RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset

1. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr RFFront-EndModuleComparison2021–Vol.2– Focuson5GChipset Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones in 2020. SPR21530 - RF report by Stéphane Elisabeth April 2021 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

2. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 2 Table of Contents Overview / Introduction 4 o Executive Summary o Key Take Away o Reverse Costing Methodology Company Profile 11 o Apple, Samsung, Huawei, LG, Lenovo, Oppo, OnePlus, Vivo, Xiaomi, RealMe, Meizu, Sharp, ZTE/nubia o Smartphones Teardown: iPhone 12 Pro, Galaxy Note20 Ultra 5G, Mate 40 Pro, V60 ThinQ, Edge+, X50 Pro 5G, 8 pro 5G, Find X2 Pro, Mi 10 Ultra 5G, X50 Pro, Aquos R, Red magic 5G, 17 o 5G Phones Comparison: Low-End, Mid-End, High-End, Premium o Preferred band 5G and 4G in 2020 Physical Analysis Summary 50 o Summary of the analyzed RF components o Comparative Analysis: Module in RF Area, Pacakging Type, Design Win, Main Supplier, Function, OEMs main Supplier Ranking Physical Comparison 70 o Area Distribution per Supplier & Function o Area Distribution per Supplier & Function Evolution o Die Design Win in Number & Area o Die Distribution per Function o Die Distribution per Function Evolution o Filter Distribution per Smartphone: Technology and Substrate o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate o Material Substrate Distribution per Smartphone Cost Comparison 89 o Chipset Cost per Smartphones o Cost Distribution per Supplier & Function o Cost Distribution per Supplier & Function Evolution Market Analysis 95 o RFFE & Connectivity Market Ecosystem & Forecast o Technology Landscape Physical Analysis 99 o Baseband Physical Analysis 101 o Qualcomm Analysis – SDR865 and SMR526 ✓ Package View & Dimensions ✓ Die View And Dimensions ✓ Die Main Block IDs o HiSilicon Analysis – Hi6365 o Mediatek Analysis – MT6190W o Samsung Analysis – SHANNON5510 o SoC Physical and Cost Comparison o 5G Sub-6 – PAMiD Front-End Analysis 142 o B41/n41 Module Analysis o Qorvo QM75005 vs. QM78041 vs. Qualcomm QPM6585 vs. Skyworks SKY58254 o UHB, MB/HB, n77/n78, n77/n78/n79 Module analysis o 5G Sub-6 – PAM Front-End Analysis 188 o n1/n3/n7/n28/n77/n78/n79, LB/UHB module Analysis o 5G Sub-6 – Multiplexer Front-End Analysis 209 o GPS/4G/5G module Analysis o 5G Sub-6 – Diversity – Front-End Analysis 220 o n77/n78/n79, UHB Module Analysis o 5G Sub-6 & mmWave – Front-End Analysis 241 o n260/n261/n79 Module Analysis o 5G mmWave – Front-End Analysis 252 o n260/n261 Module Analysis Feedbacks 272 Related Analyses 273 SystemPlus Consulting services 275

3. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Executive Summary Last year System Plus opened hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio Frequency (RF) FEM market in selected flagship smartphones. We gathered the information into four reports to track the evolution of this technology market. This year, System Plus Consulting again offers technical and cost comparisons of smartphone RFFEMs. Every comparison report will focus on a specific subject. It can be a player’s evolution, a specific technology, or a comparison of flagship devices. This, the second volume of 2021, provides insights into technology and cost data for FEMs and several components found in 31 smartphones from the latest 5G phones. It provides a ranking of 5G phones and suppliers. It features a comprehensive overview of the RFFEM architectures on the market, comparing available smartphones from these companies. It reveals material substrate trends and main used die functions, along with the different choices in integration of communication technology. We even see millimeter wavelength (mmWave) signal support this year. Also, the report reveals how companies are integrating 5G, from premium to low-end phones. With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied to provide a large panel of technical and economic choices and an overview of the market. Every component has been analyzed to understand the manufacturing process cost. Moreover, the report includes a technical and cost comparison of the modules. It also tries to explain the smartphone makers’ choices and supplier tendencies. Note: Wifi, Bluetooth and UWB Module are not included in this report.

4. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 4 Overview / Introduction Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Company Profile – Apple, Samsung, Huawei and LG – 5G RF Major Supplier Q1 2020 Q2 2020 Q3 2020 Q4 2020 Q4 2020

5. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 5 Overview / Introduction Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Samsung Smartphone Teardown – Samsung Galaxy Note20 Ultra 5G Samsung Galaxy Note20 Ultra 5G Front View ©2021 by System Plus Consulting Samsung Galaxy Note20 Ultra 5G Opened View ©2021 by System Plus Consulting Samsung Galaxy Note20 Ultra 5G Main Board ©2021 by System Plus Consulting PAMiD Modem Wifi FEM UWB FEM RxTx IF IC NFC IC Footprint Area: ~XX mm² Total Area: ~XX mm² RFFE area: ~XX mm²

6. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 6 Overview / Introduction Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Huawei Smartphone Teardown – Huawei Mate 40 Pro Footprint Area: ~XX mm² RFFE area: XX mm² RF Components (Marking) Manufacturer Functional Network Band Area (mm²) Quantity RF Board Proportion Cost ($) 429# MURATA PAM 5G n77/n78 XX X Xx HI6H12V100 HISILICON LNA/Switch XX X Xx Jt xx MURATA Filter XX X Xx KA00 KYOCERA Filter 4G B1/B3/B7 XX X Xx QAxx TAIYO YUDEN Filter 4G B40 XX X Xx QM12114 QORVO Switch XX X Xx 24 xx MURATA Filter 4G B39 XX X Xx EP UNIDENTIFIED Switch XX X Xx SN MAXSCEND Switch XX X Xx QM11022A QORVO Switch XX X Xx HI6H13V100B21 HISILICON LNA/Switch XX X Xx QM12112 QORVO Switch XX X Xx xx OJ MURATA Filter 4G B1/B3 XX X Xx B8367 (85F) QUALCOMM Filter 4G B41 XX X Xx BGS12P2L6 INFINEON TECHNOLOGIES Switch XX X Xx SKY19249 SKYWORKS Tuner XX X Xx QM13144 QORVO Tuner XX X Xx HI6H11SV100 HISILICON LNA/Switch XX X Xx QM77038 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx A 5P MURATA Multiplexer 4G B2 XX X Xx QM77033 QORVO PAMiD 4G LB XX X Xx B8538 (8AT) QUALCOMM Multiplexer 4G B28A XX X Xx TC MAXSCEND Switch XX X Xx SKY13699 SKYWORKS Switch XX X Xx B8651 (8EB) QUALCOMM Multiplexer 4G B1 XX X Xx Hi6D05V100 HISILICON PAMiD 4G XX X Xx QDM2310 QUALCOMM Diversity XX X Xx 1C MURATA Filter 4G B12/B13 XX X Xx B8369 (85H) QUALCOMM Filter XX X Xx Hi6365V100 HISILICON RxTx 2G/3G/4G/5G XX X Xx Total XX X Xx

7. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 7 Overview / Introduction Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Mid-End Phones – 5G Version Mid-End Phone Mid-End Phone RF Components (Marking) Manufacturer Functional Network Band Area (mm²) Quantity RF Board Proportion Cost ($) MXD8543S MAXSCEND Tuner XX X Xx JJ MAXSCEND Switch XX X Xx MXD8540X MAXSCEND Switch XX X Xx Hi6D05V100 HISILICON PAMiD 4G XX X Xx Hi6D51 HISILICON PAMiD 5G n77/n78/n79 XX X Xx 540# MURATA FEM XX X Xx 434# MURATA Diversity XX X Xx HI6H12V100 HISILICON LNA/Switch XX X Xx HI6H11SV100 HISILICON LNA/Switch XX X Xx VC7365 VANCHIP PAM 2G XX X Xx BGSX24MU16 INFINEON TECHNOLOGIES Switch XX X Xx TC MAXSCEND Switch XX X Xx BGS14MPA9 INFINEON TECHNOLOGIES Switch XX X Xx BGS12WN6 INFINEON TECHNOLOGIES Switch XX X Xx BGS12P2L6 INFINEON TECHNOLOGIES Switch XX X Xx KA02 KYOCERA Multiplexer 4G B25/B66 XX X Xx A 7E MURATA Multiplexer 4G B28B XX X Xx A 8Z MURATA Multiplexer 4G B20 XX X Xx A 7D MURATA Multiplexer 4G B28A XX X Xx 1C MURATA Filter 4G B12/B13 XX X Xx 7U xx MURATA Filter 4G B28 XX X Xx XY MURATA Filter 4G B20 XX X Xx A 5R MURATA Multiplexer 4G B7 XX X Xx Jt xx MURATA Filter XX X Xx KAA KYOCERA Filter 4G B41 XX X Xx xx Ey MURATA Filter XX X Xx 175# TAIYO YUDEN Filter 4G B40 XX X Xx HI6H13V100B21 HISILICON LNA/Switch XX X Xx A 6N MURATA Multiplexer 4G B12 XX X Xx MXD8533B MAXSCEND Tuner XX X Xx Hi6365V100 HISILICON RxTx 2G/3G/4G/5G XX X Xx Total XX X Xx RF Components (Marking) Manufacturer Functional Network Band Area (mm²) Quantity RF Board Proportion Cost ($) QM77040 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx SKY78191 SKYWORKS PAMiD 4G LB XX X Xx QET5100 QUALCOMM ET XX X Xx LFx WISOL Filter 4G B34 XX X Xx QM11022 (1.5x1.1) QORVO Switch XX X Xx WX UNIDENTIFIED Switch XX X Xx SN MAXSCEND Switch XX X Xx QLN5030 QUALCOMM LNA XX X Xx MXD8643 (1.55x1.55) MAXSCEND Switch XX X Xx MXD8643 (1.18x1.18) MAXSCEND Switch XX X Xx QM12114 QORVO Switch XX X Xx X6 MURATA Filter 4G B40 XX X Xx xx Lt MURATA Filter 4G B39/B41 XX X Xx 4Hxx WISOL Filter 4G B1/B3 XX X Xx QAT3518 QUALCOMM Tuner XX X Xx Cr xx MURATA Filter 4G B41 XX X Xx BGA5H1BN6 INFINEON TECHNOLOGIES LNA 4G HB XX X Xx RF1630 QORVO Switch XX X Xx QET6100 QUALCOMM ET XX X Xx QDM2310 QUALCOMM Diversity XX X Xx QPM6585 QUALCOMM PAMiD 5G n41 XX X Xx QPM5677 QUALCOMM PAMiD 5G n77/n78 XX X Xx QPM5679 QUALCOMM PAMiD 5G n79 XX X Xx QDM5679 QUALCOMM Diversity 5G n79 XX X Xx QDM5677 QUALCOMM Diversity 5G n77/n78 XX X Xx MXD8540X MAXSCEND Switch XX X Xx QM11024 QORVO Switch XX X Xx XU MURATA Filter 4G B12/B17 XX X Xx XY MURATA Filter 4G B20 XX X Xx LTE3401H NXP LNA 4G MB/HB XX X Xx PF753 QUALCOMM Tuner XX X Xx SDR865 QUALCOMM RxTx 2G/3G/4G/5G XX X Xx QAT3518 QUALCOMM Tuner XX X Xx Total XX X Xx

8. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 8 Overview / Introduction Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Phone Included in the database Smartphone List Serie Generation Version Addon Availability # of Components Region 5G Support Modem Manuf. Modem Model Model Release Apple iPhone 12 - - 23/10/2020 37 US Sub-6/mmWave Qualcomm X55M iPhone 12 Q4-2020 Apple iPhone 12 Mini - 13/11/2020 36 US Sub-6/mmWave Qualcomm X55M iPhone 12 Mini Q4-2020 Apple iPhone 12 Pro - 23/10/2020 39 US Sub-6/mmWave Qualcomm X55M iPhone 12 Pro Q4-2020 Apple iPhone 12 Pro Max 13/11/2020 37 US Sub-6/mmWave Qualcomm X55M iPhone 12 Pro Max Q4-2020 Samsung Galaxy Z Fold2 5G 19/09/2020 25 US Sub-6/mmWave Qualcomm X55M Galaxy Z Fold2 5G Q3-2020 Samsung Galaxy Note20 - 5G 06/08/2020 28 US Sub-6/mmWave Qualcomm X55M Galaxy Note20 5G Q3-2020 Samsung Galaxy Note20 Ultra 5G 22/08/2020 24 US Sub-6/mmWave Qualcomm X55M Galaxy Note20 Ultra 5G Q3-2020 Samsung Galaxy S20 - - 06/03/2020 18 Global Sub-6 Samsung S5T5123 Galaxy S20 Q1-2020 Samsung Galaxy S20 + 5G 06/03/2020 25 US Sub-6/mmWave Qualcomm X55M Galaxy S20+ 5G Q1-2020 Samsung Galaxy S20 Ultra 5G 06/03/2020 27 US Sub-6/mmWave Qualcomm X55M Galaxy S20 Ultra 5G Q1-2020 Vivo X50 Pro - - 05/03/2020 24 CN Sub-6 Qualcomm SM7250 X50 Pro Q1-2020 Vivo Nex 3s - 5G 10/03/2020 31 CN Sub-6 Qualcomm X55M Nex 3s 5G Q1-2020 Vivo X30 Pro - - 24/12/2019 22 CN Sub-6 Samsung S5E980 X30 Pro Q4-2019 Realme X50 Pro - 5G 05/03/2020 33 CN Sub-6 Qualcomm X55M X50 Pro 5G Q1-2020 Meizu 17 - - - 15/05/2020 17 CN Sub-6 Qualcomm X55M 17 Q2-2020 ZTE/Nubia Red Magic - - 5G 21/04/2020 20 Global Sub-6 Qualcomm X55M Nubia Red Magic 5G Q2-2020 Sharp Aquos R - 5G 09/04/2020 21 JP Sub-6 Qualcomm X55M Aquos R5G Q2-2020 Motorola Edge + - - 14/05/2020 23 US Sub-6/mmWave Qualcomm X55M Edge+ Q2-2020 Oppo Find X2 - 5G 08/05/2020 32 Global Sub-6 Qualcomm X55M Find X2 Q2-2020 Oppo Reno3 - - 5G 26/12/2019 19 CN Sub-6 Mediatek MT6885Z Reno3 5G Q4-2019 Oppo Reno3 Pro - 5G 26/12/2019 32 CN Sub-6 Qualcomm SM7250 Reno3 Pro 5G Q4-2019 LG V60 ThinQ - - 17/03/2020 18 US Sub-6 Qualcomm X55M V60 ThinQ Q1-2020 OnePlus 8 - - 5G 29/04/2020 16 US Sub-6/mmWave Qualcomm X55M 8 5G Q2-2020 Xiaomi Mi 10 Pro 5G 07/04/2020 29 Global Sub-6 Qualcomm X55M Mi 10 Pro 5G Q2-2020 Xiaomi Mi 10 Ultra - 17/08/2020 29 CN Sub-6 Qualcomm X55M Mi 10 Ultra Q4-2020 Xiaomi Redmi K30 - 5G 07/01/2020 23 CN Sub-6 Qualcomm SM7250 Redmi K30 5G Q1-2020 Huawei Nova 7 SE 5G 28/04/2020 31 CN Sub-6 HiSilicon Hi6290LV100 Nova 7 SE 5G Q2-2020 Huawei Mate Xs - - 26/03/2020 40 Global Sub-6 HiSilicon Hi3690V201 Mate Xs Q1-2020 Huawei P 40 Pro - 07/04/2020 42 Global Sub-6 HiSilicon Hi3690V201 P40 Pro Q2-2020 Huawei Mate 40 Pro - 23/10/2020 30 CN Sub-6 HiSilicon Kirin 9000 Mate 40 Pro Q4-2020 Huawei Mate 30 Pro 5G 18/10/2019 35 CN Sub-6 HiSilicon Hi3690V201 Mate 30 Pro 5G Q4-2019 Total 863 • All the statistical data presented after this slide is extract from a database including the above smartphones. • 31 5G smartphones has been torndown in 2020 featuring Sub-6 and mmWave compatibility. This broadband list of smartphone give an overview on the market, technology and cost trend in 2020.

9. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary o Summary of the analyzed RF components o Comparative Analysis Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Manufacturer Model Packaging Function Network Band QUALCOMM QTM525-501 MCM AiP 5G n260/n261 QUALCOMM QTM525-501BA MCM AiP 5G n260/n261 QUALCOMM QTM525-601BA MCM AiP 5G n260/n261 QUALCOMM QTM535-500 MCM AiP 5G n260/n261 QUALCOMM QTM535-500BA MCM AiP 5G n260/n261 MURATA 1RAU LG MCM AiP 5G n260/n261 USI 37U727 MCM AiP 5G n260/n261 Components Summary – Comparison View Manufacturer Model Packaging Function Network Band MURATA 1XR-484 LGA FEM 5G n260/n261 MURATA 583# DSMBGA FEM 5G n79 SKYWORKS SKY53807 DSBGA FEM 5G Manufacturer Model Packaging Function Network Band SKYWORKS SKY58242 BGA PAM 2G/5G HISILICON Hi6D13V100 LGA PAM 5G LB SKYWORKS SKY58255-11 LGA PAM 4G/5G UHB SKYWORKS SKY58258 LGA PAM 4G/5G UHB SKYWORKS SKY58245 DSBGA PAM 5G n77/n78 MURATA 429# LGA PAM 5G n77/n78 QUALCOMM QPA5581 LGA PAM 5G n1/n3/n7/n28 HISILICON Hi6D03V100 LGA PAM 5G n79 Manufacturer Model Packaging Function Network Band MURATA C LGA Diversity 5G QUALCOMM QDM4850 LGA Diversity 5G QUALCOMM QDM5630 LGA Diversity 5G UHB QUALCOMM QDM5677 LGA Diversity 5G n77/n78 QUALCOMM QDM5679 LGA Diversity 5G n79 QUALCOMM QDM5872 LGA Diversity 5G UHB SKYWORKS SKY53728-11 LGA Diversity 5G UHB Manufacturer Model Packaging Function Network Band QORVO QM28017 LGA Multiplexer GPS/4G/5G Manufacturer Model Packaging Function Network Band QORVO QM75005 LGA PAMiD 5G n41 QORVO QM78041 LGA PAMiD 5G n41 QUALCOMM QPM6585 LGA PAMiD 5G n41 SKYWORKS SKY58254-11 LGA PAMiD 4G/5G B41/n41 QORVO QM78143 LGA PAMiD 5G UHB QORVO QM77038 LGA PAMiD 3G/4G/5G MB/HB QORVO QM77040 LGA PAMiD 3G/4G/5G MB/HB QUALCOMM QPM5670 LGA PAMiD 4G/5G MB/HB QORVO QM78200 LGA PAMiD 5G n77/n78 QORVO QM78078 LGA PAMiD 5G n77/n78 QUALCOMM QPM5677 LGA PAMiD 5G n77/n78 QORVO QM78202 LGA PAMiD 5G n77/n78/n79 HISILICON Hi6D51 LGA PAMiD 5G n77/n78/n79 QUALCOMM QPM5679 LGA PAMiD 5G n79 QUALCOMM QPM4650 LGA PAMiD 5G UHB Manufacturer Model Packaging Function Network Band HISILICON Hi6365V100 BGA RxTx 2G/3G/4G/5G MEDIATEK MT6190W BGA RxTx 2G/3G/4G/5G CDMA/2G/3G/4G/5G SAMSUNG SHANNON 5510 BGA RxTx 2G/3G/4G/5G QUALCOMM SDR865 BGA RxTx 2G/3G/4G/5G QUALCOMM SMR526 BGA RxTx 5G n260/n261 • These components' structure will be presented in this report and compared.

10. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary o Summary of the analyzed RF components o Comparative Analysis Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Module in RF Front-End Proportion of Module over RF Area ©2021 by System Plus Consulting

11. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary o Summary of the analyzed RF components o Comparative Analysis Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Components Summary – Module Evolution of Module Packaging ©2021 by System Plus Consulting

12. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary o Summary of the analyzed RF components o Comparative Analysis Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Components Summary Main OEMs’ Suppliers in RFFEM per area ©2021 by System Plus Consulting

13. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison o Area Distribution per Supplier & Function o Die Design Win in Number & Area o Die Distribution per Function o Filter Distribution o PA/LNA/Switch Distribution o Material Substrate Distribution Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Area Distribution per Supplier Area distribution per supplier ©2021 by System Plus Consulting

14. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison o Area Distribution per Supplier & Function o Die Design Win in Number & Area o Die Distribution per Function o Filter Distribution o PA/LNA/Switch Distribution o Material Substrate Distribution Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Filter Distribution Filter Die Area distribution per Type ©2021 by System Plus Consulting

15. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison o Area Distribution per Supplier & Function o Die Design Win in Number & Area o Die Distribution per Function o Filter Distribution o PA/LNA/Switch Distribution o Material Substrate Distribution Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Material Distribution per smartphone Material Substrate area distribution ©2021 by System Plus Consulting

16. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison o Cost Distribution per Supplier & Function Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus Cost Distribution per supplier Cost distribution per supplier ©2021 by System Plus Consulting

17. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis o Summary o Baseband - Front-End Analysis o 5G Sub-6- Front-End Analysis o 5G Sub-6 & mmWave - Front- End Analysis o 5G mmWave - Front-End Analysis Feedbacks About System Plus Package Views & Dimensions Package Top View ©2021 by System Plus Consulting XX mm • Package: FCBGA XX-Balls • Dimensions: XX x XX x XX mm • Pitch: XX mm XX mm • Marking: <Logo HiSilicon> Hi6365GFC V100B10G HD7641917 1917-TW01 Package Side View ©2021 by System Plus Consulting Package Bottom View ©2021 by System Plus Consulting XX mm

18. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis o Summary o Baseband - Front-End Analysis o 5G Sub-6- Front-End Analysis o 5G Sub-6 & mmWave - Front- End Analysis o 5G mmWave - Front-End Analysis Feedbacks About System Plus Die Views & Dimensions Die Overview – Optical View ©2021 by System Plus Consulting XX mm • Die Area: XX mm² (XX x XX mm) Die Marking – Optical View ©2021 by System Plus Consulting XX mm

19. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis o Summary o Baseband - Front-End Analysis o 5G Sub-6- Front-End Analysis o 5G Sub-6 & mmWave - Front- End Analysis o 5G mmWave - Front-End Analysis Feedbacks About System Plus RF Components Summary Antenna Antenna Antenna Manufacturer Model Type Phone Model Module Cost Qorvo QM75005 LGA Vivo X30 Pro $XX QM78041 LGA Samsung Galaxy Note20 5G $XX Qualcomm QPM6585 LGA Oppo Reno3 Pro 5G $XX Skyworks SKY58254-11 LGA Oppo Reno3 5G $XX Antenna

20. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis o Summary o Baseband - Front-End Analysis o 5G Sub-6- Front-End Analysis o 5G Sub-6 & mmWave - Front- End Analysis o 5G mmWave - Front-End Analysis Feedbacks About System Plus Package Overview – Filters QM75005 – Opening – Optical View ©2021 by System Plus Consulting QM78041 – Opening – Optical View ©2021 by System Plus Consulting SKY58254 – Opening – Optical View ©2021 by System Plus Consulting QPM6585 – Opening – Optical View ©2021 by System Plus Consulting QM75005 – Filter – Optical View ©2021 by System Plus Consulting QM78041 – Filter – Optical View ©2021 by System Plus Consulting SKY58254 – Filter – Optical View ©2021 by System Plus Consulting QPM6585 – Filter – Optical View ©2021 by System Plus Consulting

22. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 22 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Related Analyses RELATEDTEARDOWNTRACKS RELATEDREPORTS By System Plus Consulting: • RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple • Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 Series • RF Front-End Module Comparison 2020 – Volume 4 By Yole Développement: • 5G Packaging Trends for Smartphones 2021 • 5G’s Impact on RF Front-End and Connectivity for Cellphones 2020 By System Plus Consulting: • Consumer Track – Phone

24. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 24 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Our Core Activity : The Reverse Costing® A Structure, Process and Cost Analysis Reverse Costing® consists in disassembling a device or a system, in order to identify its technology and determine its manufacturing processes and cost, using in-house models and tools.

25. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 25 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Fields Of Expertise

26. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 26 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Business Model Teardown Track 205+ teardowns per year Monitor 1 per year quarterly updated Custom Analysis 150 custom analyses per year Report 60+ per year Costing Tools 5 process-based and 3 parametric costing tools Cost Methods Training On demand

27. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 27 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Worldwide presence 100+ collaborators in 8 different countries Headquarters › Nantes – System Plus Consulting › Lyon – Yole Développement Boise Cornelius Raleigh Phoenix Austin Singapore Hsinchu Tokyo Shenzhen Seoul Frankfurt Nantes Lyon

28. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 28 Overview / Introduction Company Profile & Supply Chain Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis SoC Physical Comparison ManufacturingProcess Flow Cost Analysis Selling Price Analysis Feedbacks Related Analyses About System Plus o Company services o Contact Contact HEADQUARTER & CUSTOM PROJECT SERVICES 22 Bd Benoni Goullin 44200 Nantes, France sales@systemplus.fr - +33 2 40 18 09 16 REPORTS & MONITORS WEBSITE www.systemplus.fr TRACKS WEBSITE www.reverse-costing.com MARKETING, COMMUNICATION & PR Jean-Christophe Eloy, Marketing & Communication eloy@yole.fr - +33 686 68 19 31 Sandrine Leroy, Public Relations sandrine.leroy@yole.fr - +33 4 72 83 01 89 Western US & Canada Steve Laferriere - steve.laferriere@yole.fr + 1 310 600 8267 Eastern US & Canada Chris Youman - chris.youman@yole.fr +1 919 607 9839 Europe and RoW Lizzie Levenez - lizzie.levenez@yole.fr +49 15 123 544 182 Benelux, UK & Spain Marine Wybranietz - marine.wybranietz@yole.fr +49 69 96 21 76 78 India and RoA Takashi Onozawa - takashi.onozawa@yole.fr +81 80 4371 4887 Greater China Mavis Wang - mavis.wang@yole.fr +886 979 336 809 +86 136 6156 6824 Korea Peter Ok - peter.ok@yole.fr +82 10 4089 0233 Japan Miho Ohtake - miho.ohtake@yole.fr +81 34 4059 204 Japan and Singapore Itsuyo Oshiba - itsuyo.oshiba@yole.fr +81 80 3577 3042 Japan Toru Hosaka – toru.hosaka@yole.fr +81 90 1775 3866 Follow us on REPORTS, MONITORS & TRACKS

RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset

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RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset