Presentation-Kinwong Electronic Mar'2016-1

http://www.kinwong.com
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Mar. 2016

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• To become the Most Reliable PCB
Manufacturer in the world
• Net Sales 2015 USD 451M
• More than 20 years Experience
• Financially solid and profitable
• 6 Facilities in 3 Manufacturing Sites
• 3 product lines:
PCB, Flexible-PCB, Metal-PCB
• Technical Test Center
• Headquarter: Shenzhen, China
• ~6500 employees
ProfileProfile
Manufacturing PlantManufacturing Plant
SZ ShenzhenSZ Shenzhen
LC LongchuanLC Longchuan
JX JiangxiJX Jiangxi
OfficeOffice
HK HongkongHK Hongkong
KS KunshanKS Kunshan
FZ FuzhouFZ Fuzhou
TW TaiwanTW Taiwan
EU Germany-MunichEU Germany-Munich
Hungary-PHungary-Pécsécs
NA US-ChicagoNA US-Chicago
HeadquarterHeadquarter
EU MunichEU Munich
NA ChicagoNA Chicago
PécsPécs

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1993
Kinwong Electronic
Establish
2003
Move to Baoan
Xixiang New Factory
2005
Kinwong Shenzhen
-Flexible-PCB
2008
Kinwong Longchuan
-Rigid-PCB
2010
Kinwong Longchuan
-Metal-PCB
2012
Kinwong Longchuan
-Flexible-PCB
2014
Kinwong Jiangxi
-Rigid-PCB
MilestoneMilestone

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Organization chartOrganization chart

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Sales RevenueSales Revenue
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Sales Segment 2015Sales Segment 2015
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214M
PCB Segment by RegionPCB Segment by Region

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PCB Sales Application SegmentPCB Sales Application Segment
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Layer Count Segment 2015Layer Count Segment 2015

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PCB Product LinePCB Product Line FPC Product LineFPC Product Line Metal PCB Product LineMetal PCB Product Line
Facility OrganizationFacility Organization

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PCB divisionPCB division FPC divisionFPC division Headquarter OfficeHeadquarter Office
Shenzhen Kinwong Electronic Co. LtdShenzhen Kinwong Electronic Co. Ltd
Kinwong ShenzhenKinwong Shenzhen

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PCB divisionPCB division FPC divisionFPC division M-PCB divisionM-PCB division
Kinwong Electronic Technology (Long Chuan) Co. LtdKinwong Electronic Technology (Long Chuan) Co. Ltd
Kinwong LongchuanKinwong Longchuan

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Kinwong JiangxiKinwong Jiangxi
EntranceEntranceLobbyLobbyExhibition HallExhibition Hall
Jiangxi Kinwong Precise Circuit Co., LtdJiangxi Kinwong Precise Circuit Co., Ltd

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Shenzhen PCB Division Longchuan PCB Division Jiangxi PCB Division
In 1993 Founded & moved to BaoAn inIn 1993 Founded & moved to BaoAn in
20032003 　　
In 2006 Founded and start production inIn 2006 Founded and start production in
Jan. 2008Jan. 2008
In 2012 Founded and start production inIn 2012 Founded and start production in
Feb. 2014Feb. 2014
Plant area: 42,000 m²²
Asset value: USD66MAsset value: USD66M
Employees: ~1100
Monthly Output:600,000ft²Monthly Output:600,000ft²
Employees: ~1200
Monthly Output:1,000,000ft²Monthly Output:1,000,000ft²
Employees: ~1000
Monthly Output:1,200,000ft²Monthly Output:1,200,000ft²
Capability:Capability:
2-24L, 3/3Mil, Heavy Copper 6OZ,2-24L, 3/3Mil, Heavy Copper 6OZ,
Rigid+Flexible, HDI, Gold Finger, EpoxyRigid+Flexible, HDI, Gold Finger, Epoxy
Plugging, High speed, High Frequence,Plugging, High speed, High Frequence,
Advanced MaterialAdvanced Material
2-18L, 3/4Mil, Heavy Copper 6OZ, Semi-2-18L, 3/4Mil, Heavy Copper 6OZ, Semi-
flex, Al+Flexible,flex, Al+Flexible,
2-14L, 3/3Mil, 0.2mm Min hole2-14L, 3/3Mil, 0.2mm Min hole ,Thin,Thin
thickness board(0.2mm),thickness board(0.2mm),
Products:Products:
AutomotiveAutomotive,, Industrial,Industrial, Power modulePower module
MedicalMedical
Products:Products:
Networking, Power moduleNetworking, Power module,,
Automotive, Industrial,Automotive, Industrial,
Products:Products:
AutomotiveAutomotive ,Networking,,Networking, Consumer, PCConsumer, PC
Related ProductRelated Product
Batch:Batch:
QTA, low to Middle volumeQTA, low to Middle volume
Batch:Batch:
Middle volume to High volumeMiddle volume to High volume
Batch:Batch:
High volumeHigh volume
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PCB Product LinePCB Product Line

