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Trends in
Automotive
Packaging 2018
From Technologies to Market
©2018
SAMPLE
2
TABLE OF CONTENTS AUTOMOTIVE REPORT
• Report scope & definitions
o Scope of the report
o Companies cited in this report
o Glossary
• Executive summary
• Introduction of the automotive market
o Why packaging is so important in automotive ?
o 4 Megatrends : Electrification, autonomy, connectivity &
confort
o Worldwide automotive industry, plus focus on China
o Role of advanced packaging in automotive
• Automotive regulations & specific grades
• Applications
o Different applications in automotive
• Main axis: Power, Safety, Infotainment, Connectivity,
Lighting
o Different electronics devices in automotive (LED, MEMS and
sensors,ADAS sensors, power conversion, connectivity,
processing and storage)
• Cost analysis of electronic devices
• Automotive packaging focus by platform and
application
o Type of packaging platform in automotive
o Packages description (FO,WLCSP, QFN, FC…)
o Packaging trends per applications
o Focus on innovative packages and evolving apps
o Packages / Applications Matrix
• Players of the automotive packaging industry
o Supply chain of each application (camera, lighting,
radars…)
o Company profiles (ASE, Bosch, NXP…)
• Market forecasts
o Revenues per packages (breakdown per applications)
o Volumes (by packages, breakdown per applications)
• Conclusions
• About the author / Related Reports / Company
presentation
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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11
33
75
107
145
165
200
205
3
Biographies & contacts
Jérôme Azémar
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
Lauranne Chemisky
Emilie Jolivet
As Technical Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers
of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop business and knowledge of the company, maintain long term
relationship with its Yole’s accounts and meet their expectations. Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production
of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor
Manufacturing activities. Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor
manufacturing. Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in
Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills
which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France).
azemar@yole.fr
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package &
assembly, semiconductor manufacturing, memory and software & computing fields. Based on her valuable experience in the semiconductor industry, Emilie manages the
expansion of the technical and market expertise of the Semiconductor and Software Team. The team interacts daily with leading companies allowing semiconductor &
software analysts to collect a large amount of data and integrate their understanding of the evolution of the market with technology breakthroughs. In addition, Emilie’s
mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside
the Yole group. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). After an internship in failure analysis
at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Enriched by this experience,
she graduated with an MBA from IAE Lyon and then joined EV Group (Austria) as a business development manager in 3D & Advanced Packaging before joining Yole
Développement in 2016.
jolivet@yole.fr
Lauranne Chemisky is a technology and market analyst in the Semiconductor & Software Team at Yole Développement (Yole). Lauranne is currently engaged in the
development of market research reports as well as customized services for clients. She is able to leverage her technology training and experience in the fields of materials
and semiconductor manufacturing processes for advanced packaging applications. Previously, Lauranne worked at Apple in the Softgoods Product Design Team as a material
development engineer (CA, USA). Lauranne holds a master’s degree in Materials Science & Polymers from ITECH (Lyon, FR) and an M.Sc. in Technology and Innovation
Management from EMLyon Business School (Lyon, FR).
chemisky@yole.fr
4
 100 companies are cited in this report
ASE,Amkor, ams,Analog Devices,Apple,AT&S,Audi,Autoliv, BAIC, Baidu, Benewake, BuildYour Dreams, BMW, Bosch, Brightek,
Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental,
Daihatsu, Daimler, Dajun Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor
Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies,
Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex, Google, Hamamatsu,
Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai, Ichikoh
Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE
Automation Equipment, JJE Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent
System, LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric,
nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On Semiconductor, Optotech, Orsam, Ouster,
Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL,
Seoul Semiconductor, SAIC Motor, Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start,Taxas
Instruments,Tesla,Thorlabs,Tong Hsing Electronics,Toshiba,TowerJazz,Toyota,Transdev,TriLumina,TRW Automotive, United
Automotive Electronic Systems, Uber, Ushio,Valeo,Velodyne LiDAR,Volkswagen,Waymo,Wuhu sensorthch Intelligent Technology,
xFab and more…
COMPANIES CITED IN THE REPORT
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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OBJECTIVES OF THE REPORT
• Identify and analyze the major advanced packaging platforms used in the automotive industry
• Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting
devices, MEMS and sensors…
• Understand the impact of automotive regulations and specifications on packaging development
• Present a detailed technology roadmap for advanced packaging platforms for automotive applications
• Identify the market drivers, disruptions and business opportunities for the supply chain players
• Analyze key benefits and added value of emerging advanced packaging platforms
• Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive
landscape
• Give an overview of the players involved in the supply chain and specificities of each market segment
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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SCOPE OF THE REPORT
This report only
cover packaging
technologies for
innovative
devices in the
automotive
industry
• Introduction about the differences between automotive and consumer markets, based on our
advanced packaging industry analysis
• Analysis of packaging technologies that are implemented or will be developed for the automotive
industry
• Packaging trends in the automotive devices
• Adoption of new technologies takes time due to qualification process based on norms and
specifications
• Advanced packaging market forecast with breakdown by platform and application
• Players of the advanced packaging supply chain involved in the automotive industry
• Market forcast in units and revenue split by application and platform
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
Market drivers
8
INTRODUCTION OF THE AUTOMOTIVE INDUSTRY
• Automotive is the new El Dorado for microelectronics with several drivers for growth – 4 main trends :
• Electrification, autonomy, connectivity and comfort
• Electronics used for automotive stands 9% of the total IC market
• It’s a growing market :
• 7% growth for automotive sales
• 15% growth of electronics in automotive
• 20% growth for semiconductors in automotive
• About 30% growth for OSATs in automotive packaging
• the automotive market differs from the consumer market by higher
requirements and a better reliability for the electronics
• A electronic failure in a car can cause serious accident
• With more than hundreds of electronics parts in a car, the price pressure is higher than
in the consumer industry also because the margins in the automotive industry are smaller
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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HOW SIGNIFICANT IS THE AUTOMOTIVE PACKAGING MARKET ?
Two industries,
both controlled
by giant
companies with
~$250B in
revenue
©2018 | www.yole.fr | Trends and Markets in Automotive Packaging
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MICROELECTRONICS IN AUTOMOTIVE
Non exhaustive listWhat are the different electronic devices ?
