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SUN产品介绍
Ding Jie
Mail: Jie.ding@sun.com
Sun Proprietary/Confidential: Internal Use Only 2
完整清晰的服务器产品线
T-series
Servers
(32, 64, 128, 256
Threads)
X2270 M2 X4170
X4270/X4275
Sun Fire
x64 Servers
(1-8 Sockets)
X4640 M2
X4540 SB 8000
SPARC
Enterprise
Servers
(1-64 Processors
4-256 Cores)
M4000 M5000 M8000 M9000
SB 6000
X4450
T5120, T5220 T5140, T5240
T5440
M3000
Sun Proprietary/Confidential: Internal Use Only 3
Sun’s x64服务器产品线
Sun Blae
6000 Modular
System
刀片
服务器
Sun Fire
服务器
X4600 M2
X4640(New)
X4540
X4450
X4170 X4270
Sun Blade
6048 Modular
System
2S
X4275
4S
8S
Storage
2S Server
48 Disk
Intel/AMD CPU:
Blade X6270
Blade X6275
Blade X6440
CMT blade:
Blade T6300
Blade T6320
Blade T6340
X2270 M2
Sun Proprietary/Confidential: Internal Use Only 4
Competitive Landscape – X4270/X4275
Rack Space 1U 2U 2U 2U 2U
CPU Type Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500
Max Socket 2 Sockets 2 Sockets 2 Sockets 2 Sockets 2 Sockets
DIMMs / Chassis 18 DDR3 18 DDR3 18 DDR3 18 DDR2 16 DDR2
Max Memory 144GB (w/8GB) 144GB (w/8GB ) 144GB (w/8GB ) 144GB (w/8GB ) 128 GB (w/ 8GB)
Disk Drives 6 x 3.5” SAS/SATA
RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5 RAID 0, 1, 5
GbE Ports 4 x GbE 4 x GbE 2x GbE 2x GbE 2x GbE
Expansion Slots 3 x PCIe 6 x PCIe 6 x PCIe 4 x PCIe 4 x PCIe
Hot Swap PSUs 2 x 750W 2 x 1050W 2x 750/1200W 2 x 570/850W 2 x 675W
Hot Swap Fans Yes Yes Yes Yes None
Management ILOM ILOM iLO 2 IPMI 2.0 IPMI 2.0
Warranty 3 Yr NBD 3 Yr NBD 3 Yr NBD 3 Yr NBD 3 yr NBD
Competitors →
Features ↓
Sun Fire
X4170
Sun Fire
X4270/ X4275
HP
DL380 G6
Dell
R710
IBM
X3650M2
8 x 2.5” SAS or
SSD
16x 2.5” SAS
/12x 3.5” SAS
8x 2.5” SAS
/6x 3.5” SAS
12 x 2.5”
SAS/SATA
Sun Proprietary/Confidential: Internal Use Only 5
T系列的特点---并发多线程的CMT技术
为了提高处理器的性能,传统的
解决方法是力图不断提高处理器的
指令级并行性(ILP,Instruction
Level Parallelism)
为了加强ILP.一方面改善CPU
的体系结构 技术,例如:加强整型
处理部件、浮点处理部件、加载/
存储部件等 ,多级缓存,预测执行
等指令级并行处理技术引入到微处
理器芯片;另一方面,引入深度流
水,将指令的执行划分为更多更细
的流水级。
线程级并行(Thread Level
Parallelism, TLP)技术应运而生。TLP
技术将处理器内部的并行由指令级上升到
线程级,旨在通过线程级的并行来增加指
令吞吐量,提高处理器的资源利用率。
TLP处理 器的中心思想是:当某一个线程
由于等待内存访问结构而空闲时,可以立
刻导入其他的就绪线程来运行。这样,处
理器流水线就能够始终处于忙碌的状态,
系统的处 理能力提高了,吞吐量自然也
相应提升了。我们可以从下面示意图的比
较看出TLP相对于ILP的优势
ILP只能够缩短指令在CPU中的
执行时间,却不能有效改善由于
内存等待而造成的延迟
使用乱序执行(out-of-order)的ILP处理器能够小幅度利用内存等待的延迟来执行指令
Sun Proprietary/Confidential: Internal Use Only 6
多核路线是主流发展方向:
Intel
“Dunnington”
8 cores
AMD
“Barcelona”
12 cores
Sun
UltraSPARCTM T2
8 cores
10 Cores by 2011
TILE64TM
64 Cores
Azul
Vega 3
54 cores
Sun Proprietary/Confidential: Internal Use Only 7
Intel的未来-----多核
http://www.computerworld.com/action/article.do?command=viewArticleBasic&articleId=306606&intsrc=hm_list
-- Justin R. Rattner, Intel CTO
改进性能的唯一途径(而且我们认为是
解决功耗的唯一途径)是走多核路线。
多核技术可以把我们推回历史上的摩尔
定律的轨道。
“
”
Sun Proprietary/Confidential: Internal Use Only 8
Sun SPARC64 产品家族
全面覆盖Sun Fire产品线
M3000 M4000 M5000 M8000 M9000-32 M9000-64
Housing 2RU 6RU 10RU Rack Rack
Rack+Expansio
n
#CPU Sockets 1 4 8 16 32 64
SPARC64 VI Cores 8 16 32 64 128
SPARC64 VII Cores4 16 32 64 128 256
Max Threads 8 32 64 128 256 512
Memory (GB) 64 256 512 1024 2048 4096
I/O Slots 4 25 50 112 224 288
Domains 2 4 8 16 24
