The Rise of Biometric Cards - Edition February 2018

The Rise of Biometric Cards
World First Independent Research on Biometric Smart Cards
This work is licensed under a
Creative Commons Attribution-NonCommercial 4.0 International License.
By Antonio D’Albore
Fingerprint Sensors Section curated by Jean-François Mainguet
Edition February 2018

The Rise of Biometric Cards | Embedded Security News | embeddedsecuritynews.com
Edition February 2018 | © 2018 Antonio D’Albore, Jean-François Mainguet | All product names, logos, and brands are property of their respective owners.
Fingerprint Consumer Acceptance Timeline
Siemens and
Triodata develop
phone prototype
with fingerprint
sensor.
1998 2000
Sagem launch MC
959 ID, phone with
STM fingerprint
sensor
2011
Apple file Patent
“Devices and
Methods for
Providing Access to
Internal
Components”
(US20120258773A1)
2012
Apple buys
AuthenTec for
$356M
2013
Apple launch iPhone
5S
2

What is a Biometric Smart Card?
A Biometric Smart Card (BSC), Fingerprint Card or
Biometric System-on-Card (BSoC) is a Smart Card containing a fingerprint
sensor where:
• Biometric sample capture (enrolment / verification)
• Minutiae Template extraction
• Template storage
• Templates matching
is performed within the card.
3
A BSC shall never transfer any biometric sample and biometric reference data to any external terminal.
Template is normally stored in the SE Templates matching is normally performed by SE CPU

Potential
Man-in-the-Middle
Attack
Matching
Fingerprint
Acquisition
Biometric
Terminal
Transfer to
Matching
System
Match
Result
Potential
Man-in-the-Middle
Attack
Enrolment
Transfer to
Smart Card
Template Stored in
Secure Element
Fingerprint
Acquisition
Template
Creation
Template-On-Card (TOC)
4

Potential
Man-in-the-Middle
Attack
Enrolment
Fingerprint
Acquisition
Template
Creation
Transfer to
Smart Card
Template Stored in
Secure Element
Potential
Man-in-the-Middle
Attack
Match-On-Card (MOC)
Matching
Fingerprint
Acquisition
Biometric
Terminal
Transfer to
Smart Card
Match
Result
5

Enrolment
Fingerprint
acquisition
In-Card
template
creation
Template stored in
Secure Element
or Secure Flash
Matching
Fingerprint
acquisition
In-Card
template
creation
Match result
In-Card
templates
matching
Biometric-System-on-Card (BSoC) (1/2)
6

Extract
Measurement
Query
Template
Biometric-System-on-Card (BSoC) (2/2)
7
Capture
Pre-
Processing
Feature
Extraction
Template
Creation
Reference
template
Compare
Matching
Adaptive
Score
decision
Authenticate
Enrolment
Authentication
Typical operation time 2 ~ 5 sec.
Typical operation time 1 ~ 2 sec.

NFC POS
- In Store / In Branch
- Contact or NFC
- Before first use
or at first use
- Assisted
Secure Kiosk
- In Branch / Office
- Contact or NFC
- Non Assisted
or Assisted
Secure Tablet
- In Branch / Office
- Contact or NFC
- Assisted by tablet
operator
Card Reader
- Battery-powered
Reader or connected to
a PC
- Contact only
- At Home / Office
- Not Assisted
or assisted
Smartphone
- Smartphone with
enrolment App
- NFC or custom
cable
- Not Assisted
Standalone BSC
- BSC interact with user
by means of display,
LEDs or Audio
- Not Assisted
- Needs
battery BSC
Examples of Enrolment Schemes
8
ATM
- ATM with contactless
reader
- In Branch
- Not Assisted

Enrolment Schemes for Financial BSC (1/2)
9
Enrolment
assistend by bank
staff
User fingerprint
enrolment on a
secure tablet
Template is
decrypted in a
PCI/DSS compliant
environment
Fingerprint Template is
encrypted and sent to card
personalization bureau
Bank
customer
Bank
Template is injected
into card at
personalization time
Bureau send
Activation PIN to
customer
BSC is
shipped to
customer
User activate
BSC using
received
activation PIN
User smartphone
BSC ready for use

Enrolment Schemes for Financial BSC (2/2)
10
BSC is shipped
to customer
Bank branch
Card
personalization
Bank staff activate BSC
into card network
BSC ready for use
Customer bring its non-active
BSC at Bank branch
Card Bureau receives order
to produce BSC
Card Network
Bank staff assist customer
fingerprints enrolment
User register its
fingerprints directly on
the BSC

Considerations on Enrolment Schemes
• Enrolment is probably the most critical and costly part of each BSC project.
• The quality of the reference template generated at enrolment will determine the
efficiency of the card during its life cycle.
• Enrolment, when possible, shall be done in a secure environment:
• To identify the rightful owner of the BSC.
• To ensure good quality fingerprint scanning.
• To limit potential attacks.
• Shall be done assisted by trained staff.
• Self-enrolment will probably become popular for non-critical applications.
11

BSC Applications
• Financial Cards
• Debit / Credit Cards
• OTP Cards
• Cryptocurrency Wallet Cards
• Government
• National ID Cards
• National Healthcare Cards
• Government Ration/Subsidy Cards
• eSignature of Government documents
• Driving License Cards
• Online Voting
• Identity Verification
• Loyalty / Membership
• Online Gaming
• Access Control
• Physical Access entry
• Logical Access Login
• Healthcare & Insurance
• Health Insurance Cards
Enabler of three-factors
(3FA) authentication
Something I have
CARD
Something I know
PIN
Something I am
FINGERPRINT
12

Real Life Issues solved by BSC
13
• Solve CPF (Card Present Fraud) in Payment industry
• Combined with Dynamic CVV would allow to solve Card-Present (CP) and Card-Not-Present (CNP) fraud
• Enabler of financial cards use to elderly people with reduced vision
• Enabler of financial cards use to elderly people that have difficulty to remember PIN (and tend to write
them down on paper)
• Allow identification of genuine card holder (eID, Driving License Card, Healthcare Card) by Law
Enforcement Agencies / Hospital staff / Border Control officials
• Reduce fraudulent physical access to sites protected by card-enabled access control systems
• Reduce fraudulent logical access to systems and IT infrastructure
• Distribution of asylum seekers / migrants / refugees / displaced cash aids by NGOs as secure alternative
to mobile payments

Anatomy of a Biometric Smart Card (BSC)
14

Back Side Overlay
Anatomy of a BSC: The Components
Back Side Layer
Inlay
Front Side Layer
Front Side Overlay
Micro module
Fingerprint sensor
Sensor Bezel
15

Anatomy of a BSC: The Inlay (1/3)
SE Contacts Pad
Antenna
Status LEDs
FPS Contacts Pad
Display Driver IC
Display
Buzzer
Power Button
Passive Components
MCU / ASIC
RF IC
FPS Controller IC
Secure Flash
Flexible PCB
Inlay size is 1 – 2 mm (0.04 - 0.07 in) smaller than card W / H
Some BSC Integrators deliver inlays with FPS already embedded
16
Battery / SC
Test Pads

17
Inlay design sample for
Contact Only BSC
Antenna for Biometric Sub System
MCU / ASIC
FPS Controller IC
Test Pads
Dual Interface BSC
Antenna for Dual Interface SE

18
Battery-powered, dual Interface BSC with separated FPS module
MCU
Area Sensor
Module Interface Pad
FPS Module
This solution allow card
manufacturers to use sensors from
different vendors without needs to
re-engineering the whole inlay.
When implemented by sensor
manufacturers simplify the inlay
design because MCU and key
elements for FPS management are
already integrated into the
module.
Can only be manufactured with
Cold Lamination.