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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4 MEGA TRENDS DRIVE INNOVATION IN INNOVATION
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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AUTOMOTIVE PACKAGING RELIABILITY
Requirements
Infotainment / Comfort Powertrain Safety Connectivity
Grade 3 & 2
-40°C to +105°C
Grade 1 & 0
-40°C to +150°C
Grade 1
-40°C to +125°C
Grade 3 & 2
-40°C to +105°C
Lighting
Grade 1 (ext)
-40°C to +125°C
Grade 3 & 2 (int)
-40°C to +105°C
• 5 main application groups were identified with very different needs and operating conditions
• In these 5 applications, you can find specific electronic devices (ex: LEDs in lighting) or some electronic devices can be
found in several but with different specs (ex: MCUs in safety vs. MCUs in infotainment)
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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AUTOMOTIVE PACKAGING ANALYSIS
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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TECHNOLOGY ROAD MAPS FOR AUTOMOTIVE DEVICES
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
Market Forcast
16
AUTOMOTIVE MARKET UNIT FORECAST BY APPLICATION
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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AUTOMOTIVE MARKET UNIT FORECAST BY PLATFORM
©2018 | www.yole.fr | Trends and Markets in Automotive Packaging
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AUTOMOTIVE PACKAGING MARKET SHARES : IDMVS. OSAT
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
Players and Supply Chain
20
OEMS WORLDWIDE Non exhaustive list
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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SUPPLY CHAIN ANALYSIS
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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AUTOMOTIVE LANDSCAPE & FOCUS ON CHINESE PLAYERS
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
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RELATED REPORTS
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
The automotive market grew by 7% in revenue
in 2017, while semiconductor technology in the
automotive market is growing by 20%. Electronic
devices are more and more common in cars
and the number of electronic systems is also
increasing. The quantity of electronics in a car has
increased 2.5 times since the 90’s; in 2017, 26 cm²
of semiconductor substrates was used in a car,
while in 2023 we expect 35 cm². Four main trends
are leading this augmentation, electrification,
autonomy, connectivity and comfort. All of them
involve a large number of sensors, power supplies,
communication chips, lighting components and
processors that can come from the consumer
marketorbedevelopedspecificallyforautomotive.
This increase in electronic devices in cars will
drive the packaging market. In fact, in 2017, the
packaging for automotive total revenue was
quoted at ~$3.7B and it will reach ~$7B in 2023,
including LED module. The automotive packaging
industry is involved in many device types and
thus in many packaging platforms. In the report,
you will find detailed scenarios for growth of the
market with a breakdown by packaging platform
and automotive application, such as radar, LiDAR,
power devices, lighting and photonics.
TRENDS IN AUTOMOTIVE PACKAGING 2018
Market & Technology report - November 2018
PACKAGING DEDICATED TO AUTOMOTIVE ELECTRONICS IS GROWING
AND WILL REACH $7B IN 2023
OSATs are gaining benefits from advanced packaging in automotive.
KEY FEATURES
• Introduction about the differences
between automotive and
consumer markets, based on
our advanced packaging industry
analysis
• Analysis of packaging technologies
that are implemented or will be
developed for the automotive
industry
• Packaging trends in the automotive
devices
• Adoption of new technologies
takes duration based on
specifications and norms
• Advanced packaging market
forecast with breakdown by
platform and application
• Players of the advanced packaging
supply chain involved in the
automotive industry
• Market forcast in units and revenue
split by application and platform
(Yole Développement, November 2018)
Power
conversion
ADAS
sensors
MEMS 
sensors
Lighting
Processing
 Storage
Connectivity
modules /
Telematics
Display
Front light
Rear light
MOSFET
IGBT
Memory
MCU
DC-DC convertor
GaN HEMT
CPU/GPU
Screen
Wifi
CISRadar
LiDAR
Accelerometers
Gyroscope
Microphones
ToF
Interior lighting
GPS
Pressure sensor
Infrared imager
ECU
BMIC
Micro bolometer
Micromirror IMUs
Magnetometer Ultrasonic
Humidity sensor
Small lamp
Front-end module
Antenna
Switch
*Non exhaustive list of applications
2018 Automotive industry: electronic parts overview*
The automotive industry is highly regulated, due
to concerns about safety and pollution. Due to all
the specifications required for each component,
new device development takes a long time for
qualification. This obstacle is a limitation in terms
of use of new types of packaging. More-over, the
automotive industry is not the most receptive
for innovations in packaging. But we are entering
a new era for automotive development that may
accelerate things. There are significant demands
for power applications that can drive innovation. A
second wave could be led by increasing autonomy
and connectivity. It is important also to notice that
is the first time in history that a big effort is made
to adapt consumer technologies to automotive
to drive innovation in dedicated applications such
as powertrain. Although the main platform in
term of units is the Wire Bond Ball Grid Array
(WBBGA) package, which represents half of the
market, advanced packaging platforms such as
flip-chip and fan-out are finding their place. The
next innovation expected is embedded die in
substrate for converter dies. Packages like Quad
Flat No-leads package (QFN), Interstitial Ball
DESPITE THE HIGH DEGREE OF REGULATION, CONSUMER PACKAGING
TYPES ARE SLOWLY ADAPTED TO, AND ADOPTED BY, THE AUTOMOTIVE
MARKET
TRENDS IN AUTOMOTIVE PACKAGING 2018
Automotive packaging roadmap
(Yole Développement, November 2018)
THE BIG WINNERS OF DIVERSIFICATION AND THE INCREASE OF ELECTRONICS IN
THE AUTOMOTIVE MARKET ARE THE OSATS
Players in the advanced packaging industry for
automotive can be split into two groups, the IDMs/
Tier 1 and the OSATs. IDMs and Tier 1 are the main
suppliers of the car OEMs for integrated systems, and
OSATs specialize in the initial packaging and testing.
Automotive packaging was mostly done in-house
by IDMs and Tier 1, as it allows an easier integration
and a faster development of systems. As ever more
electronics are implemented in cars, more and more
outsourcing goes to OSATs. In the past, OSATs supplied
relatively little of the electronic advanced packaging for
the automotive market, while today OSATs represent
38% of the total revenue for advanced packaging for
cars and this proportion might keep growing. This
change has been made possible due to the increasing
quantity of devices, diversification of components,
the increased complexity of the packaging and the
reliability of specific manufacturers. Moreover, some
devices come from the consumer market that OSATs
already supply. Currently, Amkor and ASE represent
more than 80% of the automotive advanced packaging
for automotive supplied by OSATs. In 2015, Amkor
acquired J-Devices, one of the larger Japanese OSATs.
Thanks to this acquisition and new brand positioning
focused on the automotive market, Amkor is now the
top OSAT in automotive packaging with more than 50%
of the market, followed by ASE and STATS ChipPAC.
Grid Array Package (iBGA) and ceramic packaging
are also growing for specific applications like CMOS
Image Sensors (CIS), MEMS and power devices. You
will find details on all the types of packages used in
the automotive industry, technology road maps and a
market analysis for each of them.