Sun Proprietary/Confidential: Internal Use Only 9
SPARC64 VII四核处理器
• 4个 SPARC V9 内核 @ 2.4-
2.52/2.88GHz
> 改进的线程实现机制,每核2个 SMT 线程
> 64KB I$ and 64KB D$ per core
> 5-6MB 片上L2 Cache
> 65纳米工艺
> 功耗: ~120W @1.1v & 2.52/2.88GHz
• 相同的系统互联技术
• 可与现有的双核SPARC64 VI CPU在
同一系统中共存
64KB D$
64KB I$
FPU
C1
FPU
C2
Arbiter / Switch
System Interconnect
5-6MB L2$
5B @ 530Mhz
FPU
C3
FPU
C4
System
Interface
64KB D$
64KB I$
64KB D$
64KB I$
64KB D$
64KB I$
Sun Proprietary/Confidential: Internal Use Only 10
Sun保证的Solaris 二进制兼容性
保护客户软件方面的投资
路线图上高性能四核SPARC64 VII处理器
即将发布
可在统一Domain中混合SPARC64 VI 和
SPARC64 VII
保护客户硬件投资
全新/高性能CPU板与旧板同时工作
无需更换机箱
无需宕机-采用DR部署新处理器
内存镜像/指令重试等高可靠技术
SWaP 优势
in-chassis upgrade to 4-core,
mix-frequency
提高主频
混频使用
 应用迁移
Mx000 的特点
11
Sun Proprietary & Confidential: Signed CDA Required
Sun SPARC Enterprise Server
M3000
12
Sun Proprietary & Confidential: Signed CDA Required
System Cabinet
Hard Disk Drives
Power Switch
DVD Drive
Status Indicators
(Power, XSCF ready, System check)
Key Switch
(Lock, Service)
PCIe slots Gigabit Ethernet
UPC
RCI
SAS
Front View
Rear View
USB Serial LAN 0 & 1
13
Sun Proprietary & Confidential: Signed CDA Required
M4000/5000: Mid-Range Systems
Overview
Application acceleration
Up to 4 or 8 dual core SPARC64 VI/VII processors
Upgradable to SPARC64 VII (mixed support)
New higher performance interconnect
New industry standard PCI express I/O
Less down time
Greatly improved RAS functionality
Economical, modular datacenter design
6U and 10U, rack-optimized enclosures
Up to 4 dynamic system domains
New: Support for soft partitions
Solaris 10 operating system
M4000
M5000
14
Sun Proprietary & Confidential: Signed CDA Required
Sun SPARC Enterprise Server
M4000
M4000
Processor SPARC64 VI/VII
2.15/2.52GHz, 5MB L2 Cache
Max 4 (16 core)
Memory Max 256GB
Internal Disks Max 2 (2.5” SAS)
Removable Media DVD, DAT
On-board IO 2 GbE ports
Memory Bandwith 20 GBps
I/O Bandwidth 6 GBps
PCI Slots 4 PCI-E, 1 PCI-X
External IO Expansion Yes
Enclosure 6U
Redundant Parts Disk, PSU, Fan
Hot-swappable parts Disk, PSU, Fan
Power Options 1-phase 1+1 cables
Domains Max 2
RAS Management XSCF (service processor)
15
Sun Proprietary & Confidential: Signed CDA Required
Sun SPARC Enterprise Server
M5000
M5000
Processor SPARC64 VI/VII
2.15/2.52GHz, 5MB L2 Cache
Max 8 (32 core)
Memory Max 512GB
Internal Disks Max 4 (2.5” SAS)
Removable Media DVD, DAT
On-board IO 4 GbE ports
Memory Bandwidth 40 GBps
I/O Bandwidth 12 GBps
PCI Slots 8 PCI-E, 2 PCI-X
External IO Expansion Yes
Enclosure 10U
Redundant Parts Disk, PSU, Fan
Hot-swappable parts Disk, PSU, Fan
Power Options 1-phase 2+2 cables
Domains Max 4
RAS Management XSCF (service processor)
16
Sun Proprietary & Confidential: Signed CDA Required
M8000/9000: High-End Systems Overview
Application acceleration
Up to 16, 32, or 64 dual core SPARC64 VI processors
Upgradeable to SPARC64 VII (mixed support in box)
New high performance interconnect (up to 330 GB/sec)
New industry standard PCI-E I/O
Mainframe-class RAS capabilities
Unmatched configuration flexibility
Modular building block architecture
(CMU, IOU, expansion box, XSCF)
Up to 24 dynamic system domains
New- support for soft partitions
