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Impact of High
Density Hot Aisles on
IT Personnel Work
Conditions
By Jim Fink




                        White Paper #123
Executive Summary
The use of modern enclosed hot aisles to address increasing power densities in the data

center has brought into question the suitability of working conditions in these hot aisle

environments. In this paper, it is determined that the additional heat stress imposed by

such high density IT environments is of minimal concern.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   2
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Introduction
The primary purpose of a computer room and associated infrastructure is to support the operation of critical
IT equipment. Traditionally, most owners of large critical data centers have been more than willing to accept
a reasonable amount of computer room worker discomfort if necessary to support critical IT systems. This is
evidenced in nearly every data center by the presence of elevated noise, hot and cool regions, high-velocity
air, and sometimes less than ideal lighting as compared with adjoining office space. However, in recent
years the rising power density of IT equipment has demanded new approaches to computer room cooling.
In some cases these new approaches raise questions about the ability of workers to comfortably and safely
work in the computer room.




Traditional and Modern Approaches to Cooling Data
Centers
The traditional approach to cooling a data center uses a loosely coupled method of conveying air to and from
the load. This means that cooling system supply air is widely dispersed within the room, generally via raised
floor. There are no rigid boundaries to prevent cool air from mixing freely with air throughout the entire
volume of the room. This is done as an attempt to hold the average bulk temperature of the room down to a
level acceptable to IT equipment and personnel. The return air stream to the cooling system in such a room
is representative of bulk room conditions, usually around 72oF (22oC). If a hot aisle / cold aisle layout is used
in the room, temperatures observed should be higher than 72oF (22oC) in the hot aisle and lower than 72oF
(22oC) in the cold aisle. In practice, these deviations from the overall average room temperature are almost
never as large as desired. This is because traditional designs often allow a large portion of cool supply air to
bypass its intended delivery points and directly enter the hot aisle, usually through cable hole penetrations in
the floor. This lowers the hot aisle temperature. Similarly, legacy facilities generally contain no provisions to
prevent hot IT equipment exhaust air from being drawn over the tops of racks or around the ends of rows
into the cold aisle. While this is unarguably detrimental to the IT equipment in the room, the cool air leakage
serves to lessen the heat stress experienced by an individual working in the hot aisle, and the hot air leakage
might warm an uncomfortably cold aisle. Both recirculation flow paths are primarily undesirable because
they increase average IT equipment operating temperatures and decrease cooling system efficiency.
Figure 1 illustrates the data center and its air flow pattern when this traditional approach to cooling is used.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   3
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Figure 1 – Air flow pattern with traditional cooling approach




These flooded designs from years past have survived until now only because power densities were low
enough to avoid overheating IT equipment even with the imprecise delivery of cool air. Limitations become
immediately apparent when older facilities are retrofitted with high power density IT equipment without
thoroughly reconsidering the cooling architecture. For this reason, infrastructure manufacturers have
introduced products aimed at preventing recirculation for the benefit of IT equipment and the reduction of
facility operational costs. One such system, considered in this paper, involves completely enclosing the hot
aisle such that nearly all recirculation is prevented. This can be accomplished with proprietary manufactured
retrofitable products, or simply incorporated into green field building designs using normal construction
materials. An example of an enclosed system using the APC hot aisle containment system is illustrated in
Figure 2.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   4
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Figure 2 – Modern cooling approach




Some users of these new cooling systems have expressed interest in quantifying the level of heat stress that
workers are being subjected to in order to ensure compliance with local worker safety standards. This paper
intends to answer this question in both an absolute and relative sense. A conservative set of assumptions
are made and comparisons are drawn between worker heat stress in a legacy data center and a modern
zero recirculation data center.


Heat and mass transfer analysis helps to illustrate the potential effects of recirculation on worker heat
stress. By enforcing conservation of mass and energy, it is shown that for a worker standing in the hot aisle,
heat stress could either decrease or increase as recirculation is reduced or eliminated. The actual result
depends on where the worker is standing in relation to the onset of air mixing. If the worker positions himself
such that he is mostly exposed to unmixed server exhaust air, he will be exposed to higher temperatures
when recirculation is occuring than when it is not. This would likely be the case for someone working in very
close proximity to the exhaust vents on servers. However, a worker whose job involved moving around in
the general volume bounded by the hot aisle would likely experience lower temperatures in a data center
where recirculation is allowed to occur. This is because the air to which this worker is exposed has had
more of an opportunity to be tempered by cool supply air leaking into the hot aisle.                           Appendix A steps
through the energy balance equations to illustrate this point.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   5
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Meaningful conclusions cannot be drawn upon this dependency alone because turbulent mixing is somewhat
like the weather. It is nearly impossible to perfectly predict, and you’ll never find two facilities where it
happens the same way. However, with the competing effects well understood, an experiment with
appropriate assumptions can be designed to best approximate worker heat stress in a real world data center.




The CFD Experiment
The experiment involves comparison of two model data centers using Computational Fluid Dynamics (CFD)
simulation models. The models are constructed and assumptions applied so as to most nearly represent
typical installations of a legacy raised floor type data center and a modern enclosed hot aisle data center.
Figures 3 and 4 illustrate the layout for each simulation.