Automotive packaging – 2017 market shares: IDM vs. OSAT
(Yole Développement, November 2018)
OBJECTIVES OF THE REPORT
•	Identify and analyze the major advanced packaging platforms currently used in the automotive
industry
•	Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting
devices, MEMS and sensors…
•	Understand the impact of automotive regulations and specifications on packaging development
•	Present a detailed technology roadmap for advanced packaging platforms for automotive applications
•	Identify the market drivers, disruptions and business opportunities
•	Analyze key benefits and added value of emerging advanced packaging platforms
•	Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive
landscape
•	Give an overview of who is doing what, and specificities of each market segment
OSATs
38%
IDMs  Tiers 1
62%
Automotive packaging revenue 2017 total:
~$ 3.7B including LED module
ASE
25%
STATS
ChipPAC
5%
Others
14%Amkor
56%
OSATs market shares in 2017
OSATs
Current advanced packaging
technologies
Future technologies Market drivers
Integration
cost
*Number of cars that adapts CMOS Image
Sensor (CIS) for ADAS sensors
**Numbers of CIS in a car, high-end market
grows faster
Cooling
Cooling
Integration
Foot print
Thermal management
Reliability
Sensitivity
hermetic
Integration
Thermal management
Fan-Out
WLCSP (Fan in)
Flip chip (FC)/ Multi-die
Organic packages
Ceramic packages
Organic packages*
Ceramic packages**
Cu clip (or thicker Cu wire)Cu wire
FC in QFN
Quad Flat No-leads package
(QFN)(Low/mid power)
Power Module (high power)
Power
Radar
CIS
Power
More semi-open cavities
Shielding QFN
Wettable flanks
MEMS
Through hole
Embedded dieHigh Density Interconnect
(HDI) board
Standard substrate L/S
Embedded die
Side to side chip in QFN
QFN
Substrate Connection layers
MARKET  TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
ASE, Amkor, ams, Analog Devices, Apple, ATS, Audi, Autoliv, BAIC, Baidu, Benewake, Build Your Dreams,
BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery
Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun Technologies, Delphi,
DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor Corporation, Dynex
Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies,
Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex,
Google, Hamamatsu, Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell,
Huayu Automotive System, Hynix, Hyundai, Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology
Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE
Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent System,
LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz,
Mitsubishi Electric, nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On
Semiconductor, Optotech, Orsam, Ouster, Panasonic, Philips, Pixelplus, Powertech Technology, Renault,
Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor,
Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start, Taxas Instruments, Tesla,
Thorlabs, Tong Hsing Electronics, Toshiba, TowerJazz, Toyota, Transdev, TriLumina, TRW Automotive,
United Automotive Electronic Systems, Uber, Ushio, Valeo, Velodyne LiDAR, Volkswagen, Waymo, Wuhu
sensorthch Intelligent Technology, xFab and more…
Find more
details about
this report here:
RELATED REPORTS
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Find all our reports
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As Technical Project
Development Director at Yole
Développement ( Yole),
Jérôme Azémar is supporting the
development of strategic projects, following
leading customers of the company within the
semiconductor industry, from manufacturing
to packaging. His mission is to develop Yole’s
business and technical knowledge in the
industry, maintain long term relationships with
its accounts and meet their expectations.
Jérôme is the author of numerous analysis
and international publications covering
advanced packaging, power electronics and
semiconductor manufacturing. Prior to this and
upon graduating from INSA Toulouse (France)
with a Master’s in Microelectronics and Applied
Physics, Jérôme worked three years at ASML
as application engineer and two years at
STMicroelectronics as process engineer.
AUTHORS

Report scope and definitions	 6
 Scope of the report
 Companies cited in this report
 Glossary
Executive summary	 11
Introduction of the automotive market	 33
 Why packaging is so important in automotive?
 4 Megatrends : Electrification, autonomy,
connectivity  comfort
 Worldwide automotive industry, plus focus on
China
 Role of advanced packaging in automotive
- Automotive regulations  specific grades
Applications	75
 Different applications in automotive
- Main axis: Power, Safety, Infotainment,
Connectivity, Lighting
 Different electronics devices in automotive
(LED, MEMS and sensors, ADAS sensors, power
conversion, connectivity, processing and storage)
 Cost analysis taking count of different level of car
Automotive packaging focus by platform
and application 	 107
 Type of packaging platform in automotive
- Packages description (FO, WLCSP, QFN, FC…)
 Packaging trends per applications
- Focus on innovative packages and evolving apps
 Packages / Applications Matrix
Players of the automotive packaging industry	 145
 Supply chain of each application (camera,
lighting, radars…)
 Company profiles (ASE, Bosch, NXP…)
Market forecasts	 165
 Revenues per packages (breakdown per
applications)
 Volumes (by packages, breakdown per applications)
Conclusions	200
About the author / Related reports /
Company presentation 	 205
TABLE OF CONTENTS (complete content on i-Micronews.com)
Lauranne Chemisky is
a technology and market
analyst in the Semiconductor
 Software Team at Yole Développement
(Yole). Lauranne is currently engaged in the
development of market research reports as well
as customized services for clients. She is able to
leverage her technology training and experience
in the fields of materials and semiconductor
manufacturing processes for advanced packaging
applications. Previously, Lauranne worked at
Apple in the Softgoods Product Design Team
as a material development engineer (CA, USA).
Lauranne holds a master’s degree in Materials
Science  Polymers from ITECH (Lyon, FR)
and an M.Sc. in Technology and Innovation
Management from EM Lyon Business School
(Lyon, FR).
Emilie Jolivet is Director
of the Semiconductor 
Software Division at Yole
Développement (Yole), part of Yole Group
of Companies, where her specific interests
cover package  assembly, semiconductor
manufacturing, memory and software 
computing fields.
Based on her valuable experience in the
semiconductor industry, Emilie manages the
expansion of the technical and market expertise
of her team. In addition, Emilie’s mission focusses
on the management of business relationships with
semiconductor leaders and the development of
market research and strategy consulting activities
inside the Yole group.
Emilie Jolivet holds a Master’s degree in Applied
Physics specializing in Microelectronics from
INSA (Toulouse, France).