Solaris 10 operating system
17
Sun Proprietary & Confidential: Signed CDA Required
Sun SPARC Enterprise Server
M8000
SES M8000
Processor SPARC64 VI/VII
2.28 – 2.88GHz, 6MB L2 Cache
Max 16 (64 core)
Memory Max 1024GB
Backplane Bandwidth 93 GBps
Memory Bandwidth 170 GBps
I/O Bandwidth 48 GBps
Internal Disks Max 16 (2.5” SAS)
Removable Media DVD, DAT
CMU (System Board) and IOU Max 4 each
PCI Slots (on IOU) Max 32 (PCI-E)
External IO Expansion Yes
Redundant Parts CMU, IOU, XSCF, Clock board, Disk, PSU, Fan, XB
Hot-Swappable Parts CMU, IOU, XSCF, Disk, PSU, Fan
Power Options 1-phase / 3-phase / dual-grid
Domains Max 16
RAS Management XSCF (service processor)
18
Sun Proprietary & Confidential: Signed CDA Required
Sun SPARC Enterprise Server
M9000
SES M9000
Processor SPARC64 VI/VII
2.28 – 2.88GHz, 6MB L2 Cache
Max 64 (256 core)
Memory Max 4TB
Backplane Bandwidth 304.2 GBps
Memory Bandwidth 683 GBps
I/O Bandwidth 192 GBps
Internal Disks Max 64 (2.5” SAS)
Removable Media DVD, DAT
CMU (System Board) and IOU Max 16 each
PCI Slots (on IOU) Max 128 (PCI-E)
External IO Expansion Yes
Redundant Parts CMU, IOU, XSCF, Clock board, Disk, PSU, Fan, XB
Hot-Swappable Parts CMU, IOU, XSCF, Disk, PSU, Fan
Power Options 1-phase / 3-phase / dual-grid
Domains Max 24
RAS Management XSCF (service processor)
Sun Proprietary/Confidential: Internal Use Only 19
CMT产品家族
从特定应用领域向通用服务器的转变
T5120/T5220
Up to 64 Threads
T5140/T5240
Up to 128 Threads
Scottsdale
UltraSPARC T2 blade
T5440
Up to 256 Threads
20
Sun Confidential: Need to Know Only
SPARC Enterprise
T5440
Quad-Socket UltraSPARC T2
Plus
Compute Density
• 4 RU chassis
• Modular, 4-sockets – UltraSPARC T2 Plus
> 1 – 4 processor modules
> Up to 32 cores @ 1.2GHz /1.4/1.6Ghz
> Only 8 cores per processor
> Up to 256 threads
• Up to 64 FB-DIMM slots
> 512 GB using 8 GB FB-DIMMs
Reliable
• 4 Hot-Plug 2.5” SAS disks (Raid 0,1)
• DVD +/-RW
• 4 - Redundant (2+2), hot-swap PSUs
• 4 - Redundant, hot-swappable Fans
• 1900 watts typical consumption
Expandable
• 4 - Processor+Memory card pairs
• 8 x8 PCIe expansion slots (2 - XAUI)
• 4 Gb Ethernet (or 2 x 10 GbE and
2x 1GbE)
• 4 - USB 2.0
● Up to 256 threads / 512 GB
memory in a robust, redundant
chassis
● Extending the range of CMT
servers
● LDoms consolidation dream
box
Sun Proprietary/Confidential: Internal Use Only 21
Internal View (T5440)
Disk
Chassis
4 x SAS
Disk Chassis
4 Fans are required
System Configuration Card
(SCC) EEPROM
Service
Processor
Daughter Card
Power
Distribution
Board
Power BUS Bars
RED = +12Volts
BLUE = Ground
MB/FT0
MEM 0
Power
Supplies
MB/FT2
MB/FT3
MB/FT1
CPU 0
CPU 2
MEM 2
MEM 1
CPU 1
CPU 3
MEM 3
XAUI/PCIe
PCIe x8
XAUI/PCIe
PCIe x8
Sun Proprietary/Confidential: Internal Use Only 22
PCIe 外接IO扩展单元
• 4RU
• 两个PCIe boat
• 每个PCIe boat有6个插槽
• 可热插拔, PCIe x8, 全高
• 只支持PCIe, 不支持PCIx
• 支持所有T系列产品
Sun Proprietary/Confidential: Internal Use Only 23
T5220 / T5240 / T5440
Feature T5220 T5240 T5440
Form Factor 2 RU, 28.125” deep 2 RU, 28.125” deep 4 RU, 24.5” deep
CPU
1 – UltraSPARC T2 1.2,
1.4,1.6 GHz 64 threads
2 - UltraSPARC T2 Plus
1.2, 1.4,1.6GHz 64
threads each
4 - UltraSPARC T2 Plus 1.2,
1.4,1.6 GHz 64 threads each
Memory
FB-DIMM, 128 GB Max.
