1. SNS SECURITIES SMALL & MIDCAP SEMINAR,
21 JUNE 2012
21 June 2012 1

2. SAFE HARBOR STATEMENT
This presentation contains statements about management's future expectations, plans and prospects of our business that
constitute forward-looking statements, which are found in various places throughout the press release, including, but not
limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of
purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use
of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,
“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking
statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitute forward
looking statements. While these forward looking statements represent our judgments and expectations concerning the
development of our business, a number of risks, uncertainties and other important factors could cause actual developments
and results to differ materially from those contained in forward looking statements, including our inability to maintain
continued demand for our products; the impact on our business of potential disruptions to European economies from Euro
zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders,
generally without charges; the volatility in the demand for semiconductors and our products and services; failure to
adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle,
incurring additional restructuring charges in the future, acts of terrorism and violence; risks, such as changes in trade
regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and
foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage
our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31,
2011 and other key factors that could adversely affect our businesses and financial performance contained in our filings and
reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such
obligation to) update or alter our forward-looking statements whether as a result of new information, future events or
otherwise.
21 June 2012 2

3. AGENDA
I. Company Overview
II. Market
III. Strategy
IV. Financial Review
V. Summary
21 June 2012 3

4. I. COMPANY OVERVIEW
21 June 2012 4

5. I. COMPANY OVERVIEW
• Leading assembly equipment supplier with #1 and #2
positions in key products. 27% addressable market share
• Broad portfolio: die attach, packaging, plating, wire bond
Corporate Profile • Strategic positioning in wafer level and substrate packaging
• Global manufacturing operations in 7 countries; 1,618
employees worldwide. HQ in Duiven, the Netherlands
• 2011 revenue and net income of € 326.9 and € 26.7 million
Financial Highlights • Cash at 3/31/12: € 93.5 million
• Total debt at 3/31/12: € 23.1 million
• 2009 acquisition, restructuring and Asian production transfer
Investment have transformed company and earnings potential
• Advanced packaging, smart phone/tablet growth and Asian
Considerations production transfer offer significant upside potential
• Stock market valuation at significant discount to peers
21 June 2012 5

6. I. BESI PRODUCT POSITIONING
Back-end Semiconductor Assembly Process
Dicing Die Attach Wire Bond Packaging Plating
Die Sort Die Bond Wire Bond Molding Trim & Form Plating
Leadframe Assembly
Singulation
Substrate
Ball Grid Array
Wire Bond Assembly
Die Sort FC Die Bond Molding Singulation
Ball Grid Array
Substrate
Flip Chip Assembly
Die Sort FC Die Bond Molding Singulation
Wafer Level Packaging
Flip Chip Assembly
Die Attach Packaging Ball Attach
21 June 2012 6

7. I. BESI EQUIPMENT PORTFOLIO
Die Attach Packaging & Plating Wire Bonding
• Die Sorting • Molding • 3100
- DS 9000E New - AMS series • 3100
- CS 1250 - AMS Foil Smart Card
- DS 11000 - AMS WLM New
• 3200 Smart
Card
• Die Bonding • Trim & Form
- 2100 xP
- Compact series
- 2009 series
- Power series
- 2100 hS New
- Compact Line
- 2100 sD New New
XHD
• Component • Singulation
In Development
Packaging - FSL New
- 2200 evo
• Common die attach platform
• Common packaging platform
• Flip Chip • Plating
- 8800 Quantum - Leadframe
- 8800 Chameo - Solar
- "Smart Line" - Film & foil
- 2100FC
21 June 2012 7

8. I. CORPORATE TRANSFORMATION
Record Revenue:
400 € 351 million
Record Profit:
€ 47 million
Die Attach Acquisitions
350
300
Restructuring Dragon I Dragon II € 8.5 million
complete: complete: cost savings
Revenue (€ million)
250 € 6 million € 15 million plan
cost savings cost savings initiated
Asian Production Transfer
200 Esec 2100
transfer
completed
Initial
150 shipments
Dutch tooling & Hungarian of Esec
die bonding transferred 2100 from
Malaysia
100
Standard packaging and DC die bonding
systems transferred to Malaysia Expanding
Asian
50 € 14 million spent to build, expand and equip Malaysian system and Chinese capacity in
tooling operations ‘12/’13
Asian headcount increased from 34% in ‘06 to 51% in ‘11
0
2003 2004 2005 2006 2007 2008 2009 2010 2011
21 June 2012 8

9. I. CUSTOMER ECOSYSTEM
Customers End Products End Use
• Blue chip customer base, top 10 customers represent 44.7% of 2011 revenue
• Leading IDMs and Asian Subcontractors. 41%/59% split in 2011
• Long term relationships, some exceeding 45 years
21 June 2012 9

10. I. PRODUCT SHIFT TO ADVANCED PACKAGING
END USER APPLICATIONS
2011
Service • Tablets and
12% Computer,
LED
wireless devices
PCs
2008 5% 21% now represent
Service 35% of estimated
Industrial
2% 10% end user revenue
LED
Industrial 3%
10% • Automotive has
Tablets &
Wireless
also grown
Auto
Auto 17% Devices significantly in
13% Computer, 35%
recent years
PCs
50% • Service/spare
Tablets & parts has grown
Wireless
Devices
to 12%. Less
22% cyclical revenue
stream
Source: 2011 Company Estimates
21 June 2012 10