                                  Figure 3 – Top view of legacy data center floor plan

                               Raised Floor                                  IT Enclosures




                 Downflow
                 Cooling
                 Unit
                                           PDU UPS
                                                                               Perforated
                                                                               Tiles




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   6
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Figure 4 – Top view of modern enclosed hot aisle data center floor plan


                               Enclosed Horizontal Flow
                               Hot Aisle Cooling Unit




                           PDU                UPS                    IT Enclosures

The simulations differ as little as possible so as to isolate the effect of the hot aisle enclosure on worker heat
stress. The size of the room has been chosen so as to represent a small 40 kW data center, or one zone of
a much larger data center. Power density for both models was fixed to 3 kW per rack. Variables such as
cooling system air flow, IT equipment air flow, UPS air flow and inefficiencies, and room dimensions and
layout are held constant. By doing so, the CFD can focus on the impact of re-circulation in a raised floor
environment in contrast to a zero circulation, enclosed hot aisle environment. The exact specifications used
in each model are listed in Appendix B.


For both models, “virtual thermocouples” are placed immediately behind each rack from floor level to six feet
(1.83 meters) above the floor in one foot (0.30 meter) increments. The average temperature of all hot aisle
sensing points is used to estimate bulk hot aisle dry bulb temperature to which a worker would be exposed.


However, the dry bulb temperature alone is a poor measure of worker heat stress because it does not take
into account the physiological effect of humidity levels or the presence of radiant heat. A much better
measure of heat stress is Wet Bulb Globe Temperature, or WBGT. WBGT is different from a normal
thermometer reading in that it takes into consideration air temperature, humidity, and radiant heat. Each of
these factors can contribute to heat stress experienced by a worker. Guidance for maximum WBGT
exposure for a variety of conditions is provided in the Occupational Safety & Health Administration (OSHA)
Technical Manual Section III, Chapter 4. Other heat indices include the Effective Temperature Index (ET),
and Heat Stress Index (HSI), also known as the Belding & Hatch Index. ET should be applied only when
humidity is very high (IT equipment exhaust air is normally less than 20% RH humidity), and HSI is difficult to



©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   7
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
use and not a satisfactory indication of individual worker heat stress1                      Equation 1 is for WBGT when no
solar radiation is present, as is assumed to be the case in data centers.




                                             WBGT = .7 NWB + .3 GT                (Equation 1)
                                                                   where;
                                             NWB is the natural wet bulb temperature
                                                     GT is the globe temperature




The natural wet bulb, NWB, temperature is a function of both the dry bulb temperature and relative humidity
in a room. It is measured by placing a water-soaked wick type material over the bulb of a normal mercury
thermometer. The latent heat removed from the thermometer bulb by evaporation of the water reduces the
temperature relative to dry bulb, and is a direct representation of the ease with which a worker can disipate
heat by sweating. A psychrometric chart can also be used to indicate wet bulb temperature if relative
humidity is known. It has been assumed that both data centers are controlled to 45% RH. The globe
temperature, GT, is defined as the reading of a temperature sensor in the center of a thin-walled blackened
copper sphere. Both radiant heat and ambient dry bulb temperature contribute to this reading. The level of
radiant heat absorbed by an individual standing in the hot aisle is negligible because visible solid surfaces
are not substantially hotter than the worker’s body temperature. Because of this, the dry bulb temperature
from the CFD simulation can be used in place of globe temperature without compromising accuracy. NWB
and GT are then summed using Equation 1 to arrive at WBGT.


The experiment results are judged for acceptability against OSHA (US) and ISO (international) guidelines.
Table 1 represents these OSHA guidelines.


                                            Table 1 – OSHA guidelines (US only)

Work / Rest Regimen                 Light Work Load                     Moderate Work Load                  Heavy Work Load
(hourly duty cycles)                Max Permissible WBGT                Max Permissible WBGT                Max Permissible WBGT
Continuous                                   86F (30C)                          80F (26.7C)                           77F (25C)
75% work / 25% rest                         87F (30.6C)                         82F (27.8C)                         78F (25.6C)
50% work / 50% rest                         89F (31.7C)                         85F (29.4C)                         82F (27.8C)
25% work / 75% rest                         90F (32.2C)                         88F (31.1C)                           86F (30C)



OSHA provides adjustments for a number of other conditions such as clothing type and work classification in
order to make WBGT a usable quantity accross a diverse range of industries. Additionally, OSHA guidelines
for heat stress apply to individuals in generally good health, receiving adequate water and electrolyte intake.
The OSHA description of “light work load” is thought to most nearly match the work of a typical IT worker
task such as installing rack mounted equipment, or routing network cables, and the worker is assumed to be




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   8
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
dressed in normal single layer clothes. For comparison, OSHA defines “heavy work load” as heavy full body
work, and cites ”laying railroad ties” as an example of work fitting this category.


Regulations and directives regarding occupational safety generally differ from country to country, so it is
important to be familiar with the local requirements. ISO 7243, “Hot environments – Estimation of the heat
stress on working man based on WBGT index” provides similar guidance for the international community.
Figure 5 shows a graph from Annex B of ISO 7243 relating maximum WBGT for various metabolic rates and
duty cycles.


