2. INTRODUCTION
• The USB 3.0 Promoter Group announced on
November 17, 2008, version 3.0 and
submitted to USB-IF
• The first certified USB 3.0 consumer products
were announced January 5, 2010
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3. UNIVERSAL SERIAL BUS
• Designed to allow many peripherals to be
connected using a single standardized
interface socket.
• Consists of a host, USB ports, and peripheral
devices connected in a tiered-star topology
• Also called as Superspeed
• Provides power to low power consuming
devices
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4. Pre-releases
1 USB-IF formed
1 USB 1.0 specification 12 Mbit/s
1 USB 2.0 specification 480 Mbit/s
1 USB 3.0 specification 5 Gbit/s
2010 USB 3.0 devices in market
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5. Architectural components
Hub
Provides electrical interface between
devices and host.
Functionalities
Types
Host
Types
Functionalities
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6. DUAL BUS ARCHITECTURE
• USB 3.0 is a
physical
SuperSpeed
bus combined
in parallel with
a physical USB
2.0 bus
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7. SUPER SPEED CONNECTION
Device notifies it is connected
Host makes request
Device ready notifies this with ERDY
Else tells host unavailable to process by sending
NRDY
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9. CABLE STRUCTURE
• One power pair
• One twisted signal pair for USB 2.0 data path
• Two twisted signal pairs for the SuperSpeed
data path.
• Supports full duplex mode
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11. FEATURES
• Transfer Rate
• Backward compatibility
• Power specifications
• Cable length
• Transfer mode
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12. USB 3.0 vs USB2.0
USB 3.0 USB 2.0
•Super speed High speed
•900 mA power 500 mA
•Full duplex Half duplex
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13. ADVANTAGES
• Super speed
• Power efficiency
• Efficient when compared to its competitors
• Backward compatibility
DRAWBACKS
• Cable length is limited to 3m.
• Intel at present not supporting
13
14. CONCLUSION
• USB 3.0 wil also be popular like earlier
versions.
• As it is backward compatible it will be used in
the new computers and devices
• High speed communication protocol.
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USB-IF,managing body of usb specification The USB 3.0 Promoter Group announced on November 17, 2008, that version 3.0 of the specification had been completed and was transitioned to the USB Implementers Forum (USB-IF), the managing body of USB specifications. [57] This move effectively opened the specification to hardware developers for implementation in future products. The first certified USB 3.0 consumer products w at the Las Vegas Consumer Electronics Show (CES), including two motherboards by ASUS and Gigabyte Technology. [
Additional USB hubs may be included in the tiers
USB MILESTONES 2009 NEC ships world's first USB 3.0 host silicon SuperSpeed USB logo debuted Linux begins native USB 3.0 support 2008 USB 3.0 specs released 2005 Wireless USB 1.0 specs released 2002 Windows XP SP1 supports USB 2.0 natively 2001 USB OTG specification released. 2000 USB 2.0 specs released USB started to gain reputation as a mainstream bus technology 1998 Apple shipped iMac with USB ports only USB 1.1 specification released 1997 USB-IF membership increased to over 400 companies Over 500 USB products were in development worldwide 1996 USB 1.0 specs released First USB product introduced. First USB Plugfest compliance workshop held. 1995 USB Implementers Forum (USB-IF) formed with an initial membership of 340 companies 2001 usb otg, 2005 wireless usb1.0, 480 Mbit/s (now called "Hi-Speed" ). achieve 3.2 Gbit/s (0.4 GByte/s or 400 MByte/s)superspeed 2009 Linux began USB 3 support
Simultaneously 2 cannot be connected….,provides backward compatibility
