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September 2013 Rev 6 1/18
1
TDA7850
4 x 50 W MOSFET quad bridge power amplifier
Features
■ High output power capability:
– 4 x 50 W/4  max.
– 4 x 30 W/4  @ 14.4 V, 1 kHz, 10 %
– 4 x 80 W/2  max.
– 4 x 55 W/2  @ 14.4V, 1 kHz, 10 %
■ MOSFET output power stage
■ Excellent 2  driving capability
■ Hi-Fi class distortion
■ Low output noise
■ ST-BY function
■ Mute function
■ Automute at min. supply voltage detection
■ Low external component count:
– Internally fixed gain (26 dB)
– No external compensation
– No bootstrap capacitors
■ On board 0.35 A high side driver
Protections:
■ Output short circuit to gnd, to Vs, across the
load
■ Very inductive loads
■ Overrating chip temperature with soft thermal
limiter
■ Output DC offset detection
■ Load dump voltage
■ Fortuitous open gnd
■ Reversed battery
■ ESD
Description
The TDA7850 is a breakthrough MOSFET
technology class AB audio power amplifier in
Flexiwatt 25 package designed for high power car
radio. The fully complementary P-Channel/N-
Channel output structure allows a rail to rail
output voltage swing which, combined with high
output current and minimized saturation losses
sets new power references in the car-radio field,
with unparalleled distortion performances.
The TDA7850 integrates a DC offset detector.
Flexiwatt25
(Vertical)
Flexiwatt25
(Horizontal)
Table 1. Device summary
Order code Package Packing
TDA7850 Flexiwatt25 (Vertical) Tube
TDA7850H Flexiwatt25 (Horizontal Tube
www.st.com
Contents TDA7850
2/18
Contents
1 Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2 Standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.3 Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.4 DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.5 Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
TDA7850 List of tables
3/18
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
List of figures TDA7850
4/18
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Standard test and application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Components and top copper layer of the Figure 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Bottom copper layer Figure 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Output power vs. supply voltage (RL = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Output power vs. supply voltage (RL = 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Distortion vs. output power (RL = 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 10. Distortion vs. output power (RL = 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 11. Distortion vs. frequency (RL = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 12. Distortion vs. frequency (RL = 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14. Supply voltage rejection vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 15. Output attenuation vs. supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 16. Power dissipation and efficiency vs. output power (RL = 4, SINE) . . . . . . . . . . . . . . . . . 12
Figure 17. Power dissipation and efficiency vs. output power (RL = 2, SINE) . . . . . . . . . . . . . . . . . 12
Figure 18. Power dissipation vs. output power (RL = 4, audio program simulation) . . . . . . . . . . . . . 13
Figure 19. Power dissipation vs. output power (RL = 2, audio program simulation) . . . . . . . . . . . . . 13
Figure 20. ITU R-ARM frequency response, weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 13
Figure 21. Flexiwatt25 (vertical) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . 15
Figure 22. Flexiwatt25 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 16
TDA7850 Block diagram and application circuit
5/18
1 Block diagram and application circuit
1.1 Block diagram
Figure 1. Block diagram
1.2 Standard test and application circuit
Figure 2. Standard test and application circuit
IN1
0.1μF
MUTE
ST-BY
IN2
0.1μF
OUT1+
OUT1-
OUT2+
OUT2-
PW-GND
IN3
0.1μF
IN4
0.1μF
OUT3+
OUT3-
OUT4+
OUT4-
PW-GND
PW-GND
PW-GND
D94AU158D
AC-GND
0.47μF 47μF
SVR TAB S-GND
Vcc1 Vcc2
100nF470μF
HSD/VOFF_DETHSD
IN1
0.1μF
C9
1μF
IN2
C2 0.1μF
OUT1
OUT2
IN3
C3 0.1μF
IN4
C4 0.1μF
OUT3
OUT4
D95AU335C
C5
0.47μF
C6
47μF
SVR TAB
Vcc1-2 Vcc3-4
C8
0.1μF
C7
2200μF
C10
1μF
ST-BY
R1
10K
R3
*)
R2
47K
MUTE
C1
14
15
12
11
22
4
13
S-GND
16 10 25 1
HSD/OD
6 20
9
8
7
5
2
3
17
18
19
21
24
23
*) R3 = 10kΩ to be placed when pin 25 is used as offset detector.