16x Slots
FB-DIMM, 256 GB Max. up
to 32x Slots
FB-DIMM, 512 GB Max. up to
64x Slots
Network 2 – 10GbE + 4x GbE
2 - 10GbE + 2 - GbE or
4 - GbE
2 - 10GbE + 2 - GbE or 4 -
GbE
Internal Storage
8 - 2.5” SAS or SATA,
hot-swap (16 w.
refresh)
Up to 16- 2.5” SAS or
SATA, hot-swap
4 – 2.5” SAS or SATA
hot-swap
Removable Media 1 - DVD +/-RW 1 - DVD +/-RW 1 - DVD +/-RW
Serial 1 - RS-232, 4 - USB 1 - RS-232, 4 - USB 1 - RS-232, 4 - USB
PCI Express slots
6x (low profile) or 4x
+ 2x XAUI
6 - (low profile) or 4x
+ 2x XAUI
8 - (low profile) or 6x +
2x XAUI
IO box YES YES YES
Power Supply 2 - 750W AC /DC 2 - 1100W AC /DC 4 - 1120W AC (N+1)
Sun Proprietary/Confidential: Internal Use Only 24
Memory
T5120
T5220
T5140
T5240
T5440
T6320
T6340
CPU
4x1.2, 8x1.2,
8x1.4,8x1.6GHz
4x1.2, 8x1.2,
8x1.4,8x1.6GHz
8x1.2, 12x1.2,
16x1.4GHz
8x1.2, 12x1.2,
16x1.4,16x1.6GHz
1.2,1.4,1.6GHz 4 GB FB-DIMMs at
800 Mhz for 1.6GHz
4x1.2, 8x1.2,
8x1.4,8x1.6GHz
8x1.2, 12x1.2,
16x1.4GHz
系统配置
25
25
如何准确定位M系列
和T系列产品
Sun Proprietary/Confidential: Internal Use Only 26
SPARC服务器产品的特点
• M系列
> Mainframe级别可靠性和容错性
> 配置灵活,适于垂直扩展,很强的投资保护
> 单线程处理能力强
• T系列
> 部件较少,高可靠性
> 多线程并发处理能力强,是数据库,交易型及
Web应用的理想产品
> 更加节能环保
27
Sun Proprietary & Confidential: Signed CDA Required
Web
不同负载应用场合的比较
Network
Intensive
Storage
Intensive
Highly Threaded
Single Threaded
Application
M-Series
Tx000, T5x20
x64
T5x40
Data
Q&A
Sun Proprietary/Confidential: Internal Use Only 29
竞争定位
Sun IBM HP
T5x20 P6 520 rx6600 rx3600
T5x40 P6 550,P560Q rx7640 ,rx6600
T5440 P6 560Q,P570 Rx8640,Superdome

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SUN主机产品介绍.ppt

  • 2. Sun Proprietary/Confidential: Internal Use Only 2 完整清晰的服务器产品线 T-series Servers (32, 64, 128, 256 Threads) X2270 M2 X4170 X4270/X4275 Sun Fire x64 Servers (1-8 Sockets) X4640 M2 X4540 SB 8000 SPARC Enterprise Servers (1-64 Processors 4-256 Cores) M4000 M5000 M8000 M9000 SB 6000 X4450 T5120, T5220 T5140, T5240 T5440 M3000
  • 3. Sun Proprietary/Confidential: Internal Use Only 3 Sun’s x64服务器产品线 Sun Blae 6000 Modular System 刀片 服务器 Sun Fire 服务器 X4600 M2 X4640(New) X4540 X4450 X4170 X4270 Sun Blade 6048 Modular System 2S X4275 4S 8S Storage 2S Server 48 Disk Intel/AMD CPU: Blade X6270 Blade X6275 Blade X6440 CMT blade: Blade T6300 Blade T6320 Blade T6340 X2270 M2
  • 4. Sun Proprietary/Confidential: Internal Use Only 4 Competitive Landscape – X4270/X4275 Rack Space 1U 2U 2U 2U 2U CPU Type Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500 Intel Xeon 5500 Max Socket 2 Sockets 2 Sockets 2 Sockets 2 Sockets 2 Sockets DIMMs / Chassis 18 DDR3 18 DDR3 18 DDR3 18 DDR2 16 DDR2 Max Memory 144GB (w/8GB) 144GB (w/8GB ) 144GB (w/8GB ) 144GB (w/8GB ) 128 GB (w/ 8GB) Disk Drives 6 x 3.5” SAS/SATA RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5, 6 RAID 0, 1, 5 RAID 0, 1, 5 GbE Ports 4 x GbE 4 x GbE 2x GbE 2x GbE 2x GbE Expansion Slots 3 x PCIe 6 x PCIe 6 x PCIe 4 x PCIe 4 x PCIe Hot Swap PSUs 2 x 750W 2 x 1050W 2x 750/1200W 2 x 570/850W 2 x 675W Hot Swap Fans Yes Yes Yes Yes None Management ILOM ILOM iLO 2 IPMI 2.0 IPMI 2.0 Warranty 3 Yr NBD 3 Yr NBD 3 Yr NBD 3 Yr NBD 3 yr NBD Competitors → Features ↓ Sun Fire X4170 Sun Fire X4270/ X4275 HP DL380 G6 Dell R710 IBM X3650M2 8 x 2.5” SAS or SSD 16x 2.5” SAS /12x 3.5” SAS 8x 2.5” SAS /6x 3.5” SAS 12 x 2.5” SAS/SATA
  • 5. Sun Proprietary/Confidential: Internal Use Only 5 T系列的特点---并发多线程的CMT技术 为了提高处理器的性能,传统的 解决方法是力图不断提高处理器的 指令级并行性(ILP,Instruction Level Parallelism) 为了加强ILP.一方面改善CPU 的体系结构 技术,例如:加强整型 处理部件、浮点处理部件、加载/ 存储部件等 ,多级缓存,预测执行 等指令级并行处理技术引入到微处 理器芯片;另一方面,引入深度流 水,将指令的执行划分为更多更细 的流水级。 线程级并行(Thread Level Parallelism, TLP)技术应运而生。TLP 技术将处理器内部的并行由指令级上升到 线程级,旨在通过线程级的并行来增加指 令吞吐量,提高处理器的资源利用率。 TLP处理 器的中心思想是:当某一个线程 由于等待内存访问结构而空闲时,可以立 刻导入其他的就绪线程来运行。这样,处 理器流水线就能够始终处于忙碌的状态, 系统的处 理能力提高了,吞吐量自然也 相应提升了。我们可以从下面示意图的比 较看出TLP相对于ILP的优势 ILP只能够缩短指令在CPU中的 执行时间,却不能有效改善由于 内存等待而造成的延迟 使用乱序执行(out-of-order)的ILP处理器能够小幅度利用内存等待的延迟来执行指令
