1. Electronic Component
Management Plans (ECMP) and
obsolescence management
Prepared by Mrs. Jo Vann
TC107 MT1 convener for ECMP
August 2015

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2
The Avionics Supply Chain
1. Parts &
Materials
Suppliers
2. Board
Assemblers
3. Avionics
OEMs,
Logistics,
Maintenance
and Repair
4. Platform
Integrators
5. Operators
& Regulators
Parts
Boards
Contract Mfg.
Suppliers CustomersSolder etc.
Suppliers
Customers
15 - 40 yr
Lifecycle
3 - 6 yr
Lifecycle
Suppliers managed per
ECMP and Anti-counterfeit
Most life cycle
costs are incurred here
and managed by ECMP
Global Supply Chain
Avoiding counterfeit components
Requirements
flow-down vs.
products flow-up
process is
disrupted here
Aerospace
Captive
To build products that must
meet mil-aero requirements
(what we must control)
Using COTS components
targeted for other markets
(what we cannot control)
Aerospace Electronics
• Depends on
materials and
components
developed for other
industries
• Vastly different
lifecycle applications

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How does obsolescence drive the counterfeit problem?
• In 2010/2011 the USA DoD identified upwards of a million counterfeit components
in their Military supply chain.
 This resulted in the 2012 NDAA section 818 anti-counterfeit clause which was
published May 2014 as DFAR 252.247.7007
• Researcher IHS analysed electronics industry data in 2013 concerning counterfeit
parts that were reported from 2001 until early 2012:
 More than 12 million counterfeit parts have been reported over the last five
years to 2013
 57% of counterfeit part reports involved obsolete or end of
life parts.
 Nearly 37% of counterfeit parts involve components still being produced by
manufacturers.
 A single incident of a counterfeit part can cause up to 64 weeks of production line
downtime and cost up to $2.1 million to resolve.
 Counterfeit parts are mostly sold on the open market.

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Obsolescence management process
• Avionics producers must ensure continued supply of components for
maintenance cycles of 20+ years
• Microcircuits are the most dynamic components often with production
lifecycles of 5 years or less
• Avionics producers need a reactive and pro-active component
obsolescence management process which allows:
 Reactive solutions:
o Last Time Buys and One Time Buys etc.
 Pro-active solutions:
o The periodic review of component obsolescence predictions
through the use of third party tools, sourcing intelligence, review of
manufacturer product change notices (PCNs) and Last Time Buys
etc. in order to substitute ‘form fit and function active’ alternatives
o Obsolescence risk assessment of the product to plan redesigns or
product upgrades as considered necessary in a timely manner to
meet the needs of the business and customer
• An ECMP manages all of the above

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ECMP specifications:
The recommended ECMP processes for the Avionics industry ( can be
adapted or used by any industry) are:
 IEC/TS 62239-1 (International standard which is Third Party
auditable using an IECQ CB)
 EIASTD4899 published by the SAE in 2015 (preferred by one
US company which allows IEC/TS 62239-1 plans)
These two standards are very similar and interchangeable
There are also new ECMP processes for COTS assemblies:
 EIA933 published by the SAE in 2015 (preferred by one US
company)
 IEC/TS 62239-2 ( for international use and in draft which will be
Third Party auditable using an IECQ CB)
IEC/TS 62239-2 will allow the use of EIA933 plans and are very
similar.
All refer to: IEC/TS62402 and/or TechAmerica STD0016
obsolescence management standards

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IEC/TS 62239-1 Electronic Component
Management Plan
• Based on the concept of ‘manage the component application
process’ rather than customise or screen components for the
Avionics applications
• Allows the use of Mil specified components where considered
necessary
• Main advantage is that it provides the process to maximise the
use of reliable COTS components
• Assists Avionics OEMs in using small quantities of COTS
components
• Is essentially a ‘eleven step’ horizontal Process Management
Plan which can be integrated with the OEM’s AS9100 processes,
including lead-free management, anti-counterfeit management,
obsolescence management and flow-down to suppliers.
• Facilitates the substitution of alternatives