Pin description TDA7850
6/18
2 Pin description
Figure 3. Pin connection (top view)
D94AU159A
TAB
P-GND2
OUT2-
ST-BY
OUT2+
VCC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
VCC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
25
D06AU1655
TAB
P-GND2
OUT2-
ST-BY
OUT2+
VCC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
VCC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
25
Vertical
Horizontal
TDA7850 Electrical specifications
7/18
3 Electrical specifications
3.1 Absolute maximum ratings
3.2 Thermal data
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VS Operating supply voltage 18 V
VS (DC) DC supply voltage 28 V
VS (pk) Peak supply voltage (for t = 50 ms) 50 V
IO
Output peak current
repetitive (duty cycle 10 % at f = 10 Hz)
non repetitive (t = 100 s)
9
10
A
A
Ptot Power dissipation Tcase = 70 °C 80 W
Tj Junction temperature 150 °C
Tstg Storage temperature -55 to 150 °C
Table 3. Thermal data
Symbol Parameter Value Unit
Rth j-case Thermal resistance junction to case Max. 1 °C/W
Electrical specifications TDA7850
8/18
3.3 Electrical characteristics
Table 4. Electrical characteristics
(Refer to the test and application diagram, VS = 14.4 V; RL = 4 ; Rg = 600 ; f = 1 kHz;
Tamb = 25 °C; unless otherwise specified).
Symbol Parameter Test condition Min. Typ. Max. Unit
Iq1 Quiescent current RL =  100 180 280 mA
VOS Output offset voltage Play mode / Mute mode ±50 mV
dVOS
During mute ON/OFF output
offset voltage ITU R-ARM weighted
see Figure 20
-10 +10 mV
During Standby ON/OFF output
offset voltage
-10 +10 mV
Gv Voltage gain 25 26 27 dB
dGv Channel gain unbalance ±1 dB
Po Output power
VS = 13.2 V; THD = 10 %
VS = 13.2 V; THD = 1 %
VS = 14.4 V; THD = 10 %
VS = 14.4 V; THD = 1 %
23
16
28
20
25
19
30
23
W
VS = 14.4 V; THD = 10 %, 2  50 55 W
Po max. Max. output power(1) VS = 14.4 V; RL = 4 
VS = 14.4 V; RL = 2 
50
85
W
THD Distortion
Po = 4W
Po = 15W; RL = 2
0.006
0.015
0.02
0.03
%
eNo Output noise
"A" Weighted
Bw = 20 Hz to 20 kHz
35
50
50
70
V
SVR Supply voltage rejection f = 100 Hz; Vr = 1Vrms 50 75 dB
fch High cut-off frequency PO = 0.5 W 100 300 KHz
Ri Input impedance 80 100 120 K
CT Cross talk
f = 1 kHz PO = 4 W
f = 10 kHz PO = 4 W
60 70
60
-
-
dB
ISB Standby current consumption
VST-BY = 1.5 V 20
A
VST-BY = 0 V 10
Ipin5 ST-BY pin current VST-BY = 1.5 V to 3.5 V ±1 A
VSB out Standby out threshold voltage (Amp: ON) 2.75 V
VSB in Standby in threshold voltage (Amp: OFF) 1.5 V
AM Mute attenuation POref = 4 W 80 90 dB
VM out Mute out threshold voltage (Amp: Play) 3.5 V
VM in Mute in threshold voltage (Amp: Mute) 1.5 V
TDA7850 Electrical specifications
9/18
VAM in VS automute threshold
(Amp: Mute)
Att  80 dB; POref = 4 W
(Amp: Play)
Att < 0.1 dB; PO = 0. 5W
6.5 7
7.5 8
V
Ipin23 Muting pin current
VMUTE = 1.5 V
(Sourced Current)
7 12 18 A
VMUTE = 3.5 V -5 18 A
HSD section
Vdropout Dropout voltage IO = 0.35 A; VS = 9 to 16 V 0.25 0.6 V
Iprot Current limits 400 800 mA
Offset detector (Pin 25)
VM_ON Mute voltage for DC offset
detection enabled
VST-BY = 5 V
8 V
VM_OFF 6 V
VOFF Detected differential output offset VST-BY = 5 V; Vmute = 8 V ±2 ±3 ±4 V
V25_T
Pin 25 voltage for detection =
TRUE
VST-BY = 5 V; Vmute = 8 V
VOFF > ±4 V
0 1.5 V
V25_F
Pin 25 Voltage for detection =
FALSE
VST-BY = 5 V; Vmute = 8 V
VOFF > ±2 V
12 V
1. Saturated square wave output.
Table 4. Electrical characteristics (continued)
(Refer to the test and application diagram, VS = 14.4 V; RL = 4 ; Rg = 600 ; f = 1 kHz;
Tamb = 25 °C; unless otherwise specified).
Symbol Parameter Test condition Min. Typ. Max. Unit
Electrical specifications TDA7850
10/18
Figure 4. Components and top copper layer of the Figure 2.
Figure 5. Bottom copper layer Figure 2.