                                          Figure 5 – ISO guidelines (International)




These metabolic rates are simply numerical descriptions of how strenuous the worker’s job is. ISO 7243
states that a person’s metabolic rate can vary from less than 65 watts per square meter of body surface area
while at rest up to more than 260 watts per square meter during extreme exertion. From ISO descriptions,
an IT worker’s tasks are thought to most nearly represent ISO ‘class 1’ or light duty work between 65 and
130 watts per square meter. From Figure 5 it can be seen that for worst case continuous duty work at 130
watts per square meter, the maximum permissable temperature is 30C WBGT (same as OSHA guidance).
The standard states that, “almost all individuals can ordinarily be exposed without any harmful effect...” at
this temperature. Similarly to the OSHA standard, ISO assumes the worker is in good health, and is
acclimitized to the work environment. For non-acclimitized workers, ISO reduces the maximum temperature
from 30C to 29C WBGT.




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stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Experiment Results
The enclosed hot aisle system results in colder cold aisles and hotter hot aisles. The CFD analysis shows
that this cooling approach does result in slightly increased heat stress (approximately 1 degree WBGT F) as
compared to individuals exposed to legacy hot aisle conditions. However, the anticipated heat stress
remains well below OSHA and ISO imposed limitations. Table 2 illustrates the results from the CFD
analysis.


                                               Table 2 – Results of CFD analysis
                   Average Hot Aisle Dry           Worst Case Hot Aisle             Wet Bulb Globe                Average IT Equipment
                   Bulb Temperature                Wet Bulb Temperature             Temperature (OSHA /           Inlet Temperature
                   (deg F / C)                     (deg F / C)                      ISO max = 86F / 30C)          (deg F / C)



Raised Floor
Room                       81.9 / 27.7                     68.7 / 20.4                     72.7 / 22.6                    73.8 / 23.2


Enclosed Hot
Aisle Room                 89.8 / 32.1                     66.5 / 19.2                     73.5 / 23.1                    70.7 / 21.5



The dry bulb air temperature found to exist behind the racks is on average 8oF (4.4 oC) higher for the
enclosed hot aisle case. This is because of the dominating cooling effect of supply air leakage to the hot
aisle in the raised floor room as previously explained. Given the computed average inlet temperatures and
assumed relative humidity conditions, the air being exhausted into the hot aisle is found to have a worst case
wet bulb temperature of 68.7oF (20.4 oC).


The average IT equipment inlet temperature (T2 in Figure A1 of Appendix A) is also readily available as a
product of the CFD analysis, and is therefore included in Table 2. Although secondary to the stated purpose
of this paper, the information is provided to the reader for comparison because IT equipment inlet
temperature must be uniformly maintained in a range of 68-77 F (20-25 C) for optimal availability. 2 Figure
6 goes further to show average IT equipment inlet temperature as a function of height. Position 7 is the top-
most position in a standard 42U rack, with each of the 7 positions containing a single 6U server.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   10
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Figure 6 – IT equipment inlet temperature as a function of mounting position in rack.

                                                       Average IT Inlet Temperatures

                      7                                                                                                   91.0



                      6                                                        80.9



                      5
    Server Position




                                                                                                 Enclosed Hot Aisle Room
                                                                                                 Raised Floor Room
                      4



                      3



                      2
                                                                            AHR max recommended
                                                                            inlet temp
                      1
                       65.0            70.0          75.0               80.0                 85.0                 90.0                    95.0
                                                              Temperature (deg F)




Although both average temperatures fall within desired range, Figure 6 shows that the legacy raised floor
data center has a very undesirable temperature gradient, subjecting equipment installed near the top of
racks (shown as server positions 6 and 7) to excessive temperatures of 80.9oF (27.2oC) and 91oF (32.8 oC)
respectively.




Conclusions
Recirculation prevention is a desirable condition that results in colder cold aisles and hotter hot aisles. While
this characteristic benefits the facility from the standpoint of availability, power density capacity, and energy
efficiency, it does result in slightly increased heat stress (approximately 1 degree WBGT F) to individuals
exposed to hot aisle conditions. However, the anticipated heat stress remains well below OSHA / ISO
imposed limitations. The small rise in WBGT occurs because mixing in the raised floor facility acts to lower
hot aisle WBGT slightly more than the increased IT exhaust temperature acts to raise it. Although
conservative assumptions were made, individual data center performance will vary. For example, a
sufficiently deep (36 inches or 0.91 meter) unobstructed raised floor was used in this experiment to be
conservative. If a shallower raised floor with partial blockage were simulated, the results could differ
significantly.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or      11
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
References
1. OSHA Technical Manual Section III, Ch. 4, Table III:4-2
2. ASHRAE TC 9.9
3. ISO 7243




About the Author:
Jim Fink is product manager for large systems precision cooling products at American Power Conversion in
West Kingston, RI. He holds a Bachelors degree in Electrical Engineering from Union College in
Schenectady, NY, and a Masters in Business Administration from University of Rhode Island. He is a
registered professional engineer in the state of Rhode Island, and has 10 years of experience in mission
critical facilities design and operation.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   12
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Appendix A – Heat & Mass Transfer Theory
The effect of recirculation on hot aisle worker heat stress is unclear because of competing effects. Figure
A1 shows a flow diagram representing intended and recirculation air flow paths in a computer room. It is
assumed that the system is heat and flow balanced, meaning the total heat rejected from the cooling system
is equal to the total heat dissipated by the IT equipment, and the total flow rate of air supplied by the cooling

equipment is equal to the total air ingested by the IT equipment, or                       & &
                                                                                          V1 + V2 .