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• i-Micronews.com website  related @Micronews e-newsletter
• Communication  webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market  technology reports
• Patent investigation and patent infringement risk analysis
• Structure, process and cost analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting  Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations  Corporate Communication: Sandrine Leroy (leroy@yole.fr)
© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE
Life Sciences
 Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging  BioPhotonics
o Bio Technologies
Power
Wireless
o RF Devices Technology
o Compound Semiconductors  Emerging Materials
o Power Electronics
o Batteries  Energy Management
Semiconductor
 Software
o Package  Assembly  Substrates
o Semiconductor Manufacturing
o Memory
o Software  Computing
Photonics,
Sensing  Display
o Solid-State Lighting  Display
o MEMS, Sensors  Actuators
o Imaging
o Photonics  Optoelectronics
Semiconductor
 Software
Power Wireless
Photonics,
Sensing
 Display
Life
Sciences 
Healthcare
3©2018 | www.yole.fr | About Yole Développement
4 BUSINESS MODELS
o Consulting and Analysis
• Market data  research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering  costing
• Patent analysis
• Design and characterization
of innovative optical systems
• Financial services (due
diligence, MA with our
partner)
www.yole.fr
o Syndicated reports
• Market  technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns  reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication  webcast
services
• Events:TechDays, forums,…
www.i-Micronews.com
o Monitors
• Monthly and/or Quarterly
update
• Excel database covering supply,
demand, and technology
• Price, market, demand and
production forecasts
• Supplier market shares
www.i-Micronews.com/reports
4©2018 | www.yole.fr | About Yole Développement
6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
5©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
6©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low
7©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators, end-
users and software
developers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers
8©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
9©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market  technology analysis, patent
investigation and patent infringement risk analysis, teardowns  reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS  Sensors
• RF devices  technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory
10©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/4)
MEMS  SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware  Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS  Sensors for Automotive Market  Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS  COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market  Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process  Cost Report
− Gas  Particles 2018 – Market  Technology Report
− Gas  Particles Comparison 2018 – Structure, Process  Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market 
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market  Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process  Cost Report
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF  Photonic Components  Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS  COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
o PATENT ANALYSES – by KnowMade
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
 Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process  Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market  Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
 Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market  Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process  Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors  Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1  2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/4)
IMAGING  OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
o PATENT ANALYSES – by KnowMade
− iPhone X Dot Projector – Patent-to-Product Mapping
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Status of the CMOS Image Sensor Industry 2018 – Market  Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process  Cost Report
− CMOS Image Sensors Monitor 2018* – Quarterly Update**
− Camera Module 2017 – Market  Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process  Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market  Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1  2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market  Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
 Cost Report
− Fan-Out Packaging 2018 – Market  Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process  Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology  Market Trends
for Lithography  Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology  Market Trends for
Lithography  Bonding/Debonding 2018 – Market  Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process  Cost Report
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)
MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND  DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND  DRAM)
o REVERSE ENGINEERING  COSTING REVIEW – by System Plus Consulting
− DRAM Technology  Cost Review 2018
− NAND Memory Technology  Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market  Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process  Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market  Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process  Cost Report
− Status of the GaN IP – Patent Watch 2018  Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market  Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market  Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process  Cost Report
− Power ICs Market Monitor 2018 – Quarterly Update**
− Power ICs Market Comparison 2018* – Structure, Process  Cost Report
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018  Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market  Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors  Quantum Dots 2017 - LED Downconverters for Lighting  Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market  Technology
Report
− VCSELs Comparison 2018 – Structure, Process  Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market  Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS  Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences  Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market  Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market  Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN  REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
15©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronews e-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing  Communication Project Manager
16©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US 
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US 
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan  Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (India  ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea  Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO  President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO  President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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Trends in Automotive Packaging 2018 by Yole Développement

  • 1. Trends in Automotive Packaging 2018 From Technologies to Market ©2018 SAMPLE
  • 2. 2 TABLE OF CONTENTS AUTOMOTIVE REPORT • Report scope & definitions o Scope of the report o Companies cited in this report o Glossary • Executive summary • Introduction of the automotive market o Why packaging is so important in automotive ? o 4 Megatrends : Electrification, autonomy, connectivity & confort o Worldwide automotive industry, plus focus on China o Role of advanced packaging in automotive • Automotive regulations & specific grades • Applications o Different applications in automotive • Main axis: Power, Safety, Infotainment, Connectivity, Lighting o Different electronics devices in automotive (LED, MEMS and sensors,ADAS sensors, power conversion, connectivity, processing and storage) • Cost analysis of electronic devices • Automotive packaging focus by platform and application o Type of packaging platform in automotive o Packages description (FO,WLCSP, QFN, FC…) o Packaging trends per applications o Focus on innovative packages and evolving apps o Packages / Applications Matrix • Players of the automotive packaging industry o Supply chain of each application (camera, lighting, radars…) o Company profiles (ASE, Bosch, NXP…) • Market forecasts o Revenues per packages (breakdown per applications) o Volumes (by packages, breakdown per applications) • Conclusions • About the author / Related Reports / Company presentation ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample 6 11 33 75 107 145 165 200 205