TDA7850 Electrical specifications
11/18
3.4 Electrical characteristic curves
Figure 6. Quiescent current vs. supply
voltage
Figure 7. Output power vs. supply voltage
(RL = 4)
Figure 8. Output power vs. supply voltage
(RL = 2)
Figure 9. Distortion vs. output power
(RL = 4)
Figure 10. Distortion vs. output power
(RL = 2)
Figure 11. Distortion vs. frequency
(RL = 4)
AC00064
Vs (V)
100
110
120
130
140
150
160
170
180
190
200
8 10 12 14 16 18
Vi = 0
RL =∞
Id (mA)
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
8 9 10 11 12 13 14 15 16 17 18
Po (W)
Vs (V)
RL= 4Ω
f = 1 KHz
Po-max
THD= 10%
THD= 1%
AC00064
AC00066
0
10
20
30
40
50
60
70
80
90
100
110
120
130
8 9 10 11 12 13 14 15 16 17 18
Vs (V)
Po (W)
Po-max
THD=10%
THD=1%
RL= 2Ω
f = 1 KHz
AC00067
0.001
0.01
0.1
1
10
0.1 1 10 100
Po (W)
THD (%)
VS = 14.4 V
RL = 4Ω
f = 1 KHz
f = 10 KHz
AC00068
0.001
0.01
0.1
1
10
0.1 1 10 100
Po (W)
THD (%)
VS = 14.4 V
RL = 2Ω
f = 10 KHz
f = 1 KHz
AC00069
0.001
0.01
0.1
1
10
10 100 1000 10000 100000
f (Hz)
THD (%)
VS = 14.4 V
RL = 4Ω
Po = 4 W
Electrical specifications TDA7850
12/18
Figure 12. Distortion vs. frequency
(RL = 2)
Figure 13. Crosstalk vs. frequency
Figure 14. Supply voltage rejection vs.
frequency
Figure 15. Output attenuation vs. supply
voltage
Figure 16. Power dissipation and efficiency
vs. output power (RL = 4, SINE)
Figure 17. Power dissipation and efficiency
vs. output power (RL = 2, SINE)
AC00070
0.001
0.01
0.1
1
10
10 100 1000 10000 100000
f (Hz)
THD (%)
VS = 14.4 V
RL = 2Ω
Po = 8 W
-100
-90
-80
-70
-60
-50
-40
-30
-20
10 100 1000 10000 100000
RL = 4Ω
Po = 4 W
Rg = 600Ω
f (Hz)
CROSSTALK (dB)
AC00071
AC00072
-100
-90
-80
-70
-60
-50
-40
-30
-20
10 100 1000 10000 100000
f (Hz)
SVR (dB)
Rg = 600Ω
Vripple = 1 Vrms
AC00073
-100
-80
-60
-40
-20
0
5 6 7 8 9 10
Vs (V)
OUTPUT ATTN (dB)
RL = 4Ω
Po = 4 W ref
AC00074
0
10
20
30
40
50
60
70
80
90
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Ptot (W) η (%)
Po (W)
0
10
20
30
40
50
60
70
80
90
Ptot
η
VS = 14.4 V
RL = 4 x 4Ω
f = 1 KHz SINE
AC00075
0
20
40
60
80
100
120
140
160
180
0 5 10 15 20 25 30 35 40 45 50 55
0
10
20
30
40
50
60
70
80
90
Ptot (W) η (%)
Po (W)
Ptot
η
VS = 14.4 V
RL = 4 x 2Ω
f = 1 KHz SINE
TDA7850 Electrical specifications
13/18
Figure 18. Power dissipation vs. output power
(RL = 4, audio program simulation)
Figure 19. Power dissipation vs. output power
(RL = 2, audio program simulation)
Figure 20. ITU R-ARM frequency response,
weighting filter for transient pop
AC00076
5
10
15
20
25
30
0 1 2 3 4 5 6
VS = 13.2 V
RL = 4 x 4Ω
GAUSSIAN NOISE
CLIP START
Ptot (W)
Po (W) AC00077
5
10
15
20
25
30
35
40
45
50
55
60
0 2 4 6 8 10
VS = 13.2 V
RL = 4 x 2Ω
GAUSSIAN NOISE
CLIP START
Ptot (W)
Po (W)
Output attenuation (dB)
-50
-40
-30
-20
-10
0
10
10 100 1000 10000 100000
Hz AC00343
Application hints TDA7850
14/18
4 Application hints
Referred to the circuit of Figure 2.
4.1 SVR
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF
time sequence and, consequently, plays an essential role in the pop optimization during
ON/OFF transients. To conveniently serve both needs, Its minimum recommended value
is 10µF.
4.2 Input stage
The TDA7850's inputs are ground-compatible and can stand very high input signals (±
8Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off
will amount to 16 Hz.
4.3 Standby and muting
Standby and Muting facilities are both CMOS compatible. In absence of true CMOS ports or
microprocessors, a direct connection to Vs of these two pins is admissible but a 470k
equivalent resistance should be present between the power supply and the muting and
ST-BY pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the standby, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5 V/ms.
4.4 DC offset detector
The TDA7850 integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating. The feature is enabled by
the MUTE pin (according to table 3) and works with the amplifier unmuted and with no signal
on the inputs.
The DC offset detection is signaled out on the HSD pin. To ensure the correct functionality of
the Offset Detector it is necessary to connect a pulldown 10 kW resistor between HSD and
ground.
4.5 Heatsink definition
Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be
deduced from Figure 18, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will
cause Pdiss = 26 W. Assuming Tamb = 70 °C and TCHIP = 150 °C as boundary conditions, the
heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal
shutdown occurrence even after long-term and full-volume operation.
TDA7850 Package information
15/18
5 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 21. Flexiwatt25 (vertical) mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.45 4.50 4.65 0.175 0.177 0.183
B 1.80 1.90 2.00 0.070 0.074 0.079
C 1.40 0.055
D 0.75 0.90 1.05 0.029 0.035 0.041
E 0.37 0.39 0.42 0.014 0.015 0.016
F (1) 0.57 0.022
G 0.80 1.00 1.20 0.031 0.040 0.047
G1 23.75 24.00 24.25 0.935 0.945 0.955
H (2) 28.90 29.23 29.30 1.139 1.150 1.153
H1 17.00 0.669
H2 12.80 0.503
H3 0.80 0.031
L (2) 22.07 22.47 22.87 0.869 0.884 0.904
L1 18.57 18.97 19.37 0.731 0.747 0.762
L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626
L3 7.70 7.85 7.95 0.303 0.309 0.313
L4 5 0.197
L5 3.5 0.138
M 3.70 4.00 4.30 0.145 0.157 0.169
M1 3.60 4.00 4.40 0.142 0.157 0.173
N 2.20 0.086
O 2 0.079
R 1.70 0.067
R1 0.5 0.02
R2 0.3 0.12
R3 1.25 0.049
R4 0.50 0.019
V1 3˚ (Typ.)
V 5˚ (T p.)
V2 20˚ (Typ.)
V3 45˚ (Typ.)
(2): molding protusion included
(1): dam-bar protusion not included
Flexiwatt25 (vertical)
H3
R4
G
V
G1
L2
H1
H
F
M1
L
FLEX25ME
V3
OL3L4
H2
R3
N
V2
R
R2
R2
C
B
L1
M
R1
L5 R1 R1
E
D
A
Pin 1
V
V1
V1
7034862
Package information TDA7850
16/18
Figure 22. Flexiwatt25 (horizontal) mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.45 4.50 4.65 0.175 0.177 0.183
B 1.80 1.90 2.00 0.070 0.074 0.079
C 1.40 0.055
D 2.00 0.079
E 0.37 0.39 0.42 0.014 0.015 0.016
F (1) 0.57 0.022
G 0.75 1.00 1.25 0.029 0.040 0.049
G1 23.70 24.00 24.30 0.933 0.945 0.957
H (2) 28.90 29.23 29.30 1.139 1.150 1.153
H1 17.00 0.669
H2 12.80 0.503
H3 0.80 0.031
L (2) 21.64 22.04 22.44 0.852 0.868 0.883
L1 10.15 10.5 10.85 0.40 0.413 0.427
L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626
L3 7.70 7.85 7.95 0.303 0.309 0.313
L4 5 0.197
L5 5.15 5.45 5.85 0.203 0.214 0.23
L6 1.80 1.95 2.10 0.070 0.077 0.083
M 2.75 3.00 3.50 0.108 0.118 0.138
M1 4.73 0.186
M2 5.61 0.220
N 2.20 0.086
P 3.20 3.50 3.80 0.126 0.138 0.15
R 1.70 0.067
R1 0.50 0.02
R2 0.30 0.12
R3 1.25 0.049
R4 0.50 0.02
V 5 (Typ.)
V1 3 (Typ.)
V2 20 (Typ.)
V3 45 (Typ.)
Flexiwatt25
(Horizontal)
7399733 C
(1): dam-bar protusion not included; (2): molding protusion included
TDA7850 Revision history
17/18
6 Revision history
Table 5. Document revision history
Date Revision Changes
22-Nov-2006 1 Initial release.
27-Feb-2007 2 Added Chapter 3.4: Electrical characteristic curves.
09-Oct-2007 3
Updated the values for the dVOS and Iq1 parameters on the Table 4.
Added Figure 20 on page 13.
12-Sep-2008 4
Updated Figure 2: Standard test and application circuit.
Updated Section 4.4: DC offset detector and Section 4.3: Standby
and muting.
Updated the values of VOS and THD parameters on the Table 4.
07-Nov-2008 5
Modified max. values of the THD distortion in Table 4: Electrical
characteristics on page 8.
17-Sep-2013 6 Updated Disclaimer.
