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Design of 60 GHz Receiver in
CMOS

Team 5:
Hao Wang
Ming Ding
Mayur Sarode
Assignment

       Goals:
       •   Use 57 to 64 GHz unlicensed band
       •   Over 1 Gbps of bit rate at a distance of 10 m
       •   Cost <10 euro's
       •   Robust receiver
       Challenges:
       • Use latest CMOS technology (65nm - 45 nm)
       • Selecting channel BW, modulation
       • Specifications of the Digital part of the system




/ name of department                                        30-5-2010   PAGE 1
Evaluating the Link Budget
                           Contribution    Running total
  TX power                 +10dBm          10dBm
  TX antenna gain          10dB            20dBm
  Path loss over 10m       -68.1188dBm     -48.1188dBm
  Rx antenna gain          10dB            -38.1188dBm
  Background noise         -174dBm/Hz      -174dBm/Hz
  Noise BW(3Ghz)           +94.7712        -79.2288dBm
  Noise figure of RX       +10dB           -69.2288dBm
  SNR at output                            -38.1188-(-69.2288)=31.11
  Required SNR                             10dB
  System margin                            21dB

   Oxygen absorption can be omitted here
   Path loss more complicated

/ name of department                                                   30-5-2010   PAGE 2
Bit rate calculation

C     BW *log 2 (1 SNR) 14.863
We use 10 Gbps
    We use 16-QAM modulation, which

    The required Bandwidth

    12Gbps/4b=3GHz
System Specification

                    Specifications   achieved   unit
 Technology         45-130           65         nm
 Supply Power       -                1.2        V
 Power              <1000            39.4296    mW

 cost               <10              5.4        euro

 Noise Figure       10               1.93       dB

 RF frequency       57-64            60.91      GHz
 LO frequency       55-64            57.91      GHz
 IF frequency       3                3          GHz




 Bond wire:1nH/mm
 Bond pad~ 100 fF
Choice of Architecture(1)

       Goal
           To design a Low noise amplifier, Mixer and the oscillator
           Low IF architecture was selected.

       +++
       Monolithic integration
       LNA matching
       LPF filter
       ---
       LO leakage
       IP2
       Sensitive to noise
       Gain and phase match

/ name of department                                              30-5-2010   PAGE 5
Choice of Architecture(2)

       Antennas
       • Omnidirectional antennas provide limited gain and bit rate



       • Using directional and array of antennas to meet the requirements
       • Use of phase shifters to improve SNR of a receiver
       • It reduces multipath propagation
       • Filters
       Low pass filter at the output mixer




/ name of department                                                  30-5-2010   PAGE 6
The CMOS technology


       We choose 65 nm for our design
       Trade off between design bottleneck and benefits of scaling
       Advantages
       Higher speed, higher integration
       Challenges
       •   Increasing leakage
       •   Reduction in voltage supply
       •   Process variability
       •   Parasitic effects and impedance matching




/ name of department                                                 30-5-2010   PAGE 7
System performance

  Noise Figure IIP3                Gain       SNR     Power
                                                      consumed
  1.425dB              -24.55 dB   21.521dB   ?????   39.4296mW




/ name of department                                     30-5-2010   PAGE 8
New System Performance

   Noise               IIP3(dB)   Gain(dB)   SNR    Power
   Figure(dB)                                       consumed
                                                    (mW)
   1.3971              -14.42     17.768     ????   52.79




/ name of department                                    30-5-2010   PAGE 9
LOW NOISE AMPLIFIER
                             DESIGN




/ name of department                         30-5-2010   PAGE 10
Survey of LNA’s
Paper                   CMOS   Supply   topology          specifications
                        (nm)   (volt)


60 GHz compact          65     1.2      3 stage single    Center
LNA in 65 nm                            ended topology    Frequency=57 GHz
                                                          Gain=19.1
                                                          NF=5.5 dB
A 60GHz Low-            90     1.2      Single stage      NF=9.6,
Noise High-                             cascode           IP3=-14
Linearity Receiver                                        gain =10 dB
Front-End Design                                          5.4mA