11. II. MARKET
21 June 2012 11

12. II. ASSEMBLY EQUIPMENT MARKET FORECAST
Assembly Equipment Market Size (Apr 2012 VLSI) YoY Growth Rate (Apr 2012 VLSI)
6 160%
CAGR
‘11-’16: 3.6%
140%
120,5% 5,0
5 4,8
4,5 4,4
120%
4,3
4,2
4,0 100%
4
80%
3 2,9 60%
2,1 40%
2 11,7% 15,6%
7,4% 20%
-7,8% -5,3%
-9,2% 0%
1
-26,2% -28,2% -20%
0 -40%
2008 2009 2010 2011 2012E 2013E 2014E 2015E 2016E
Source: VLSI April 2012
• 2011 assembly market revised growth revised downwards by VLSI to -7.8%
• 2012 looks much better than initial forecasts. -5% vs. initial forecast of -21%
21 June 2012 12

13. II. BESI COMPETITIVE POSITION
2011 2010 2009 2008
Source: VLSI January 2012 2011 Market Market Market Market Company
(In US$ millions) Market Size Share Share Share Share Competition Position
Die Attach 1,015.2 32% 29% 29% 27%
Die Bonding 749.7 33% 28% 27% N/A ASM-PT, Shinkawa, #1
Panasonic, Renesas, K/S
Multi Module N/A N/A N/A N/A N/A Panasonic #1
Flip Chip 207.7 29% 33% 32% N/A Panasonic, ASM-PT #1
Die Sorting 57.8 30% 26% 11% N/A Muhlbauer, ASM-PT #2
Packaging 668.0 12% 10% 13% 12%
Molding 407.2 15% 9% 13% 13% Towa, ASM-PT, Yamada, Dai #2
Ichi Seiko
T&F 113.9 11% 19% 17% 12% ASM-PT, Gallant #2
Saw/Laser Singulation 138.2 4% 4% 8% 13% Hanmi, Rocco #3
Plating 25.9 92% 90% 98% 38% AGM, Technic #1
Total Addressable Mkt 1,700 27% 24% 27% 21% ASM-PT, Panasonic #1
Total Assembly Mkt 4,192 14% 14% 11% 12% ASM-PT, K/S #3
• Gained market share in 2011 particularly in molding, die sorting and die bonding products
• 27% addressable market share. Well positioned in highest growth areas
• Accuracy, precision and speed distinguishes Besi vs. competition, particularly for mainstream market
21 June 2012 13

14. II. ADVANCED PACKAGING IS THE FUTURE
Greater
Miniaturization
Greater
High Growth End Higher Accuracy Complexity
User Areas:
Die Attach
• Die Sorting: DS 9000
• Die Bonding: ES 2009, 2100
Media Tablets, • Flip Chip: DC 8800 FC
• Multi Module: DC EVO 2200
Smart phones,
Digital set top
Lower Power Increased
boxes, Autos, Mems Consumption Packaging
Density
• Molding: AMS-W
• Singulation: FCL
Higher
Performance
• High growth applications require ever smaller, denser and more complex chips with increased performance,
all at lower energy usage.
• <40 nanometer geometry will be the standard chip design over the next 3-5 years
• System on Chip or System in Package via substrate and wafer level packaging process is the only answer
• Besi has full range of AP systems. 2011E revenue: 70% substrate/wafer level vs. 30% leadframe
21 June 2012 14

15. II. SMART PHONE / TABLET MARKET TRENDS
Smart Phones 2011-2016
2,500
76.4%
2,000 30.8%
62.5%
million phones
1,500 • Rapid unit growth in smart
850 1,500 phones and tablets forecast
400 650
1,000 over next 5 years
500 1,050 900 850 • Estimated unit growth rates:
600
0
2011 2012 2013 2014 2015 2016
• Smart phones:
Basic Phones Smart Phones
• 2012: 62.5%
• 2016: 3.5x
Tablets 2011 - 2014
• Tablets:
• 2012: 120%
• 2014: 4x
• Significant potential revenue
growth driver
Source: Prismark
21 June 2012 15

16. II. SMART PHONE ILLUSTRATION
Main Components Manufacturer Country Besi Systems Utilized
Processor Samsung South Korea 8800FCQ, AMS-W, Singulation
DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation
Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation
Battery Samsung South Korea N/A
Power Management Dialog Germany 2100sD, 2009
Compass AKM Japan N/A
Accelerator/Gyroscope ST Micro Italy/France 2100sD
Communications
Radio Frequency Memory Intel USA 8800FCQ, Singulation
Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation
Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation
Skyworks, 2200 evo, AMS-W, Singulation, 8800
PA Module Triquint USA Chameo
Video/Audio
Touch Screen Control TI USA 2100sD, AMS-W, Singulation
Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation
LCD Display LG South Korea N/A
Touch Screen Wintek USA N/A
LG, Foxconn, South Korea,
Camera – 5/8 megapixel/VGA CoWell China 2200 evo
Besi systems are capable of assembling components representing up to 50% of smart phone content
21 June 2012 16

