Compact Heat Exchanger

1. Improving the Performance of Electronics Devices
by Enhancing Heat Transfer Rate using Compact
Heat Exchanger
Department of Mechanical Engineering 1

2. Compact Heat Exchanger
• High heat transfer surface area per unit volume of the exchanger
• Area density greater than 700 m2/m3 for gas or greater
than 300 m2/m3 when operating in liquid or two-phase
streams.
• Highly efficient
• Reduce volume, weight and cost

3. 1. Plate fin heat exchanger
2. Tube fin heat exchanger
3. Diffusion bonded heat exchanger
4. Printed circuit heat exchanger
5. Plate and frame heat exchanger (brazed plate/welded plate)
6. Spiral heat exchanger
7. Compact shell and tube heat exchanger
Types of compact heat exchanger

4. Types of compact heat exchanger:
1.Plate fin heat exchanger

5. Types of compact heat exchanger:
2. Tube fin heat exchanger

6. Types of compact heat exchanger:
3. Diffusion bonded heat exchanger

7. Types of compact heat exchanger:
4. Printed circuit heat exchanger

8. Types of compact heat exchanger:
5. Plate and frame heat exchanger (brazed plate/welded plate)

9. Types of compact heat exchanger
6. Spiral heat exchanger

10. Types of compact heat exchanger:
7. Compact shell and tube heat exchanger.

11. Sector/Application of CHE:
• Chemicals and petrochemicals
• Cryogenics
• Paper & board
• Textiles & fabric
• Oil & gas processing
• Prime movers
• Medical Industry
• Electronics

12. LITERATURE REVIEW

13. Department of Mechanical Engineering 13
Review of applications and developments of ultra-thin micro
heat pipes for electronic cooling
• A review of the applications and developments of UTHPs for electronic
cooling is reported.
• The UTHPs are particularly suitable for the heat dissipation of ultra-slim
portable electronic devices.

14. Power saving exploration for high end ultra slim laptop
computers with miniature loop heat pipe cooling module
(a) schematic of the proposed mLHP

15. Objective and Problem
Identification
Problem:
When we continuously use laptop the processor chips gets warm by which
Performance of laptop decreases.
Objective:
So to overcome above problem, We are enhancing the Heat transfer of that
processor chips by using a compact Heat exchanger.

16. Methodology
Evaporator

17. Description:
•When Processor Chip gets warm, Evaporator extract the heat from that
surface. Evaporator is connected with the tubes coupling.
•High thermal conductivity fluid is present in tubes. And that fluid is
circulated in overall operation.
•The tube couplings are connected with the compact heat exchanger,
which is the main body for heat transfer to the atmosphere.
•The compact heat exchanger will transfer the heat to atmosphere with
the help of fans and a cooling fan.

18. How to couple?

19. How to couple?

20. TUBE FIN HEAT EXCHANGER

21. Construction
1. Finned tube is the main heat exchange element in the finned
tube heat exchanger.
2. The heat transfer between the inner and outer fluid through
the tube wall and fins, and because the fin expands the heat
transfer area, the heat transfer can improve.
3. The shape of the fins on the finned tube is generally circular
or rectangular

22. 1. The finned tube is made of fins on the surface of the tube.
2. The common methods of connection are hot sleeve, inlay,
tension winding, welding and so on. In addition, the fin tube
can also be made by the method of integral rolling, integral
casting or machining.
3. When the convective heat transfer coefficient of the two
fluids is different, the fins on the smaller heat transfer
coefficient can enhance heat transfer.

23. 1. The finned tube is composed of a base tube and a fin, and
the base tube is provided with a round tube, a flat tube, an
elliptical tube and so on. the fin is provided with a plurality
of types, which can be respectively processed on a single
base tube, and can also be connected with several tubes at
the same time.

25. Working
•Finned Tube Heat exchanger have tubes with extended outer surfaces are or
fins to enhance the heat transfer rate from the additional area of fins.
•Finned tube enhance the heat transfer area between the tube and surrounding
Fluid.

26. Factor Influencing Design
1. Design Pressure and temperature
2. Process Fluid
3. Heating/Cooling curves
4. Allowable pressure drop
5. Required Thermal effectiveness

27. Design Parameter
1. Fin Configuration Design
• Fin count/pitch
• Fin Thickness
• Fin Height
• Fin Material- Carbon steel, stainless steel, Aluminium and
alloys, copper and Alloys.
2. Tube circuit Designing
• Tube Diameter
• Tube Spacing
• Number of tube rows
• Tube Material- Carbon steel, Chromium-Molybdenum steel,
Aluminium and alloys, Copper and alloys.

28. Liquid Coolants For Electronics cooling
Sr. No Fluid Freezing Point
(oC)
Flash
Point (oC)
Viscosity
(Kg/m.s)
Thermal
Conductivity
(w/m.k)
1 Silicate-ester < -50 > 175 0.009 0.132
2 Aliphatic (PAO) < -50 > 175 0.009 0.137
3 W/methanol
(60:40 v/v)
-40 29 0.002 0.4
4 W/Potassium
Formate (60:40
wt/wt)
-35 None 0.0022 0.53

29. Expected Outcomes
•As we use laptop continuously it gets warm, by which the
performance of laptop decreases, specially gaming laptops.
•To overcome the problem compact heat exchanger will be
helpful.
•This project will help to cool the Processor chips (CPU and
GPU) as well as PCB (Printed circuit board). This will
indirectly increase the performance of the laptop.