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Shenzhen FPC Division Longchuan FPC Division
In 2005 Founded & Start production in ShenzhenIn 2005 Founded & Start production in Shenzhen
baoanbaoan 　　
In 2012 and start production in Apr.In 2012 and start production in Apr.
Employees: ~900
FPCA Monthly Output: 10KKFPCA Monthly Output: 10KK
Employees: ~1100
FPCA Monthly Output: 40KKFPCA Monthly Output: 40KK
1-8L, 0.02/0.05mm, Impedance +/_10% ,Coverlay1-8L, 0.02/0.05mm, Impedance +/_10% ,Coverlay
registration tolerance +/-0.1mm, Solder maskregistration tolerance +/-0.1mm, Solder mask
registration tolerance +/_0.05mm, SMT wholeregistration tolerance +/_0.05mm, SMT whole
processprocess
2-8L, 0.02/0.05mm, Impedance +/_10% ,Coverlay2-8L, 0.02/0.05mm, Impedance +/_10% ,Coverlay
registration tolerance +/-0.1mm, Solder maskregistration tolerance +/-0.1mm, Solder mask
registration tolerance +/_0.05mm, Outline dimensionregistration tolerance +/_0.05mm, Outline dimension
tolerance +/_0.05mm, SMT whole processtolerance +/_0.05mm, SMT whole process
Production:Production:
Display Module, Touch Panel , Automotive, SmartDisplay Module, Touch Panel , Automotive, Smart
PhonePhone
Production:Production:
Automotive ,Display Module, Touch panel, Smart Phone
Batch:Batch:
QTA, low to Middle volume,QTA, low to Middle volume,
Batch:Batch:
Middle volume to High volumeMiddle volume to High volume
FPC Product LineFPC Product Line

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• Start production Mar.2010 with USD16M investment
• Monthly Capacity 400,000 sq ft
• ~550 employees
• Separate building with 200,000 sq. ft areas
• Base Material: Aluminum base, Copper base,
Stainless base
• Technical capability: 1-6 Layer, COB, Concave Cup,
Countersink/Screw Hole
• Surface finish: OSP, HASL, ENIG,ENEPIG, Silver
Plating
• Automotive, LED Lighting ， TV Light Bar, Power
MPCB Product lineMPCB Product line 金属基板生产线

