Personal Information
Cargo
Founding Architect
Setor
Electronics / Computer Hardware
Site
www.cielution.com
Sobre
Cielution products and services are intended to meet the needs of the electronics industry in technology development, product design and process engineering. We accomplish this using our core competency in the areas of mechanical, thermal and fluid flow simulation.
Specialties
Electronics Reliability, Thermal and Mechanical Simulation, Chip-Package Interaction (CPI), IC Packaging and Assembly, Electronics Cooling, FEA Simulation Services, CFD Simulation Services, 3D Stacking, TSV Reliability, Compact Modeling
Marcadores
fea
electronics cooling
tsv
warpage
thermal management
ctm
chip stacking
compact thermal model
cfd
cielution llc
chip package co-design
assembly
package assembly
through silicon via
3d ics
die stacking
thermo-mechanical modeling
chip cooling
cielspot
cielution
power-thermal co-design
thermally aware ic design
ic packaging
printed circuit board
pcb
thermal modeling
electronics thermal management
fan cooling
avionics cooling
telecom thermal management
telecom cooling
wind tunnel testing
telecom
electronics reliability
heat sink selection
prototype testing
flow bench
fan selection
thermal interface material
tim ii
tim selection
enclosure thermal management
cielmech
thermal co-design
fan sizing
blowers
stress
3d ic assembly
electronics packaging
3d ic
simulation
thermo mechanical
3d tsv
fan laws
altitude correction
heterogenous packaging
3d tsv stacking
cte mismatch
through silicon stack
ansys
tss
power-thermal optimization
thermally aware design
thermo-mechanical reliability
chip package interaction
dynamic thermal response
cpi
interconnect reliability
medical device design
temperature
contract manufacturing services
heat transfer
heat sink
sheetmetal enclosure
radiation heat transfer
finned housing
cast housing
clamshell enclosure
natural convection cooling
modal
random vinration
explicit
avionics reliability
shock
drop
srs
board level reliability
vibration modeling
board level thermal management
active cooling
graphics card
pci slot
transient
dynamic ctm
ic thermal profile
chip level hot spot
power map
elelctronics cooling
icepak
high altitude
heat sinks
racks
servers
flotherm
fluid flow
air flow
fan curve
numerical simulation
engineering
stress modeling
more than moore.
ectc
tharmal
thermally aware ic design
compact model
semiconductor packaging
finite element analysis
finite element modeling
package stress
fem
ic stacking
wafer warpage
tsv stress
hot spot
www.cielution.com
3d stacking
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