TDA7850
18/18
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
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Original Audio Amplifier IC TDA7850 7850 SIP-25 New ST Microelectronics

  • 1. September 2013 Rev 6 1/18 1 TDA7850 4 x 50 W MOSFET quad bridge power amplifier Features ■ High output power capability: – 4 x 50 W/4  max. – 4 x 30 W/4  @ 14.4 V, 1 kHz, 10 % – 4 x 80 W/2  max. – 4 x 55 W/2  @ 14.4V, 1 kHz, 10 % ■ MOSFET output power stage ■ Excellent 2  driving capability ■ Hi-Fi class distortion ■ Low output noise ■ ST-BY function ■ Mute function ■ Automute at min. supply voltage detection ■ Low external component count: – Internally fixed gain (26 dB) – No external compensation – No bootstrap capacitors ■ On board 0.35 A high side driver Protections: ■ Output short circuit to gnd, to Vs, across the load ■ Very inductive loads ■ Overrating chip temperature with soft thermal limiter ■ Output DC offset detection ■ Load dump voltage ■ Fortuitous open gnd ■ Reversed battery ■ ESD Description The TDA7850 is a breakthrough MOSFET technology class AB audio power amplifier in Flexiwatt 25 package designed for high power car radio. The fully complementary P-Channel/N- Channel output structure allows a rail to rail output voltage swing which, combined with high output current and minimized saturation losses sets new power references in the car-radio field, with unparalleled distortion performances. The TDA7850 integrates a DC offset detector. Flexiwatt25 (Vertical) Flexiwatt25 (Horizontal) Table 1. Device summary Order code Package Packing TDA7850 Flexiwatt25 (Vertical) Tube TDA7850H Flexiwatt25 (Horizontal Tube www.st.com
  • 2. Contents TDA7850 2/18 Contents 1 Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2 Standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.4 Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.2 Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3 Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.4 DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.5 Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
  • 3. TDA7850 List of tables 3/18 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
  • 4. List of figures TDA7850 4/18 List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Standard test and application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4. Components and top copper layer of the Figure 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Bottom copper layer Figure 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7. Output power vs. supply voltage (RL = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 8. Output power vs. supply voltage (RL = 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 9. Distortion vs. output power (RL = 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 10. Distortion vs. output power (RL = 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11. Distortion vs. frequency (RL = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 12. Distortion vs. frequency (RL = 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13. Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 14. Supply voltage rejection vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 15. Output attenuation vs. supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 16. Power dissipation and efficiency vs. output power (RL = 4, SINE) . . . . . . . . . . . . . . . . . 12 Figure 17. Power dissipation and efficiency vs. output power (RL = 2, SINE) . . . . . . . . . . . . . . . . . 12 Figure 18. Power dissipation vs. output power (RL = 4, audio program simulation) . . . . . . . . . . . . . 13 Figure 19. Power dissipation vs. output power (RL = 2, audio program simulation) . . . . . . . . . . . . . 13 Figure 20. ITU R-ARM frequency response, weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 13 Figure 21. Flexiwatt25 (vertical) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . 15 Figure 22. Flexiwatt25 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 16
  • 5. TDA7850 Block diagram and application circuit 5/18 1 Block diagram and application circuit 1.1 Block diagram Figure 1. Block diagram 1.2 Standard test and application circuit Figure 2. Standard test and application circuit IN1 0.1μF MUTE ST-BY IN2 0.1μF OUT1+ OUT1- OUT2+ OUT2- PW-GND IN3 0.1μF IN4 0.1μF OUT3+ OUT3- OUT4+ OUT4- PW-GND PW-GND PW-GND D94AU158D AC-GND 0.47μF 47μF SVR TAB S-GND Vcc1 Vcc2 100nF470μF HSD/VOFF_DETHSD IN1 0.1μF C9 1μF IN2 C2 0.1μF OUT1 OUT2 IN3 C3 0.1μF IN4 C4 0.1μF OUT3 OUT4 D95AU335C C5 0.47μF C6 47μF SVR TAB Vcc1-2 Vcc3-4 C8 0.1μF C7 2200μF C10 1μF ST-BY R1 10K R3 *) R2 47K MUTE C1 14 15 12 11 22 4 13 S-GND 16 10 25 1 HSD/OD 6 20 9 8 7 5 2 3 17 18 19 21 24 23 *) R3 = 10kΩ to be placed when pin 25 is used as offset detector.