            Figure A1 – Recirculation air flow paths
                                                                                   T1 :   Cooling equipment supply air temperature
                                     &
                                    V1                                             T2 :   IT equipment inlet air temperature
                                                       Mixing
                T1                                         T2                      T3 :   IT equipment exhaust air temperature

                                                                                   T4 :
 &
V2          Cooling
           Equipment
                                                        IT
                                                    Equipment
                                                                      &
                                                                     V2
                                                                                          Cooling equipment return air temperature

                                                                                   ∆T = T4 − T1 = T3 − T2

                  T4                                                                &
                                                                                   V1 :   Volumetric flow rate of air in intended flow
                                                        T3
              Mixing
                                      &
                                     V1                                            path


                                                                                                                                                &
                                                                                                                                               V2
                                                                                    : Volumetric flow rate of recirculation air




An energy balance written for both stream mixing processes reveals:
                                                        &         &
                                                       V1 ⋅ T1 + V2 ⋅ T3
                                               T2 =                               Equation 1
                                                             & &
                                                            V1 + V2
                                                        &         &
                                                       V1 ⋅ T3 + V2 ⋅ T1
                                               T4 =                               Equation 2
                                                             & &
                                                            V1 + V2


Equations 1 and 2 are rearranged so that the effect of recirculation on                      T2 and T4 is apparent.
                                                            ⎛V&           ⎞
                                               T2 = T1 + ∆T ⎜ 2
                                                            ⎜V            ⎟
                                                                          ⎟       Equation 3
                                                              &
                                                            ⎝ 1           ⎠
                                                            ⎛V&           ⎞
                                               T4 = T3 − ∆T ⎜ 2
                                                            ⎜V            ⎟
                                                                          ⎟       Equation 4
                                                              &
                                                            ⎝ 1           ⎠




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   13
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Equation 3 and 4 show that as recirculation decreases, IT equipment supply air temperture                                T2   is minimized,

and cooling system return air temperature               T4 is maximized.        For previously mentioned reasons, these are

both generally desirable conditions with respect to facility availability and energy efficiency.


A worker directly exposed to IT equipment exhaust air would experience temperature                               T3 .   This may occur

for example if the worker’s job required he or she to actually stand in the back of the IT enclosure, thereby

being completely surrounded by hot exhaust air. Writing equation 3 in terms of                           T3 yields;
                                                         & &
                                                      ⎛ V + V2             ⎞
                                         T3 = T1 + ∆T ⎜ 1
                                                      ⎜ V                  ⎟
                                                                           ⎟            Equation 5
                                                          &
                                                      ⎝    1               ⎠
Equation 5 shows that temperature              T3   and hence the worker’s heat stress would decrease as recirculation

   &
( V2 ) is reduced or eliminated. In simple terms this can be explained by saying that the air around the

worker’s body has only been heated from 1 pass, not multiple passes through IT equipment, therefore it is
cooler than it would be had recirculation been occuring. However, in a typical raised floor computer room,
the return air mixing shown just upstream of the cooling system in Figure A1 often occurs further upstream
(closer to the IT equipment exhaust). In other words, cool supply air entering the hot aisle actually begins to
mix with hot server exhaust air well before travelling all the way back to the cooling system. This suggests

that a worker standing in the hot aisle would be more nearly exposed to                        T4 , the post mixing return air
tempurature, rather than         T3 , the unmixed IT equipment exhaust air temperature.                     Equation 4 shows that a

worker standing in air at temperature            T4 would endure increased heat stress if recirculation were reduced or
eliminated. Thus, the net effect of recirculation prevention on a worker’s heat stress level depends on just
where the worker is standing in relation to where the two air streams begin mixing. Meaningful conclusions
cannot be drawn upon this dependency alone because turbulent mixing is somewhat like the weather. It’s
nearly impossible to perfectly predict, and you’ll never find two facilities where it happens the same way.
However, with the competing effects well understood, an experiment with appropriate assumptions can be
designed to best approximate worker heat stress in a real world data center.




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   14
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0
Appendix B – Data Used in CFD Models
Specifications Common to Both Data Center Models
IT Racks                                         13

Power per IT rack                                3.08 kW uniformly distributed amongst 7 x 6U servers per rack

Total IT power                                   40 kW

UPS inefficiencies                               3.2 kW

PDU inefficiencies                               800 W

IT air flow per rack                             391 cfm (664 m3/h)

UPS air flow                                     513cfm (872 m3/h)

Room dimensions                                  H x W x D = 10 x 23.4 x 14 feet (3 x 7.1 x 4.3 meters)

IT intake Relative Humidity                      45%

Cooling system air flow                          6,500cfm (11,043 m3/h)




Specifications Unique to Raised Floor Data Center
                                                 A 3 foot (0.91 meter) under-floor plenum is used to minimize effects of under-
Raised-floor plenum
                                                 floor pressure gradient
                                                 40% recirculation occurs by way of uniformly distributed leakage from the
                                                 raised floor
Recirculation
                                                 Note: most large raised floor installations observed in the field are found to
                                                 exhibit at least this much recirculation.

