HVDC Transmission lines Market, Technology and Geographical Trends 2016 Presentation by Mattin GRAO of Yole Developpement at Electronica Chinaconference

HVDC Transmission lines –
Market,Technology and Geographical
Trends

2
PLAN OF THE PRESENTATION
• Yole Group
• Introduction
• Technical trend & Challenges
• Market Analysis and Forecast
• Conclusion

3
MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas

5
SERVING MULTIPLE INDUSTRIAL FIELDS
• We are
working
accross
multiples
industries
to
understand
the impact
of More-
than-Moore
technologie
s from
device to
system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systems
Industrial and
defense
Energy

6
INTRODUCTION
• At the end of the XIX. century, the competition
between AC & DC was won by the first one thanks
to transformers technology available at that time.
• Transformers enable to increase the AC voltage
in an easy way.
©2016 | www.yole.fr | HVDC

7
POWER ELECTRONICS IN POWER TRANSMISSION
• The development of power electronics devices opened
new opportunities on the power transmission lines.
Power
electronics
devices
enabled the
power
conversion
from AC to
DC
Mercury-arc valves
1970’s 2000’s
Thyristors (GTO,
IGCT, etc.)
1930’s
IGBTs

8
HVDC ADVANTAGES
• HVDC lines :
• Interconnection between different frequency power networks.
• Lower losses through long distances (>600-800 km).
• Best economic solution for submarine cables >80 km.
• Instant and precise control of the power flow (mostly when IGBTs are used).
• Lower visual impact and less space requirements for DC towers compared to AC towers.
• Grid access for renewable resources.
• HVDC has lower losses than AC, but DC converter stations are more expensive than AC stations.
• The initial investment is much higher for the HVDC line, but in operation it is a better economic solution for very long distance
power transmission.
• Recently, power electronics converters have also made their apparition in AC power transmission lines in order to bring
stability & power flow control on the grid:
• FACTS: Flexible Alternating CurrentTransmission System.
400 MW submarine HVDC line in San Francisco’s bay

9
HVDC TECHNOLOGY
• Line Commutated Converters (LCC) - (launched in the 70’s) :
• Power up to 8 GW
• Based onThyristor devices
• Voltage Source Converters (VSC) - (launched in the end 90’s)
• Power up to 1 GW
• Based on IGBT devices
• Control of the reactive power -> more manageable grids.
• It is expected that VSC will take over a large portion of the
HVDC market in the future.
HVDC stands for HighVoltage Direct Current.
It specifies a system used for transmitting or exchanging electrical power by means of direct current.

10
TECHNICAL TRENDS IN HVDC
How the technological choice is evolving
• The use of this technology is mostly driving by the European market and their off-shore renewables
connection to the grid.
There is a clear
trend towards
VSC-HVDCs
(IGBT based)
due to their
total control of
the reactive
power and
thereby, the
manageability of
the grids.
* % of cumulative HVDC line units
Market share ofVSC, over all HVDC lines installed
worldwide*

11
LCC
Line Commuted Converters – Thyristor based technology
• The next technological challenge in a LCC should come from
the passive components.
• The filters are too bulky.
• Any technological improvement in terms of volume density
in capacitors would have a considerable impact.
• Still, the thyristor based converters (LCC) will be the most used
technology in the future HVDC lines.
• Maturity
• Excellent efficiency (~99%)
• Installation costs
• No major technical changes are going to happen.
The twelve-pulse bridge topology
Twelve-pulse bridge

12
VSC
Voltage Source Converters – IGBT based technology
• TheVSC has still several challenges to overcome.
• Conversion efficiency -> New topologies
• Power devices for high-voltage -> SiC transistors
• Cost reduction
• The simplest topology for aVSC is a half-bridge converter,
with hundreds of IGBT in series to make a valve.
• High commutation switches -> low efficiency (~96%)
• Lots of harmonics
A half-bridge topology using IGBT valves
Source: ALSTOM

13
VSC
Alternative architectures
• The actual trend is to use Multi-Modular Converters.
• More manageable and more efficient.
Multi level converter using chain link modules
Source: ALSTOM
LCC losses 0.7%
VSC standard losses 2-3%
VSC MMC losses 1%

