Xilinx XC7Z020-Based Processor Module Combining the performance of two-core ARM® Cortex-A9 and the flexibility and programmability of 7th generation FPGA
2. Full datasheet
Page 2 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
Document history
HISTORYHISTORYHISTORYHISTORY
VERSIONVERSIONVERSIONVERSION VERSIONVERSIONVERSIONVERSION VERSIONVERSIONVERSIONVERSION
1.0.0
4-sep-2012
17:26
First draft version
1.1.0
12-nov-2012
10:16
Pin tables added
1.2.0
06-feb-2012
09:16
Components and connectors locating added. Name of motherboard connectors
fixed.
1.3.0
15-feb-2012
09:16
Fixed issue in Pinout.
3. Full datasheet
Page 3 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1. General information
The module AX-SOM-XC7Z020 – is high performance, high integrated and compact
module with optimal price. This module - ideal solution for building such embedded
devices as: medical equipment, video equipment, industrial controllers (PLCs),
multimedia devices and others, where a lot of peripheral modules is used and high
performance requires.
For module ready next BSPs:
Embedded Linux
Windows Embedded Compact 7
eCOS 3.0
FreeRTOS
4. Full datasheet
Page 4 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.1. Short description
Xilinx Zynq XC7Z020:
o 667-, 733-, 800 MHz ARM® 2 x Cortex-A9 MPCore
o VFP and NEON® SIMD instructions support
o TrustZone® support
o 3 x Watchdog timers
o L1 32KB I-Cache/32KB D-Cache, 512KB L2 Cache
o Hardware encryption blocks (AES, SHA)
o 85K Logic Cells Artix-7 FPGA
o 2x AXI 32b Master, 2x AXI 32b Slave
o 4x AXI 64b/32b memory windows between FPGA and PS
o AXI 64b ACP
o DMA
Up to 8Gbit DDR3 RAM
Up to 8Gbit NAND Flash
Up to 64Mbit QSPI Flash
Network: 2 x EMAC/GMAC (10/100/1G) with IEEE 1588v2 support
2 x USB 2.0 High Speed OTG (480 Mbit/s)
2 x MMC/SD/SDIO
2 x CAN 2.0 A/B
2 x UART
2 x I2C
2 x SPI
2 x XADC (12b)
GPIO
33,333MHz main oscillator
Power supply range for module 3,0…5,5V
Possible to set various I/O bank voltage
Module dimensions 56mm x 50mm
Small board to board connectors with 0,6mm step (Hirose FX8-120S-SV)
5. Full datasheet
Page 5 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.1. Functional description
Fig. 1: Functional diagram of the module
XC7Z020
@ 800MHz
DC/DCs
QSPI
Flash
16 MB
NAND
Flash
256MB..1GB
DDR3
256MB..1GB
@ 533MHzConnectors
2 x Hirose2 x Hirose2 x Hirose2 x Hirose
FX8FX8FX8FX8----120S120S120S120S----SVSVSVSV
DDRC
6. Full datasheet
Page 6 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.1. Description of the functional blocks
1.1.1. Xilinx Zynq-7000 XC7Z020 platform
Used Xilinx Zynq XC7Z020 in CLG484 package as main SoC.
1.1.2. DDR3 memory
By default, is used DDR3 Samsung K4B1G1646G-BCH9, with 256MBytes size
(Can be expanded up to 1GByte).
Beginning of DDR3 – 0x0000 0000 (Depends on OCM configuration).
1.1.3. QSPI Flash memory
By default, is used QSPI Flash Flash memory Numonyx N25Q128A11B1241F with
16MBytes.
QSPI Flash memory connected to QSPI0 bus.
1.1.4. NAND Flash memory
By default, is used NAND Flash memory Samsung MT29F4G08ABBDAHC-IT:D,
with 512MBytes size (Can be expanded up to 1GByte).
Bus connected to NAND interface with 8-bit bus width.
Take care about MIO: QSPI and NAND are using some same pins.Take care about MIO: QSPI and NAND are using some same pins.Take care about MIO: QSPI and NAND are using some same pins.Take care about MIO: QSPI and NAND are using some same pins.
1.1.5. Power supply
For VCCINT and VCCPINT (1,0V) are used DC/DC Micrel MIC22705YML. For
VCCO_DDR and PS_DDR (1,5V) are used LDO Micrel MIC38300HYHL. For VCCAUX,
VCCPAUX, VCCBRAM, VCCO_0, RSVDVCC, VCCADC, VCCO_MIO0_500, QSPI Flash,
NAND Flash (1,8V) are used LDO Micrel MIC38300HYHL. For DDR3 VREF_DDR is used TI
TPS51200DRC. For power sequencing is used Analog Devices ADM1185ARMZ-1.
1.1.6. Boot mode for Xilinx Zynq-7000 XC7Z020
User can select next boot modes according EPP Technical reference manual and
using BOOT_DEV[2:1] pins:
BOOT_DEV[2:1] = 00000000 ---- JTAG bootJTAG bootJTAG bootJTAG boot (need set JTAG_INDEP to 0)
BOOT_DEV[2:1] = 01010101 ---- NAND bootNAND bootNAND bootNAND boot
BOOT_DEV[2:1] = 10101010 ---- QSPI bootQSPI bootQSPI bootQSPI boot
BOOT_DEV[2:1] = 11111111 ---- SD bootSD bootSD bootSD boot
“1” means connection to 1,8V and “0” means connection to GND.