Anatomy of a BSC: Cross Section Sample
19
Laminated Card bodyBSC Inlay Sensor – FPCB Connection
FPS Bezel
Bezel should not
extend over card
surface to avoid
scratches
Protective Coating
Fingerprint Area Sensor
A slightly recesses
sensor can increases
component life.
The sensor below the card surface it also serve as finger tactile reference,
allowing to a smoother user experience

Anatomy of a BSC: Card Body Lamination (1/3)
Card body
Construction
Hot
Lamination
Cold
Lamination
Moulded
card body
Non-Moulded
card body
20
Lukewarm
60~80°C
Warm
80~120°C
Hot
120~280°C

Anatomy of a BSC: Hot Lamination (2/3)
21
• World standard manufacturing process for all standard non-powered cards. Billion of
cards made every year with Hot Lamination
• Use existing production process
• Need additional Milling + Implanting + Embedding modules and custom cutting tool (to
detach the sensor from film)
• Additional step for FPS cavity making
• Cannot be used for cards with batteries and displays and other temperature-sensitive
components
• Done at different temperature ranges according to layers materials and components to
embed
• Allow making large lamination stacks (e.g. 32 or 64 cards per sheet)

Anatomy of a BSC: Cold Lamination (3/3)
22
• Only suitable process for cards that have batteries, LCD, e-paper display, dynamic
magnetic stripes and buttons
• Process automation very complex, most players make use of manual labour
• Popular in Taiwan / South Korea / Thailand
• Normally more expensive than Hot Lamination
• Sheets need highly precise collation to avoid gaps between sensor and card surface
• Injection moulding OK for prototypes, practically not used for mass production
• Possible only small lamination stacks (e.g. 8 or 16 cards per sheet stacks)

Anatomy of a BSC: Card Body Lamination
23
Hot Lamination
Card Cross Section
Cold Lamination
Card Cross Section
Front Side Overlay
Front Side Layer
FPCB Inlay
Back Side Layer
Back Side Overlay
Front Side Layer
Adhesive
FPCB Inlay
Adhesive
Back Side Layer
Offset / Silk Screen Printed Layer Offset / Silk Screen Printed Layer
Offset / Silk Screen Printed Layer
Can have Magnetic Stripe, Signature Panel, Hologram
Offset / Silk Screen Printed Layer

Anatomy of a BSC: Operative Strategies
Card body
Construction
IC Power Supply
Power is supplied to SE only after successful fingerprint
verification. No successful verification = no ATR.
Card body
Construction
APP Status
The terminal check APP status. Default APP state = Disabled.
After successful fingerprint verification APP state = Enabled.
Card body
Construction
ATR ATR
Double ATR
Terminal checks for a 2° ATR to occur within a predefined
number of clock cycles. If Fingerprint verification after the first
ATR fails, then the second ATR is not sent.
24

Anatomy of a BSC: Power Supply (1/2)
With Replaceable Battery
With Rechargeable Battery
+
Energy Harvesting
With Rechargeable Battery
+
Chip Contact
With Non Rechargeable Battery
With Battery
No Battery
+
Energy Harvesting
Without Battery
No Battery
+
Supercapacitor (SC)
In some contexts SC are considered
Rechargeable Batteries
25
No Battery
+
Chip Contact

Anatomy of a BSC: Power Supply (2/2)
• Flat, printed Lithium Ion batteries are easy to implement but can create issues:
• Transport issues (Air, Courier).
• In some countries, subject to certification.
• Supercapacitors (SC) can be used in Energy Harvesting BSC for short-term energy
storage. Use limited by high cost.
• BSC without battery requires card reader / NFC reader for enrolment.
• Replaceable batteries used in Non-ISO card (thickness) for Access Control applications.
• Most of BSC with display, buzzer, dynamic magnetic stripes and other electronics use
batteries to operate.
26

Anatomy of a BSC: FPS Cavity Making
27
Smooth and clean cavity
No debris removal
Injection Moulding
Complex industrialization for
mass production
Chip and FPS sensor cavity are
created during injection
Cavities punched out from PVC
sheet
Operation performed after sheet
printing
Sheet Punching
Requires precise alignment of
lamination sandwich
Suitable for mass production
Only for sensors embedded after
lamination
Require modification to chip
cavity milling equipment
Mechanical Milling
Most popular method for cavity
making
Suitable for mass production

Anatomy of a BSC: Swipe vs Area Sensors
Generate large Image
Problematic torsion/bending test
Swipe
Sensors
Unreliable in many applications
Significant learning curveSmall footprint
Easy bonding to FPCB
Area
Sensors
Accurate Subject to scratches
Large footprintEasy to use
Flexible are ideal for smart cards
28
Costly when large
and made out of silicon

Anatomy of a BSC: Area Sensors short specs
29
• Average thickness 0.25 ~ 0.3 mm (0.009 ~ 0.011 in)
• Full fingerprint scan ~ 1 sec
• 1.8 ÷ 3.3 V operations
• Resolution ≥ 500 dpi (sensors with lower resolution compensate with larger active area)
• Output 8 bit, 256 grey scale values
• Wakeup upon touch (few ms wait)
• Protective coating to increase durability
• ESD Protection ±15 kV (IEC 61000-4-2)
• Durability ≥ 1 M touches
• Some models include Bezel into their design
• For mass production shall be delivered in Super 35 mm Tape format
• Flexible Bump technology becoming popular for mass volumes embedding

Anatomy of a BSC: Sensor Position on Card
• From a purely engineering point of view, the fingerprint sensor
can be placed anywhere on the card.
• From a practical perspective all current implementations place
the sensor on the right side of the card:
• The fingerprint acquisition can be performed even when
the card is working in “Contact” mode and is it inserted
into a POS slot.
• It’s the thumb ergonomic location when handling the card
for a contactless transaction.
• Swipe fingerprint sensors are placed more toward the right
edge of the card, to allow enough space for swiping process.
30
Area where fingerprint sensor is normally located in a BSC

Anatomy of a BSC: Bezel
Cover sensor bonding pads
Aesthetic
Cover sensor cavity walls
Bezel, when present, have Functionals and Aesthetic reasons:
Must be flexible enough to comply with dynamic torsional stress of ISO/IEC 10373-1 and Mastercard CQM
Electrically drive the fingertip during the
sensing process
Cover gap between card and sensor
Functional
ESD protection
31

Anatomy of a BSC: MCU / ASIC
• ARM Cortex M3 or M4, 32bit RISC de facto standard as general purpose MCUs
• Perform Template Match when this is not done by SE
• Coordinate/control BSC components
• Several BSC makers are designing their own ASIC:
• Integrate FPS IC + MCU + Flash + RF IC.
• Cheaper when manufactured in volume.
• Easier to integrate (less components).
• Will drive inlay cost down.
• Can be done only when product with generic MCU
reach maturity.
• Time-to-Market 18-24 months.
32

Anatomy of a BSC: RF IC
• The RF IC can perform multiple tasks:
• Harvest power from RFID excitation field
• Voltage Regulator, when is not done by LDO
• Clock Generator / Clock Regulator
• Reset Generator
• Anti-collision mechanism
• Distribute power supply to both SE + BSC MCU/ASIC + FPS
• When present, charge Rechargeable Battery or
Supercapacitor
33

Anatomy of a BSC: Led, Buzzer & LCD
Other elements that can be present on a Biometric Card:
LED
Buzzer
Flexible LCD / e-paper
Ensure compliance with ISO/IEC 17839-1:2014 - Biometric System-on-Card --
Part 1: Core requirements
34

Anatomy of a BSC: Cless Interfaces / Transponders ICs
ISO 14443 Type A, B, C
NFC
Bluetooth LE
HID 125 kHz / HID iClass
Mifare Classic / DESFire EV1
Legic Advant
Atmel 5577
Popular on BSoC Access Cards
35

Anatomy of a BSC: Cless Interfaces / Transponders ICs
Popular on BSC Access Control Cards
HID 125 kHz / HID iClass
Mifare Classic / DESFire EV1
Legic Advant
Atmel 5577
36
ISO 14443 Type A, B, C
NFC
Bluetooth LE
Sony FeliCa

Edition January 2018 | © 2018 Antonio D’Albore, Jean-François Mainguet | All product names, logos, and brands are property of their respective owners.
Inlay Making and BSC Personalization
37
BSC Production

BSC Production: Making of FPCB
FPCB
Copper Plating
Laser Drill
Line Formatting
AOI & PSR
Gold Plating
Marking
SMD / COF
Solder Paste
Mount
Reflow
Prelam / Packaging
Placement on Template
Inlays Packing
Sensor mount on Inlay
FPCA Sheets Packing
Prelam sheets making
Inlays Packing
Bonding
38
Tray, Reel
or FPCA
Tray, Reel
or FPCA

Single steps when bezel is integrated into FPS design
BSC Production: Key Manufacturing Steps
Sheets Printing
Sheet FPS Cavity
Punching
Layers Collation
Sheets
Lamination
Sheet Punching
Cards Gathering
Micromodule
Cavity Milling
Micromodule
Embedding
FPS Cavity Milling
Anisotropic
conductive epoxy
on contact pads
cavity walls
coated with
adhesive epoxy
FPS Embedding Bezel Placement
FPS embedded
after lamination
FPS embedded
before lamination
39

BSC Production: Some Considerations
40
• As of today only Fingerprint Cards offer sensors delivered in a package (they call T-
Shape) able to be embedded after lamination.
• Companies are investing into making standalone FPS modules:
• Jinco Universal > allow them to use a common base inlay with several sensors from
different vendors
• Next Biometrics > allow them to offer a complete module for easy integration to card
manufacturers and BSC developers
• Some sensors (embedded on inlay) can also be placed under the overlay:
• Can be aesthetically very pleasant (flat)
• Provide additional scratch resistance to sensing area
• Does not help user experience, because won’t be any tactile reference neither
guidance for the acquisition

BSC Production: The Personalization
EmbossLaser engraving Direct-To-Card
Overlaminate
Overlay
Sensor bezel / card thickness can potentially create interference / jam in personalization equipment
Inkjet
Rear Indent
Front Indent
Retransfer
41

