PCB Production Introduction /How to Make PCB will separated with 3 parts to introduce about printed circuit boards PCB basic, different PCB types, PCB material, PCB sheet, PCB production process, main PCB manufacturing process include PCB drilling, plated through hole, dry film,PCB etching, solder mask, different PCB surface finishing and so on...

1. PCB Production Introduction
PCB means printed
circuits board or
printed wiring boards.
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2. PCB is used to carry the electronic components and provide connection the
parts.
SingleSided
PCB
DoubleSided
PCB
Multilayer
PCB
Rigid
PCB
FlexPCB
Rigidand
flexPCB
PTHPCB
Buriedvia
PCB
Blindvia
PCB
HALPCB
Cartonmask
PCB
Goldconnector
PCB
ImmersionGo
PCB
Platinggold
PCB
ENTEK
PCB
By
Hardness
PCB TypesPCB Types
By Hole Depth
Fabrication and
Customer RequirementsBy
Contracture
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3. PCB Base Structure
Prepreg
Copper Foil
Copper foil thickness ： 1/4 oz,1/3oz,1/2oz,1oz,2oz,3oz
etc.
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4. Finished PCB
As picture below ：
Solder mask
Annual ring
Screen Marks
PAD
Production Number
3C601
3C6013C601
12658Golden Finger
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5. Difference between double side
PCB and multi layer PCB
From the production process :
1. Double-sided PCB lamination with only prepreg and
copper foil. Multilayer PCB with inner core except
prepreg and copper foil.
2. Multilayer PCB is with inner layer production, and
double layer PCB
PCB manufacture| Printed circuit board production| How to make PCB| China PCB house

6. PCB Base Material Introduction
 There are mainly 3 types divided from TG ：
1.TG 130 , the resin consisted by two functional groups℃
Character: low TG, poor heat resistance.
2. TG 140 , the resin is consisted by four functional groups.℃
Character: good heat resistance, good stability, is most commonly used PCB material.
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7. 3. High TG (TG >150 ), the resin is composed of a plurality of functional groups.℃
Character: TG higher means better heat resistance, but also higher price. The
production process is relatively more complex.
By different related parts ：
1. Halogen material
Characters: Most of PCB material used currently is halogen material. It is harmful as it
produces dioxides, dioxin TCDD, dioxin ring cyclohexane when burned, ben
furan and others who with heavy smoke, highly toxic, carcinogenic, once
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8. intake couldn’t exhaust , will harm to health.
2.Halogen-free material.
Characters: Little proportion of halogen content. According to JPCA-ES-01-2003
standard CL, Br, I content less than 0.09% by weight could call
halogen free material. Due to its harm to human ,relevant laws and
regulations prohibit to use halogen materials for PCB plate (WEEE,
ROHS).
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9. PCB Base Material
Introduction
 Divided by solder process
 1. Leaded PCB manufacturing process is with toxic, harmful, reflected in mental
 decline, nausea, headache, insomnia, loss of appetite and so on. Typically is
 anemia, central nervous system disorder.
 2.Leadfree is defined as the lead content <0.1% according to EU. But Japan is
 0.2% as lead-free. It includes the coating of soldering, semiconductor, plated
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10. PCB Base Material Introduction
 through hole and PCB pads, stabilizers and related (halogenated resins, wire, paint,
 dye, glass bonding materials etc.)
1)Less toxic to the human body;
2)The melting point of solder material rises (about 217 );℃
3)High requirement on heat resistance of PCB material
4) PCB sheet material requires low DK value, low CET ( before Z-axis expansion
coefficient tg point 50PPM / , after tg 250PPM / ). Normal PCB material sheet℃ ℃
is before TG point 80PPM / , after TG point 300PPM /℃ ℃
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