  • 3. 3 Biographies & contacts Jérôme Azémar ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample Lauranne Chemisky Emilie Jolivet As Technical Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop business and knowledge of the company, maintain long term relationship with its Yole’s accounts and meet their expectations. Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor Manufacturing activities. Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France). azemar@yole.fr Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package & assembly, semiconductor manufacturing, memory and software & computing fields. Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the Semiconductor and Software Team. The team interacts daily with leading companies allowing semiconductor & software analysts to collect a large amount of data and integrate their understanding of the evolution of the market with technology breakthroughs. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside the Yole group. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). After an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Enriched by this experience, she graduated with an MBA from IAE Lyon and then joined EV Group (Austria) as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016. jolivet@yole.fr Lauranne Chemisky is a technology and market analyst in the Semiconductor & Software Team at Yole Développement (Yole). Lauranne is currently engaged in the development of market research reports as well as customized services for clients. She is able to leverage her technology training and experience in the fields of materials and semiconductor manufacturing processes for advanced packaging applications. Previously, Lauranne worked at Apple in the Softgoods Product Design Team as a material development engineer (CA, USA). Lauranne holds a master’s degree in Materials Science & Polymers from ITECH (Lyon, FR) and an M.Sc. in Technology and Innovation Management from EMLyon Business School (Lyon, FR). chemisky@yole.fr
  • 4. 4  100 companies are cited in this report ASE,Amkor, ams,Analog Devices,Apple,AT&S,Audi,Autoliv, BAIC, Baidu, Benewake, BuildYour Dreams, BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies, Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex, Google, Hamamatsu, Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai, Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent System, LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric, nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On Semiconductor, Optotech, Orsam, Ouster, Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor, Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start,Taxas Instruments,Tesla,Thorlabs,Tong Hsing Electronics,Toshiba,TowerJazz,Toyota,Transdev,TriLumina,TRW Automotive, United Automotive Electronic Systems, Uber, Ushio,Valeo,Velodyne LiDAR,Volkswagen,Waymo,Wuhu sensorthch Intelligent Technology, xFab and more… COMPANIES CITED IN THE REPORT ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 5. 5 OBJECTIVES OF THE REPORT • Identify and analyze the major advanced packaging platforms used in the automotive industry • Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting devices, MEMS and sensors… • Understand the impact of automotive regulations and specifications on packaging development • Present a detailed technology roadmap for advanced packaging platforms for automotive applications • Identify the market drivers, disruptions and business opportunities for the supply chain players • Analyze key benefits and added value of emerging advanced packaging platforms • Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive landscape • Give an overview of the players involved in the supply chain and specificities of each market segment ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 6. 6 SCOPE OF THE REPORT This report only cover packaging technologies for innovative devices in the automotive industry • Introduction about the differences between automotive and consumer markets, based on our advanced packaging industry analysis • Analysis of packaging technologies that are implemented or will be developed for the automotive industry • Packaging trends in the automotive devices • Adoption of new technologies takes time due to qualification process based on norms and specifications • Advanced packaging market forecast with breakdown by platform and application • Players of the advanced packaging supply chain involved in the automotive industry • Market forcast in units and revenue split by application and platform ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 8. 8 INTRODUCTION OF THE AUTOMOTIVE INDUSTRY • Automotive is the new El Dorado for microelectronics with several drivers for growth – 4 main trends : • Electrification, autonomy, connectivity and comfort • Electronics used for automotive stands 9% of the total IC market • It’s a growing market : • 7% growth for automotive sales • 15% growth of electronics in automotive • 20% growth for semiconductors in automotive • About 30% growth for OSATs in automotive packaging • the automotive market differs from the consumer market by higher requirements and a better reliability for the electronics • A electronic failure in a car can cause serious accident • With more than hundreds of electronics parts in a car, the price pressure is higher than in the consumer industry also because the margins in the automotive industry are smaller ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 9. 9 HOW SIGNIFICANT IS THE AUTOMOTIVE PACKAGING MARKET ? Two industries, both controlled by giant companies with ~$250B in revenue ©2018 | www.yole.fr | Trends and Markets in Automotive Packaging
  • 10. 10 MICROELECTRONICS IN AUTOMOTIVE Non exhaustive listWhat are the different electronic devices ? ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 11. 11 4 MEGA TRENDS DRIVE INNOVATION IN INNOVATION ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 12. 12 AUTOMOTIVE PACKAGING RELIABILITY Requirements Infotainment / Comfort Powertrain Safety Connectivity Grade 3 & 2 -40°C to +105°C Grade 1 & 0 -40°C to +150°C Grade 1 -40°C to +125°C Grade 3 & 2 -40°C to +105°C Lighting Grade 1 (ext) -40°C to +125°C Grade 3 & 2 (int) -40°C to +105°C • 5 main application groups were identified with very different needs and operating conditions • In these 5 applications, you can find specific electronic devices (ex: LEDs in lighting) or some electronic devices can be found in several but with different specs (ex: MCUs in safety vs. MCUs in infotainment) ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 13. 13 AUTOMOTIVE PACKAGING ANALYSIS ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 14. 14 TECHNOLOGY ROAD MAPS FOR AUTOMOTIVE DEVICES ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 16. 16 AUTOMOTIVE MARKET UNIT FORECAST BY APPLICATION ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 17. 17 AUTOMOTIVE MARKET UNIT FORECAST BY PLATFORM ©2018 | www.yole.fr | Trends and Markets in Automotive Packaging
  • 18. 18 AUTOMOTIVE PACKAGING MARKET SHARES : IDMVS. OSAT ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 20. 20 OEMS WORLDWIDE Non exhaustive list ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 21. 21 SUPPLY CHAIN ANALYSIS ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 22. 22 AUTOMOTIVE LANDSCAPE & FOCUS ON CHINESE PLAYERS ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 23. 23 RELATED REPORTS ©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
  • 24. The automotive market grew by 7% in revenue in 2017, while semiconductor technology in the automotive market is growing by 20%. Electronic devices are more and more common in cars and the number of electronic systems is also increasing. The quantity of electronics in a car has increased 2.5 times since the 90’s; in 2017, 26 cm² of semiconductor substrates was used in a car, while in 2023 we expect 35 cm². Four main trends are leading this augmentation, electrification, autonomy, connectivity and comfort. All of them involve a large number of sensors, power supplies, communication chips, lighting components and processors that can come from the consumer marketorbedevelopedspecificallyforautomotive. This increase in electronic devices in cars will drive the packaging market. In fact, in 2017, the packaging for automotive total revenue was quoted at ~$3.7B and it will reach ~$7B in 2023, including LED module. The automotive packaging industry is involved in many device types and thus in many packaging platforms. In the report, you will find detailed scenarios for growth of the market with a breakdown by packaging platform and automotive application, such as radar, LiDAR, power devices, lighting and photonics. TRENDS IN AUTOMOTIVE PACKAGING 2018 Market & Technology report - November 2018 PACKAGING DEDICATED TO AUTOMOTIVE ELECTRONICS IS GROWING AND WILL REACH $7B IN 2023 OSATs are gaining benefits from advanced packaging in automotive. KEY FEATURES • Introduction about the differences between automotive and consumer markets, based on our advanced packaging industry analysis • Analysis of packaging technologies that are implemented or will be developed for the automotive industry • Packaging trends in the automotive devices • Adoption of new technologies takes duration based on specifications and norms • Advanced packaging market forecast with breakdown by platform and application • Players of the advanced packaging supply chain involved in the automotive industry • Market forcast in units and revenue split by application and platform (Yole Développement, November 2018) Power conversion ADAS sensors MEMS sensors Lighting Processing Storage Connectivity modules / Telematics Display Front light Rear light MOSFET IGBT Memory MCU DC-DC convertor GaN HEMT CPU/GPU Screen Wifi CISRadar LiDAR Accelerometers Gyroscope Microphones ToF Interior lighting GPS Pressure sensor Infrared imager ECU BMIC Micro bolometer Micromirror