Section curated by Jean-François Mainguet
42
Fingerprint Sensors

Fingerprint Sensors : Types of Capture
43
The user just touches the sensing area The user sweeps their finger across the
sensing area
Area Sensor
“Static”
Sweep (Swipe) Sensor
“Dynamic”
The larger the image, the better the recognition rates  an area sensor must not be “too small”
• Ergonomics: almost no training required
• Image size: smaller than Sweep Sensor
• Cost: normally cost more than Sweep Sensor
• Ergonomics: some training required
• Image size: normally larger than Area Sensor
• Cost: normally cheaper than Area Sensor

Fingerprint Sensors: Substrate
44
Plastic
Flexible
Requires an external silicon
chip (driver).
Silicon
Flexible if thinned
Cost directly linked to sensor
area. Area sensor  cost more
than swipe sensor .
Glass
Not flexible
Requires an external silicon
chip (driver).
Used for BSC Not used for BSC Used for BSC

45
Optical
- Reflection FTIR
- Direct image:
- Structured light
- Pinhole
- Transmission
- OCT
Capacitance
- Passive
- Active (RF field)
Pressure
- Piezo
- Conductive membrane
- Tactile (MEMS)
Electro-Optical
- Piezo-led
- Emissive polymer
Thermal
- Passive
- Active
Ultrasound
Fingerprint Sensors: Physics

Fingerprint Sensors: Passive Capacitive Sensing
46
Valley Capacitance
Sensing Pixel
A Passive Capacitive fingerprint work on the measurement of the capacitance between the skin and the sensing pixel.
- Ridge: skin is touching the coating, there is only the coating capacitance.
- Valley: the capacitance between skin and coating is in series with the coating capacitance, so a lower capacitance.
To provide enough sensitivity, the coating must be as thin as possible: a few microns is better, but some companies
proposes hundreds of microns at the cost of a lower resolution (blurred images).
A significant drawback is the sensitivity to external electrical fields, the most dangerous being ESD (Electro-Static
Discharge).
Valley Response Signal
Coating Layer
Finger Skin
Substrate
Ridge Capacitance
Ridge Response Signal

Fingerprint Sensors: Active Capacitance RF Sensing
47
Active capacitance sensing is using a RF signal that goes through the capacitance between the skin and the pixel. The
main advantage is the ability to adjust the signal level, at the cost of a connection to the skin.
Finger
Signal
Substrate
Sensing
PixelBezel
Protective Coating
Valley Capacitance
Ridge
Capacitance
Response Signal

Fingerprint Sensors: Active Thermal Sensing
48
The sensor measures heat capacity. A low power heat pulse is applied to
each sensor pixel over a short period of time and a response is measured.
- valley: the air is very thermally resistive, and so the heat stays inside
the sensing element, the final temperature is high
- Ridge: the skin is pumping the heat, final pixel temperature is lower
Finger
Protective Coating
Time
Temperature
air
skin
Temperature
difference
Heat pulse
Valley: warmer
Sensing
Pixel
Heat Pulse Injecting ElementRidge: colder
Heat transfer

Fingerprint Sensors: The choice for Smart Cards
49
Find a compromise:
A sensing type: swipe or area?
• Swipe: larger image but ergonomic may be a problem
• Area: easier to use but costly than Swipe
A sensing technology: active capacitance & thermal are the most common for smart cards
A sensor substrate:
• A silicon substrate sensor must be small because of the cost and the flexibility requirements, so with
lower accuracy
• A plastic substrate is less expensive, flexible and will be larger, but requires some silicon drivers
anyhow
Power consumption
Acquisition speed

Biometric Cards and Sensors Value Chains
50
The Value Chain

Fingerprint Cards Value Chain
51
BIOMETRIC CARD
SOLUTION
PROVIDER
IPs
The Biometric Card Solution Provider can potentially design Biometric Engine, ASIC and Inlay in house.
Sensor
Manufacturer
ASIC
Foundry
Sensor
Solution Provider
Inlay
Manufacturer
ASIC
Designer
Biometric
Engine Designer
MCU / RF ICs
Supplier
Inlays / Prelams
Sensors
APIs
Dev. Tools
Test Tools
Enrolment SW
Delivery
Card
Manufacturer
IP Licenses
Sensor
Manufacturer

Fingerprint Sensors Value Chain
Specs
Sensor Module
Packaging
Sensor Solution
Provider
Sensor
Manufacturing
Sensor Controller
Foundry
Sensor Controller
Packaging
BIOMETRIC CARD
SOLUTION
PROVIDER
IPs
ASIC Foundry ASIC PackagingASIC Design
52
IC Foundry MCU PackagingMCU Design
Biometric Engine
Firmware
OR

Past Trials
2014
Sparebanken DIN
Norway
Zwipe + MasterCard
Payment 2017
Pick n Pay
South Africa
OT-Morpho + MasterCard
2017
Absa Bank
South Africa
2016
Bundesdruckerei
Germany
Bundesdruckerei
Physical Access
2015
Danske Bank
Denmark
Zwipe + MasterCard
Logical Access
Applications
2017
Bulbank Bank
Bulgaria
2015
Battistolli
Italy
Card-Tech + Ingenico
Identification
53

Ongoing Trials
Payment
Physical Access
Logical Access
Applications
Identification
2017
Pleinair Casino
France
MeReal Biometrics
2017
United Nations
Switzerland
KSID + Elan + Jinco
2017
AirPlus
Germany
Kona I + FPC
54
2018
Bank of Cyprus
Cyprus
Gemalto + Visa + Zwipe
2018
Mountain American Credit Union
USA
Kona I + Visa

Commercial Rollouts
Payment
Physical Access
2017
Woori Bank
South Korea
Korea Smart ID
Logical Access
2017
Istanbul Municipality
Turkey
Korea Smart IDApplications
Identification
55

Future Trials & Commercial Rollouts
2018
Cartes Bancaires
France
Gemalto + Visa
2018
Bank of Cyprus
Cyprus
Gemalto + Visa + Zwipe
56
2018
Cartes Bancaires
France
Idemia + Mastercard
2018
Multiple Banks
Japan
Idemia + JBC
2018
Banca Intesa San Paolo
Italy
Gemalto + Mastercard
2018
United Nations
Switzerland
KSID
2018
Barclaycard
UK
Gemalto + Visa
2018
Banco Santander
Spain
Idemia + Mastercard
Payment
Physical Access
Logical Access
Applications
Identification
2018
Mountain American
Credit Union
USA
Kona I + Visa

BSC Development at Major Payment Card Schemes
57
Late entrant into BSC business
First BSC presented at Bloomberg Next in Oct 2017
Cooperation with Gemalto and Kona I
Several pilots expected during Y2018
Launched Idemia F-Code to Japan Nov 2017
Current focus Japanese market only
Some pilots expected in Japan during Y2018
Early sponsor of BSC technology
Advocate of battery-less BSC
CQM qualification of several products ongoing
Cooperation with Idemia and Idex
Working on BSC with China Datang Technologies
Card specs updating in progress
No qualified products announce yet

Normative References
58
Standards developed by Technical Committee ISO/IEC JTC 1/SC 17
Cards and personal identification
The current area of work for JTC 1/SC 17 consists of:
• Identification and related documents
• Cards, and
• Security devices associated with their use in inter-industry
applications and international interchange
Details at https://www.iso.org/committee/45144.html

59
Type S1 “conventional”
Dimensions ID-1 as ISO/IEC 7810
Torsion and bending as ISO/IEC 7816-1
Contact interface as specified in ISO/IEC 7816-3
USB interface as specified in ISO/IEC 7816-12
Contactless interface as specified in ISO/IEC 14443
Type S2 (ID-T) “ticker” – NEW FORMAT
Card is 2.5 mm (0.098 in) thick
2.5 mm thick card cannot be inserted in card slot by
mistake
Width / height as an ISO/IEC 7810 card
Need not conform to ISO/IEC 7816-1 flexibility
Supports only ISO/IEC 14443 contactless interface
Regardless of S1 or S2, a BSC must have some form of feedback mechanism such as LCD display, LED or buzzer
ISO/IEC 17839-1:2014 - Biometric System-on-Card
Part 1: Core requirements

60
The minimum size of an area sensor shall be 169 mm2
(13 × 13 mm or 0.512 × 0.512 in)
Allows fingerprint sensor, voice microphone, camera for facial image, signature input pad
In the case of a swipe sensor, the effective area of fingerprint
capture is bigger than the sensor size. A swipe sensor shall
have a minimum width of 13 mm (0.512 in)
ISO/IEC 17839-2:2015 - Biometric System-on-Card
Part 2: Physical characteristics

61
ISO/IEC 17839-3:2016 covers:
• Commands and data structures
• Internal Enrollment and External Enrollment
• Initiation of verification
• Status feedback
• Processing time management and extension
• Capability discovery mechanism
ISO/IEC 17839-3:2016 - Biometric System-on-Card --
Part 3: Logical information interchange mechanism