  • 6. Pin description TDA7850 6/18 2 Pin description Figure 3. Pin connection (top view) D94AU159A TAB P-GND2 OUT2- ST-BY OUT2+ VCC OUT1- P-GND1 OUT1+ SVR IN1 IN2 S-GND IN4 IN3 AC-GND OUT3+ P-GND3 OUT3- VCC OUT4+ MUTE OUT4- P-GND4 HSD 1 25 D06AU1655 TAB P-GND2 OUT2- ST-BY OUT2+ VCC OUT1- P-GND1 OUT1+ SVR IN1 IN2 S-GND IN4 IN3 AC-GND OUT3+ P-GND3 OUT3- VCC OUT4+ MUTE OUT4- P-GND4 HSD 1 25 Vertical Horizontal
  • 7. TDA7850 Electrical specifications 7/18 3 Electrical specifications 3.1 Absolute maximum ratings 3.2 Thermal data Table 2. Absolute maximum ratings Symbol Parameter Value Unit VS Operating supply voltage 18 V VS (DC) DC supply voltage 28 V VS (pk) Peak supply voltage (for t = 50 ms) 50 V IO Output peak current repetitive (duty cycle 10 % at f = 10 Hz) non repetitive (t = 100 s) 9 10 A A Ptot Power dissipation Tcase = 70 °C 80 W Tj Junction temperature 150 °C Tstg Storage temperature -55 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit Rth j-case Thermal resistance junction to case Max. 1 °C/W
  • 8. Electrical specifications TDA7850 8/18 3.3 Electrical characteristics Table 4. Electrical characteristics (Refer to the test and application diagram, VS = 14.4 V; RL = 4 ; Rg = 600 ; f = 1 kHz; Tamb = 25 °C; unless otherwise specified). Symbol Parameter Test condition Min. Typ. Max. Unit Iq1 Quiescent current RL =  100 180 280 mA VOS Output offset voltage Play mode / Mute mode ±50 mV dVOS During mute ON/OFF output offset voltage ITU R-ARM weighted see Figure 20 -10 +10 mV During Standby ON/OFF output offset voltage -10 +10 mV Gv Voltage gain 25 26 27 dB dGv Channel gain unbalance ±1 dB Po Output power VS = 13.2 V; THD = 10 % VS = 13.2 V; THD = 1 % VS = 14.4 V; THD = 10 % VS = 14.4 V; THD = 1 % 23 16 28 20 25 19 30 23 W VS = 14.4 V; THD = 10 %, 2  50 55 W Po max. Max. output power(1) VS = 14.4 V; RL = 4  VS = 14.4 V; RL = 2  50 85 W THD Distortion Po = 4W Po = 15W; RL = 2 0.006 0.015 0.02 0.03 % eNo Output noise "A" Weighted Bw = 20 Hz to 20 kHz 35 50 50 70 V SVR Supply voltage rejection f = 100 Hz; Vr = 1Vrms 50 75 dB fch High cut-off frequency PO = 0.5 W 100 300 KHz Ri Input impedance 80 100 120 K CT Cross talk f = 1 kHz PO = 4 W f = 10 kHz PO = 4 W 60 70 60 - - dB ISB Standby current consumption VST-BY = 1.5 V 20 A VST-BY = 0 V 10 Ipin5 ST-BY pin current VST-BY = 1.5 V to 3.5 V ±1 A VSB out Standby out threshold voltage (Amp: ON) 2.75 V VSB in Standby in threshold voltage (Amp: OFF) 1.5 V AM Mute attenuation POref = 4 W 80 90 dB VM out Mute out threshold voltage (Amp: Play) 3.5 V VM in Mute in threshold voltage (Amp: Mute) 1.5 V
  • 9. TDA7850 Electrical specifications 9/18 VAM in VS automute threshold (Amp: Mute) Att  80 dB; POref = 4 W (Amp: Play) Att < 0.1 dB; PO = 0. 5W 6.5 7 7.5 8 V Ipin23 Muting pin current VMUTE = 1.5 V (Sourced Current) 7 12 18 A VMUTE = 3.5 V -5 18 A HSD section Vdropout Dropout voltage IO = 0.35 A; VS = 9 to 16 V 0.25 0.6 V Iprot Current limits 400 800 mA Offset detector (Pin 25) VM_ON Mute voltage for DC offset detection enabled VST-BY = 5 V 8 V VM_OFF 6 V VOFF Detected differential output offset VST-BY = 5 V; Vmute = 8 V ±2 ±3 ±4 V V25_T Pin 25 voltage for detection = TRUE VST-BY = 5 V; Vmute = 8 V VOFF > ±4 V 0 1.5 V V25_F Pin 25 Voltage for detection = FALSE VST-BY = 5 V; Vmute = 8 V VOFF > ±2 V 12 V 1. Saturated square wave output. Table 4. Electrical characteristics (continued) (Refer to the test and application diagram, VS = 14.4 V; RL = 4 ; Rg = 600 ; f = 1 kHz; Tamb = 25 °C; unless otherwise specified). Symbol Parameter Test condition Min. Typ. Max. Unit
  • 10. Electrical specifications TDA7850 10/18 Figure 4. Components and top copper layer of the Figure 2. Figure 5. Bottom copper layer Figure 2.
