Embedded Platforms Launch Press Presentation
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Embedded Platforms Launch Press Presentation
- 1. Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded Systems Buddy Broeker, Director, AMD Embedded Solutions AMD Confidential | Embargoed until 12:01 a.m. Monday, April 26, 2010
- 6. High-performance memory with low latency
- 8. RAS features, including ECC
- 9. Low power, strong performance-per-watt
- 10. Well-established software & tools and ecosystem
- 11. Broad knowledge base among developers
- 12. Support for multiple operating systems
- 13. Efficient design & development cycles
- 16. DDR3
- 17. HT3
- 18. 25W
- 19. Dual-Core
- 20. 2.2GHz
- 21. DDR3
- 22. HyperTransport™ 3 (HT3) technology
- 23. 65W
- 24. Quad-Core
- 25. 2.2GHz
- 26. DDR3
- 27. HT3
- 28. DirectX® 10.1
- 30. Drive up to 4 displays
- 31. HDMI
- 32. UVD support
- 33. 8W, 12W, 15W
- 34. Single- or Dual-Core options
- 35. 1.0 – 1.5 GHz
- 36. DDR3
- 37. HT1 or HT3
- 38. 25W, 45W
- 39. Dual-Core
- 40. 2.0 – 2.8GHz
- 41. DDR2 or DDR3
- 45. DDR3 memory
- 46. High-performance I/O with HyperTransport™ 3.0 technology
- 48. BGA and lidless options
- 49. Low-z-height for small, compact form factors
- 51. Reliability
- 52. Low cost
- 54. ECC
- 55. Virtualization
- 56. Multiple power management/ reduction features
- 58. No compromise on application performance
- 59. Socket-compatibility for easy design upgrade
- 60. Easy migration path to higher performance
- 61. Chipset & graphics compatibility
- 62. Clear roadmap progression¹As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.
- 63. Ideal Applications Thin-clients Medical Imaging Point-of-sale (POS) & Kiosk Systems Industrial Controls Ruggedized, Field, & Military Systems Telecommunications & Networking Digital Signage Small/Home Office to Enterprise Storage Gaming Machines Single Board Computing (SBC)
- 65. Improved overall platform performance with lower power compared to previous generation AMD platforms
- 66. More form factor options with reduced footprint