IMUs Magnetometer Ultrasonic Humidity sensor Small lamp Front-end module Antenna Switch *Non exhaustive list of applications 2018 Automotive industry: electronic parts overview* The automotive industry is highly regulated, due to concerns about safety and pollution. Due to all the specifications required for each component, new device development takes a long time for qualification. This obstacle is a limitation in terms of use of new types of packaging. More-over, the automotive industry is not the most receptive for innovations in packaging. But we are entering a new era for automotive development that may accelerate things. There are significant demands for power applications that can drive innovation. A second wave could be led by increasing autonomy and connectivity. It is important also to notice that is the first time in history that a big effort is made to adapt consumer technologies to automotive to drive innovation in dedicated applications such as powertrain. Although the main platform in term of units is the Wire Bond Ball Grid Array (WBBGA) package, which represents half of the market, advanced packaging platforms such as flip-chip and fan-out are finding their place. The next innovation expected is embedded die in substrate for converter dies. Packages like Quad Flat No-leads package (QFN), Interstitial Ball DESPITE THE HIGH DEGREE OF REGULATION, CONSUMER PACKAGING TYPES ARE SLOWLY ADAPTED TO, AND ADOPTED BY, THE AUTOMOTIVE MARKET
  • 25. TRENDS IN AUTOMOTIVE PACKAGING 2018 Automotive packaging roadmap (Yole Développement, November 2018) THE BIG WINNERS OF DIVERSIFICATION AND THE INCREASE OF ELECTRONICS IN THE AUTOMOTIVE MARKET ARE THE OSATS Players in the advanced packaging industry for automotive can be split into two groups, the IDMs/ Tier 1 and the OSATs. IDMs and Tier 1 are the main suppliers of the car OEMs for integrated systems, and OSATs specialize in the initial packaging and testing. Automotive packaging was mostly done in-house by IDMs and Tier 1, as it allows an easier integration and a faster development of systems. As ever more electronics are implemented in cars, more and more outsourcing goes to OSATs. In the past, OSATs supplied relatively little of the electronic advanced packaging for the automotive market, while today OSATs represent 38% of the total revenue for advanced packaging for cars and this proportion might keep growing. This change has been made possible due to the increasing quantity of devices, diversification of components, the increased complexity of the packaging and the reliability of specific manufacturers. Moreover, some devices come from the consumer market that OSATs already supply. Currently, Amkor and ASE represent more than 80% of the automotive advanced packaging for automotive supplied by OSATs. In 2015, Amkor acquired J-Devices, one of the larger Japanese OSATs. Thanks to this acquisition and new brand positioning focused on the automotive market, Amkor is now the top OSAT in automotive packaging with more than 50% of the market, followed by ASE and STATS ChipPAC. Grid Array Package (iBGA) and ceramic packaging are also growing for specific applications like CMOS Image Sensors (CIS), MEMS and power devices. You will find details on all the types of packages used in the automotive industry, technology road maps and a market analysis for each of them. Automotive packaging – 2017 market shares: IDM vs. OSAT (Yole Développement, November 2018) OBJECTIVES OF THE REPORT • Identify and analyze the major advanced packaging platforms currently used in the automotive industry • Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting devices, MEMS and sensors… • Understand the impact of automotive regulations and specifications on packaging development • Present a detailed technology roadmap for advanced packaging platforms for automotive applications • Identify the market drivers, disruptions and business opportunities • Analyze key benefits and added value of emerging advanced packaging platforms • Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive landscape • Give an overview of who is doing what, and specificities of each market segment OSATs 38% IDMs Tiers 1 62% Automotive packaging revenue 2017 total: ~$ 3.7B including LED module ASE 25% STATS ChipPAC 5% Others 14%Amkor 56% OSATs market shares in 2017 OSATs Current advanced packaging technologies Future technologies Market drivers Integration cost *Number of cars that adapts CMOS Image Sensor (CIS) for ADAS sensors **Numbers of CIS in a car, high-end market grows faster Cooling Cooling Integration Foot print Thermal management Reliability Sensitivity hermetic Integration Thermal management Fan-Out WLCSP (Fan in) Flip chip (FC)/ Multi-die Organic packages Ceramic packages Organic packages* Ceramic packages** Cu clip (or thicker Cu wire)Cu wire FC in QFN Quad Flat No-leads package (QFN)(Low/mid power) Power Module (high power) Power Radar CIS Power More semi-open cavities Shielding QFN Wettable flanks MEMS Through hole Embedded dieHigh Density Interconnect (HDI) board Standard substrate L/S Embedded die Side to side chip in QFN QFN Substrate Connection layers
  • 26. MARKET TECHNOLOGY REPORT COMPANIES CITED IN THE REPORT (non exhaustive list) ASE, Amkor, ams, Analog Devices, Apple, ATS, Audi, Autoliv, BAIC, Baidu, Benewake, Build Your Dreams, BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies, Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex, Google, Hamamatsu, Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai, Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent System, LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric, nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On Semiconductor, Optotech, Orsam, Ouster, Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor, Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start, Taxas Instruments, Tesla, Thorlabs, Tong Hsing Electronics, Toshiba, TowerJazz, Toyota, Transdev, TriLumina, TRW Automotive, United Automotive Electronic Systems, Uber, Ushio, Valeo, Velodyne LiDAR, Volkswagen, Waymo, Wuhu sensorthch Intelligent Technology, xFab and more… Find more details about this report here: RELATED REPORTS Benefit from our Bundle Annual Subscriptionoffersandaccessouranalyses at the best available price and with great advantages • Sensors for Robotic Vehicles 2018 • Power Electronics for EV/HEV 2018 • Automotive Lighting: Technology, Industry and Market Trends 2017 • Status of Advanced Substrates 2018: Embedded Dies Interconnects, Substrate Like PCB Trends • LiDAR for Automotive - Patent Landscape Analysis • Automotive Radar Comparison 2018 Find all our reports on www.i-micronews.com As Technical Project Development Director at Yole Développement ( Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop Yole’s business and technical knowledge in the industry, maintain long term relationships with its accounts and meet their expectations. Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme worked three years at ASML as application engineer and two years at STMicroelectronics as process engineer. AUTHORS Report scope and definitions 6 Scope of the report Companies cited in this report Glossary Executive summary 11 Introduction of the automotive market 33 Why packaging is so important in automotive? 4 Megatrends : Electrification, autonomy, connectivity comfort Worldwide automotive industry, plus focus on China Role of advanced packaging in automotive - Automotive regulations specific grades Applications 75 Different applications in automotive - Main axis: Power, Safety, Infotainment, Connectivity, Lighting Different electronics devices in automotive (LED, MEMS and sensors, ADAS sensors, power conversion, connectivity, processing and storage) Cost analysis taking count of different level of car Automotive packaging focus by platform and application 107 Type of packaging platform in automotive - Packages description (FO, WLCSP, QFN, FC…) Packaging trends per applications - Focus on innovative packages and evolving apps Packages / Applications Matrix Players of the automotive packaging industry 145 Supply chain of each application (camera, lighting, radars…) Company profiles (ASE, Bosch, NXP…) Market forecasts 165 Revenues per packages (breakdown per applications) Volumes (by packages, breakdown per applications) Conclusions 200 About the author / Related reports / Company presentation 205 TABLE OF CONTENTS (complete content on i-Micronews.com) Lauranne Chemisky is a technology and market analyst in the Semiconductor Software Team at Yole Développement (Yole). Lauranne is currently engaged in the development of market research reports as well as customized services for clients. She is able to leverage her technology training and experience in the fields of materials and semiconductor manufacturing processes for advanced packaging applications. Previously, Lauranne worked at Apple in the Softgoods Product Design Team as a material development engineer (CA, USA). Lauranne holds a master’s degree in Materials Science Polymers from ITECH (Lyon, FR) and an M.Sc. in Technology and Innovation Management from EM Lyon Business School (Lyon, FR). Emilie Jolivet is Director of the Semiconductor Software Division at Yole Développement (Yole), part of Yole Group of Companies, where her specific interests cover package assembly, semiconductor manufacturing, memory and software computing fields. Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside the Yole group. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France).