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Item Year
2016 2017 2018
Max. Layer Count 20L 26L 32L
Min. Core Thickness excl.CU 0.075mm 0.075mm 0.05mm
Min. Finished Board Thickness 0.4mm 0.35mm 0.2mm
Max. Finished Board Thickness 5.0mm 5.5mm 6.0mm
Min. Inner Layer Trace Width/Spacing 0.076mm/0.076mm 0.06mm/0.06mm 0.05mm/0.05mm
Min. Outer Layer Trace Width/Spacing 0.076mm/0.076mm 0.076mm/0.076mm 0.06mm/0.06mm
Min. Mechanical Drilled Hole Size 0.2mm 0.2mm 0.15mm
Min. Laser Drilled Hole Size 0.125mm 0.1mm 0.075mm
Max. Mechanical Through Hole Aspect Ratio 10:01 12:01 16:01
Max. Laser Drilled Blind Hole Aspect Ratio 0.6:1 0.8:1 0.8:1
HDI Type 2+N+2 2+N+2 3+N+3
Soldermask Registration 0.038mm 0.035mm 0.035mm
Min. Soldermask Bridge 0.076mm 0.06mm 0.055mm
Min. BGA Pitch 0.5mm 0.5mm 0.45mm
Via In Pad Mass Production Mass Production Mass Production
Depth Control Blind Routing Accuracy ±0.15mm ±0.1mm ±0.05mm
Min. Single-ended Impedance Tolerance ±10% ±8% ±5%
Min. Differential Impedance Tolerance ±10% ±8% ±5%
Surface Finish HASL/ HASL Lead Free 、 Chemical Tin 、 Chemical Ag 、 ENIG + OSP 、 Gold finger
Base Material General Tg 、 Middle Tg 、 High Tg 、 Halogen Free 、 Low Dk 、 Low Loss 、 High CTI 、
PTFE
Advanced product
Buried/Embedded Coin R & D Mass Production Mass Production
Rigid-flex Mass Production Mass Production Mass Production
Rigid-flex + HDI Mass Production Mass Production Mass Production
Rigid-flex + Metal Base R & D Mass Production Mass Production
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Technical Roadmap PCBTechnical Roadmap PCB

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Item Year 2016 2017 2018
Min. Finished Board Thickness 0.05mm 0.05mm 0.04mm
Max. Finished Board Thickness 4.0mm 4.0mm 5.0mm
Min. Laser Drilled Hole Size φ0.05mm φ0.025mm φ0.025mm
Min. Mechanical Drilled Hole Size φ0.10mm φ0.10mm φ0.10mm
Max. Mechanical Drilled Hole Size φ6.3mm φ6.3mm φ6.3mm
Min. Trace Width/Spacing 0.04mm/0.04mm 0.035mm/0.035mm 0.035mm/0.035mm
Min. Annular Ring of Single/Double-sided Board 0.1mm 0.075mm 0.075mm
Min. Inner Layer Annular Ring of Multi-layer Board 0.15mm 0.125mm 0.125mm
Min.Coverlay Bridge 0.15mm 0.15mm 0.15mm
Min. Outer Layer Annular Ring of Multi-layer Board 0.15mm 0.125mm 0.125mm
Min. Soldermask Opening 0.3mm 0.3mm 0.25mm
Min. Single-ended Impedance Tolerance ±8% ±7% ±6%
Min. Differential Impedance Tolerance ±8% ±7% ±7%
Min. Coverlay Opening
φ0.4mm φ0.4mm φ0.4mm
0.5mm X 0.5mm 0.5mm X 0.5mm 0.5mm X 0.5mm
Coverlay Registration Manul Alignment ±0.1mm ±0.1mm ±0.1mm
　 General Fixture ±0.09mm ±0.09mm ±0.09mm
　 Precise Fixture ±0.075mm ±0.075mm ±0.075mm
　 CCD Alignment / ±0.05mm ±0.05mm
Max.Layer Count Flex Board 6L 8L 8L
　 Stratified Board 6L 6L 6L
　 Rigid-flex Board 6L 8L 8L
　 HDI 4L 4L 6L
Surface Finish Gold Plating, ENIG 、 OSP 、 ENIG + OSP, Gold Plating + OSP, Gold Plating + ENIG
Technical Roadmap FPCTechnical Roadmap FPC