62
• ISO/IEC 24787:2010 - On-card biometric comparison
• ISO/IEC TR 30117:2014 - Guide to on-card biometric comparison
standards and applications
• ISO/IEC 18584:2015 - Conformance test requirements for on-
card biometric comparison applications
Other ISO TS / TR

63
• Popular certification among:
• Chip vendors, module vendors, inlays manufacturers
• Card manufacturers
• Applicable only to ISO ID-1 (S1) biometric cards
• Self-assessment methodology controlled by on-site audits
• BSC products tested under CSI (Card Structure Integrity & Security) program.
• A LoA (Letter of Approval) is issued by MasterCard for each device that has passed all
tests.
Mastercard Card Quality Management (CQM)

64
Focus on EMV® 2nd Generation Specifications
• EMV 2nd Generation Specifications in progress:
• Biometric Terminal effective from Jan 1, 2018
• EMV 3-D Secure 2.0
• Specifies use of multiple options for step-up authentication, including biometrics
Visa, MasterCard and Amex have updated their Applet specs allowing Fingerprint Verification to be used as PIN alternative.
Contactless BPC
Payment Terminal wait for verification response
from the BPC
CVM = CDCVM
Contact BPC
No Action is performed by the Payment Terminal
CVM = No CVM

65
Payment service (PSD2) – Directive (EU) 2015/2366
• It provides the legal foundation for the further development of a better integrated internal
market for electronic payments within the EU.
• It puts in place comprehensive rules for payment services with the goal of making
international payments (within the EU) as easy, efficient and secure as payments within a
single country.
• Requires Strong Customer Authentication, using at least two independent elements
categorized as:
Something I have
CARD
Something I know
PIN
Something I am
FINGERPRINT
INHERENCEPOSSESSIONKNOWLEDGE

66
ICAO Doc Series 9303 – Machine Readable Travel Documents
• ICAO – Doc 9303 – Part 9: Deployment of Biometric Identification and Electronic Storage
of Data in eMRTDs.
• ICAO – Doc 9303 – Part 10: Logical Data Structure (LDS) for Storage of Biometrics and
Other Data in the Contactless Integrated Circuit (IC).
Focus on storage / format / interoperability of biometric data into eMRTD.
No references to BSC.

Fingerprint Cards Acceptance Factors
67
CONSUMERS
Familiarity with smart cards
Familiarity with smartphones
Increasing acceptance for new technologies
Slow acceptance of mobile payments
LEGAL
Compliant with most regional / national legal
frameworks demanding biometric data not to be
stored in public DB.
EU GDPR effective May 2018 prohibits processing
of “Biometric Data”
INDUSTRY
Need to reduce Card-Present Fraud
Improve Identification / Verification processes
Growing focus on Safety/Security of physical assets
Minor or no infrastructure upgrade cost
Rising immigration control & MRTD verification
HEALTH
Risk of infection transmission with standalone
Fingerprint scanner (rotavirus, norovirus, hepatitis
A virus, respiratory syncytial virus, rhinovirus,
influenza virus, Shigella dysenteriae,
Enterohemorrhagic Escherichia coli, etc.)

Fingerprint Cards Potential Blocking/Risk Factors
68
• Rejection due to personal reasons.
• Cultural incompatibility.
• Absence of respective biometric feature.
• Insufficient characteristics of the respective biometric feature.
• Abnormal characteristic of the respective biometric feature.
• Criminal organizations might develop techniques to fool fingerprint sensor (liveness detector, blood
detector, etc.).
• Because Biometric features are static, stolen (capture, cloned, forged) biometric cannot be revoked or
changed.
• Challenge to get product working in Hot / Dry / Dirty environment.
• Competing mobile payment technology may impact the smart card market.
• Banks / Organizations might be unwilling to pay for the product high price.

BSC Drawbacks
69
• Much more complex to manufacture compared to a standard dual interface smart card
• Much more expensive than a standard dual interface smart card
• Need user going through a certain product use training, even if minimal
• More complex to activate compared to a standard dual interface smart card
• Payment BSC without battery cannot be used for user authentication at standard ATMs
• Payment BSC cannot be used or used with difficulty in stores that have POS terminal positioned far from
customers
• Issuer shall bear the additional cost for the enrolment process:
• For Assisted Enrolment, cost of trained staff + enrolment equipment
• For Self-Enrolment cost for additional device and its shipping to user

Tier 1 Card Vendors
70
The Companies of the Business

Tier 1 Card Vendors: Gemalto
71
• Initial approach was to use BSC licensed from two developers
• BSC Products:
• Licensed Contact-only BSC, with IDEX Sensor
• Licensed Dual Interface BSC, with FPC Sensor
• Dual interface, battery-less BSC, under development (FPC Sensor)
• Product industrialization completed at major plant in France. When business will pick-up
possible card body making at Singapore plant.
• Joint Marketing promotion with MasterCard
• Several trials, mostly in Europe, expected to deploy during Y2018
• Commercial launch expected Q1/Y2018
• Finalizing BSC system integration with Cartes Bancaires (France)

Tier 1 Card Vendors: Idemia
72
• First, among top card vendor to have started development of BSC
• Two in-house development from Oberthur and Safran Morpho teams
• BSC Products, all in-house development, F-Code line:
• Contact-only BSC (IDEX Sensor)
• Dual interface, battery-less BSC (FPC1320 Sensor)
• Dual interface, battery-less BSC (FPC1321 T-Shape Sensor) called F-Code Comfort
• Industrialization completed at major European plant. When business will pick-up
possible card body making at Shenzhen plant.
• Joint Marketing promotion with MasterCard
• Ongoing trial of F-Code Comfort at Cartes Bancaires LAB
• First Mass Deployment expected on Q2/Y2018 by Cartes Bancaires, France
• Partnering with JCB for Japanese market

Tier 1 Card Vendors: G+D
73
• Not aware of any development

BSC Developers
74

BSC Developers: Bundesdruckerei GmbH
1879
Founded
Germany
HQ
Sole Proprietorship
Type
Ulrich Hamann
CEO
• World leader in the field of ID technology and banknote printing
• Owned by The Federal Republic of Germany
• Producer of Germany National ID Cards and ePassports
• Developed GoID, multifunctional Contactless ID BSC:
• Use capacitive sensor
• Thick 2.5mm (Format ISO S2)
• Made of hard-wearing fibre composite
• Energy harvesting
• Can have display, keypad and lanyard hole
• Some components made with 3D printing process
bundesdruckerei.de
WEB
75

BSC Developers: CardLab ApS
2003
Founded
Denmark
HQ
Private
Type
Frank Sandeløv
CEO
• Strong IP Portfolio focusing on Powered Smart Cards
• Partnership with QuardLock for development of a OTP BSoC
• Trials in USA and UAE
• Exclusive lamination process with variable temperature setup
• New Thailand plant, expected launch of BSC products Q1 Y2018
• Key Products:
• Non-rechargeable battery dual interface BSC inlay and cards
• Non-rechargeable battery contactless NFC BSC inlay and cards
• Inlays with multiple items: fps + display + dynamic magstripe + led
• BSC with Swipe sensor FPC1080A (FIPS compliant)
Cardlab.com
WEB
76

BSC Developers: Card-Tech S.r.l.
77
2006
Founded
Italy
HQ
Private
Type
Fabrizio Borracci
CEO
• Holds global set of patents on Biometric System on Card
• Manufacturing partnership with top-tier card vendor
• Partnership with IDEX for sensors, sensor embedded on inlay
• Flexible inlay engineered for seamless integration with existing
processes
• No bezel design
• Template Matching on SE
• Key Products:
• Contact BSC inlay, next live pilot at bank Q1/2018
• Dual Interface Energy Harvesting BSC inlay (under development)
card-tech.it
WEB

BSC Developers: Feitian Technologies
78
1998
Founded
China
HQ
SZSE: 300386
Type
Yu Huang
CEO
• Chinese professional card manufacturer specialized in PKI and Strong ID products
• Y2016 revenue CNY882.43M (€112M)
• Offering Mobile Payment Terminals, OTP Tokens, Card Readers, Software
Protection Tokens, Card OS licensing, ID and EMV Cards
• Developing contactless BSC with Idex area sensor
ftsafe.com
WEB

BSC Developers: First Biometrics
79
2015
Founded
USA
HQ
Private
Type
Charlie Gomez
CEO
• Private funded start-up
• Own IPs + acquired IPs for several patents on Biometric Cards processes and
manufacturing
• Partnership with Next Biometrics for Large Area Sensors
• Partnership with tier-one SE suppliers
• Manufacturing base in East Asia and US
• BSC under development:
• FIPS certified BSC for ID market, battery powered
• Large area sensor BSC for Payment market, battery powered
• Energy harvesting BSC
firstbiometrics.com
WEB