A 60-GHz CMOS           130    1.2      Common gate       Voltage gain:28 dB
Receiver Front-End                      topology          NF:12.5,
                                                          Power :9mw

60-GHz Receiver         65n    1.2      5 stage Cascode   20 dB gain
and Transmitter                         topology
Front-Ends in 65-
 / name of department                                         30-5-2010   PAGE 11
Choice of topology

       • Choice between common gate,cascode and common
         source




   In this a assignment a combination of cascode and common source amplifier is used



/ name of department                                                  30-5-2010   PAGE 12
Design of the circuit




                                                                           30-5-2010   PAGE 13
/Courtesy:LNA-ESD co design for fully integrated CMOS wireless receivers
Passive and active component
       specifications
      These formula are based on the short channel model of CMOS




                                       Length=0.065e-6 m
                                       Ft=190MHz




/ name of department                                               30-5-2010   PAGE 14
Design of the second Stage

            •C1 is taken as a bond pad capacitance
            •L1 is the bond wire used for output matching
                                                1
                                          w0
                                                LC
            •CL is designed by


            •Ld and the source inductance of M1 is
            designed to maximize gain.
            •RL is designed for a quality factor of 10




/ name of department                                        30-5-2010   PAGE 15
Design of circuit (2)

       • Biasing of CMOS with a current mirror (1.72mA)
       • Reduces channel length modulation effect
                       W2
              Iout     L2
       •
              Iref     W1
                       L1
    •Reduction in noise finger with number of fingers

    •ESD protection at the gate

    •Input and output bond pad capacitance

    •Noise in the power supply lines

    •Input /output matching
/ name of department                                      30-5-2010   PAGE 16
Components specifications

        Parameter            Designed Values   Optimized Values
        Width                9.954 um          10 um
        Ls(for Ft=190 GHz)   4.18e-11 H        3.35e-11 H
        Lg                   5.55e-10 H        2.75e-10 H
        Ld                   7.063e-12 H       4e-10 H
        CL                   8.74e-14 F        8.79e-14 F
        RL                   303.479 ohm       303.479 ohm




/ name of department                                         30-5-2010   PAGE 17
Performance(1)




/ name of department    30-5-2010   PAGE 18
Performance(2)




/ name of department    30-5-2010   PAGE 19
Performance(3)

                          1dB compression
                          point= -20 dBm




                        K>1 for the 60Ghz
                        band




/ name of department         30-5-2010   PAGE 20
Performance




/ name of department   30-5-2010   PAGE 21
/ name of department   30-5-2010   PAGE 22
Specifications
  RF_power                      IP3in                IP3out_upper   IP3out_lower
  -12                           -12.437              7.369          7.282


                       1st and 3rd order spectrums




/ name of department                                                        30-5-2010   PAGE 23
LNA achieved specifications


                       Specifications
                       S(2,1) (power again)          19.25 dB
                       Voltage gain                  18.54 dB
                       Third order intercept(IIP3)   -12 dBm
                       Noise figure                  1.206 dB
                       1 dB compression point        -20dBm
                       Center frequency              60.91 GHz
                       Power dissipation             31.03 mW




/ name of department                                             30-5-2010   PAGE 24
Future Developments

       • Replacing inductors with Microstrip transmission lines, coplanar
         waveguides

       • Resistance and Inductance of interconnects

       • Effects of variation in temperature

       • Effect of the substrate




/ name of department                                                30-5-2010   PAGE 25
Corrections made to the LNA

                       • Biasing of the output stage. The output stage was biased with a
                       resitor of 10K ohm from the drain to the source.




/ name of department                                                               30-5-2010   PAGE 26
New performance(1):Noise Figure

                       •Noise figure




/ name of department                     30-5-2010   PAGE 27
New performance(2): S parameters




/ name of department                      30-5-2010   PAGE 28
New performance(3): 1 dB compression
       point and stability




/ name of department                   30-5-2010   PAGE 29
New Performance(3):Input output
       matching




/ name of department                     30-5-2010   PAGE 30
New performance(4):IIP3
  RF_power             IP3in     IP3out_upper   IP3out_lower
  -12                  -12.621   7.185          7.284




/ name of department                                    30-5-2010   PAGE 31
New Specifications


                       Specifications
                       S(2,1) (power again)          16.25 dB
                       Voltage gain                  14.925 dB
                       Third order intercept(IIP3)   -12.621 dBm
                       Noise figure                  1.206 dB
                       1 dB compression point        -19dBm
                       Center frequency              60.91 GHz
                       Power dissipation             44.4mW




/ name of department                                               30-5-2010   PAGE 32

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LnA Design_group5

  • 1. Design of 60 GHz Receiver in CMOS Team 5: Hao Wang Ming Ding Mayur Sarode
  • 2. Assignment Goals: • Use 57 to 64 GHz unlicensed band • Over 1 Gbps of bit rate at a distance of 10 m • Cost <10 euro's • Robust receiver Challenges: • Use latest CMOS technology (65nm - 45 nm) • Selecting channel BW, modulation • Specifications of the Digital part of the system / name of department 30-5-2010 PAGE 1
  • 3. Evaluating the Link Budget Contribution Running total TX power +10dBm 10dBm TX antenna gain 10dB 20dBm Path loss over 10m -68.1188dBm -48.1188dBm Rx antenna gain 10dB -38.1188dBm Background noise -174dBm/Hz -174dBm/Hz Noise BW(3Ghz) +94.7712 -79.2288dBm Noise figure of RX +10dB -69.2288dBm SNR at output -38.1188-(-69.2288)=31.11 Required SNR 10dB System margin 21dB Oxygen absorption can be omitted here Path loss more complicated / name of department 30-5-2010 PAGE 2
  • 4. Bit rate calculation C BW *log 2 (1 SNR) 14.863 We use 10 Gbps We use 16-QAM modulation, which The required Bandwidth 12Gbps/4b=3GHz
  • 5. System Specification Specifications achieved unit Technology 45-130 65 nm Supply Power - 1.2 V Power <1000 39.4296 mW cost <10 5.4 euro Noise Figure 10 1.93 dB RF frequency 57-64 60.91 GHz LO frequency 55-64 57.91 GHz IF frequency 3 3 GHz Bond wire:1nH/mm Bond pad~ 100 fF
  • 6. Choice of Architecture(1) Goal To design a Low noise amplifier, Mixer and the oscillator Low IF architecture was selected. +++ Monolithic integration LNA matching LPF filter --- LO leakage IP2 Sensitive to noise Gain and phase match / name of department 30-5-2010 PAGE 5
  • 7. Choice of Architecture(2) Antennas • Omnidirectional antennas provide limited gain and bit rate • Using directional and array of antennas to meet the requirements • Use of phase shifters to improve SNR of a receiver • It reduces multipath propagation • Filters Low pass filter at the output mixer / name of department 30-5-2010 PAGE 6
  • 8. The CMOS technology We choose 65 nm for our design Trade off between design bottleneck and benefits of scaling Advantages Higher speed, higher integration Challenges • Increasing leakage • Reduction in voltage supply • Process variability • Parasitic effects and impedance matching / name of department 30-5-2010 PAGE 7
  • 9. System performance Noise Figure IIP3 Gain SNR Power consumed 1.425dB -24.55 dB 21.521dB ????? 39.4296mW / name of department 30-5-2010 PAGE 8
  • 10. New System Performance Noise IIP3(dB) Gain(dB) SNR Power Figure(dB) consumed (mW) 1.3971 -14.42 17.768 ???? 52.79 / name of department 30-5-2010 PAGE 9
