USN Services
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This document discusses how printed electronics technology can enable ubiquitous sensing network (USN) services. It begins with an introduction and overview of printed electronics. It then discusses several potential applications of the technology, including future internet/consumer applications, energy efficient buildings, and factories of the future. Specific use cases are described for each application area. The document also covers topics like technology comparisons and the role of digital content in enabling new services and devices. In general, the document argues that printed electronics can support the development of integrated smart systems and ubiquitous sensing networks through lower-cost manufacturing approaches.
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USN Services
- 1. USN Services enabled by Printed Electronics Technology Dr. Andreas Schaller ASC Andreas Schaller Technology Consulting info@andreas-schaller.de USN Services enabled by Printed Electronics Technology 1
- 2. Agenda 1. Introduction - ASC / EUView on the Internet of Things 2. Future Internet / B2C Applications - Use Case 3. Energy Efficient Buildings / Public Applications - Use Case 4. Factories of the Future / B2B Applications - Use Case 5. Technology Comparison 6. Summary USN Services enabled by Printed Electronics Technology 2
- 3. ICT Drivers USN Services enabled by Printed Electronics Technology 3 1990 1996 2002 2008 2014 BillionofPhones Year 1 2 3 Voice Data Media Sensors 4 Trends 5 6 IOT
- 4. Electronics Technology USN Services enabled by Printed Electronics Technology 4 1985 1990 1995 2000 2005 2010 ->- 1980 Television TV-Set Computer C64 Recorder DVD Digital Sony Mavica Portable Nokia 5110 Mobile Razr Wearable Ipod nano Embedded Silicon Product Example 8088 386 486 Pentium Pentium 4 Core 2 Core 4 Transitor Volume 5000 275000 1600000 3100000 42000000 200000000 2000000000 Feature Size 2 µm 1.5 µm 0.8 µm 0.35 µm 0.13 µm 65 nm 45 nm IC Packages Package Example DIP PLCC QFP FQFP BGA CSP SiP/MCM Package Type Pin Pin Lead Lead Ball Ball Ball Pitch Size 2.5 mm 1.7 mm 1.0 mm 0.4 - 1.0 mm 0.7–1.5 mm 0.5 mm 0.25–0.4 mm Small IC Packaging Package Example SOT-23 SOIC SOP Package Type Lead Lead Lead Pitch Size 3mm 1.7 mm 0.65 mm Passive Components Package Example 1206 0603 0402 0201 01005 Pitch Size 2.5 mm 2.5 mm 3.2 mm × 1.6 mm 1.6 mm × 0.8 mm 1.0 mm × 0.5 mm 0.6 mm × 0.3 mm 0.4 mm × 0.2 mm Package Technology THT THT SMT SMT SMT SMT SMT Interconnect Technology Component Placement THT THT/SMT SMT ( Descrete + IC ) SMT ( Descrete + IC ) SMT ( Descrete + IC ) SMT (Mix ) SMT (Mix ) Material Curing Wavesoldering Wave/Reflowsoldering Reflow ( 220° C ) Reflow ( 220° C ) Reflow ( 250° C ) Reflow ( 250° C ) Reflow ( 250° C ) Mfg-Concept Batch Processing Batch Processing in-line (1-Sided) in-line (2-Sided) in-line (2-Sided/dual line) in-line (2-Sided/dual line) in-line (2-Sided/dual line) Printed Wiring Board Process Subtractive Subtractive Subtractive Subtractive Subtractive Subtractive / Semi-additive Layers Soldermask Multilayer/drilling Via /Laserdrilling Micro-Via / HDI Line Space/Width 100/100 100/100 75/75 50/50 50/50 40/40 25/25 Product Sample
- 5. Future ICT Driver and Markets ”Internet of Things” USN Services enabled by Printed Electronics Technology 5 Green Cars Factories of the Future Energy-efficient Buildings Future Internet • Microelectronics • Ubiquitous positioning • Wirelessly communicating smart systems • Non-silicon based components • Energy harvesting technologies • Privacy- and security-by-design Surface Mount Technology Printed Technology Embedded Intelligence Integrated Smart Systems
- 6. Integrated Smart Systems Main devices and applications USN Services enabled by Printed Electronics Technology 6
- 7. Future Internet USN Services enabled by Printed Electronics Technology 7 GPS Library Social Networks Location AR Payment Coupons Loyalty TV/Cinema Flight Ticketing Product Info Wellness Ticketing Gaming Sport B2C OLED Smart Packaging Diagnosis Large Area Sensors Future Internet
- 8. Large Area Sensors Integrated Pyro/Piezoelectric Sensors • Capacitive sensor part is based on ferroelectric polymer • Sensor response to ΔT, Δp controls the transistor‘s gate • Transistor transforms high-impedance sensor signal to low-impedance output • Monolithically integrated on flexible substrate USN Services enabled by Printed Electronics Technology 8 p ~ 40 µC/m2K d33 = 24 pC /N VG VDS VG VDS Sensor TransistorsIntegrated organic physical sensor
- 9. Human-Machine Interface All-printed sensor with ACREO display • Control with/without touch • Minimized number of materials • Large Areas Electronics • Very robust USN Services enabled by Printed Electronics Technology 9 http://cid-2e87bf9055410c4c.photos.live.com/self.aspx/ASC-Andreas%20Schaller%20Technology%20Consulting/3Plast.wmv
- 10. HMI Applications SensorFunctionality Sort Select PointArray PointArray Several Suppliers 3Plast Demonstrator Several Suppliers Source : GestIC Source : gesture-cube Laser Source : Microsoft Source : Apple Sensor TypeDo not touch Source : Motorola Can not touch SensorFunctionality Sort Select Sensor Type USN Services enabled by Printed Electronics Technology 10
- 11. Energy Efficient Buildings USN Services enabled by Printed Electronics Technology 11 Public HealthPublic Safety E-Government Public Transportation Digital Library Energy Health Care Environment Public Places Traffic Control Pu blic Energy- efficient Buildings Smart Packaging Diagnosis Clean Energy Lighting
- 12. Use Case Mildew Watch Dog USN Services enabled by Printed Electronics Technology 12 Write Function : Sensing Energy Harvesting EventData Function : Storing Information Function : Computing Function : Connecting Energy Harvesting Knowledge Read/Write • Type : RFID Label • Size : 180 mm x 10 mm • Standard : UHF (868 MHz) EPC • Memory : 1-Bit WORM • Sensor : Water Detection (Alarm) • Function : Sensor based Antenna Activation • Price : est. ~ 0,30 € • NEXT STEP : Wireless Activation !