BSC Developers: Infinacom, LLC.
80
• Private company, spinoff from Diamond Sun Labs, founded by
Francisco (Cisco) Schipperheijn (Founder), Keith Goldstein (CEO)
and Thomas Ziemkus (CTO)
• R&D activities ongoing, target products:
• Dual Interface Battery-less Payment BSC
• Virtual Payment BSC
• The Virtual BSC is intended to be an APP provided to customer,
associated with the real BSC.
• Developing Biometric Engine based on SE, inlay without MCU.
• Licensing business model targeting card manufacturers.
Founded
2017
HQ
USA
Type
Private
CEO
Keith Goldstein
WEB
infinacom.com

BSC Developers: Jinco Universal Co. Ltd.
81
HQ Type CEO
• Asia’s strongest OEM/ODM of customized powered smart cards / inlays
• Partnership with Korea Smart ID (KSID) for Card Production
• Partnership with Elan Microelectronics for sensors
• Strong promotion in South Korea / China / Taiwan / South East Asia
• Specific patents on BSoC
• Working on retina recognition smart card (patented)
• Key Products:
• Contactless BSC with rechargeable battery
• Dual Interface, energy harvesting BSC
• Dual Interface, rechargeable battery BSC with dynamic magstripe and display
WEBFounded
2005 Taiwan Private Ted Lin (林武旭) Jinco.com.tw

BSC Developers: Kona I
82
HQ
• South Korea largest manufacturers of smart cards
• Strong Card OS and manufacturing know-how
• Supplier to Visa for trial BSCs
• Sensors from FPC, biometric engine by Precise Biometrics
• Offer a full range of BSC, in house Inlay development:
• Non-rechargeable or rechargeable Battery
• Energy-Harvesting
• e-paper display
• PKI engine
WEBFounded
1998 South Korea
Type
KOSDAK
052400
CEO
Jung-il Cho (조정일) konai.com

BSC Developers: Korea Smart ID
83
• Subsidiary of UNISEM Group, South Korea industrial group manufacturer of equipment
for semiconductor manufacturing
• Company focus is BSC system integration
• Cooperation with Kona I (Card OS) and Jinco Universal (BSC Inlay)
• So far, KSID is the company with the largest number of BSC
deployed in the market:
• UN Geneva, Logical and Physical access control BSC
• Woori Bank, bidding system for National Market Agency
of the Public Procurement Service
• Istanbul Municipality, taxi drivers License ID card
Founded
2013
HQ
South Korea
Type
Private
CEO
Dong Su Kim (김 동 수)
WEB
emobileid.co.kr

BSC Developers: Linxens
84
• World-class provider of component-based solutions for the security & identity
market, shipped more than 90 Billion connectors since its founding.
• Cooperation with FPC on the T-Shape packaging
• Developer of OEM inlay technology, powered by Contact, Antenna or Battery,
supporting several components:
• Sensor
• MCU
• SE
• Contact Plate
• RF Antenna / Battery
Founded
1986
HQ
France
Type
Private
CEO
Christophe Duverne
WEB
linxens.com

BSC Developers: Lion Security Co., Ltd.
85
• Private South Korean company leveraging VP Mr. Daniel Park previous experience
in E-Smart Technologies.
• Developing BSC on Cold Lamination technology
• Key product is LS-BMC (Lion Security - BioMetrics Card):
• Energy harvesting dual interface
• Area sensor FPC 9.6 x 9.6 mm, 508 dpi
• Arm M4 MCU
Founded
2015
HQ
South Korea
Type
Private
CEO
In-Beom Kang (강인범)
WEB
lioncu.net

BSC Developers: Maneul Lab Inc.
86
2004
Founded
South Korea
HQ
Private
Type
JunYoung Chang (장준영)
CEO
• South Korean start-up working on several IT solutions:
• M-Cube: Indoor Location Service
• MobiTalk: Messaging solution
• Red POS: POS solution
• The Card: battery-powered wallet card – up to 200 cards - with Fingerprint sensor.
• First prototype publicly demo at Trustech 2017 was with sensor under overlay
• Currently working on area sensor from FPC
• Biometric engine by Precise Biometrics
maneullab.com
WEB

BSC Developers: Mereal Biometrics Ltd.
87
2009
Founded
Hong Kong
HQ
Private
Type
Philippe Blot
CEO
• Investment by French Groupe Partouche (Casino, Hotel, Events)
• Co-founded by Philippe Blot (UINT CEO)
• Patented Acoustic / RFID OTP transmission to terminal
• Sales & Marketing base in Hong Kong
• UINT Limoges (France) engineering & manufacturing plant
• Current production capacity ~250K cards / month
• Key Products:
• Dual Interface, rechargeable battery BSC with Swipe Sensor
• Dual Interface, rechargeable battery BSC with Area Sensor from FPC
• Contactless Portable Charger
merealbiometrics.com
WEB

BSC Developers: MoriX Co., Ltd.
88
2005
Founded
Japan
HQ
Private
Type
Morihiko Kubota
(久保田守彦)
CEO
• Partnership with Toshiba Solutions Corp.
• Selling Cards & Fingerprint Sensors
• In-house Fingerprint Matching algorithm development
• COF Sensor Co-developed with ASD: 508 dpi, 9.4 x 11 mm active area
• NFC BSC under development
• Key Products:
• BSC contact with non-rechargeable battery
• BSC contact with display and non-rechargeable battery
• Fingerprint Sensor module
morixjp.com
WEB

BSC Developers: NXP Semiconductors (1/2)
89
1953
Founded
Netherlands
HQ
Nasdaq: NXPI
Type
Richard L. Clemmer
CEO
• On October 31, 2017, NXP announced to be working with Fingerprint Cards on a BSC
solution. No details where given. I can only speculate that it will be something like this:
nxp.com
WEB
ISO/IEC 14443
SmartMX2
P60-Like SE
M4-Like
MCU
Power
Management IC
ISO/IEC 7816
FPS (SPI) FPS (Vdd)
BSC
App
I/O VDD
Most likely Extraction and Matching
from Precise Biometrics.
NXP has license to embed BioMatch
into their solutions.
Biometric OS Layer into User ROM
FPC Sensors Firmware NXP solution, I believe will be
available in FFC or PDM package

90
BSC Developers: NXP Semiconductors (2/2)
• However, if it will be like expected, will be a disruptive innovation with consequences:
• Extremely simplify the task of inlay development, because it will carry simply an
antenna with two wiring to sensor (SPI and VDD) plus sensor bonding pads
• Drastic reduction of Inlay cost
• Combined with FPC T-Shape sensor, will allow 2nd tier card manufacturers to enter
into the BSC business using the production process that they already in place for
financial cards (Hot Lamination + Milling + Embedding)
• Will pose an extremely serious threat to companies such as Card Tech, Zwipe and
others that have heavily invested into own BSC inlay development and are without
differentiating factors (e.g. own card OS, e-paper displays, acoustic authentications,
batteries, dynamic CVV).

BSC Developers: SmartDisplayer
91
2002
Founded
Taiwan
HQ
Private
Type
George Ou
(檔案)
CEO
• Company specialized in design and manufacturing of powered cards such as
Display Cards, OTP Cards, Dynamic CVV Cards and All-in-one cards
• Delivered to market > 8M Display Cards including 600.000 All-in-one Cards
• HQ, R&D and Production unit in Taiwan
• Battery-powered BSC with area sensor under development
smartdisplayer.com
WEB

BSC Developers: Tactilis Pte
92
2014
Founded
Singapore
HQ
Private
Type
Michael Gardiner
CEO
• Firm founded by industry seasoned professionals
• Privately funded
• Exclusive, patented manufacturing process
• Fully equipped plant in Penang, Malaysia
• Offering BSC Inlays & complete cards
• Supporting a tier-one card vendor
• Integrate secure flash up to 4GB
• Low profile communication strategy
• Key Products:
• Dual interface, energy harvesting, BSC with large area sensor card + inlay
tactilisltd.com
WEB

BSC Developers: Toshiba Corp.
93
1875
Founded
Japan
HQ
TYO: 6502
Type
Satoshi Tsunakawa
(綱川智)
CEO
• BSC developed by Toshiba Infrastructure Systems & Solutions Corp.
• First product targeting mainly ID applications
• Main specs of first BSC launched in the market:
• Contact only, no battery
• Enrolment performed on USB fingerprint scanner
• Minutiae extraction and template creation done by App on PC, then
transferred to SE
• Uses a Morix FPSF105AU Area Sensor, 8 x 8mm, 160 x 160 pixels
• Hot laminated card body
toshiba.co.jp
WEB