Cooling system                                   Down-flow cooling unit




Specifications Unique to Enclosed Hot Aisle Data Center
Hot Aisle                                        Enclosed on tops and ends, but not hermetically sealed
Cooling system                                   Rear return front discharge cooling unit (horizontal flow)




©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or   15
stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com           Rev 2005-0

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Impact of High Density Hot Aisles on IT Worker Conditions

  • 1. Impact of High Density Hot Aisles on IT Personnel Work Conditions By Jim Fink White Paper #123
  • 2. Executive Summary The use of modern enclosed hot aisles to address increasing power densities in the data center has brought into question the suitability of working conditions in these hot aisle environments. In this paper, it is determined that the additional heat stress imposed by such high density IT environments is of minimal concern. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 2 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 3. Introduction The primary purpose of a computer room and associated infrastructure is to support the operation of critical IT equipment. Traditionally, most owners of large critical data centers have been more than willing to accept a reasonable amount of computer room worker discomfort if necessary to support critical IT systems. This is evidenced in nearly every data center by the presence of elevated noise, hot and cool regions, high-velocity air, and sometimes less than ideal lighting as compared with adjoining office space. However, in recent years the rising power density of IT equipment has demanded new approaches to computer room cooling. In some cases these new approaches raise questions about the ability of workers to comfortably and safely work in the computer room. Traditional and Modern Approaches to Cooling Data Centers The traditional approach to cooling a data center uses a loosely coupled method of conveying air to and from the load. This means that cooling system supply air is widely dispersed within the room, generally via raised floor. There are no rigid boundaries to prevent cool air from mixing freely with air throughout the entire volume of the room. This is done as an attempt to hold the average bulk temperature of the room down to a level acceptable to IT equipment and personnel. The return air stream to the cooling system in such a room is representative of bulk room conditions, usually around 72oF (22oC). If a hot aisle / cold aisle layout is used in the room, temperatures observed should be higher than 72oF (22oC) in the hot aisle and lower than 72oF (22oC) in the cold aisle. In practice, these deviations from the overall average room temperature are almost never as large as desired. This is because traditional designs often allow a large portion of cool supply air to bypass its intended delivery points and directly enter the hot aisle, usually through cable hole penetrations in the floor. This lowers the hot aisle temperature. Similarly, legacy facilities generally contain no provisions to prevent hot IT equipment exhaust air from being drawn over the tops of racks or around the ends of rows into the cold aisle. While this is unarguably detrimental to the IT equipment in the room, the cool air leakage serves to lessen the heat stress experienced by an individual working in the hot aisle, and the hot air leakage might warm an uncomfortably cold aisle. Both recirculation flow paths are primarily undesirable because they increase average IT equipment operating temperatures and decrease cooling system efficiency. Figure 1 illustrates the data center and its air flow pattern when this traditional approach to cooling is used. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 3 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 4. Figure 1 – Air flow pattern with traditional cooling approach These flooded designs from years past have survived until now only because power densities were low enough to avoid overheating IT equipment even with the imprecise delivery of cool air. Limitations become immediately apparent when older facilities are retrofitted with high power density IT equipment without thoroughly reconsidering the cooling architecture. For this reason, infrastructure manufacturers have introduced products aimed at preventing recirculation for the benefit of IT equipment and the reduction of facility operational costs. One such system, considered in this paper, involves completely enclosing the hot aisle such that nearly all recirculation is prevented. This can be accomplished with proprietary manufactured retrofitable products, or simply incorporated into green field building designs using normal construction materials. An example of an enclosed system using the APC hot aisle containment system is illustrated in Figure 2. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 4 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 5. Figure 2 – Modern cooling approach Some users of these new cooling systems have expressed interest in quantifying the level of heat stress that workers are being subjected to in order to ensure compliance with local worker safety standards. This paper intends to answer this question in both an absolute and relative sense. A conservative set of assumptions are made and comparisons are drawn between worker heat stress in a legacy data center and a modern zero recirculation data center. Heat and mass transfer analysis helps to illustrate the potential effects of recirculation on worker heat stress. By enforcing conservation of mass and energy, it is shown that for a worker standing in the hot aisle, heat stress could either decrease or increase as recirculation is reduced or eliminated. The actual result depends on where the worker is standing in relation to the onset of air mixing. If the worker positions himself such that he is mostly exposed to unmixed server exhaust air, he will be exposed to higher temperatures when recirculation is occuring than when it is not. This would likely be the case for someone working in very close proximity to the exhaust vents on servers. However, a worker whose job involved moving around in the general volume bounded by the hot aisle would likely experience lower temperatures in a data center where recirculation is allowed to occur. This is because the air to which this worker is exposed has had more of an opportunity to be tempered by cool supply air leaking into the hot aisle. Appendix A steps through the energy balance equations to illustrate this point. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 5 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 6. Meaningful conclusions cannot be drawn upon this dependency alone because turbulent mixing is somewhat like the weather. It is nearly impossible to perfectly predict, and you’ll never find two facilities where it happens the same way. However, with the competing effects well understood, an experiment with appropriate assumptions can be designed to best approximate worker heat stress in a real world data center. The CFD Experiment The experiment involves comparison of two model data centers using Computational Fluid Dynamics (CFD) simulation models. The models are constructed and assumptions applied so as to most nearly represent typical installations of a legacy raised floor type data center and a modern enclosed hot aisle data center. Figures 3 and 4 illustrate the layout for each simulation. Figure 3 – Top view of legacy data center floor plan Raised Floor IT Enclosures Downflow Cooling Unit PDU UPS Perforated Tiles ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 6 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 7. Figure 4 – Top view of modern enclosed hot aisle data center floor plan Enclosed Horizontal Flow Hot Aisle Cooling Unit PDU UPS IT Enclosures The simulations differ as little as possible so as to isolate the effect of the hot aisle enclosure on worker heat stress. The size of the room has been chosen so as to represent a small 40 kW data center, or one zone of a much larger data center. Power density for both models was fixed to 3 kW per rack. Variables such as cooling system air flow, IT equipment air flow, UPS air flow and inefficiencies, and room dimensions and layout are held constant. By doing so, the CFD can focus on the impact of re-circulation in a raised floor environment in contrast to a zero circulation, enclosed hot aisle environment. The exact specifications used in each model are listed in Appendix B. For both models, “virtual thermocouples” are placed immediately behind each rack from floor level to six feet (1.83 meters) above the floor in one foot (0.30 meter) increments. The average temperature of all hot aisle sensing points is used to estimate bulk hot aisle dry bulb temperature to which a worker would be exposed. However, the dry bulb temperature alone is a poor measure of worker heat stress because it does not take into account the physiological effect of humidity levels or the presence of radiant heat. A much better measure of heat stress is Wet Bulb Globe Temperature, or WBGT. WBGT is different from a normal thermometer reading in that it takes into consideration air temperature, humidity, and radiant heat. Each of these factors can contribute to heat stress experienced by a worker. Guidance for maximum WBGT exposure for a variety of conditions is provided in the Occupational Safety & Health Administration (OSHA) Technical Manual Section III, Chapter 4. Other heat indices include the Effective Temperature Index (ET), and Heat Stress Index (HSI), also known as the Belding & Hatch Index. ET should be applied only when humidity is very high (IT equipment exhaust air is normally less than 20% RH humidity), and HSI is difficult to ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 7 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 8. use and not a satisfactory indication of individual worker heat stress1 Equation 1 is for WBGT when no solar radiation is present, as is assumed to be the case in data centers. WBGT = .7 NWB + .3 GT (Equation 1) where; NWB is the natural wet bulb temperature GT is the globe temperature The natural wet bulb, NWB, temperature is a function of both the dry bulb temperature and relative humidity in a room. It is measured by placing a water-soaked wick type material over the bulb of a normal mercury thermometer. The latent heat removed from the thermometer bulb by evaporation of the water reduces the temperature relative to dry bulb, and is a direct representation of the ease with which a worker can disipate heat by sweating. A psychrometric chart can also be used to indicate wet bulb temperature if relative humidity is known. It has been assumed that both data centers are controlled to 45% RH. The globe temperature, GT, is defined as the reading of a temperature sensor in the center of a thin-walled blackened copper sphere. Both radiant heat and ambient dry bulb temperature contribute to this reading. The level of radiant heat absorbed by an individual standing in the hot aisle is negligible because visible solid surfaces are not substantially hotter than the worker’s body temperature. Because of this, the dry bulb temperature from the CFD simulation can be used in place of globe temperature without compromising accuracy. NWB and GT are then summed using Equation 1 to arrive at WBGT. The experiment results are judged for acceptability against OSHA (US) and ISO (international) guidelines. Table 1 represents these OSHA guidelines. Table 1 – OSHA guidelines (US only) Work / Rest Regimen Light Work Load Moderate Work Load Heavy Work Load (hourly duty cycles) Max Permissible WBGT Max Permissible WBGT Max Permissible WBGT Continuous 86F (30C) 80F (26.7C) 77F (25C) 75% work / 25% rest 87F (30.6C) 82F (27.8C) 78F (25.6C) 50% work / 50% rest 89F (31.7C) 85F (29.4C) 82F (27.8C) 25% work / 75% rest 90F (32.2C) 