  • 11. LOW NOISE AMPLIFIER DESIGN / name of department 30-5-2010 PAGE 10
  • 12. Survey of LNA’s Paper CMOS Supply topology specifications (nm) (volt) 60 GHz compact 65 1.2 3 stage single Center LNA in 65 nm ended topology Frequency=57 GHz Gain=19.1 NF=5.5 dB A 60GHz Low- 90 1.2 Single stage NF=9.6, Noise High- cascode IP3=-14 Linearity Receiver gain =10 dB Front-End Design 5.4mA A 60-GHz CMOS 130 1.2 Common gate Voltage gain:28 dB Receiver Front-End topology NF:12.5, Power :9mw 60-GHz Receiver 65n 1.2 5 stage Cascode 20 dB gain and Transmitter topology Front-Ends in 65- / name of department 30-5-2010 PAGE 11
  • 13. Choice of topology • Choice between common gate,cascode and common source In this a assignment a combination of cascode and common source amplifier is used / name of department 30-5-2010 PAGE 12
  • 14. Design of the circuit 30-5-2010 PAGE 13 /Courtesy:LNA-ESD co design for fully integrated CMOS wireless receivers
  • 15. Passive and active component specifications These formula are based on the short channel model of CMOS Length=0.065e-6 m Ft=190MHz / name of department 30-5-2010 PAGE 14
  • 16. Design of the second Stage •C1 is taken as a bond pad capacitance •L1 is the bond wire used for output matching 1 w0 LC •CL is designed by •Ld and the source inductance of M1 is designed to maximize gain. •RL is designed for a quality factor of 10 / name of department 30-5-2010 PAGE 15
  • 17. Design of circuit (2) • Biasing of CMOS with a current mirror (1.72mA) • Reduces channel length modulation effect W2 Iout L2 • Iref W1 L1 •Reduction in noise finger with number of fingers •ESD protection at the gate •Input and output bond pad capacitance •Noise in the power supply lines •Input /output matching / name of department 30-5-2010 PAGE 16
  • 18. Components specifications Parameter Designed Values Optimized Values Width 9.954 um 10 um Ls(for Ft=190 GHz) 4.18e-11 H 3.35e-11 H Lg 5.55e-10 H 2.75e-10 H Ld 7.063e-12 H 4e-10 H CL 8.74e-14 F 8.79e-14 F RL 303.479 ohm 303.479 ohm / name of department 30-5-2010 PAGE 17
  • 19. Performance(1) / name of department 30-5-2010 PAGE 18
  • 20. Performance(2) / name of department 30-5-2010 PAGE 19
  • 21. Performance(3) 1dB compression point= -20 dBm K>1 for the 60Ghz band / name of department 30-5-2010 PAGE 20
  • 22. Performance / name of department 30-5-2010 PAGE 21
  • 23. / name of department 30-5-2010 PAGE 22
  • 24. Specifications RF_power IP3in IP3out_upper IP3out_lower -12 -12.437 7.369 7.282 1st and 3rd order spectrums / name of department 30-5-2010 PAGE 23
  • 25. LNA achieved specifications Specifications S(2,1) (power again) 19.25 dB Voltage gain 18.54 dB Third order intercept(IIP3) -12 dBm Noise figure 1.206 dB 1 dB compression point -20dBm Center frequency 60.91 GHz Power dissipation 31.03 mW / name of department 30-5-2010 PAGE 24
  • 26. Future Developments • Replacing inductors with Microstrip transmission lines, coplanar waveguides • Resistance and Inductance of interconnects • Effects of variation in temperature • Effect of the substrate / name of department 30-5-2010 PAGE 25
  • 27. Corrections made to the LNA • Biasing of the output stage. The output stage was biased with a resitor of 10K ohm from the drain to the source. / name of department 30-5-2010 PAGE 26
  • 28. New performance(1):Noise Figure •Noise figure / name of department 30-5-2010 PAGE 27
  • 29. New performance(2): S parameters / name of department 30-5-2010 PAGE 28
  • 30. New performance(3): 1 dB compression point and stability / name of department 30-5-2010 PAGE 29
  • 31. New Performance(3):Input output matching / name of department 30-5-2010 PAGE 30
  • 32. New performance(4):IIP3 RF_power IP3in IP3out_upper IP3out_lower -12 -12.621 7.185 7.284 / name of department 30-5-2010 PAGE 31
  • 33. New Specifications Specifications S(2,1) (power again) 16.25 dB Voltage gain 14.925 dB Third order intercept(IIP3) -12.621 dBm Noise figure 1.206 dB 1 dB compression point -19dBm Center frequency 60.91 GHz Power dissipation 44.4mW / name of department 30-5-2010 PAGE 32