Advanced Slides for High Tech Topics
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Powerpoint slide presentation samples - Reed Crouch
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Advanced Slides for High Tech Topics
- 1. SAMPLE SLIDES ADVANCEDANIMATIONS, TRANSITIONS, GRAPHICS & COMPLEX INFORMATION SLIDES FOR HIGH TECHNOLOGY TOPICS (ORIGINATED FROM SEVERALPRESENTATIONS.) Reed Crouch
- 2. New PRC Research Strategy Consortia Projects – Fundamental Research Multifunction Testbeds Company-Specified Projects
- 3. DIRECTOR: Prof. Rao R. Tummala DEPUTY DIRECTOR: Prof. Madhavan Swaminathan ADMINISTRATIVE Lauren Hall Mary Ellen Mount INFRASTRUCTURE Dean Sutter Mike Toole FINANCIAL & INDUSTRY RELATIONS Carl Rust Mary Ellen Mount Judy Lorier, Tina Crouch MARKETING Reed Crouch Carl Rust Lauren Hall RESEARCH WLP&A SOP C.P. Wong RF SOP Manos Tentzeris OPTO SOP G.K. Chang Multi- Functio SOP DESIGN Madhavan Swaminathan FABRICATION Rao Tummala NANO & Bio SENSOR Z.L. Wang & Farrokh Ayazi 3D SOP Chong Yoon MULTIFUNCTION Venky Sundaram
- 4. FACULTY LEADER MSDT ETFT FACULTY LEADER PM FACULTY LEADER NANOPACK EMAP PM FACULTY LEADER TIM LEADER PRC Faculty & Research Staff Spring2007 LEADER FACULTY PM FACULTY LEADER PM SOP @ GT-PRC Materials Opto SOP Nano-Bio SOP RF SOP Design & Test SOP Integration, Assembly & Reliability
- 5. Lauren Hall Mgr. Admin. & Operations Newsletters, Promotional Carl Rust Associate Director, Industry Open Houses, Industry Meetings Reed Crouch Communications Coordinator Mass Communications, Website, Publications, Graphics Marketing Leyla Conrad Associate Director, Education Courses, Programs, Students Swapan Bhattacharya Research Scientist DBO-1 & Nano Bio Workshop Ravi Doraiswami Research Engineer DBO-2 Mahesh Varadarajan Research Engineer SOP Textbook Education & Conferences Boyd Wiedenman Research Engineer 3S Workshop Mary Ellen Mount Administrative Coordinator Special Projects, Planning, Support Lauren Hall Mgr. Administration & Operations Scheduling, Events, Travel PRC Administration Dean Sutter Associate Director, Infrastructure Labs, Equipment, Support Mike Toole Lab Technician Maintenance, Testing, Calibration Infrastructure Carl Rust Associate Director, Industry Relations & Financial Industry Partnerships, International Collaborations, Financial Judy Lorier Accounting Manager Budgets, Reports, Projects Tina Crouch Accountant Budgets, Reports Industry Relations & Financial Mary Ellen Mount Administrative Coordinator Special Projects, Planning, Support ADMIN OPS
- 6. Core Technologies DESIGN & TESTMATERIALS THERMAL MECHANICAL &INTER- CONNECTS SUBSTRATE NANO BIOELECTRONICS Core Technologies & Teams Extended Faculty Team Organics Si Core Teams Process Staff Admin Staff Center Leadership
- 7. Europe ATOTECH AT&S BOSCH EPCOS INFINEON NXP SEMICONDUCTORS India SAMEER Korea HYNIX LG ELECTRONICS SAMSUNG TECHWIN Japan DISCO IBIDEN NGK-NTK OAK-MITSUI PANASONIC SONY POLITECNICO DI TORINO Institute of Microelectronics A Global Center U.S.A. APPLIED MATERIALS BREWER SCIENCE CELESTICA CHOMERICS DOW CHEMICAL DOW CORNING DRAPER LABORATORY DUPONT ENDICOTT INTERCONNECT GENERAL ELECTRIC HONEYWELL IBM INDIUM INTEL JACKET MICRO DEVICES LORD MAXTEK MEDTRONIC QUALCOMM ROCKWELL COLLINS ROGERS CORP. ROHM & HAAS SONOSCAN STARFIRE SYSTEMS TEXAS INSTRUMENTS