  • 27. ORDER FORM Trends in Automotive Packaging 2018 SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code: 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • Western US Canada - Steve Laferriere: + 1 310 600-8267 – laferriere@yole.fr • Eastern US Canada - Troy Blanchette: +1 704 859 0453 – troy.blanchette@yole.fr • Europe RoW - Lizzie Levenez: + 49 15 123 544 182 – levenez@yole.fr • Japan Rest of Asia - Takashi Onozawa: +81-80-4371-4887 – onozawa@yole.fr • Greater China - Mavis Wang: +886 979 336 809 – wang@yole.fr • Specific inquiries: +33 472 830 180 – info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: November 15, 2018 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER - Ref YD18047 Please enter my order for above named report: One user license*: Euro 5,990 Multi user license: Euro 6,490 - The report will be ready for delivery from December 19, 2018 - For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image Sensors, Compound Semiconductors, RF Devices Technologies, Solid-state Lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management. The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to grow their business. CONSULTING AND ANALYSIS • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis • Design and characterization of innovative optical systems • Financial services (due diligence, MA with our partner) More information on www.yole.fr MEDIA EVENTS • i-Micronews.com website related @Micronews e-newsletter • Communication webcast services • Events: TechDays, forums… More information on www.i-Micronews.com REPORTS • Market technology reports • Patent investigation and patent infringement risk analysis • Structure, process and cost analysis • Cost simulation tool More information on www.i-micronews.com/reports CONTACTS For more information about : • Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr) • Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies • Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)
  • 28. © 2018 Yole Développement FromTechnologies to Market Source: Wikimedia Commons
  • 29. 2©2018 | www.yole.fr | About Yole Développement YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE Life Sciences Healthcare o Microfluidic o BioMEMS o Inkjet Printing o Solid-State Medical Imaging BioPhotonics o Bio Technologies Power Wireless o RF Devices Technology o Compound Semiconductors Emerging Materials o Power Electronics o Batteries Energy Management Semiconductor Software o Package Assembly Substrates o Semiconductor Manufacturing o Memory o Software Computing Photonics, Sensing Display o Solid-State Lighting Display o MEMS, Sensors Actuators o Imaging o Photonics Optoelectronics Semiconductor Software Power Wireless Photonics, Sensing Display Life Sciences Healthcare
  • 30. 3©2018 | www.yole.fr | About Yole Développement 4 BUSINESS MODELS o Consulting and Analysis • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis • Design and characterization of innovative optical systems • Financial services (due diligence, MA with our partner) www.yole.fr o Syndicated reports • Market technology reports • Patent investigation and patent infringement risk analysis • Teardowns reverse costing analysis • Cost simulation tool www.i-Micronews.com/reports o Media • i-Micronews.com website • @Micronews e-newsletter • Communication webcast services • Events:TechDays, forums,… www.i-Micronews.com o Monitors • Monthly and/or Quarterly update • Excel database covering supply, demand, and technology • Price, market, demand and production forecasts • Supplier market shares www.i-Micronews.com/reports
  • 31. 4©2018 | www.yole.fr | About Yole Développement 6 COMPANIES TO SERVEYOUR BUSINESS Due diligence www.yole.fr Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr Market, technology and strategy consulting www.yole.fr IP analysis Patent assessment www.knowmade.fr Innovation and business maker www.bmorpho.com Design and characterization of innovative optical systems www.piseo.fr Yole Group of Companies
  • 32. 5©2018 | www.yole.fr | About Yole Développement OUR GLOBAL ACTIVITY 30%of our business 40%of our business 30%of our business Greater China office Yole Japan HQ in Lyon Nantes Paris Nice Vénissieux Europe office Frankfurt Hsinchu Tokyo Yole Inc. Phoenix Yole Korea Seoul Palo Alto
  • 33. 6©2018 | www.yole.fr | About Yole Développement ANALYSIS SERVICES - CONTENT COMPARISON Technology and Market Report Leadership Meeting QA Service Depth of the analysis Breadthoftheanalysis Meet the Analyst Custom Analysis High High Low
  • 34. 7©2018 | www.yole.fr | About Yole Développement SERVING THE ENTIRE SUPPLY CHAIN Our analysts provide market analysis, technology evaluation, and business plans along the entire supply chain Integrators, end- users and software developers Device manufacturers Suppliers: material, equipment, OSAT, foundries… Financial investors, RD centers
  • 35. 8©2018 | www.yole.fr | About Yole Développement SERVING MULTIPLE INDUSTRIAL FIELDS We work across multiples industries to understand the impact of More-than- Moore technologies from device to system From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy management
  • 36. 9©2018 | www.yole.fr | About Yole Développement o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover: o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain… Our reports are for you! The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the industry. o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount. REPORTS COLLECTION www.i-Micronews.com • MEMS Sensors • RF devices technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Advanced substrates • Power electronics • Batteries and energy management • Compound semiconductors • Solid state lighting • Displays • Software • Memory
  • 37. 10©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (1/4) MEMS SENSORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the MEMS Industry 2018 – Update − Silicon Photonics 2018 – Update − Consumer Biometrics: Hardware Software 2018 – Update − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017 − Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Acoustic MEMS and Audio Solutions 2017 − MEMS Sensors for Automotive Market Technology Trends 2017 − High End Inertial Sensors 2017 − Magnetic Sensor 2017 o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT – by System Plus Consulting − Piezo MEMS 2018 * o PATENT ANALYSES – by KnowMade − MEMS Microphone – Patent Landscape Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − MEMS Pressure Sensor 2018 – Market Technology Report − MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report − Gas Particles 2018 – Market Technology Report − Gas Particles Comparison 2018 – Structure, Process Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis − MEMS Packaging 2017 – Market Technology Report − MEMS Packaging Comparison 2017 – Structure, Process Cost Report RF DEVICES ANDTECHNOLOGIES o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wireless technologies (Radar, V2X) for Automotive 2018 − RF Standards and Technologies for Connected Objects 2018 − RF Photonic Components Technologies for 5G Infrastructure 2018 o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System Plus Consulting − Automotive Radar Comparison 2018 o PATENT ANALYSES – by KnowMade − RF Acoustic Wave Filters 2017 – Patent Landscape Analysis o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market Technology Report – Update − RF Front-End Module Comparison 2018 – Structure, Process Cost Report − RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis − Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report – Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process Cost Report − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market Technology Report – Update − RF GaN Comparison 2018* – Structure, Process Cost Report − RF GaN 2018 – Patent Landscape Analysis SOFTWARE o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Consumer Biometrics: Sensors Software 2018 – Update − Processing Hardware and Software for AI 2018 - Vol. 1 2 − From Image Processing to Deep Learning, Introduction to Hardware and Software Update : 2017 version still available / *To be confirmed