17. III. STRATEGY
21 June 2012 17

18. III. BUSINESS STRATEGY
Vision World class assembly
equipment manufacturer
Market
positioning Fast growing, leading edge market segments
How to win Technology-led, mainstream supplier of substrate and wafer level
packaging solutions
Enter selected Maximize product Exit when
markets with value with transfer technology becomes
leading technology into mainstream “commoditized”
Actions (I) (II) (III) (IV) (V)
Maintain Accelerate Reduce Transfer Acquire
leading edge revenue structural costs production to complementary
technology growth Asia companies
Leverage "One Besi" Strategy
21 June 2012 18

19. III. STRUCTURAL TRANSFORMATION CONTINUES
2011 2012 2013
Key Operational Objectives
ES 2100 production transfer to Malaysia
ES 2009 production transfer to Malaysia
50% MY/100% China capacity expansion
12% HC reduction plan
• Keys: transfer of production and personnel to Asia. Increased efficiency of euro operations
• Asian production transfer on schedule
• 32% YOY increase in Malaysian shipments in 2011. 2x increase in direct shipments
• Transfer of ES 2100 production from Switzerland to Malaysia completed in 2011
• 12% headcount reduction plan initiated October 2011: € 8.5 million savings targeted. On
hold given Q1 order ramp
• € 60 million quarterly break even revenue target bettered in Q1-12
21 June 2012 19

20. III. AQUISITION STRATEGY
Packaging & Plating Die Attach
Packaging Plating Leadframes Flip Chip Chip Sorting Flip Chip/ Single Chip
Multi Chip
1993 1995 1997 2000 2002 2005 2010
• € 50 million packaging company has become € 327 million assembly
equipment supplier
• Acquisitions since 2000 totaling € 80 million, net have created Die Attach leader
• Seeking technology led companies which increase advanced packaging
presence and can be incorporated into One Besi platform
21 June 2012 20

21. IV. FINANCIAL REVIEW
21 June 2012 21

22. IV. SUMMARY FINANCIAL HIGHLIGHTS
Year Ended December 31,
• Financial transformation since 2008
(€ millions, except share data) 2009 2010 2011
• Scale and market presence have changed
due to Esec acquisition:
Revenue 147.9 351.1 326.9
• Expanded mainstream presence
Orders 162.5 376.5 301.1 • Leveraged revenue potential
Gross margin 28% 39% 40%
• Strategic positioning in advanced
packaging has yielded benefits:
EBITDA 17.9 60.5 45.8 • Enhanced top line growth
Pretax income 4.9 47.4 34.6 • Increased gross margins
Net income 5.4 47.3 26.7
EPS (diluted) 0.16 1.25 0.73 • Solid gross margins and profits in 2011
despite downturn due to:
Net margin 4% 13% 8% • Advanced packaging presence
• Ongoing Asian production transfer
Adj. net income (loss) (28.0) 41.6 27.4 • 2010 product line restructurings
Adj. EPS (diluted) (0.85) 1.11 0.75
• Solid liquidity base. Expanding net cash
Net Cash 19.6 22.9 62.7 • Dividend initiated in 2010
Dividend per share - 0.20 0.22
21 June 2012 22

23. IV. LIQUIDITY TRENDS
Cash Debt
100
93.5 • Net cash position has grown to
90 87.5
€ 70.4 million from € 19.6
million at year end 2009
• Significant increase in
80 76.6
profitability
69.3 • Redemption and share
70
65.5 conversion of 5.5% convertible
61.8
notes in Q2 2011
60
• Improved inventory
(euro in millions)
55.0
49.4
47.7 49.9 management
50 48.1
46.8 46.4 45.9 • Includes € 20.2 million for
share repurchases and cash
40 dividends in 2011
• € 1.92 per share relative to
30 27.0
24.8 share price of € 5.70 at end of
23.1
Q1-12
20 16.1
10 • Strong balance sheet supports
future organic growth and
0 acquisition strategy
Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12
Net Cash 0.9 (1.3) 5.1 22.9 19.6 45.7 49.6 62.7 70.4
21 June 2012 23

24. V. SUMMARY
21 June 2012 24

25. V. SUMMARY
• Leading semi assembly equipment supplier with #1 or #2 positions in fastest
growing segments (smart phones/tablets). Gaining share
• Structural transformation continues. Scalability of business model seen in
recent industry cycle
• Solid profit in 2011 in challenging environment. Shareholder value enhanced
through € 20.2 million share repurchases and dividends
• Strong liquidity. € 70.4 million net cash at 3/31/12 (€ 1.92 per share)
• Business outlook for 2012 improving. 50% sequential revenue growth and
substantial profit improvement forecast for Q2-12
• Advanced packaging presence, smart phone/tablet growth and Asian
production transfer offer significant upside potential
• Attractive stock market valuation relative to peers
21 June 2012 25