BSC Developers: Zwipe AS
94
2009
Founded
Norway
HQ
Private
Type
Kim Kristian Humborstad
CEO
• Strongest IP Portfolio for Biometric solutions with >50 patents
• Kuang-Chi Group partner for China JV and 20.1% stake
• First company to have trials with MasterCard
• Inlay-based solution tailored for card manufacturers
• Sensor agnostic solution, currently delivering FPC FPS
• Supplier of Dual Interface BPC Inlay to Gemalto
• Key Products:
• Access Control BSC (non-ISO, replaceable battery)
• Contactless Energy harvesting BSC (ID, Access Control)
• Dual Interface Energy Harvesting BSC inlay (Payment)
zwipe.com
WEB

BSC Developers: Whom is Offering What
95
Non-
Rechargeable
Battery
Rechargeable
Battery
+
Chip Contact
Rechargeable
Battery
+
Energy Harvesting
No Battery
+
Chip Contact
No Battery
+
Energy
Harvesting
Replaceable
Battery
Sell Complete
Card?
Sell Inlay?
CardLab ✓ ✓ ✓ ✓ ✓ ✓ ✓
Card Tech ✓ ✓ ✓ ✓
Gemalto ✓ ✓ ✓ 
Idemia ✓ ✓ ✓ ✓ 
Jinco Universal ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
Kona I ✓ ✓ ✓ 
KSID ✓ ✓ ✓ ✓ 
Lion Security ✓ ✓ 
Linxens ✓  ✓
Maneullab ✓ ✓ 
MeReal Biometrics ✓ ✓ 
Morix ✓ ✓ ✓
SmartDisplayer ✓ ✓ ✓
Tactilis ✓ ✓ ✓ ✓
Zwipe ✓ ✓ ✓ ✓

Fingerprint Sensors Developers
96

FPS Makers: Datang Microelectronics
97
1996
Founded
China
HQ
Private
Type
Yanhui Yang (杨延辉)
CEO
• Belonging to Datang Telecom Technology, a State owned 3.3B$ industrial group
• China largest design house + foundry for Smart Card ICs
• In-house development + production of Capacitive Area and Swipe sensors
• In-house development + production of MCU + RF Chip
• Business cooperation with Chengdu Finchos Electronics
• China strongest company in smart card-related development
• Key Products:
• Capacitive Sensor DMT-FS-PB4F, 208 x 288 pixel, 14.4 x 10.4 mm, 508dpi,
UnionPay and FIPS Certified
• MCU DMT-FAC-CG4Q, Core ARM SC300, EAL 4+ certified
dtm.com.cn
WEB

FPS Makers: Elan Microelectronics Corp.
98
1994
Founded
Taiwan
HQ
TPE: 2458
Type
I. H. Yeh (葉儀晧 )
CEO
• Company listed on Taiwan Stock Exchange with $750M Market Cap.
• Y2016 revenue of $218M
• HQ in Taiwan, offices also in China and USA, >1000 employees, >55% in R&D
• Products: FPS, Smart Human Interface, Notebook Input Device, MCU
• Hold multiple patents on sensors, registered in Taiwan, China and USA
• Partner on BSC cards with Jinco (FPCB + Lamination) and KSID (SE)
• Cards with Elan sensor currently under test at United Nations
• Low-power Area Sensor for Battery-Less BSC under development (target Q2/Y2018)
• Key BSC Products:
• eFSA160S-H701Z Area Sensor, 160 x 160 pixel, 8 x 8 mm
emc.com.tw
WEB

FPS Makers: Fingerprint Cards AB (1/2)
99
1997
Founded
Sweden
HQ
STO: FING-B
Type
Christian Fredrikson
CEO
• Biometric company, focus on sensors, algorithms, software and packages
• Listed in Nasdaq Stockholm, Y2016 revenue €678M, 39% operating margin
• 550 employees on 13 offices in Sweden, USA, India, China, Korea, Japan, Denmark
• Strong player in fingerprint sensors for mobile
• Offering capacitive silicon-based area and swipe sensors optimized for smart cards
• Most recent area sensors are delivered in LGA or T-Shape packaging
• Developed FPC1300-Serie optimized for smart card application:
• FPC1320, 508dpi
• FPC1321, 508dpi, smaller and lower power consumption than FPC1320
• FPC 1080A, swipe sensor, FIPS compliant
fingerprints.com
WEB

100
• The Fingerprint Cards T-Shape is a packaging option for the FPC 1300 series
• Optimized for hot lamination + milling + embedding process
Bonding PadsBezel Sensing Area
35mm TapeTape on Sensing Area act as protective layer
ExternalSide
InternalSide
FPS Makers: Fingerprint Cards AB (2/2)

FPS Makers: IDEX ASA
101
1996
Founded
Norway
HQ
OSE: IDEX
Type
Dr. Hemant K. Mardia
CEO
• Company listed on Oslo Stock Exchange with NOK 2.739B ($ 336M) Market Cap.
• Biometric company, focus on fingerprint imaging and fingerprint recognition technology
• >120 employees, with offices in Norway, UK, USA, China
• Offer silicon and polymer sensors for mobile, IoT and smart card applications
• Patented Off-Chip technology where MCU and Sensor controller are integrated under
the polymer-base sensing area
• Main offering of off-chip sensors optimized for smart cards:
• IDX3010, sensing area 8.9 x 8.9 mm, 130 x 129 pixel, 373 dpi
• IDX3200, sensing are 9.5 x 9.5 mm, 132 x 131 pixel, 350 dpi
• 13 x 13 mm sensor under development, release expected during Y2018
idex.no
WEB

FPS Makers: Infinity Electronic Biotech
102
2007
Founded
Taiwan
HQ
Private
Type
Ye Jian Tim
(葉健添 )
CEO
• Subsidiary of Super Wings International Ltd, an Hong Kong company operating in Textile
and Biometrics.
• Specialised in silicon-based capacitive fingerprint sensors
• Offering BSC-optimized sensor IFE338:
• capacitive area sensor
• 192 x 192 pixel @ 508 dpi
• I/F UART or GPIO
• Module with integrated MCU
• Module size 13.5 x 26 x 0.61 mm (W x L x T)
ifebiotech.com
WEB

FPS Makers: MoriX Co., Ltd.
103
2005
Founded
Japan
HQ
Private
Type
Morihiko Kubota
(久保田守彦)
CEO
• In-house Fingerprint Matching algorithm development
• Key specs of BSC optimized FPSF 105 AU fingerprint sensor:
• Capacitive area sensor 8 x 8 mm, 508 dpi, 160 x 160 pixels
• Built-in 8 bit ADC
• Finger present detection
• SPI Interface
• Power consumption:
• Standby mode 1.5 mA
• During fingerprint scan 7 mA
morixjp.com
WEB

FPS Makers: New Imaging Technologies
104
2005
Founded
France
HQ
Private
Type
Francois Coursaget
CEO
• French company pioneer in Wide Dynamic Range solutions
• Developer of optic-less high resolution, up to 2000 dpi, fingerprint sensors
• At least two BSC developers are working to integrate NIT sensors into their
products
new-imaging-technologies.com
WEB

FPS Makers: Next Biometrics Group AS
105
2000
Founded
Sweden
HQ
OSE: NEXT
Type
Ritu Favre
CEO
• Company listed on Oslo Stock Exchange with $80M Market Cap.
• HQ in Oslo, offices in Czech Rep., USA, Taiwan and China, 60 employees
• Core business design and commercialize flexible fingerprint sensors
• Fingerprint sensing through patented Active Thermal principle
• Manufacturing partnership with Innolux Taiwan
• Sensor used in Tactilis, and First Biometrics (under development) BSC
• Only supplier offering an ISO-Compliant area sensor (11.9 x 17.9 = 201 mm2)
• Key BSC Products:
• NB-0610-S2, 11.9 x 16.9 mm, 385 dpi,
• NB-4410-S2/I2 (sensor + flexible inlay module)
nextbiometrics.com
WEB

FPS Makers: FlexEnable Ltd
106
2015
Founded
UK
HQ
Private
Type
Chuck Milligan
CEO
• Offer flexible platform based on high performance organic thin-film transistor (OTFT)
• Company platform enables flexible, thin, robust displays
and sensors
• Key solutions for BSC:
• Capacitive fingerprint sensor
• Optical fingerprint sensor with vein sensing capability
• FlexEnable business model:
• IPs license
• Prototypes making
• Technology transfer
flexenable.com
WEB

Developers of BSC-Optimized Biometric Engines
107

Developers of BSC-Optimized Biometric Engines
Precise Biometrics ZwipeFulcrum Biometrics
Idemia id3Innovatrics
108
NeuroTechnology

BSC Key Industry Organizations
109
Russian Biometric Society
Russia
rusbiometrics.com
European Association for
Biometric
The Netherland
eab.org
Biometric Institute
UK / Australia
biometricsinstitute.org
Swedish National
Biometric Association
Sweden
biometricassociation.org
International Biometrics +
Identity Association
USA
ibia.org
Center for Biometrics and
Security Research
China
cbsr.ia.ac.cn
Fido Alliance
USA
fidoalliance.org
National Institute of
Standards and Technology
USA
nist.gov