  • 6. Sun Proprietary/Confidential: Internal Use Only 6 多核路线是主流发展方向: Intel “Dunnington” 8 cores AMD “Barcelona” 12 cores Sun UltraSPARCTM T2 8 cores 10 Cores by 2011 TILE64TM 64 Cores Azul Vega 3 54 cores
  • 7. Sun Proprietary/Confidential: Internal Use Only 7 Intel的未来-----多核 http://www.computerworld.com/action/article.do?command=viewArticleBasic&articleId=306606&intsrc=hm_list -- Justin R. Rattner, Intel CTO 改进性能的唯一途径(而且我们认为是 解决功耗的唯一途径)是走多核路线。 多核技术可以把我们推回历史上的摩尔 定律的轨道。 “ ”
  • 8. Sun Proprietary/Confidential: Internal Use Only 8 Sun SPARC64 产品家族 全面覆盖Sun Fire产品线 M3000 M4000 M5000 M8000 M9000-32 M9000-64 Housing 2RU 6RU 10RU Rack Rack Rack+Expansio n #CPU Sockets 1 4 8 16 32 64 SPARC64 VI Cores 8 16 32 64 128 SPARC64 VII Cores4 16 32 64 128 256 Max Threads 8 32 64 128 256 512 Memory (GB) 64 256 512 1024 2048 4096 I/O Slots 4 25 50 112 224 288 Domains 2 4 8 16 24
  • 9. Sun Proprietary/Confidential: Internal Use Only 9 SPARC64 VII四核处理器 • 4个 SPARC V9 内核 @ 2.4- 2.52/2.88GHz > 改进的线程实现机制,每核2个 SMT 线程 > 64KB I$ and 64KB D$ per core > 5-6MB 片上L2 Cache > 65纳米工艺 > 功耗: ~120W @1.1v & 2.52/2.88GHz • 相同的系统互联技术 • 可与现有的双核SPARC64 VI CPU在 同一系统中共存 64KB D$ 64KB I$ FPU C1 FPU C2 Arbiter / Switch System Interconnect 5-6MB L2$ 5B @ 530Mhz FPU C3 FPU C4 System Interface 64KB D$ 64KB I$ 64KB D$ 64KB I$ 64KB D$ 64KB I$
  • 10. Sun Proprietary/Confidential: Internal Use Only 10 Sun保证的Solaris 二进制兼容性 保护客户软件方面的投资 路线图上高性能四核SPARC64 VII处理器 即将发布 可在统一Domain中混合SPARC64 VI 和 SPARC64 VII 保护客户硬件投资 全新/高性能CPU板与旧板同时工作 无需更换机箱 无需宕机-采用DR部署新处理器 内存镜像/指令重试等高可靠技术 SWaP 优势 in-chassis upgrade to 4-core, mix-frequency 提高主频 混频使用  应用迁移 Mx000 的特点
  • 11. 11 Sun Proprietary & Confidential: Signed CDA Required Sun SPARC Enterprise Server M3000
  • 12. 12 Sun Proprietary & Confidential: Signed CDA Required System Cabinet Hard Disk Drives Power Switch DVD Drive Status Indicators (Power, XSCF ready, System check) Key Switch (Lock, Service) PCIe slots Gigabit Ethernet UPC RCI SAS Front View Rear View USB Serial LAN 0 & 1
  • 13. 13 Sun Proprietary & Confidential: Signed CDA Required M4000/5000: Mid-Range Systems Overview Application acceleration Up to 4 or 8 dual core SPARC64 VI/VII processors Upgradable to SPARC64 VII (mixed support) New higher performance interconnect New industry standard PCI express I/O Less down time Greatly improved RAS functionality Economical, modular datacenter design 6U and 10U, rack-optimized enclosures Up to 4 dynamic system domains New: Support for soft partitions Solaris 10 operating system M4000 M5000
  • 14. 14 Sun Proprietary & Confidential: Signed CDA Required Sun SPARC Enterprise Server M4000 M4000 Processor SPARC64 VI/VII 2.15/2.52GHz, 5MB L2 Cache Max 4 (16 core) Memory Max 256GB Internal Disks Max 2 (2.5” SAS) Removable Media DVD, DAT On-board IO 2 GbE ports Memory Bandwith 20 GBps I/O Bandwidth 6 GBps PCI Slots 4 PCI-E, 1 PCI-X External IO Expansion Yes Enclosure 6U Redundant Parts Disk, PSU, Fan Hot-swappable parts Disk, PSU, Fan Power Options 1-phase 1+1 cables Domains Max 2 RAS Management XSCF (service processor)
  • 15. 15 Sun Proprietary & Confidential: Signed CDA Required Sun SPARC Enterprise Server M5000 M5000 Processor SPARC64 VI/VII 2.15/2.52GHz, 5MB L2 Cache Max 8 (32 core) Memory Max 512GB Internal Disks Max 4 (2.5” SAS) Removable Media DVD, DAT On-board IO 4 GbE ports Memory Bandwidth 40 GBps I/O Bandwidth 12 GBps PCI Slots 8 PCI-E, 2 PCI-X External IO Expansion Yes Enclosure 10U Redundant Parts Disk, PSU, Fan Hot-swappable parts Disk, PSU, Fan Power Options 1-phase 2+2 cables Domains Max 4 RAS Management XSCF (service processor)
  • 16. 16 Sun Proprietary & Confidential: Signed CDA Required M8000/9000: High-End Systems Overview Application acceleration Up to 16, 32, or 64 dual core SPARC64 VI processors Upgradeable to SPARC64 VII (mixed support in box) New high performance interconnect (up to 330 GB/sec) New industry standard PCI-E I/O Mainframe-class RAS capabilities Unmatched configuration flexibility Modular building block architecture (CMU, IOU, expansion box, XSCF) Up to 24 dynamic system domains New- support for soft partitions Solaris 10 operating system
  • 17. 17 Sun Proprietary & Confidential: Signed CDA Required Sun SPARC Enterprise Server M8000 SES M8000 Processor SPARC64 VI/VII 2.28 – 2.88GHz, 6MB L2 Cache Max 16 (64 core) Memory Max 1024GB Backplane Bandwidth 93 GBps Memory Bandwidth 170 GBps I/O Bandwidth 48 GBps Internal Disks Max 16 (2.5” SAS) Removable Media DVD, DAT CMU (System Board) and IOU Max 4 each PCI Slots (on IOU) Max 32 (PCI-E) External IO Expansion Yes Redundant Parts CMU, IOU, XSCF, Clock board, Disk, PSU, Fan, XB Hot-Swappable Parts CMU, IOU, XSCF, Disk, PSU, Fan Power Options 1-phase / 3-phase / dual-grid Domains Max 16 RAS Management XSCF (service processor)
  • 18. 18 Sun Proprietary & Confidential: Signed CDA Required Sun SPARC Enterprise Server M9000 SES M9000 Processor SPARC64 VI/VII 2.28 – 2.88GHz, 6MB L2 Cache Max 64 (256 core) Memory Max 4TB Backplane Bandwidth 304.2 GBps Memory Bandwidth 683 GBps I/O Bandwidth 192 GBps Internal Disks Max 64 (2.5” SAS) Removable Media DVD, DAT CMU (System Board) and IOU Max 16 each PCI Slots (on IOU) Max 128 (PCI-E) External IO Expansion Yes Redundant Parts CMU, IOU, XSCF, Clock board, Disk, PSU, Fan, XB Hot-Swappable Parts CMU, IOU, XSCF, Disk, PSU, Fan Power Options 1-phase / 3-phase / dual-grid Domains Max 24 RAS Management XSCF (service processor)
  • 19. Sun Proprietary/Confidential: Internal Use Only 19 CMT产品家族 从特定应用领域向通用服务器的转变 T5120/T5220 Up to 64 Threads T5140/T5240 Up to 128 Threads Scottsdale UltraSPARC T2 blade T5440 Up to 256 Threads
  • 20. 20 Sun Confidential: Need to Know Only SPARC Enterprise T5440 Quad-Socket UltraSPARC T2 Plus Compute Density • 4 RU chassis • Modular, 4-sockets – UltraSPARC T2 Plus > 1 – 4 processor modules > Up to 32 cores @ 1.2GHz /1.4/1.6Ghz > Only 8 cores per processor > Up to 256 threads • Up to 64 FB-DIMM slots > 512 GB using 8 GB FB-DIMMs Reliable • 4 Hot-Plug 2.5” SAS disks (Raid 0,1) • DVD +/-RW • 4 - Redundant (2+2), hot-swap PSUs • 4 - Redundant, hot-swappable Fans • 1900 watts typical consumption Expandable • 4 - Processor+Memory card pairs • 8 x8 PCIe expansion slots (2 - XAUI) • 4 Gb Ethernet (or 2 x 10 GbE and 2x 1GbE) • 4 - USB 2.0 ● Up to 256 threads / 512 GB memory in a robust, redundant chassis ● Extending the range of CMT servers ● LDoms consolidation dream box
  • 21. Sun Proprietary/Confidential: Internal Use Only 21 Internal View (T5440) Disk Chassis 4 x SAS Disk Chassis 4 Fans are required System Configuration Card (SCC) EEPROM Service Processor Daughter Card Power Distribution Board Power BUS Bars RED = +12Volts BLUE = Ground MB/FT0 MEM 0 Power Supplies MB/FT2 MB/FT3 MB/FT1 CPU 0 CPU 2 MEM 2 MEM 1 CPU 1 CPU 3 MEM 3 XAUI/PCIe PCIe x8 XAUI/PCIe PCIe x8