- 8. Global Partnership Membership $$ Tech Transfer Self-Sufficiency 1 10 2 3 4 5 6 7 8 9 OVERALL 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 Summary, rationale, contributors, benchmarks, tests, studies, results, etc. Summary, rationale, contributors, benchmarks, tests, studies, results, etc. Summary, rationale, contributors, benchmarks, tests, studies, results, etc. Summary, rationale, contributors, benchmarks, tests, studies, results, etc. INDUSTRY COLLABORATION
- 9. Global Models for Competitiveness China Japan Korea Germany UK Belgium • 7 centers • 1 patent office • 2 centers • 10 centers • 2 firms • 4 government offices • 9 centers • 1 firm • 1 government office • 6 centers • 7 government offices • 8 centers • 5 government offices • 1 other
- 10. Current Approach to Systems
- 11. What Are 3D ICs? Courtesy MCNC 2D to 3D SOC (800 µM) Functional ICs Thinned ICs (30 µM) 3D ICs
- 12. Impact of 3D ICs Limited without 3D Systems 3. Discrete Components2. Stacked Memory 4. Connectors & Batteries 1. Processor Package
- 13. Thermal Interfaces IC IC ICs & 3D ICs Interconnects Nanoscale Components BEOL-Like Wiring BEOL-Like Wiring Nanoscale Components IC SOC IC IC IC IC ICs & 3D ICs Interconnects Thermal Interfaces Power CORETSV TSV Cavity 3D ICs 3D Systems 3D ICs vs. 3D Systems Transceiver Controller Memory Logic Transceiver Controller Memory Logic
- 14. Concept of System Wafer Fab Silicon or Large Area Core Cavity 5. Battery nano 1. Through Si vias (TSVs) and stack bonding 10-50µ pitch 4. System interconnections 20-100µ pitch 2. High density wiring 1-5µ L/S 3. Embedded passives and actives 1µ thickness IC IC Stacked ICs IC Battery
- 15. MEMSPD/TIA GaAs THERMAL SOP NANO-BIO-SENSORS SYSTEM-IN-PACKAGE (SIP) ULTRA HIGH DENSITY I/O INTERFACE DIGITAL SOP RF SOP OPTOELECTRONIC SOP Core SOP Animation Nanoscaled Interconnects Thinfilm Build-up Dielectric Ultra-fine pitch wiring & vias
- 16. Open Innovation is Key to Global Competitiveness Research Technology Development Product Development Industry Role Industry Role 25% Academic Role 15% Academic Role Pre-Competitive 3-5 Years 3 Years Competitive 2 Years Products
- 17. Integration Research STACK BOND •BONDING 3D ASSM }ALL SI PACKAGE •DIELECTRIC •CONDUCTOR •SI CORE SI MODULE •EMBEDDED COMPONENTS •BGA CONNECTOR •2ND LEVEL SMT SILICON PACKAGE TSV DESIGN EMBEDDED ACTIVES & PASSIVES SYSTEM INTERCONNECTION } •DESIGN •M&P TSV
- 18. PRC Finances & GT Support Req’d Note: Includes In-kind Services, Equip, $ Materials NSF ERC Era $1.6M $2.6M GT Contributions $15M PRC FY12 and Beyond $1M $2.0M $10M 5-Year Post-ERC Era $1.3M $2.0M PRC Costs $10M
- 19. GLOBALLYSHAREDVISION Industry • Academia – END USERS – Further Research NSECMANAGEMENT VISION•FOCUS•PR•COLLABORATION •EDUCATION•ADMINISTRATION•PERSONNEL NSECINFRASTRUCTURE SHAREDFACILITIES COLLABORATION NATIONAL•INTERNATIONAL SYSTEMS & ENABLING TECHNOLOGIES INDUSTRY WIRING,DIELECTRICS,FLUIDICS PHOTONICS RF INTERCONNECTS BATTERIES&THERMAL BIO-SENSORS INT.NETWORKCOMMS CANCERDETECTION MOLECULARMANIPUL. COMPUTERPOWER CHEMISTRYADVANCES BIOMEDICALADVANCES COMMUNICATIONS MATERIALSADVANCES CONCEPT DEVELOPMENT SCIENCE & ENGINEERING LABS & FACILITIES NANO PROCESS DEVELOPMENT NANO MANUFACTURING DEVELOPMENT EDUCATION PRE-COLLEGE UNIVERSITIES: GRADUATE, UNDERGRAD INDUSTRY OUTREACH: • INTERDISCIPLINARY FELLOWSHIPS • INDUSTRY • INT’L PARTNERS • MINORITIES • VIRTUAL ENVIRONMENT • NATIONAL ACADEMIC PARTNERS • OTHER RESEARCH Personal Health & Safety • Education – NEEDS – Economic Growth • Multiple Use Technology