORTS, MONITORS &TRACKS

5G Packaging Trends for the Smartphones 2021 - Sample

Recomendados

Recomendados

Mais conteúdo relacionado

Mais de Yole Developpement

Mais de Yole Developpement (20)

Último

Último (20)

5G Packaging Trends for the Smartphones 2021 - Sample