  • 11. TDA7850 Electrical specifications 11/18 3.4 Electrical characteristic curves Figure 6. Quiescent current vs. supply voltage Figure 7. Output power vs. supply voltage (RL = 4) Figure 8. Output power vs. supply voltage (RL = 2) Figure 9. Distortion vs. output power (RL = 4) Figure 10. Distortion vs. output power (RL = 2) Figure 11. Distortion vs. frequency (RL = 4) AC00064 Vs (V) 100 110 120 130 140 150 160 170 180 190 200 8 10 12 14 16 18 Vi = 0 RL =∞ Id (mA) 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 8 9 10 11 12 13 14 15 16 17 18 Po (W) Vs (V) RL= 4Ω f = 1 KHz Po-max THD= 10% THD= 1% AC00064 AC00066 0 10 20 30 40 50 60 70 80 90 100 110 120 130 8 9 10 11 12 13 14 15 16 17 18 Vs (V) Po (W) Po-max THD=10% THD=1% RL= 2Ω f = 1 KHz AC00067 0.001 0.01 0.1 1 10 0.1 1 10 100 Po (W) THD (%) VS = 14.4 V RL = 4Ω f = 1 KHz f = 10 KHz AC00068 0.001 0.01 0.1 1 10 0.1 1 10 100 Po (W) THD (%) VS = 14.4 V RL = 2Ω f = 10 KHz f = 1 KHz AC00069 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 f (Hz) THD (%) VS = 14.4 V RL = 4Ω Po = 4 W
  • 12. Electrical specifications TDA7850 12/18 Figure 12. Distortion vs. frequency (RL = 2) Figure 13. Crosstalk vs. frequency Figure 14. Supply voltage rejection vs. frequency Figure 15. Output attenuation vs. supply voltage Figure 16. Power dissipation and efficiency vs. output power (RL = 4, SINE) Figure 17. Power dissipation and efficiency vs. output power (RL = 2, SINE) AC00070 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 f (Hz) THD (%) VS = 14.4 V RL = 2Ω Po = 8 W -100 -90 -80 -70 -60 -50 -40 -30 -20 10 100 1000 10000 100000 RL = 4Ω Po = 4 W Rg = 600Ω f (Hz) CROSSTALK (dB) AC00071 AC00072 -100 -90 -80 -70 -60 -50 -40 -30 -20 10 100 1000 10000 100000 f (Hz) SVR (dB) Rg = 600Ω Vripple = 1 Vrms AC00073 -100 -80 -60 -40 -20 0 5 6 7 8 9 10 Vs (V) OUTPUT ATTN (dB) RL = 4Ω Po = 4 W ref AC00074 0 10 20 30 40 50 60 70 80 90 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Ptot (W) η (%) Po (W) 0 10 20 30 40 50 60 70 80 90 Ptot η VS = 14.4 V RL = 4 x 4Ω f = 1 KHz SINE AC00075 0 20 40 60 80 100 120 140 160 180 0 5 10 15 20 25 30 35 40 45 50 55 0 10 20 30 40 50 60 70 80 90 Ptot (W) η (%) Po (W) Ptot η VS = 14.4 V RL = 4 x 2Ω f = 1 KHz SINE
  • 13. TDA7850 Electrical specifications 13/18 Figure 18. Power dissipation vs. output power (RL = 4, audio program simulation) Figure 19. Power dissipation vs. output power (RL = 2, audio program simulation) Figure 20. ITU R-ARM frequency response, weighting filter for transient pop AC00076 5 10 15 20 25 30 0 1 2 3 4 5 6 VS = 13.2 V RL = 4 x 4Ω GAUSSIAN NOISE CLIP START Ptot (W) Po (W) AC00077 5 10 15 20 25 30 35 40 45 50 55 60 0 2 4 6 8 10 VS = 13.2 V RL = 4 x 2Ω GAUSSIAN NOISE CLIP START Ptot (W) Po (W) Output attenuation (dB) -50 -40 -30 -20 -10 0 10 10 100 1000 10000 100000 Hz AC00343
  • 14. Application hints TDA7850 14/18 4 Application hints Referred to the circuit of Figure 2. 4.1 SVR Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time sequence and, consequently, plays an essential role in the pop optimization during ON/OFF transients. To conveniently serve both needs, Its minimum recommended value is 10µF. 4.2 Input stage The TDA7850's inputs are ground-compatible and can stand very high input signals (± 8Vpk) without any performance degradation. If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off will amount to 16 Hz. 4.3 Standby and muting Standby and Muting facilities are both CMOS compatible. In absence of true CMOS ports or microprocessors, a direct connection to Vs of these two pins is admissible but a 470k equivalent resistance should be present between the power supply and the muting and ST-BY pins. R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. About the standby, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5 V/ms. 4.4 DC offset detector The TDA7850 integrates a DC offset detector to avoid that an anomalous DC offset on the inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on the outputs which may lead to speakers damage for overheating. The feature is enabled by the MUTE pin (according to table 3) and works with the amplifier unmuted and with no signal on the inputs. The DC offset detection is signaled out on the HSD pin. To ensure the correct functionality of the Offset Detector it is necessary to connect a pulldown 10 kW resistor between HSD and ground. 4.5 Heatsink definition Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be deduced from Figure 18, which reports the simulated power dissipation when real music/speech programmes are played out. Noise with gaussian-distributed amplitude was employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will cause Pdiss = 26 W. Assuming Tamb = 70 °C and TCHIP = 150 °C as boundary conditions, the heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation.