  • 22. Sun Proprietary/Confidential: Internal Use Only 22 PCIe 外接IO扩展单元 • 4RU • 两个PCIe boat • 每个PCIe boat有6个插槽 • 可热插拔, PCIe x8, 全高 • 只支持PCIe, 不支持PCIx • 支持所有T系列产品
  • 23. Sun Proprietary/Confidential: Internal Use Only 23 T5220 / T5240 / T5440 Feature T5220 T5240 T5440 Form Factor 2 RU, 28.125” deep 2 RU, 28.125” deep 4 RU, 24.5” deep CPU 1 – UltraSPARC T2 1.2, 1.4,1.6 GHz 64 threads 2 - UltraSPARC T2 Plus 1.2, 1.4,1.6GHz 64 threads each 4 - UltraSPARC T2 Plus 1.2, 1.4,1.6 GHz 64 threads each Memory FB-DIMM, 128 GB Max. 16x Slots FB-DIMM, 256 GB Max. up to 32x Slots FB-DIMM, 512 GB Max. up to 64x Slots Network 2 – 10GbE + 4x GbE 2 - 10GbE + 2 - GbE or 4 - GbE 2 - 10GbE + 2 - GbE or 4 - GbE Internal Storage 8 - 2.5” SAS or SATA, hot-swap (16 w. refresh) Up to 16- 2.5” SAS or SATA, hot-swap 4 – 2.5” SAS or SATA hot-swap Removable Media 1 - DVD +/-RW 1 - DVD +/-RW 1 - DVD +/-RW Serial 1 - RS-232, 4 - USB 1 - RS-232, 4 - USB 1 - RS-232, 4 - USB PCI Express slots 6x (low profile) or 4x + 2x XAUI 6 - (low profile) or 4x + 2x XAUI 8 - (low profile) or 6x + 2x XAUI IO box YES YES YES Power Supply 2 - 750W AC /DC 2 - 1100W AC /DC 4 - 1120W AC (N+1)
  • 24. Sun Proprietary/Confidential: Internal Use Only 24 Memory T5120 T5220 T5140 T5240 T5440 T6320 T6340 CPU 4x1.2, 8x1.2, 8x1.4,8x1.6GHz 4x1.2, 8x1.2, 8x1.4,8x1.6GHz 8x1.2, 12x1.2, 16x1.4GHz 8x1.2, 12x1.2, 16x1.4,16x1.6GHz 1.2,1.4,1.6GHz 4 GB FB-DIMMs at 800 Mhz for 1.6GHz 4x1.2, 8x1.2, 8x1.4,8x1.6GHz 8x1.2, 12x1.2, 16x1.4GHz 系统配置
  • 26. Sun Proprietary/Confidential: Internal Use Only 26 SPARC服务器产品的特点 • M系列 > Mainframe级别可靠性和容错性 > 配置灵活,适于垂直扩展,很强的投资保护 > 单线程处理能力强 • T系列 > 部件较少,高可靠性 > 多线程并发处理能力强,是数据库,交易型及 Web应用的理想产品 > 更加节能环保
  • 27. 27 Sun Proprietary & Confidential: Signed CDA Required Web 不同负载应用场合的比较 Network Intensive Storage Intensive Highly Threaded Single Threaded Application M-Series Tx000, T5x20 x64 T5x40 Data
  • 28. Q&A
  • 29. Sun Proprietary/Confidential: Internal Use Only 29 竞争定位 Sun IBM HP T5x20 P6 520 rx6600 rx3600 T5x40 P6 550,P560Q rx7640 ,rx6600 T5440 P6 560Q,P570 Rx8640,Superdome

Notas do Editor

  1. This is Sun's official corporate overview last updated on January 25, 2007. This presentation is aimed at both existing and new customers who might want to hear a broad overview of Sun. It is contained in five sections in two files .. Sun Executive Overview - Introduction. Sun Executive Overview - Products, Innovations, Good News, Customers For detailed statistics use the 'Executive Essentials' document as a source document. You will need to adapt this material for each customer situation. Prepare for your presentation by understanding the following things from the customer or sales rep on the account: Current status of the account. What the customer wants to achieve from the presentation What the sales rep wants you to achieve from the presentation What is your role, what can you help to do – for customer or rep? Speak with energy, authority and ensure that you connect with the customer. Make your presentation highly interactive. Check in before you start and keep checking in with the customer that they are getting what they need from you and from Sun. START Thank you for your time today. I know that some of you in the room may not have look at Sun for a while, while others have been doing business with us for some time. We have found over the past year that even those that have a history with us are unaware of some of significant changes that have recently taken place. This overview today will update you on what has changed at Sun and how Sun today has emerged as the most innovative IT infrastructure supplier in the industry.