14
VSC
Alternative architectures
• Transformers are a big source of losses and very bulky.
The Dual-
Active-Bridge
topology is
being studied
as a future
alternative by
SuperGrid
• Cascade connection
• Not a large transformer at the AC side.
• It uses a medium frequency transformer (10-20 kHz),
• A ZVS* is used in order to minimize commutation losses
Solid StateTransformer
* ZVS: Zero Voltage Switch
Several DABs
in cascade
DAB topology

15
HIGH POWER DEVICES
Silicon Carbide devices
• In the same direction, developments are done for WBG devices.
• 10kV SiC BJTs are being developed
• Limited commutation losses
• Higher breakdown voltage
• Better thermal conductivity
• SiC MOSFETs present the drawback of their oxide reliability in very high voltages (> 6kV).
And others..
• When it comes to a high power transmission installations (>2-3 GW) thyristors are always used as the IGBTs have
certain limits.
• The robustness and the voltage/current tolerance is larger for thyristors.
• The minimized losses is also essential when it comes to a high power transmission line

16
VSC
Summary of on-going developments
Solid state transformers
System volume
Greater efficiency
Multi-Modular Converters -
Chain link modules
Greater efficiency
SiC
High-power
devices
SS-Transformer
Passive
components

17
HVDC INSTALLATIONS WORLDWIDE
2010-2015 in GW capacity
©2015 | www.yole.fr |
• China is leading by far the HVDC lines
installations:
• 2010-2015: 95 GW
• India has planned several
HVDC projects for the
next years
• 2010-2015: 6 GW
• In Europe several
important projects have
been carried out:
• 2010-2015: 16 GW
• USA and Canada have
launched several HVDC
projects:
• 2010-2015: 3.5 GW
• Brazil has constructed the
longest HVDC line in the
world with 2375 km
• 2013: 7.1 GW

18
HVDC CAPACITY IN CHINA
• China is constructing HVDC lines with huge power capacities due to their incremental needs in power on their actual
networks.
• Before 2012, their HVDC transmission lines had a capacity of 2GW–3GW.
• From 2013 on, China is installing 6.4 GW and even 8GW HVDC lines.
• For the period between 2010–2015, China has an accumulative installed HVDC capacity of 95GW.
• It represents 67% of worldwide capacity of installed HVDC lines.
China is
creating its
future super-
grid network
for energy
compensation
between
regions.
©2015 | www.yole.fr | Status of Chinese Power Electronics

19
GEOGRAPHICAL TRENDS
Main drivers
China is constructing HVDC lines with
huge power capacities
• Due to their incremental needs in power on
their actual networks.
• From the north-west to the south-east
India also builds HVDC lines with
large power capacities, due to their
incremental needs in power & transfer
between regions.
• In Europe, main drivers are:
• Integration of renewable energies
• Interconnection between different grids
• Submarine cables
USA and Canada both
renewables’integration and
power transfers between regions
are boosting the HVDC projects.
Brazil has constructed the
world with 2375 km
• 2013: 7.1 GW
LCC technology
6 – 8 GW
VSC / LCC
technology
0.5 - 1GW
LCC technology
2 – 3 GW
Lines capacities on
the range of
0.5-1GW
for the coming
projects 3.5 GW
(even 7.2 GW).
Hydropower
Coal
Wind power
UHVDC: 800kV – 1100kV

20
HVDC INSTALLATIONS WORLDWIDE
2016-2020 forecast
©2015 | www.yole.fr |
• China is leading by far the HVDC lines
installations:
• 2010-2015: 95 GW
• 2016-2020: 90 GW
• India has planned several
HVDC projects for the
next years
• 2010-2015: 6 GW
• 2016-2020: 10 GW
• In Europe several
important projects have
been carried out:
• 2010-2015: 16 GW
• 2016-2020: 12 GW
• USA and Canada have
launched several HVDC
projects:
• 2010-2015: 3.5 GW
• 2016-2020: 15 GW
• Brazil has constructed the
world with 2375 km
• 2013: 7.1 GW

21
MARKET FORECAST
2010-2020
• There are important fluctuations in the installed GW, depending on the number of projects to come to the end each year.
• During the next 5 years almost 200 GW HVDC capacity will be installed worldwide.
• Estimation of 40 GW – 50 GW transmission capacity per year.

