Ceramics UK 2019 presentation

1. Thin, Flexible
Ribbon Ceramics
Michael Badding1 and John Olenick2
Ceramics UK
7-10-19
1Corning Incorporated
2ENrG Incorporated

2. © 2018 Corning Incorporated .© 2018 Corning Incorporated
Corning Incorporated is one of the world’s leading
innovators in materials science. For more than 165
years, Corning has applied its unparalleled expertise
in glass science, ceramics, and optical physics to
develop products and processes that have transformed
industries and enhanced people’s lives.
Founded:
1851
Headquarters:
Corning, New York
Employees:
>50,000 worldwide
2018 Core Sales:
$11.4 billion (at rate of 107 ¥/$)
Fortune 500 Ranking (2018):
293

3. 3Science & Technology © 2019 Corning Incorporated
A Track Record of Innovation
2012
Ultra-Slim
Flexible Glass
2000
Low-Density
LCD Glass
2013
All-Optical
Converged
Cellular &
Wi-Fi Solution
Antimicrobial
Glass
2016
High-Transmission
Light-Guide Plate
for LCD Displays
Advanced
Glass for
Wearables
Gas Particulate
Filters
2017
Damage-Resistant
Pharmaceutical
Glass Packaging
Ultra-Bendable
Optical Fiber
2007
Tough, Thin
Cover Glass
for Mobile
Devices
2015
Light, Tough
Automotive
Glass
2006
High
Throughput
Cell Culture
Solutions
1982
Liquid Crystal
Display Glass
1877
Signal Lenses
1879
Glass Bulb
for Edison’s
Electric Light
1912
Railroad
Lanterns
1915
Heat-Resistant
PYREX®Glass
1935
Hale
Telescope
Mirror
1947
Television
Picture Tube
Processes
1952
Glass-Ceramics
1964
Fusion
Overflow
Process
1970
Low-Loss
Optical Fiber
1972
Ceramic
Substrates
for Catalytic
Convertors
1932
High-Purity
Fused Silica
1934
Silicones
1961
Space Shuttle
Window Glass

4. 4Science & Technology © 2019 Corning Incorporated
Introduction – Thin Ceramics
• Corning prior work: ultrathin flexible sintered ceramics
• 3YSZ (TZP) flexible sintered ceramic
– 20 to 40 µm thick
– Fully dense, translucent
– >1 GPa bend strength
– Extreme thermal shock tolerance
• Working with ENrG Incorporated (2008)
– Identify applications for ultrathin 3YSZ
– Process development
Flexing of sintered 20 µm thick
3YSZ sheet

5. 5Science & Technology © 2019 Corning Incorporated
Ultrathin 3YSZ technology commercially available

6. 6Science & Technology © 2019 Corning Incorporated
Ribbon Ceramics = Extreme Thermal Shock Tolerance
• Ability to deflect (flexibility) provides low stress response to local thermal strains.
• One example of how thin form enables new properties

7. 7Science & Technology © 2019 Corning Incorporated
The cost problem with ceramics
Operations/ProcessHarshness
Market Volume
Price$/m2
300°C 10
100
1000
600°C
900°C

8. 8Science & Technology © 2019 Corning Incorporated
• New process produces thin, continuous sintered ceramics
– length >10 m
– in roll form
• Different process, different properties vs. conventional
piecewise sintering
Ribbon Ceramics are manufactured in a new continuous process
Continuous
Manufacturing
Process
Sintered ceramic web 100 mm wide,
40 um thick
sintered alumina
ribbon
10 m length
example

9. 9Science & Technology © 2019 Corning Incorporated
CorningTM Ribbon Ceramics
Corning’s innovative new process and unique
combination of capabilities enable breakthrough
ceramic solutions in ultra-thin form factors
High-precision
processing
Continuously
Fired Ceramic
Wafer and
Panels 100 mm wide
Deep technical expertise
in ceramics and
continuous processes
Produced in rolls Supplied as panels
Ultra-thin ceramic substrates

10. 10Science & Technology © 2019 Corning Incorporated
Two complementary ribbon materials currently available
Material Thickness (µm) Commercial Status
3YSZ (TZP) 20-40 Commercial (ENrG)
Alumina 40-80 Development sampling (Corning)
Material Bend Strength Fracture Toughness RT electrical HT electrical
3YSZ >1GPa 9-10 Insulator Conductor
Alumina 700 MPa 3-5 Insulator Insulator
*Bend strength measured by 2pt method on 40 um material. Fracture toughness range from literature.