- 13. Manufacturing Concept USN Services enabled by Printed Electronics Technology EPC GEN2 Chip Printed Antenna Inkjet Printed PriMeBits Solution RFID Tag Sensing Sensitivity driven by paper selection ! Low Cost Approach Pore radius (µm) d(V/A)dr((cm3/m2)/I) The five-lines WORM resistance changing w ith w ater drops 1 10 100 1000 10000 100000 1000000 10000000 0 1 2 3 4 5 6 The number of the w ater drops TheWORMresistance(ohm) pre-sintered no pre-sintered The five-lines WORM resistance changing in 80% humidity 1 10 100 1000 10000 100000 1000000 10000000 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Time ( h ) TheWORMresistance(ohm) pre-sintered no pre-sintered Resistivity(Ohm)Resistivity(Ohm) Time (h) # waterdrops 80% 13
- 14. Triple Tag and Reader USN Services enabled by Printed Electronics Technology Power Difference Measurement Future Alternative : RSSI (Receive Signal Strength Indicator) Tag# ∆dBm Prototype Package Reference Actual Historical 14
- 15. Factories of the Future USN Services enabled by Printed Electronics Technology 15 M2M Mobile Office CRM Email Business Processes Cold Chain B2 B Apparel Transportation Authen- tication Logistics Compliance Shop Floor Factory Floor Factories of the Future Smart Packaging OLED Large Area Sensors
- 16. Smart Packaging drives Pharmacy Services USN Services enabled by Printed Electronics Technology 16 © Stora Enso © Stora Enso © Stora Enso Pharmacy Logistics Personal Care Medical Compliance http://www.rfidjournal.com/article/view/7848 http://81.209.16.38/Link.aspx?id=1034686 http://www.rfidjournal.com/article/view/7785 - Digital content driven services in pharmacy needs new smart packaging solutions - Smoother integration of electronics in packaging is required Data Logging Event Detection Human Machine Interface
- 17. Low Cost Printed Memory USN Services enabled by Printed Electronics Technology 17 Demonstration roll-to-roll run • direct gravure • produced length > 150m • roll-to-roll die-cut • encapsulation: manual hot lamination ROKO pilot line © VTT © VTT © EPFL ©Nicanti •resistive memory: electrically induced sintering (high-resistance->low-resistance) •key point : electrically post-fabrication programmable Uwrite= 10 V and Rs= 330 Ω.
- 18. Questionnaire Card USN Services enabled by Printed Electronics Technology 18
- 19. Technology Comparison USN Services enabled by Printed Electronics Technology 19 Level 5 Connections between systems Ambient Intelligence Level 4 Subassembly System Integration Level 3 Connections between PWBs Smart System Level 2 Printed Wiring Board (PWB) System-in-Foil Level 1 Integrated Circuits Functional Layers Level 0 Monolithic Silicon Chip Printable Ink Silver Ink Printed Antenna RFID Label Battery Assisted Label Smart Package RFID System Surface Mount Technology Printed Electronic Technology
- 20. Technology Comparison USN Services enabled by Printed Electronics Technology 20 $$$CO2 Assumptions : - Production environment not included - Battery MFG not included, only BOM - Recycling not included
- 21. New Content=New Service=New Device USN Services enabled by Printed Electronics Technology 21 - Digital Content drives Services and new Devices - New digitalized content needs a new device to create a commercially successful Service Source : Stora EnsoSource : Sensible Solutions Construction Pharmacy Human Machine Interface Source : 3Plast
- 22. Questions ? USN Services enabled by Printed Electronics Technology 22 Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt) Dr. Andreas Schaller Email : andreas@andreas-schaller.de Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt) Office : Schulstr. 11, 95676 Wiesau Management : Dr. Andreas Schaller District Court : AG Weiden, HRB 3499