22
SEMICONDUCTOR MARKET IN HVDC
• Yole estimates that the semiconductor
market for HVDC in 2014 reached
$36.5M.
• While in 2015 it almost doubled:
$61.75M.
• For the next 5 years, this market should
increase to an average of $60M-$65M.
• 2015 has been an extraordinary year for IGBT
based HVDC lines.
• >$35M only for IGBT modules.
• +280% from 2014 for IGBT market in HVDC.
• European wind offshore farm connection

© 2016
Conclusion

24
CONCLUSION
• In the coming years, new HVDC projects should be built, mainly in North America and in
emerging economies, such as Brazil and India.
• As well as, in the Chinese vast expansion project.
• R&D investments will focus on the development of the transistor-basedVSC technology.
• Enough reasons to encourage tier I (power converter) and tier II (power module, capacitors,
cooling systems, etc.) power electronic components suppliers to be involved in this expanding
market!!

25
FOR ANY QUESTION
Mattin GRAOTXAPARTEGI
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He graduated from Grenoble INP with an
Engineering degree in Electrical Systems, followed by a specialization in embedded systems for transportation. He then earned an
advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial,
financial, and marketing fields within the aeronautics industry.
Mail: grao@yole.fr

© 2016
Yole Développement
FromTechnologies to Market

27©2016 | www.yole.fr | About Yole Développement
MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas

4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market &Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns & Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast services
• Events
www.i-Micronews.com

A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr

OUR GLOBAL ACTIVITY

RESEARCH PRODUCTS - CONTENT COMPARISON
Custom analysis scope is defined with
you to meet your information and
budget needs
Breadth of the analysis
Depthoftheanalysis
Custom
Analysis
Workshops
Standard Reports

SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plan along
the entire
supply chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We are
working
accross
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systems
Industrial and
defense
Energy

REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Power electronics
• Batteries and Energy management
• Compound semiconductors
• LED
o Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
• Patent investigation
• Component and module reverse engineering and costing analysis
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +70 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com

OUR 2016 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS
byYole Développement
o MEMS & SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMs Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing
Opportunities 2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
− AlN Thin Film Markets and Applications 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut and Embedded Die Business Update 2016*
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging for Wearables and Mobile Applications 2016
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging
2016**
− Emerging Materials for Advanced Packaging 2016
− Deposition Technologies Equipment & Materials 2016
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED,
CMOS 2016
**To be confirmed

OUR 2016 REPORTS PLANNING (2/2)
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications & Market 2016: from LED to Consumer Electronics*
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
− OLED for Lighting 2016
− LED Lighting Module PCB / Substrate Technology, Industry and Market Trends 2016**
− LED in Automotive Lighting 2016
o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
PATENT ANALYSIS by Knowmade
o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis
expertise)
o Patent Investigation (crossed analysis based on Knowmade & Yole Développement
expertise)
o Patent Landscape
TEARDOWN & REVERSE COSTING by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be
published in 2016.

OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Infrared Detector Technology & Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology & Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies & Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology & Market Trends

MICRONEWS MEDIA
o About Micronews Media
Micronews Media, powered by Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community.
With our services, we help you to reach your
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high added-
value editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o Four supports and channels for your visibility
• A webcast to highlight your expertise and
develop your business identifying
commercial leads
• Articles, advertisements & logo and
banners dedicated to your company, its
products and expertise in @Micronews e-
newsletter and on i-Micronews.com
Focused
community
Identified
contacts
Large
community
Mass contacts

COMMUNICATION SERVICES
All services listed below are available on–demand.
o i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o @Micronews, the e-newsletter
Headline article - Tiles
o Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event withYole support (logistics, promotion, data…)
Contacts:
Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),
Marketing & Communication Project Managers.

CONTACT INFORMATION
Follow us on
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan & President,Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, CEO & President,Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia:Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General
• Email: info@yole.fr

HVDC Transmission lines Market, Technology and Geographical Trends 2016 Presentation by Mattin GRAO of Yole Developpement at Electronica Chinaconference

Recomendados

Recomendados

Mais conteúdo relacionado

Mais procurados

Mais procurados (20)

Destaque

Destaque (20)

Semelhante a HVDC Transmission lines Market, Technology and Geographical Trends 2016 Presentation by Mattin GRAO of Yole Developpement at Electronica Chinaconference

Semelhante a HVDC Transmission lines Market, Technology and Geographical Trends 2016 Presentation by Mattin GRAO of Yole Developpement at Electronica Chinaconference (20)

Mais de Yole Developpement

Mais de Yole Developpement (20)

Último

Último (20)

HVDC Transmission lines Market, Technology and Geographical Trends 2016 Presentation by Mattin GRAO of Yole Developpement at Electronica Chinaconference