Personal Information
Organização/Local de trabalho
Austria area Austria
Cargo
VP Advanced Technology Development @ Besi Austria, Technology Angel & Catalyst for Innovation
Setor
Manufacturing
Sobre
Passionate about cutting edge technology and making the impossible possible! Since begin of the millennium working in equipment business for emerging semiconductor packaging technologies, responsible for R&D and product management while carrying business ownership for flip-chip bonders, RFID assembly lines, thermo compression bonders, and wafer level fan-out bonders.
The world's biggest install base of flip chip bonders - the famous Datacon 8800 flip chip platform (ba-ba-lin-lin), soon reaching a number of 1000 installations, has been grown in a marvelous team work of great colleagues and employees under my leadership.
Now focusing on technology scouting and networking in order to suppo...
Apresentações
(2)Documentos
(3)Personal Information
Organização/Local de trabalho
Austria area Austria
Cargo
VP Advanced Technology Development @ Besi Austria, Technology Angel & Catalyst for Innovation
Setor
Manufacturing
Sobre
Passionate about cutting edge technology and making the impossible possible! Since begin of the millennium working in equipment business for emerging semiconductor packaging technologies, responsible for R&D and product management while carrying business ownership for flip-chip bonders, RFID assembly lines, thermo compression bonders, and wafer level fan-out bonders.
The world's biggest install base of flip chip bonders - the famous Datacon 8800 flip chip platform (ba-ba-lin-lin), soon reaching a number of 1000 installations, has been grown in a marvelous team work of great colleagues and employees under my leadership.
Now focusing on technology scouting and networking in order to suppo...