  • 38. 11©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (2/4) IMAGING OPTOELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the Compact Camera Module and Wafer Level Optics − Industry 2018 – Update − 3D Imaging and Sensing 2018 – Update − Sensors for Robotic Vehicles 2018 − Machine Vision for Industry and Automation 2018 − Imagers and Detectors for Security and Smart Buildings 2018 − Uncooled Infrared Imagers 2017 o PATENT ANALYSES – by KnowMade − iPhone X Dot Projector – Patent-to-Product Mapping o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Status of the CMOS Image Sensor Industry 2018 – Market Technology Report - Update − CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report − CMOS Image Sensors Monitor 2018* – Quarterly Update** − Camera Module 2017 – Market Technology Report − Compact Camera Module Comparison 2018 – Structure, Process Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis ADVANCED PACKAGING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Advanced Packaging Industry 2018 – Update − Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends − 3D TSV and Monolithic Business Update 2018 – Update − Power Modules Packaging 2018 – Update − Discrete Power Packaging 2018 – Update* − Status of Panel Level Packaging 2018 − Trends in Automotive Packaging 2018 − Hardware and Software for AI 2018 - Vol. 1 2 − Thin-Film Integrated Passive Devices 2018 − Memory Packaging Market and Technology Report 2018 – Update* o PATENT ANALYSES – by KnowMade − Hybrid Bonding for 3D Stack – Patent Landscape Analysis o LINKED REPORTS– by Yole Développement and System Plus Consulting − Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report - Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process Cost Report − Fan-Out Packaging 2018 – Market Technology Report – Update* − Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report MANUFACTURING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wafer Starts for More Than Moore Applications 2018 − Equipment for More than Moore: Technology Market Trends for Lithography Bonding/Debonding 2018 − Polymeric Materials for wafer-level Advanced Packaging 2018 − Laser Technologies for Semiconductor Manufacturing 2017 − Glass Substrate Manufacturing in the Semiconductor Field 2017 − Equipment and Materials for Fan-Out Packaging 2017 − Equipment and Materials for 3D TSV Applications 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − Equipment for More than Moore: Technology Market Trends for Lithography Bonding/Debonding 2018 – Market Technology Report − Wafer Bonding Comparison 2018 – Structure, Process Cost Report Update : 2017 version still available / *To be confirmed
  • 39. 12©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (3/4) MEMORY o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Emerging Non Volatile Memory 2018 – Update − Memory Packaging Market and Technology Report 2018 – Update* o QUARTERLY UPDATE – by Yole Développement** − Memory Market Monitor 2018 (NAND DRAM) o MONTHLY UPDATE – by Yole Développement** − Memory Pricing Monitor 2018 (NAND DRAM) o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting − DRAM Technology Cost Review 2018 − NAND Memory Technology Cost Review 2018 o PATENT ANALYSES – by KnowMade − 3D Non-Volatile Memories – Patent Landscape COMPOUND SEMICONDUCTORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Compound Semiconductor Industry 2018* − GaAs Materials, Devices and Applications 2018 − InP Materials, Devices and Applications 2018 − Bulk GaN Substrate Market 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power SiC 2018: Materials, Devices, and Applications – Market Technology Report – Update − SiC Transistor Comparison 2018 – Structure, Process Cost Report − Power SiC 2018 – Patent Landscape Analysis − Power GaN 2018: Materials, Devices, and Applications – Market Technology Report – Update − GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report − Status of the GaN IP – Patent Watch 2018 Patent Activity 2017 − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 – Market Technology Report – Update − RF GaN – Patent Landscape Analysis POWER ELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Power Electronics Industry 2018 – Update − Discrete Power Packaging 2018 – Update* − Power Electronics for Electric Vehicles 2018 – Update − Integrated Passive Devices (IPD) 2018 − Wireless Charging Market Expectations and Technology Trends 2018 − Thermal Management Technology and Market Perspectives in Power − Electronics and LEDs 2017 − Gate Driver 2017 − Power MOSFET 2017 − IGBT 2017 − Market Opportunities for Thermal Management Components in Smartphones 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power Modules Packaging 2018 – Market Technology Report – Update − Automotive Power Module Packaging Comparison 2018 – Structure, Process Cost Report − Power ICs Market Monitor 2018 – Quarterly Update** − Power ICs Market Comparison 2018* – Structure, Process Cost Report BATTERY AND ENERGY MANAGEMENT o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 – Update o PATENT ANALYSES – by KnowMade − Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017 o LINKED REPORTS – by Yole Développement and KnowMade − Solid State Electrolyte Battery 2018 – Market Technology Report − Solid-State Batteries 2018 – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
  • 40. 13©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (4/4) SOLID STATE LIGHTING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update − Automotive Lighting 2018: Technology, Industry and Market Trends – Update − UV LEDs 2018: Technology, Industry and Market Trends – Update − LiFi: Technology, Industry and Market Trends − LED Lighting Module Technology, Industry and Market Trends 2017 − CSP LED Lighting Modules − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − Horticultural Lighting 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − VCSELs 2018: Technology, Industry and Market Trends – Market Technology Report − VCSELs Comparison 2018 – Structure, Process Cost Report DISPLAYS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update − Displays and Optical Vision Systems for VR/AR/MR 2018 − MicroLED Displays 2018 – Market Technology Report – Update o PATENT ANALYSES – by KnowMade − MicroLED Display – Patent Landscape Analysis MEDTECH o MARKET AND TECHNOLOGY REPORT – by Yole Développement − BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical − Applications 2018 – Update − Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update − Neurotechnologies and Brain Computer Interface 2018 − CRISPR-Cas9 Technology: From Lab to Industries 2018 − Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018 − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Liquid Biopsy: from Isolation to Downstream Applications 2018 − Chinese Microfluidics Industry 2018 − Scientific Cameras for the Life Sciences Analytical Instrumentation Laboratory Markets 2018* − Artificial Organ Technology and Market 2017 − Connected Medical Devices Market and Business Models 2017 − Status of the Microfluidics Industry 2017 − Organs-On-Chips 2017 − Solid-State Medical Imaging 2017 − Medical Robotics Market Technology Analysis 2017 o PATENT ANALYSES – by KnowMade − Microfluidic IC Cooling – Patent Landscape − Circulating Tumor Cell Isolation – Patent Landscape − OCT Medical Imaging – Patent Landscape − Pumps for Microfluidic Devices – Patent Landscape 2017 − Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017 − FLUIDIGM – Patent Portfolio Analysis 2017 − Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Organs-On-Chips 2017 – Market Technology Report − Organ-on-a-Chip – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed
  • 41. 14©2018 | www.yole.fr | About Yole Développement OUR 2017 PUBLISHED REPORTS LIST (3/3) OUR PARTNERS’ REPORTS PATENT ANALYSES – by KnowMade − Wireless Charging Patent Landscape Analysis − RF Acoustic Wave Filters Patent Landscape Analysis − NMC Lithium-Ion Batteries Patent Landscape Analysis − Pumps for Microfluidic Devices Patent Landscape − III-N PatentWatch − FLUIDIGM Patent Portfolio Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017 − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping − Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets − MicrofluidicTechnologies for Diagnostic Applications Patent Landscape TEARDOWN REVERSE COSTING – by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017 MORE INFORMATION o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide).
  • 42. 15©2018 | www.yole.fr | About Yole Développement MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 11,200+ monthly unique visitors, the 10,500+ weekly readers of @Micronews e-newsletter Several key events planned for 2018 on different topics to attract 120 attendees on average Gain new leads for your business from an average of 340 registrants per webcast Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager
  • 43. 16©2018 | www.yole.fr | About Yole Développement CONTACT INFORMATION o CONSULTING AND SPECIFICANALYSIS, REPORT BUSINESS • North America: • Steve LaFerriere, Senior Sales Director forWestern US Canada Email: laferriere@yole.fr – + 1 310 600-8267 • Troy Blanchette, Senior Sales Director for Eastern US Canada Email: troy.blanchette@yole.fr – +1 704 859-0453 • Japan Rest of Asia: • Takashi Onozawa, General Manager,Asia Business Development (India ROA) Email: onozawa@yole.fr - +81 34405-9204 • Miho Othake, Account Manager (Japan) Email: ohtake@yole.fr - +81 3 4405 9204 • Itsuyo Oshiba, Account Manager (Korea Singapore) Email: oshiba@yole.fr - +81-80-3577-3042 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • RoW: Jean-Christophe Eloy, CEO President,Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o FINANCIAL SERVICES (in partnership withWoodside Capital Partners) • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr - +33 4 72 83 01 80 • Ivan Donaldson,VP of Financial Market Development Email: ivan.donaldson@yole.fr - +1 208 850 3914 o CUSTOM PROJECT SERVICES • Jérome Azémar,Technical Project Development Director Email: azemar@yole.fr - +33 6 27 68 69 33 o GENERAL • Sandrine Leroy, Director, Public Relations Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55 • Email: info@yole.fr - +33 4 72 83 01 80 Follow us on