Choosing the right PCB laminate is key to a quality product, You must consider application, assembly techniques, etc. But don't get caught by the "latest & greatest" fad. Make sensible decisions and save yourself money without compromising quality.
19. Lead Assembly
• Traditional Epoxy System (/21)
• I.e. Nan Ya NP-140
• I.e. TLM TLM-140
• Meets Customer Tg≥135˚C Requirement
• Low Cost Materials (~0.8x)
• Easy to Manufacture
20. 2L Lead-Free Assembly
• Modified Epoxy System (/101 /121)
• I.e. Nan Ya NP-140M - NOT NP-140!
• I.e. TLM TLM-140(mt)
• Pb-Free Compatible Materials
• Low Risk for Z-Axis CTE Failures
• Low-Medium Cost Materials (~0.9x)
• Easy to Manufacture
21. ≥4L Lead-Free Assembly
• Modified & Filled Epoxy System (/99 /126)
• I.e. Nan Ya NP-175F - NOT NP-170!
• I.e. TLM TLM-170(t)
• Pb-Free Compatible Materials
• Anti-CAF
• Low CTE Z-Axis Expansion
• Medium Cost Materials (~1.0x)
• Difficult to Manufacture
• Routed NOT Punched!
22. High Speed & RF
• Modified & Filled Epoxy Systems (/29 /129)
• I.e. Isola FR408HR
• I.e. Nelco N4000-SI
• I.e. Panasonic Megtron4
• Same as ≥4L Lead-Free Assembly, But Lower Dk/
Df c/o Specialty Fillers
• Higher Cost Materials (~1.8x)
• Difficult to Manufacture
• Other Important Considerations
23. Discussion
• HATS Testing
• Define Qualified Materials in PCB Specification
• Specify as IPC-4101 Slash Sheet
• More Engineering Consideration
• USA vs. Asia Materials
• Vendor Portability
• Customer Communication
• Cost vs. Quality