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Item Year
2016 2017 2018
Max. Layer Count 4L 6L 8L
Min. Metal Base Thickness 0.5mm 0.4mm 0.3mm
Max. Metal Base Thickness 5.0mm 6.0mm 6.0mm
Min. Thermal Conductive Layer
Thickness
0.05mm 0.038mm 0.038mm
Min. Core Thickness 0.1mm 0.076mm 0.05mm
Min. Inner Layer Trace
Width/Spacing
0.1mm/0.076mm 0.076mm/0.076mm 0.076mm/0.076mm
Min. Outer Layer Trace
Width/Spacing
0.1mm/0.076mm 0.076mm/0.076mm 0.076mm/0.076mm
Min. Drilled Hole Size 0.55mm 0.55mm 0.30mm
Countersink Hole Depth Tolerance ±0.05mm ±0.05mm ±0.05mm
Voltage Test Value DC4000V DC 5000V DC 6000V
Breakdown Voltage 6KV AC 6KV AC 6KV AC
Max. Finished Copper Thickness 6 oz 10 oz 10 oz
Metal Base Type
AL Base 、 Copper Base 、 Stainless Steel Base 、 Iron Base 、 Ceramic
Base 、 Mg Base
Thermal Conductivity 1W/mk 、 2W/mk 、 3W/mk 、 5W/mk 、 8W/mk
Surface Finish
OSP 、 ENIG 、 Chemical Ag 、 Chemical Tin 、 Electro-plating
Ag 、 ENEPIG 、 HASL/ HASL Lead Free
Technical Roadmap MPCBTechnical Roadmap MPCB

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Key customersKey customers

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Value VendorValue Vendor

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Rank Company
Net Sales
(MUSD)
1 Nippon Mektron 2,530
2 Young Poong Group 2,253
3 Unimicron 2,148
4 SEMCO 2,117
5 Ibiden 1,865
6 Tripod 1,506
47 CCTC 302
48 Kinwong 301
49 DAP 300
50 KCE 300
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20142014
20132013
Sourcing: NT Information Ltd. yearly report
Global Industry RankingGlobal Industry Ranking
Rank Company
Net Sales
(MUSD)
2 ZDT 2,483
3 Unimicron 2,130
4 SEMCO 1,562
39 SI Flex 419
40 Kinwong 374
41 ASE 360
Rank Company
Net Sales
(MUSD)
2 ZDT 2,483
3 Unimicron 2,130
4 SEMCO 1,562
36 Unitech 455
37 Kinwong 451
38 Flexium 429
39 Founder 423
2015 Estimate2015 Estimate

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Quality PolicyQuality Policy
Continuous Improvement on products & services to build the best
products to most satisfy customers, strive for zero defect.
Quality AssuranceQuality Assurance

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SupplierSupplier
SQESQE
Quality ActivitiesQuality Activities
Production DepartmentProduction Department
QEQE IQCIQC IPQAIPQA LABLAB
22 SystemSystem
3 Activities3 Activities
22 SystemSystem
3 Activities3 Activities
APQP&CPAPQP&CP MSAMSA PPAPPPAP
OQCOQC
CustomerrequirementCustomerrequirement
CustomerSatisfyCustomerSatisfy
SPCSPCFMEAFMEA VDA6.3VDA6.3
Continuous Improvement Process
CustomerCustomer
CSCS
Quality ControlQuality Control Quality EngineeringQuality Engineering
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Industry CertificateIndustry Certificate
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AwardsAwards
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Environmental PolicyEnvironmental Policy
Environmental rule & law compliance,
reduce cost & waste, keep cleanness &
safety production, continuous
improvement on environmental
protection
Contribute to the environmental
protection and the sustainable
development of human society.
Environmental PolicyEnvironmental Policy

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 Close to perfect inventory management system
 Strictly implement FIFO on every PCBs
 Quick turn around in twice a day trucks to HK
 More than 20 years global export experiences
by forwarder & different couriers with account
open for years.
Global LogisticsGlobal Logistics

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Corporate Social ResponsibilityCorporate Social Responsibility
Community Donation Programme
Kinwong University
Football Match(Teambuilding exercise)
Incentive Travel Reward Programme
Kinwong has implemented a comprehensive
corporate social responsibility programme as a way
to offer support and encouragement to its staff
members as well as to give back to the society

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Dedication And High-quality ProductDedication And High-quality Product

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