  2. But we are not the only chip designer who has begun to work on these problems, merely the ones in the lead. Two of the other big chip manufacturers, Intel and AMD, have already shipped or announced to ship quad-core processors at the expense of high clock rates and absurdly large caches. Start-ups such as Azul and Tilera have designed for massive numbers of cores as a matter of course. Intel has announced that it's working on an 80-core chip to be delivered by 2011. In short, almost everyone gets the idea that masiv multi-core and multi-threaded architectures are the key to performance going forward.
  3. Application acceleration for 2007 and into the future: First FF & DC systems deliver increased performance First 18 months: system performance doubles... acceleration is economical (change CPU module) and convenient (field upgradeable). Higher single system performance benefits very large workloads and creates possibility for greater application consolidation Faster I/O and increased I/O connectivity Increased RAS by design- introducing key new features Safe application portability – retain infrastructure investments SPARC/Solaris 10 binary compatibility – Application Guarantee Same system mgmt software, connect to same Sun storage Remote connection/management via Sun Connection
  4. The midrange systems will support at least two processor generations, Olympus and Jupiter We expect these systems to be upgradeable For customers requiring more than the 5/10 on board IO slots, there is an option to add external IO expansion modules(2 IOU).
  5. The midrange systems will support at least two processor generations, Olympus and Jupiter We expect these systems to be upgradeable For customers requiring more than the 5/10 on board IO slots, there is an option to add external IO expansion modules.
  6. The midrange systems will support at least two processor generations, Olympus and Jupiter We expect these systems to be upgradeable For customers requiring more than the 5/10 on board IO slots, there is an option to add external IO expansion modules(2 IOU).
  7. The midrange systems will support at least two processor generations, Olympus and Jupiter We expect these systems to be upgradeable For customers requiring more than the 5/10 on board IO slots, there is an option to add external IO expansion modules(4 IOU).
  8. In Summary, the Datacenter servers were designed with the highest reliability and availability in mind, with high redundancy, serviceability and lots of health checks. They will have fast CMT processors with lots of memory and the latest industry standard I/O. As has been Suns philosophy in the past, the servers will be modular with shared common components for your investment protection and will have expandable I/O. The domaining will be highly flexible with hard partitions, soft partitions, and application containers resulting in an industry leading virtualization strategy.
  9. In Summary, the Datacenter servers were designed with the highest reliability and availability in mind, with high redundancy, serviceability and lots of health checks. They will have fast CMT processors with lots of memory and the latest industry standard I/O. As has been Suns philosophy in the past, the servers will be modular with shared common components for your investment protection and will have expandable I/O(8 IOU). The domain will be highly flexible with hard partitions, soft partitions, and application containers resulting in an industry leading virtualization strategy.
  10. In Summary, the Datacenter servers were designed with the highest reliability and availability in mind, with high redundancy, serviceability and lots of health checks. They will have fast CMT processors with lots of memory and the latest industry standard I/O. As has been Suns philosophy in the past, the servers will be modular with shared common components for your investment protection and will have expandable I/O (16 IOU) . The domain will be highly flexible with hard partitions, soft partitions, and application containers resulting in an industry leading virtualization strategy.
  11. Looking then at the number of threads the application requires and where the application workload gets its data either directly from disk storage or over the network, Sun found that these workloads could be grouped into four basic workload categories: Data Centric Workloads – This is all about managing, analyzing and transforming data (such as for Data Warehousing, Data Mining, and OLTP). These are highly threaded applications that access data from storage. Application Centric Workloads – This is about enterprise applications, managing multiple threads (such as for ERP, CRM, SCM). There are typically highly threaded applications that access data from both the network and disk storage, such as Java 2 Enterprise Edition application servers. Web Centric Workloads – This is about managing data that comes off the network. These are highly threaded applications that get most of their data from the network (such as IP pro­cessing, Web serving, Caching). Compute Centric Workloads – This is about primarily single threaded applications, running one thread extremely fast (such as for HPTC, Grid, Financial Risk and Portfolio Analysis), where the data is taken mainly from the network but could also come from disk storage. We also recognize that there is a high-performance computing (HPC) workload category, but these typically have very similar system requirements to the compute-centric workloads. Let's take a look at the workload attributes and system requirements for these four workload categories.