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IEC/TS62239-1, 11 step OEM ‘systems level’
ECMPThis is a cross functional process linked to a company’s AS9100 procedures:
1. Component Manufacturer approval i.e. ISO9001, AS9100, TS16949, S/0001
including COTS assemblers and subcontractors ( jointly with Supplier
quality)
2. Component selection i.e. use of PPL, approved manufacturers, minimise
uprated components (jointly with hardware design)
3. Component application i.e. derating, thermal management, vibration
environmental requirements, SEU mitigation, semiconductor wear-out
mitigation etc. for each application
4. Component qualification i.e. component testing or analysis of data for each
application
5. Component quality assurance every lot ordered i.e. outgoing ppm rate,
product ESS testing
6. Component dependability (reliability) , which includes obsolescence
management, reliability predictions etc.
7. Component compatibility with the equipment manufacturing process, e.g.
reworking lead-free BGAs, refinishing component terminations
8. Component data and Component configuration control, including PCN
monitoring
9. Anti-counterfeit management e.g. special testing of untraceable components
and audits of suppliers
10. Lead-free management, e.g. capture termination finishes and rework as
required
11. Subcontractor and COTS assembler ECMP approval and management (jointly
with Supplier Quality)
Colour key: could be managed by component engineering, Managed by other

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IEC/TS 62239-1 Electronic Component Management Plan
IEC/TS 62239-2 (
allows the use of SAE
EIA-933) for COTS
Assemblies

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Evidence that the ECMP process enables and mitigates the
number of LTBs a business makes
Manufacturer Product Change Notices (PCNs) are monitored as part of
the ECMP process over 12 months from one franchised broad-line
distributor representing 28 manufacturers:
 220 PCNs were analysed
 Of which 25 were EOL i.e. 11.36% of PCNs were LTBs

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PCN analysis
• This resulted in 25 LTBS being found impacting our
business from one broad-line franchised distributor
requiring analysis
• Using the IEC/TS 62239-1 ECMP process we were able
to find and approve alternatives for 40% of these LTBs
and only 5 LTBS were actioned e.g.
 Manufacturer Recommended alternatives were
approved
 Lead-free alternatives were approved
 Second sources were approved
 New suppliers alternatives were approved.

11. 11
11
IEC publications
THIRD PARTY AUDITED
on annual basis
ECMP
IEC/TS 62239-1
owned by IEC TC107
equivalent to SAE EIA-4899
IEC/TS62647-XX
series
(adopting GEIA-STD-
0005 series
(Lead-free)
IEC/TS 62668-X
Counterfeit avoidance
which
allows use of
SAE AS5553
IEC 62396-X
series
(SEU Radiation)
IEC/TS 62402
(Obsolescence
owned by TC56 )
Embedded Requirements:
•Life-limited
semiconductors, etc.
IEC/TR 62240
(Uprating)
IEC/TS 62564-1
(AQEC) for
Enhanced Plastic
components
IEC/PAS 62435
(Long term
Storage owned
by TC47 WG3 )
IEC 62340-5
(ESD)
IEC/TS 62500
(Highly
accelerated
tests)
IEC/TS 62668-1
(adopts
STACK S/0001)
IEC/TS 62239-2
Allows the use of
SAE EIA 933
For
COTS
assemblies

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International anti-counterfeit standards
SA
E
IEC
IEC/TC
107
WG3
G-14
AAQS
C
IEC/TS6
2668-2
G19A
IEC/TS6
2668-1
G19A
D G19C
AS6171
Test
Methods
AS6496
Franchise
d
distributor
AS6301
,AS646
2
audit
checklist
s
G19CI
AS5553
electronic
component
s
G21
AS617
4
materiels
AS9100
Rev D for
publicatio
n 2016/17

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IEC/TS 62239-1 Electronic Component Management Plan
Third Party audit schemes
Third Party audit schemes which support IEC/TS 62239-1:
1. IECQ
o Is the auditing side of the IEC , see http://www.iecq.org/
o Establishes auditor training schemes, audit rules of procedure and maintain
copies of the audit certificates, see http://certificates.iecq.org/
o Can establish audit schemes for IEC specifications and other specifications
from other standards bodies providing there is no competing IEC
specification
o IECQ audits all National Certifying Bodies auditors ( BSI, ECCB, CEPREI,
DNV, UTE etc.) to ensure consistency of auditing.
o IECQ have training schemes for Certifying Bodies to audit:
o AS9100 and AS9110
o IEC/TS 62239-1 ECMP
o SAE AS5553
o IEC/TS 62668-1 ( to be established in 2016 )
o Planning general industry traceability audit scheme for 2016.
o Planning an IEC/TS 62239-2 COTS assembly audit scheme for
2016/2017

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IEC/TS 62239-1 Electronic
Component Management
For further information contact:
• Jo Vann, jo.vann@ge.com, TC107 convenor of:
 MT1 IEC/TS 62239-1 ECMP and IEC/TS 62239-2 COTS Assemblies
 WG2 Aerospace Qualified Electronic Components
 WG3 Anti-counterfeit
 WG4 atmospheric radiation SEE effects.
• Jo Vann, GEL/107 convenor , UK mirror
committee to TC107