7. Full datasheet
Page 7 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.2. Connector description
For connection with motherboard 2 x Hirose FX8-120P-SV connectors (with 0,6 mm
step) are used.
1.2.1. The physical location of the connectors
Fig. 2: Locating components on the front of the module
Xilinx
Zynq
DDR3
NAND QSPI
Flash
DC/DC
DDR3
««««DONEDONEDONEDONE»»»» LEDLEDLEDLED
««««nPORnPORnPORnPOR»»»» LEDLEDLEDLED
LDO
LDO
8. Full datasheet
Page 8 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
Fig. 3: Locating connectors on the rear of the module
1.2.2. Signal description on X1-X2 connectors
Please take care about supported I/O voltage when connecting to pins.
Pin type:
MIO_1.8V - PS Digital I/O with 1,8V levels;
MIO_S - PS Digital I/O with selected voltage levels;
FPGA I/O - PL I/O with selected voltage levels;
Analog - Analog I/O;
Power in - Power input line;
Power out - Power output line;
Ground - Ground;
- - Other.
X1 (MIO)
X2 (FPGA)
1
2 120
119
1
2
119
120
9. Full datasheet
Page 9 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.1.1.1. X1 connector (PS MIO)
Pin
number
Signal Name GPIO Type Processor’s ball Note
1 VCC_IN Power in
2 ZNQ_TDI H13
3 VCC_IN Power in
4 ZNQ_TDO G14
5 VCC_IN Power in
6 ZNQ_TMS G12
7 VCC_IN Power in
8 ZNQ_TCK G11
9 VCC_IN Power in
10 nPOR
11 VCC_IN Power in
12 VCCBATT G9
13 VCC_IN Power in
14 nSRST
15 VCC_IN Power in
16 VCC_1.8V
17 VCC_IN Power in
18 GND Ground
19 VCC_IN Power in
20 MIO[49] GPIO1_49 C14
21 VCC_IN Power in
22 MIO[22] GPIO0_22 A14
23 VCC_IN Power in
24 MIO[37] GPIO1_37 B14
25 VCC_IN Power in
26 MIO[26] GPIO0_26 A13
27 VCC_IN Power in
28 MIO[34] GPIO1_34 B12
29 VCC_IN Power in
30 MIO[28] GPIO0_28 A12
31 GND Ground
32 MIO[43] GPIO1_43 B11
33 GND Ground
34 MIO[30] GPIO0_30 A11
35 GND Ground
36 MIO[47] GPIO1_47 B10
37 GND Ground
38 MIO[45] GPIO1_45 B9
39 GND Ground
40 MIO[35] GPIO1_35 F14
41 GND Ground
42 MIO[40] GPIO1_40 E14
43 GND Ground
44 GND Ground
45 GND Ground
46 MIO[39] GPIO1_39 C13
47 GND Ground
48 MIO[50] GPIO1_50 D13
49 GND Ground
50 MIO[44] GPIO1_44 E13
51 GND Ground
52 MIO[38] GPIO1_38 F13
53 GND Ground
54 MIO[53] GPIO1_53 C12
55 VCCMIO_1
56 MIO[46] GPIO1_46 D12
13. Full datasheet
Page 13 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
115 VCCIO_35_INPUT Power in
116 IO_L9N_T1_DQS_AD3N_35 A17
117 VCCIO_35_INPUT Power in
118 IO_L9P_T1_DQS_AD3P_35 A16
119 VCCIO_35_INPUT Power in
120 GND Ground
14. Full datasheet
Page 14 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.2. Mechanical Outline
Fig. 4: Mechanical outline (top view)
15. Full datasheet
Page 15 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
Fig. 5: Mechanical outline and Bottom Connectors (bottom view)
• DXF or STEP model on request
16. Full datasheet
Page 16 Full datasheet: Processor module based on Xilinx Zynq XC7Z020
1.3. Electrical specification
Parameter Min Normal Max Unit
Power supply,
VCC_IN
3,0 3,3 5,5 V
Power consumption TBD TBD TBD mA
Please note that the output of the 1.0 V regulator is limited to 4 A. Please use the Xilinx XPower
Analyzer to estimate the power consumption of your design.
1.4. Order code
AXAXAXAX----SoMSoMSoMSoM----XC7Z020CESXC7Z020CESXC7Z020CESXC7Z020CES----RxRxRxRx----NxNxNxNx----SSSS16161616----IIII
XC7Z020CES – Engineering sample;
XC7Z020 – Final version of Zynq SoC (now not accessible);
Rx – DDR3 RAM size, [256, 512, 1024] – example: 256 MBytes DDR3 RAM – R256;
Nx – NAND Flash size, [256, 512, 1024] – example: 256 MBytes NAND Flash – N256;
I – industrial temp range.
Order example:
AX-SoM-XC7Z020CES-R256-N256,
with this order code, on module will be installed next configuration: Xilinx XC7Z020CES, 256 MBytes
DDR3 RAM, 256 MBytes NAND Flash and without QSPI Flash. All components in commercial
temperature range.
By default, this module shipped with Embedded Linux OS.