Personal Information
Organização/Local de trabalho
Ithaca, New York Area United States
Cargo
Doctoral Research Assistant at Integrated Electronics Engineering Center (IEEC)
Setor
Electronics / Computer Hardware
Sobre
- Extensive packaging materials expertise, particularly in package and board level assembly reliability, failure analysis and Surface Mount Technology (SMT) process
- In-depth understanding of microstructure and thermo-mechanical response of lead-free solder joints
- Certified Lean Six Sigma Green Belt with knowledge of Design Of Experiments (DOE), statistical analysis and Failure Modes and Effects Analysis (FMEA)
- Experience with Printed Circuit Board (PCB), reflow oven and stencil printing printing
• Material Characterization Techniques: SEM, EBSD, EDX
•Thermal Analysis Testing: Differential Scanning Calorimetry (DSC),Thermal Gravimetric Analysis (TGA)
•Board-level and joint