88F (31.1C) 86F (30C) OSHA provides adjustments for a number of other conditions such as clothing type and work classification in order to make WBGT a usable quantity accross a diverse range of industries. Additionally, OSHA guidelines for heat stress apply to individuals in generally good health, receiving adequate water and electrolyte intake. The OSHA description of “light work load” is thought to most nearly match the work of a typical IT worker task such as installing rack mounted equipment, or routing network cables, and the worker is assumed to be ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 8 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 9. dressed in normal single layer clothes. For comparison, OSHA defines “heavy work load” as heavy full body work, and cites ”laying railroad ties” as an example of work fitting this category. Regulations and directives regarding occupational safety generally differ from country to country, so it is important to be familiar with the local requirements. ISO 7243, “Hot environments – Estimation of the heat stress on working man based on WBGT index” provides similar guidance for the international community. Figure 5 shows a graph from Annex B of ISO 7243 relating maximum WBGT for various metabolic rates and duty cycles. Figure 5 – ISO guidelines (International) These metabolic rates are simply numerical descriptions of how strenuous the worker’s job is. ISO 7243 states that a person’s metabolic rate can vary from less than 65 watts per square meter of body surface area while at rest up to more than 260 watts per square meter during extreme exertion. From ISO descriptions, an IT worker’s tasks are thought to most nearly represent ISO ‘class 1’ or light duty work between 65 and 130 watts per square meter. From Figure 5 it can be seen that for worst case continuous duty work at 130 watts per square meter, the maximum permissable temperature is 30C WBGT (same as OSHA guidance). The standard states that, “almost all individuals can ordinarily be exposed without any harmful effect...” at this temperature. Similarly to the OSHA standard, ISO assumes the worker is in good health, and is acclimitized to the work environment. For non-acclimitized workers, ISO reduces the maximum temperature from 30C to 29C WBGT. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 9 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 10. Experiment Results The enclosed hot aisle system results in colder cold aisles and hotter hot aisles. The CFD analysis shows that this cooling approach does result in slightly increased heat stress (approximately 1 degree WBGT F) as compared to individuals exposed to legacy hot aisle conditions. However, the anticipated heat stress remains well below OSHA and ISO imposed limitations. Table 2 illustrates the results from the CFD analysis. Table 2 – Results of CFD analysis Average Hot Aisle Dry Worst Case Hot Aisle Wet Bulb Globe Average IT Equipment Bulb Temperature Wet Bulb Temperature Temperature (OSHA / Inlet Temperature (deg F / C) (deg F / C) ISO max = 86F / 30C) (deg F / C) Raised Floor Room 81.9 / 27.7 68.7 / 20.4 72.7 / 22.6 73.8 / 23.2 Enclosed Hot Aisle Room 89.8 / 32.1 66.5 / 19.2 73.5 / 23.1 70.7 / 21.5 The dry bulb air temperature found to exist behind the racks is on average 8oF (4.4 oC) higher for the enclosed hot aisle case. This is because of the dominating cooling effect of supply air leakage to the hot aisle in the raised floor room as previously explained. Given the computed average inlet temperatures and assumed relative humidity conditions, the air being exhausted into the hot aisle is found to have a worst case wet bulb temperature of 68.7oF (20.4 oC). The average IT equipment inlet temperature (T2 in Figure A1 of Appendix A) is also readily available as a product of the CFD analysis, and is therefore included in Table 2. Although secondary to the stated purpose of this paper, the information is provided to the reader for comparison because IT equipment inlet temperature must be uniformly maintained in a range of 68-77 F (20-25 C) for optimal availability. 2 Figure 6 goes further to show average IT equipment inlet temperature as a function of height. Position 7 is the top- most position in a standard 42U rack, with each of the 7 positions containing a single 6U server. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 10 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 11. Figure 6 – IT equipment inlet temperature as a function of mounting position in rack. Average IT Inlet Temperatures 7 91.0 6 80.9 5 Server Position Enclosed Hot Aisle Room Raised Floor Room 4 3 2 AHR max recommended inlet temp 1 65.0 70.0 75.0 80.0 85.0 90.0 95.0 Temperature (deg F) Although both average temperatures fall within desired range, Figure 6 shows that the legacy raised floor data center has a very undesirable temperature gradient, subjecting equipment installed near the top of racks (shown as server positions 6 and 7) to excessive temperatures of 80.9oF (27.2oC) and 91oF (32.8 oC) respectively. Conclusions Recirculation prevention is a desirable condition that results in colder cold aisles and hotter hot aisles. While this characteristic benefits the facility from the standpoint of availability, power density capacity, and energy efficiency, it does result in slightly increased heat stress (approximately 1 degree WBGT F) to individuals exposed to hot aisle conditions. However, the anticipated heat stress remains well below OSHA / ISO imposed limitations. The small rise in WBGT occurs because mixing in the raised floor facility acts to lower hot aisle WBGT slightly more than the increased IT exhaust temperature acts to raise it. Although conservative assumptions were made, individual data center performance will vary. For example, a sufficiently deep (36 inches or 0.91 meter) unobstructed raised floor was used in this experiment to be conservative. If a shallower raised floor with partial blockage were simulated, the results could differ significantly. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 11 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 12. References 1. OSHA Technical Manual Section III, Ch. 4, Table III:4-2 2. ASHRAE TC 9.9 3. ISO 7243 About the Author: Jim Fink is product manager for large systems precision cooling products at American Power Conversion in West Kingston, RI. He holds a Bachelors degree in Electrical Engineering from Union College in Schenectady, NY, and a Masters in Business Administration from University of Rhode Island. He is a registered professional engineer in the state of Rhode Island, and has 10 years of experience in mission critical facilities design and operation. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 12 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 13. Appendix A – Heat & Mass Transfer Theory The effect of recirculation on hot aisle worker heat stress is unclear because of competing effects. Figure A1 shows a flow diagram representing intended and recirculation air flow paths in a computer room. It is assumed that the system is heat and flow balanced, meaning the total heat rejected from the cooling system is equal to the total heat dissipated by the IT equipment, and the total flow rate of air supplied by the cooling equipment is equal to the total air ingested by the IT equipment, or & & V1 + V2 . Figure A1 – Recirculation air flow paths T1 : Cooling equipment supply air temperature & V1 T2 : IT equipment inlet air temperature Mixing T1 T2 T3 : IT equipment exhaust air temperature T4 : & V2 Cooling Equipment IT Equipment & V2 Cooling equipment return air temperature ∆T = T4 − T1 = T3 − T2 T4 & V1 : Volumetric flow rate of air in intended flow T3 Mixing & V1 path & V2 : Volumetric flow rate of recirculation air An energy balance written for both stream mixing processes reveals: & & V1 ⋅ T1 + V2 ⋅ T3 T2 = Equation 1 & & V1 + V2 & & V1 ⋅ T3 + V2 ⋅ T1 T4 = Equation 2 & & V1 + V2 Equations 1 and 2 are rearranged so that the effect of recirculation on T2 and T4 is apparent. ⎛V& ⎞ T2 = T1 + ∆T ⎜ 2 ⎜V ⎟ ⎟ Equation 3 & ⎝ 1 ⎠ ⎛V& ⎞ T4 = T3 − ∆T ⎜ 2 ⎜V ⎟ ⎟ Equation 4 & ⎝ 1 ⎠ ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 13 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 14. Equation 3 and 4 show that as recirculation decreases, IT equipment supply air temperture T2 is minimized, and cooling system return air temperature T4 is maximized. For previously mentioned reasons, these are both generally desirable conditions with respect to facility availability and energy efficiency. A worker directly exposed to IT equipment exhaust air would experience temperature T3 . This may occur for example if the worker’s job required he or she to actually stand in the back of the IT enclosure, thereby being completely surrounded by hot exhaust air. Writing equation 3 in terms of T3 yields; & & ⎛ V + V2 ⎞ T3 = T1 + ∆T ⎜ 1 ⎜ V ⎟ ⎟ Equation 5 & ⎝ 1 ⎠ Equation 5 shows that temperature T3 and hence the worker’s heat stress would decrease as recirculation & ( V2 ) is reduced or eliminated. In simple terms this can be explained by saying that the air around the worker’s body has only been heated from 1 pass, not multiple passes through IT equipment, therefore it is cooler than it would be had recirculation been occuring. However, in a typical raised floor computer room, the return air mixing shown just upstream of the cooling system in Figure A1 often occurs further upstream (closer to the IT equipment exhaust). In other words, cool supply air entering the hot aisle actually begins to mix with hot server exhaust air well before travelling all the way back to the cooling system. This suggests that a worker standing in the hot aisle would be more nearly exposed to T4 , the post mixing return air tempurature, rather than T3 , the unmixed IT equipment exhaust air temperature. Equation 4 shows that a worker standing in air at temperature T4 would endure increased heat stress if recirculation were reduced or eliminated. Thus, the net effect of recirculation prevention on a worker’s heat stress level depends on just where the worker is standing in relation to where the two air streams begin mixing. Meaningful conclusions cannot be drawn upon this dependency alone because turbulent mixing is somewhat like the weather. It’s nearly impossible to perfectly predict, and you’ll never find two facilities where it happens the same way. However, with the competing effects well understood, an experiment with appropriate assumptions can be designed to best approximate worker heat stress in a real world data center. ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 14 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0
  • 15. Appendix B – Data Used in CFD Models Specifications Common to Both Data Center Models IT Racks 13 Power per IT rack 3.08 kW uniformly distributed amongst 7 x 6U servers per rack Total IT power 40 kW UPS inefficiencies 3.2 kW PDU inefficiencies 800 W IT air flow per rack 391 cfm (664 m3/h) UPS air flow 513cfm (872 m3/h) Room dimensions H x W x D = 10 x 23.4 x 14 feet (3 x 7.1 x 4.3 meters) IT intake Relative Humidity 45% Cooling system air flow 6,500cfm (11,043 m3/h) Specifications Unique to Raised Floor Data Center A 3 foot (0.91 meter) under-floor plenum is used to minimize effects of under- Raised-floor plenum floor pressure gradient 40% recirculation occurs by way of uniformly distributed leakage from the raised floor Recirculation Note: most large raised floor installations observed in the field are found to exhibit at least this much recirculation. Cooling system Down-flow cooling unit Specifications Unique to Enclosed Hot Aisle Data Center Hot Aisle Enclosed on tops and ends, but not hermetically sealed Cooling system Rear return front discharge cooling unit (horizontal flow) ©2005 American Power Conversion. All rights reserved. No part of this publication may be used, reproduced, photocopied, transmitted, or 15 stored in any retrieval system of any nature, without the written permission of the copyright owner. www.apc.com Rev 2005-0