Lattice has introduced its CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays. Systems with embedded cameras and displays often do not have the right type or number of interfaces, which can be resolved using a bridge. The new CrossLink device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP to create a new product class called programmable ASSP (pASSP™).
2. Lattice
Semiconductor[2]
Lattice Semiconductor
Company at a Glance
HQ:
Headquarters
DC:
Development Ctr.
OC:
Operations Ctr.
GLOBAL PRESENCE
Enabling processing and connectivity applications where time-to-
market, low power, and small size are critical.
CONSUMER INDUSTRIAL &
AUTOMOTIVE
COMMUNICATIONS
& COMPUTING
PROGRAMMABLE
LOGIC
VIDEO
CONNECTIVITY mmWave
MARKETS & PRODUCTS STRONG FINANCIALS
$406M
2015 Revenue
Consistent double-digit
revenue growth
2 BILLION +
Devices sold by
Lattice in the last 10
years
NASDAQ:
LSCC
IPO 1989
Founded
1983
2015
Acquired Silicon Image
for ~$600M
HISTORY OF INNOVATION
1992
ispCPLD
2003
HDMI
2004
SiBEAM 2006
Lattice
ECP2M
2011
Acquired
SiliconBlue for
~$62M
iCE65
6. Lattice
Semiconductor[6]
Lattice Solves Internal Device Connectivity Issues
The ONLY Completely Customizable Video Bridge For Mobility
MOBILE
PROCESSOR
MCU
APPLICATION
PROCESSOR
SPI
D-PHY
D-PHY
DUAL
D-PHY
DISPLAY
DISPLAY
DSLR
PROCESSOR
Camera aggregator bridge Display aggregator bridge
Display interface bridgeCamera interface bridge
D-PHY
D-PHY
D-PHY
D-PHY
Sub-LVDSIMAGE
SENSOR
RightEyeLeftEye
7. Lattice
Semiconductor[7]
CrossLink Device’s Features
First programmable ASSP (pASSP) interface IC bridge supporting leading
protocols for mobile image sensors and displays
World’s fastest MIPI D-PHY bridging IC delivering up to 4K UHD resolution
at 12 Gbps bandwidth
Supports popular mobile, camera, display and legacy interfaces
Industry’s smallest package size with a 6 mm2 option
Lowest power programmable bridging solution in active mode
Built-in sleep mode
Combines the flexibility and fast time to market of an FPGA with the power
and functional optimization of an ASSP to create a new product class called
programmable ASSP (pASSP)
8. Lattice
Semiconductor[8]
Fastest Time to Market
ASSP Benefits with FPGA Programmability
Quicker Time to Market
Develop and make design corrections in real time
Create new use cases as they develop
Same Low Power
Optimized RTL for the use case
Same Behavior
One-time programmable NVCM technology
Smaller Form Factor
WLCS and flip chip packages
Same Low Cost
Number of pins dictates product cost, not FPGA logic vs. gates
1X
9. Lattice
Semiconductor[9]
Highest Level of Flexibility
Programmability Increases Interface and Design Options
Display Interface Protocols
MIPI DSI to MIPI DSI
MIPI DSI to Dual DSI
Dual MIPI DSI to Dual MIPI DSI
MIPI DSI to OpenLDI/LVDS
MIPI DSI to MIPI DPI
Single OpenLDI/LVDS to MIPI DSI
MIPI DPI to MIPI DSI
IPs available NOW
Camera Interface Protocols
Dual MIPI CSI-2 to MIPI CSI-2
MIPI CSI-2 to Parallel CMOS
Parallel CMOS to MIPI CSI-2
SubLVDS to MIPI CSI-2
11. Lattice
Semiconductor[11]
Smallest Form Factor
2x – 3x Smaller Footprint Than the Competition – As Small as 6 mm2
36 WLCSP 64 ucfBGA 81 csfBGA 80 ctfBGA
0.4 mm pitch 0.4 mm pitch 0.5 mm pitch 0.65 mm pitch
2.46 x 2.46 mm 3.5 x 3.5 mm 4.5 x 4.5 mm 6.5 x 6.5 mm
36 WLCSP 80 ctfBGA
12. Lattice
Semiconductor[12]
Lowest Power
100 mW Active. 25 – 50% Lower Power Than the Competition
CrossLink Competitor 2 Competitor 3
0
50
100
150
200
250
Power(mW)
Competitor 1
Competitor 2
Competitor 3
CrossLink
Bridging Functions
Competitor 1
14. Lattice
Semiconductor[14]
Multi CSI-2 Bridge For Camera
Image
Processor
D-PHYx4RX
1.2Gbps/lane
D-PHYx4RX
1.2Gbps/lane
D-PHYTXx4
@1.5Gbps
Cntrl
GEARING
Mux/Merge
RST
Config
SPI/I2C
image sensor
LineBuffer
GEARINGLOGIC
GEARING
LineBuffer
Trigger Image
Sensor
Control
Trigger Image
Sensor
Controlimage sensor
I2C Slave
to Multi-
Master
I2C
OSC
CrossLink
CSI-2
Solves Multi Image Sensor Latency Issues
CSI-2
CSI-2
15. Lattice
Semiconductor[15]
1:2 Dual MIPI DSI Bridge for Display
Left Eye Right Eye
D-PHYTX
1.5Gbps/lane
D-PHYTX
1.5Gbps/lane
RXx4D-PHY(soft)on
1.2GbpsPdiffIOphysical
RST
Config SPI/I2CREFCLK(Optional)PLL
1:16GEARING
Application
Processor
Power
Management
Split Function
CrossLink
Solves AP Port Limitations
DSI
DSI
DSI
16. Lattice
Semiconductor[16]
DSI
RGB to MIPI DSI Display Bridge
X4D-PHYTX
@1.5Gbps/lane
Pixeltobyte
PLL
De-packetize
TXcontroller
CMOS to D-PHY
LP_D0
D_0
D_1
D_2
D_3
LP_CLK
V_Sync
H_Sync
Pixel_Clk
Pixel_Data
Application Processor Display
Solves AP and Display Interface Mismatches
CrossLink
17. Lattice
Semiconductor[17]
Target Markets & Applications
Any End Product Using Image Sensors or Displays
DSC / DSLRWearables
Smartphones
Tablets
Mobile
Drones
Traditional
Machine
Vision
Surveillance
Medical
Handheld
Equipment
EBOOK
18. Lattice
Semiconductor[18]
Most Flexible - Supports popular mobile, camera, display and legacy
interfaces
Smallest package size – 6 mm2 option
Lowest power programmable bridging solution in active mode
Built-in sleep mode
Ideal for virtual reality headsets, drones, smartphones, tablets, DSLR
cameras, and wearable devices
Takes the strongest features from ASSPs and FPGAs to deliver the best
solution of both worlds
CrossLink evaluation boards are available now from Lattice and its
distributors and production devices will be available shortly
CrossLink Device
World’s Fastest MIPI D-PHY Bridging IC
19. Lattice
Semiconductor[19]
As communications become more mobile, and
more of the world’s “things” talk with each other in
increasingly complex ways, we will be the
undisputed global leader for
Smart Connectivity Solutions
For more information visit: http://www.latticesemi.com/CrossLink
Notas do Editor
2004 – SiBEAM founded
HQ: Portland, OR
DC:
- Hillsboro, OR
San Jose, CA
Shanghai, China
Manila, Philippines
Hyderabad, India
OC:
Manila, Philippines
Singapore