11. 11Science & Technology © 2019 Corning Incorporated
Zirconia Ribbon Ceramics
• 3YSZ ceramics (97 mol% ZrO2, 3 mol% Y2O3)
– >99.5% RD
– ~0.25 um grain size
– ~15 nm surface Ra, as made
➢ 1 GPa bend strength

12. 12Science & Technology © 2019 Corning Incorporated
Alumina Ribbon Ceramics
• Process control enables dense, fine-grain microstructure with superior strength @ ~700
MPa
– Flexural strength compares well to typical alumina @ ~400 Mpa
Porosity 0.2%
Grain Size 1.4um
Purity >99.9%
Ra ~50 nm
2-pt bend strength of 40 um thick
alumina
Avg = 720 Mpa
Std. Dev. = 65 MPa

13. 13Science & Technology © 2019 Corning Incorporated
Handling options
• Handling thin ceramics through processing can be challenging due to flexibility
– Breaks commonly due to biaxial bending, creasing, point loads
Free-standing Temporary bond
to carrier
R2R
𝐷 =
𝐸𝑡3
12(1 − 2)
(future)
80 µm = 8X rigidity of 40 µm

14. 14Science & Technology © 2019 Corning Incorporated
Allowable bend radius depends on material and thickness
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
0 5 10 15 20 25 30 35 40 45 50
Stress(GPa)
Bend Radius (mm)
Alumina (0.040 mm)
Zirconia (0.040 mm)
Zirconia (0.020 mm)
Zirconia (0.020 mm) strength
20 um 3YSZ ribbon wrapped
around a 7 mm diameter pencil
σx  Et/2R

15. 15Science & Technology © 2019 Corning Incorporated
Coatings: DCS, R2R Format, Intellivation
R2R Vacuum Sputtering of Copper onto
20µm thick Zirconia Ribbon Ceramic
Photo & demo courtesy of Intellivation
Demonstration of R2R Lamination of OCA
onto Zirconia Ribbon Ceramic
Photo & demo courtesy of Dorey
Converting Systems
Initial R2R trials show promise…

16. 16Science & Technology © 2019 Corning Incorporated
Rapid device processing
• Low thermal mass and thermal shock tolerance of thin ceramics offers possibility of rapid
thermal device processing
2” wide, 40 um thick
alumina ribbon on 3”
diameter rolls
~20 ipm conveyance speed

17. 17Science & Technology © 2019 Corning Incorporated
Metallization examples
TEC Pattern 20u electroplated Cu
30u Cu plating and via filling
• Demonstrated metallization with thin and thick Cu
– Sputtering, Electroplating, Screen printing
• Single side circuitization / patterning
• Via conformal plating and via filling
screening printed circuits

18. 18Science & Technology © 2019 Corning Incorporated
Alumina Ribbon Ceramic for RF: low loss tangent, high Dk
High purity of Alumina ribbon ceramic results in
extremely low loss tangent, < 10-4, in 10-60 GHz range
(measured).
Coupled with high Dk (~9) enables finer metallization
and spacing
• Compact passive devices
• Low loss and crosstalk waveguides
• Small near-field antennasHigh Dk
Low Dk
High Df
Low Df
40 µm
Al2O3
HPFS
LTCC
Polymers
Glass

19. 19Science & Technology © 2019 Corning Incorporated
Alumina Ribbon Ceramic offers high breakdown strength and low thermal
resistance for Power Electronics applications
Temperature
(°C)
Breakdown voltage
(kV)
30 11
100 7.5
200 5
300 4
400 3.5
500 3
600 2.5
700 2
Breakdown
Voltage - 40 um
Ribbon Ceramic
IGBT Thermal modeling

20. 20Science & Technology © 2019 Corning Incorporated
Flexible ceramic substrates for thin, flexible batteries
• All solid state Li/LiPON/LiCoO2
• Thin film technology
• Requires inert substrate with mechanical and chemical stability in
thermal processing at >600 C
– LiCoO2 cathode layer anneal required for desired crystal phase
• Thin substrates enable higher energy density
• 3YSZ substrate an ideal choice
~20 µm

21. 21Science & Technology © 2019 Corning Incorporated
SSLB on Flexible Ceramic Substrate (ITN)
– As Thin as 20 mm YSZ
– Area Up to 40 cm2
– Cathodes up to 15 mm
Thick
– Up to 600 Wh/l
– 1-150 mAh Capacity
– Package Thickness <
250 mm

22. 22Science & Technology © 2019 Corning Incorporated
ITN’s FIPP

23. 23Science & Technology © 2019 Corning Incorporated
Other ribbon materials at an earlier stage
• Ribbon ZTA
• Ribbon Silica
40 um thick high
purity SiO2
Microstructure of 50 µm
thick high purity ZTA

24. 24Science & Technology © 2019 Corning Incorporated
Conclusion
• Flexible ceramic ribbons available with expanding capabilities and material options
– Current capability is 100 mm wide in 10’s m length
– 3YSZ @ 20 um and 40 um
– Al2O3 @ 40 um and 70 um
– Other compositions possible
• Ribbon ceramic characteristics
– Flexibility
– Thin form factor, smaller vias for device compactness
– Smooth native surface for fine metallization
– Dense and fine-grained
• Higher strength, transmittance
– High purity
• Improved thermal conductivity, loss tangent

25. Thank you for your attention!