  • 15. TDA7850 Package information 15/18 5 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 21. Flexiwatt25 (vertical) mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 4.45 4.50 4.65 0.175 0.177 0.183 B 1.80 1.90 2.00 0.070 0.074 0.079 C 1.40 0.055 D 0.75 0.90 1.05 0.029 0.035 0.041 E 0.37 0.39 0.42 0.014 0.015 0.016 F (1) 0.57 0.022 G 0.80 1.00 1.20 0.031 0.040 0.047 G1 23.75 24.00 24.25 0.935 0.945 0.955 H (2) 28.90 29.23 29.30 1.139 1.150 1.153 H1 17.00 0.669 H2 12.80 0.503 H3 0.80 0.031 L (2) 22.07 22.47 22.87 0.869 0.884 0.904 L1 18.57 18.97 19.37 0.731 0.747 0.762 L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 L3 7.70 7.85 7.95 0.303 0.309 0.313 L4 5 0.197 L5 3.5 0.138 M 3.70 4.00 4.30 0.145 0.157 0.169 M1 3.60 4.00 4.40 0.142 0.157 0.173 N 2.20 0.086 O 2 0.079 R 1.70 0.067 R1 0.5 0.02 R2 0.3 0.12 R3 1.25 0.049 R4 0.50 0.019 V1 3˚ (Typ.) V 5˚ (T p.) V2 20˚ (Typ.) V3 45˚ (Typ.) (2): molding protusion included (1): dam-bar protusion not included Flexiwatt25 (vertical) H3 R4 G V G1 L2 H1 H F M1 L FLEX25ME V3 OL3L4 H2 R3 N V2 R R2 R2 C B L1 M R1 L5 R1 R1 E D A Pin 1 V V1 V1 7034862
  • 16. Package information TDA7850 16/18 Figure 22. Flexiwatt25 (horizontal) mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 4.45 4.50 4.65 0.175 0.177 0.183 B 1.80 1.90 2.00 0.070 0.074 0.079 C 1.40 0.055 D 2.00 0.079 E 0.37 0.39 0.42 0.014 0.015 0.016 F (1) 0.57 0.022 G 0.75 1.00 1.25 0.029 0.040 0.049 G1 23.70 24.00 24.30 0.933 0.945 0.957 H (2) 28.90 29.23 29.30 1.139 1.150 1.153 H1 17.00 0.669 H2 12.80 0.503 H3 0.80 0.031 L (2) 21.64 22.04 22.44 0.852 0.868 0.883 L1 10.15 10.5 10.85 0.40 0.413 0.427 L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 L3 7.70 7.85 7.95 0.303 0.309 0.313 L4 5 0.197 L5 5.15 5.45 5.85 0.203 0.214 0.23 L6 1.80 1.95 2.10 0.070 0.077 0.083 M 2.75 3.00 3.50 0.108 0.118 0.138 M1 4.73 0.186 M2 5.61 0.220 N 2.20 0.086 P 3.20 3.50 3.80 0.126 0.138 0.15 R 1.70 0.067 R1 0.50 0.02 R2 0.30 0.12 R3 1.25 0.049 R4 0.50 0.02 V 5 (Typ.) V1 3 (Typ.) V2 20 (Typ.) V3 45 (Typ.) Flexiwatt25 (Horizontal) 7399733 C (1): dam-bar protusion not included; (2): molding protusion included
  • 17. TDA7850 Revision history 17/18 6 Revision history Table 5. Document revision history Date Revision Changes 22-Nov-2006 1 Initial release. 27-Feb-2007 2 Added Chapter 3.4: Electrical characteristic curves. 09-Oct-2007 3 Updated the values for the dVOS and Iq1 parameters on the Table 4. Added Figure 20 on page 13. 12-Sep-2008 4 Updated Figure 2: Standard test and application circuit. Updated Section 4.4: DC offset detector and Section 4.3: Standby and muting. Updated the values of VOS and THD parameters on the Table 4. 07-Nov-2008 5 Modified max. values of the THD distortion in Table 4: Electrical characteristics on page 8. 17-Sep-2013 6 Updated Disclaimer.
  • 18. TDA7850 18/18 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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