Global BSC Shipment Forecast Y2018-2020
110
Source: ABI Research, Fingerprint Cards, Gartner, HIS Markit, Nilson Report, Precise Biometrics, Statista, Carnegie Research, Strategy Analytics, Swedbank, Antonio D’Albore estimates.
0
50
100
150
200
250
300
2018 2019 2020
MillionsofCards
Other
Access Control
ID
Payment

Global BSC ASP Forecast Y2017-2020 (K pieces)
111
$-
$5
$10
$15
$20
$25
$30
$35
$40
2017 2018 2019 2020
Clamshell BSC
Battery BSC
No battery BSC

The Future
112
• Vein sensing capability
• Blood flow / heartbeat detection
• FPS IC + RF IC integrated into Smart Card Chip
• Dynamic CVV/DCV + FPS for full CP and CNP fraud
protection
• FPS under conductive plastic
• Contactless fingerprint
• Behavioural biometric
• DNA scanner
• Associate template with finger temperature
vein pattern

Biometric Cards: latest developments (1/2)
113
• A leading company, manufacturer of secure elements has started developing a SE with
integrated interfaces for fingerprint sensor.
• Two tier-1 BSC developers are developing enrolment solutions based on POS and ATM.
• KSID is developing a new BSC with ePaper display
• Visa announces BPC trials in Mountain America Credit Union and Bank of Cyprus
• A South East Asia-based company started developing a BSC inlay targeting card
manufacturers. Product expected to be announced during Y2018.
• Idex ASA working on a new polymer-based area sensor and an innovative solution for
self-enrollment

Biometric Cards: latest developments (2/2)
114
• Toshiba launched contact-only BSC with Morix area sensor
• SmartDisplayer have started development of BSC with area sensor
• Elan is developing a low power consumption area sensor optimized for battery-less BSC
• Idemia and JCB announced launch F-Code card in Japan. Not sure if this announcement
can have any effect on the ongoing partnership between Idemia and MasterCard.
• IDEX officially announced their partnership with MasterCard
• Germany company Mühlbauer involved in customization of equipment for Milling +
Embedding of fingerprint area sensors onto cards.

ACKNOWLEDGEMENTS
115
Thank you to the following people for all their contribution, effort, motivation provided to me during this work: Ondřej
Adámek, Rouzet Agaiby, Massimo Edoardo Baumgartner, Paolo Bean, Fred Benkley, Luca Bertoletti, Fabrizio Borracci,
Adriano Canzi, Unho Choi, James Chuang, Mona Chung, Laszlo Csercsa , Renato Comelli, Thomas Decker, Pascal Dufour,
Ritu Favre, Sebastian Gallschütz, Michael Gardiner, Franck Germain, Kim Kristian Humborstad, Min-ki Jung, In-Beom Kang,
Dong Su Kim, Ariyuki Kishimoto, Charlotte Knudsen, Henrik Knudzon, Julien Larsonneur, Ted Lin, Joe Lo, Christopher A
Ludden, Hemant Mardia, Giovanni Memoli, Anne McAleer, Chuck Milligan, Marc Muller, Robert Mueller, Henning Bonde
Nielsen, Francesco Pesenti Barili, Nicolas Raffin, Michel Roig, Frank Sandeløv, Michele Scarlatella, Stan Swearingen, Mindy
Tan, Luca Tenzi, Enrico Vainieri, David B. Walshak, David Wyatt, Jin Yiwen.
Finally, to my caring, loving, and supportive wife, Tina: my deepest gratitude. Your encouragement when the times got
rough are much appreciated and duly noted. My heartfelt thanks.

Contacts
116
Antonio D’Albore
Editor-in-Chief
Embedded Security News
antonio.dalbore@embeddedsecuritynews.com
+39 392 5198737
@AndongESN
@embedded.sec.news
embeddedsecuritynews.com
Jean-François Mainguet
biometrics.mainguet.org
Fingerprint Sensors section curated by

References
117
- http://coe.int/en/web/conventions/full-list/-/conventions/treaty/005
- http://cordis.europa.eu/search/result_en?q=cardlab
- http://dhl.it/en/express/shipping/shipping_advice/lithium_batteries.html
- http://dmt.com.cn/product/aqkz/zwsb/529.html
- http://ec.europa.eu/justice/policies/privacy/docs/95-46-ce/dir1995-46_part1_en.pdf
- https://en.wikipedia.org/wiki/Biometrics
- https://en.wikipedia.org/wiki/Data_Protection_Directive
- https://en.wikipedia.org/wiki/General_Data_Protection_Regulation
- https://en.wikipedia.org/wiki/Fingerprint_recognition
- https://en.wikipedia.org/wiki/Personally_identifiable_information
- https://en.wikipedia.org/wiki/Supercapacitor
- http://fingertec.com/download/tips/whitepaper-01.pdf
- http://www.gemalto.com/govt/biometrics/biometric-data
- http://heritage.org/homeland-security/report/biometric-technologies-security-legal-and-policy-implications
- http://horizon2020projects.com/special-reports/technical-information-card-fraud-identity-theft-protection-
technologies/
- http://iata.org/whatwedo/cargo/dgr/Pages/lithium-batteries.aspx
- https://www.icao.int/Meetings/a38/Documents/WP/wp094_en.pdf
- https://www.icao.int/publications/pages/publication.aspx?docnum=9303

References
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- https://www.icao.int/publications/Documents/9303_p9_cons_en.pdf
- https://www.icao.int/publications/Documents/9303_p10_cons_en.pdf
- http://www.isorg.fr/
- http://legacy.emvco.com/faq.aspx?id=319
- https://www.level2kernel.com/emv-contactless-kernel-system-functions-configurations.html
- http://www.mainguet.org/
- https://www.mastercardconnect.com/
- https://ncbi.nlm.nih.gov/pubmed/19006507
- http://nvlpubs.nist.gov/nistpubs/Legacy/SP/nistspecialpublication800-122.pdf
- http://patentexaminer.org/wp-content/uploads/2011/09/SmartMetric.MC_.2.Complaint_small.pdf
- http://patentexaminer.org/wp-content/uploads/2011/09/SMME_v_MasterCard_1.pdf
- http://prba.org/wp-content/uploads/IATA-Lithium-Battery-Guidance-2017-1.pdf
- https://www.quardlock.com/
- https://www.sec.gov/Archives/edgar/data/1301991/000114420415058083/v421136_ex10-8.htm
- https://scribd.com/doc/316791717/Special-Report-Biometrics-and-Border-Security
- https://uni-kassel.de/fb07/fileadmin/datas/fb07/5-Institute/IWR/Hornung/isse_2004_47-
57_biometric_identity_cards.pdf
- https://ups.com/media/news/en/ca/intl_lithium_battery_regulations.pdf

References
119
- https://www.youtube.com/watch?v=jw_4uaRNsBA&t=1228s
- https://www.youtube.com/watch?v=VESg5mPWk34&t=21s

References
120
Struif, B.: Use of Biometrics for User Verification in Electronic Signature Smartcards. In: Attali, S., Jensen, T. (eds.) E-smart 2001. LNCS,
vol. 2140, pp. 220–227. Springer, Heidelberg (2001)
Murdoch, S.J., Drimer, S., Anderson, R., Bond, M.: Chip and PIN is broken. In: 2010 IEEE Symposium on Security and Privacy (2010)
Biometric Application Programming Interface (API) for Java Card, NIST/Biometric Consortium Biometric Interoperability, Assurance, and
Performance Working Group, version 1.1 (August 2002)
Henniger O., Nikolov D. (2013) Extending EMV Payment Smart Cards with Biometric On-Card Verification. In: Fischer-Hübner S., de Leeuw
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Specs
121
ISO/IEC 7816-4:2013 Identification cards – Integrated circuit cards – Part 4: Organization, security and commands for
interchange
ISO/IEC 7816-11:2014 Identification cards – Integrated circuit cards – Personal verification through biometric methods
ISO/IEC 9797-2:2011 Information technology – Security techniques – Message Authentication Codes (MACs) – Part 2: Mechanisms
using a dedicated hash-function
ISO/IEC 17839-1:2014 Biometric System-on-Card: Core requirements
ISO/IEC 17839-2:2015 Biometric System-on-Card: Physical characteristics
ISO/IEC 17839-3:2016 Biometric System-on-Card: Logical information interchange mechanism
ISO/IEC 18033-2:2006 Information technology – Security techniques – Encryption algorithms – Part 2: Asymmetric ciphers
ISO/IEC 18033-3:2010 Information technology – Security techniques – Encryption algorithms – Part 3: Block ciphers
ISO/IEC 19092:2008 -- Financial services -- Biometrics -- Security framework
ISO/IEC 19785-3 Information technology – Common Biometric Exchange Formats Framework – Patron format specifications
ISO/IEC 19794-1:2011 - Information technology -- Biometric data interchange formats -- Part 1: Framework
ISO/IEC 19794-2:2011 - Information technology –- Biometric data interchange formats –- Part 2: Finger minutiae data
ISO/IEC 19794-2:2011/Cor 1:2012 - XML encoding and clarification of defects
ISO/IEC 19794-2:2011/Amd 1:2013 - Conformance testing methodology and clarification of defects
ISO/IEC 19794-2:2011/Amd 2:2015 - Conformance testing methodology and clarification of defects
ISO/IEC 19794-3:2006 - Information technology -- Biometric data interchange formats -- Part 3: Finger pattern spectral data
ISO/IEC 19794-4:2011 - Information technology -- Biometric data interchange formats -- Part 4: Finger image data
ISO/IEC 19794-5:2011 - Information technology -- Biometric data interchange formats -- Part 5: Face image data
ISO/IEC 19794-6:2014 - Information technology -- Biometric data interchange formats -- Part 6: Iris image data
ISO/IEC 19794-7:2014 - Information technology -- Biometric data interchange formats -- Part 7: Signature/sign time series
data
ISO/IEC 19794-8:2011 -- Information technology -- Biometric data interchange formats -- Part 8: Finger pattern skeletal data
ISO/IEC 19794-9:2011 -- Information technology -- Biometric data interchange formats -- Part 9: Vascular image data
ISO/IEC 19794-10:2007 -- Information technology -- Biometric data interchange formats -- Part 10: Hand geometry silhouette
data
EMV® Specification Bulletin No. 185 - First Edition March 2017 - Biometric Terminal Specification

Patents (1/5)
122
CA 02581230 C Apparatus for fingerprint sensing and other measurements
CN 2010 20665177 非接触式包含指纹辨识的电子智能卡片 (Non-contact intelligent electronic card comprising
fingerprint identification )
CN 2010 20671893 非接触式电子式智慧卡片 (Non-contact electronic smart card )
CN 2015 20355127 智慧卡片指纹按压装置 (Wisdom card fingerprint press device)
CN 2016 02176914 U Fingerprint identification smart card
DE 2002 10257111 A1 Chipcard and method for production of a chipcard
DE 2016 10101609 A1 Authentifikationsvorrichtung, Authentifikationsdokument und Verfahren zur
Authentifizierung einer Person
DE 2016 10201976 B3 Vorrichtung und Verfahren zur Bearbeitung eines Substrats
GB 2012 00019750 D0 Enrolling fingerprints by combining image strips to obtain sufficient width
GB 2013 00004639 D0 Fingerprint sensor
GB 2015 00022870 D0 Biometric smartcard with multiple modes of operation
GB 2015 00008294 D0 Biometric enrolment authorisation
GB 2015 00008296 D0 Contactless biometric identification device allowing multiple configurations
GB 2016 00000892 D0 Low thickness biometric card
GB 2016 00003099 D0 One-time password device
GB 2016 00004138 D0 Apparatus for testing a battery-powered device
GB 2016 00009572 D0 Smartcard and method for controlling a smartcard
GB 2016 00014998 D0 Biometric smartcard for providing feedback to a user
GB 2017 00004847 D0 Calibration method
GB 2017 00006460 D0 Biometric smartcard

Patents (2/5)
123
IT 2006 UD00028 A1 Carta Elettronica Universale Personale
IT 2006 UD00046 A1 Metodo Per Realizzare Una Scheda Personale Sicura E Suo Processo Di Funzionamento
IT 2006 UD00075 A1 A method for making a secure personal card and its working process
JP 2011 0105750 A ic card with fingerprint authentication
JP 2014 0529123 A Biometric authentication available smart card
JP 2016 0115098 A 指紋認証付スマートカードとこれを用いた決済方法
(Smart card with fingerprint authentication and settlement method using the same)
KR 2014 0164109 B1 RF Smart Combi-card Of Fingerprint Type And Dealing Method Thereof
KR 2015 0056437 RF Smart Card Of Fingerprint Type With Battery
KR 2015 0121247 Fingerprint Recognition Card and Authentication Method Using the Same
KR 2015 0180446 B2 Smart Card Integrated With Thermoelement And Fingerprint Verification Chip As Laminated
Structure
KR 2016 0064133 A Smart Card Comprising Fingerprint Detecting Device And Method For Driving The Same
KR 2016 0090633 A Smart Card And A Fingerprint Recognition System Using Thereof
KR 2016 0125877 A RF Smart Card of Fingerprint Type with Battery
KR 2016 0129832 B1 Fingerprint Smart Card Having A Prevention Function Forged Fingerprint
TW 2010 0009718 A Method of manufacturing secure personal card and manufacturing processes thereof
TW 2016 0029842 A Fingerprint press device for smart card
TW 2016 0202811 U Switch structure of electronic module

Patents (3/5)
124
US 1983 4621190 A Card with an IC module
US 1999 6325285 B1 Smart card with integrated fingerprint reader
US 2004 0129787 A1 Secure biometric verification of identity
US 2005 0178827 A1 Flexible fingerprint sensor arrays
US 2005 0212657 A1 Identity verification system with self-authenticating card
US 2006 0000892 A1 Method for biometric security using a smartcard
US 2006 0000899 A1 Method and system for dna recognition biometrics on a smartcard
US 2006 0113381 A1 Batteryless contact fingerprint-enabled smartcard that enables contactless capability
US 2007 0223179 A1 Fingerprint recognition smart card
US 2007 0228154 A1 System and method for sensing biometric and non-biometric smart card devices
US 2008 0164325 A1 Universal Smart Card
US 2008 0054875 A1 Biometric sensor and sensor panel
US 2008 0040615 A1 Biometric embedded devicer
US 2009 0084858 A1 Method For Making A Secure Personal Card And Its Working Process
US 2012 0241524 A1 Activation and indication of an RF field on a device including a chip
US 2013 0036463 A1 Biometric-enabled smart card
US 2013 0320464 A1 Integrally molded die and bezel structure for fingerprint sensors and the like
US 2015 0049925 A1 Method of manufacturing an electronic card
US 2015 0286855 A1 Fingerprint matching algorithm
US 2015 0371077 A1 Fingerprint recognition for low computing power applications
US 2015 0379250 A1 Secure biometric verification of identity
US 2017 0161528 A1 Smart card systems comprising a card and a carrier
US 2017 0213097 A1 Flexible Card with Fingerprint Sensor
US 2017 0213122 A1 Document with Sensor Means

Patents (4/5)
125
US 2017 0228631 A1 Smartcard and method for controlling a smartcard
US 2017 0262692 A1 Capacitive Fingerprint sensing Device and Methon for Capturing a fingerprint using the
sensing device
USD 693874 S1 Electronic payment card with biometric verification means
USD 776664 S1 Smart card
USD 786355 S1 Smart card with a chip and finger-print sensor
USD 788847 S1 Smart card with a chip and finger-print sensor
USD 791772 S1 Smart card with a fingerprint sensor
WO 1998 052735 A1 Method of making smart cards
WO 2011 083241 A1 Multiple application chip card having biometric validation
WO 2006 080929 A1 Method of making a memory card by injection molding
WO 2013 155040 A1 Smart connect devices for the interconnectivity of data cards with computing devices to
enable the performance of various functions upon authentication by a user's fingerprint
and/or a user's photograph
WO 2013 160011 A1 Method of manufacturing an electronic card
WO 2016 016129 A1 Multi-layer composite for a security and/or value document and method for producing same
WO 2016 055660 A1 Contactless Biometric Identification Device Allowing Multiple Configurations
WO 2016 055661 A1 Biometric enrolment authorisation
WO 2016 055662 A1 Power load management
WO 2016 055663 A1 Power harvesting in a passive rfid device
WO 2016 055665 A1 Self-contained fingerprint identification device

Patents (5/5)
WO 2016 160816 A1 Smart data cards that enable the performance of various functions upon
activation/authentication by a user's fingerprint, oncard pin number entry, and/or by
facial recognition of the user, or by facial recognition of a user alone, including an
automated changing security number that is displayed on a screen on a card's surface
following an authenticated biometric match
WO 2016 190678 A1 Smart Card Including Fingerprint Detection Device And Driving Method Therefor
WO 2017 017085 A1 Smart card with main application and persistence application
WO 2017 025479 A1 Security protected passive rfid device
WO 2017 025481 A1 Power optimization
WO 2017 064097 A1 Multiple finger fingerprint authentication device
WO 2017 081268 A1 Value or security document made of a fiber composite material, and method for producing
the value or security document
WO 2017 089216 A1 Identification document and method for identifying an individual
WO 2017 093514 A1 Fingerprint card
WO 2017 093516 A1 Biometric card
WO 2017 102699 A1 Id token having a protected microcontroller
WO 2017 102984 A1 Device
WO 2017 109173 A1 Biometric device
126

The Rise of Biometric Cards - Edition February 2018

The Rise of Biometric Cards - Edition February 2018

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