Micro Electro Mechanical Systems (MEMS)

1. Department of Instrumentation & Control Engineering, MIT, Manipal
Lecture #02
MEMS – An Overview
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2. Department of Instrumentation & Control Engineering, MIT, Manipal
Contents
1. Advantages and limitations
2. Applications
3. Visual Examples of MEMS Devices
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3. S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
Advantages:
Small systems tend to move or stop more quickly due to low mechanical
inertia.
It is thus ideal for precision movements and for rapid actuation.
Miniaturized systems encounter less thermal distortion and mechanical
vibration due to low mass.
Miniaturized devices are particularly suited for biomedical and aerospace
applications due to their minute sizes and weight.
Small systems have higher dimensional stability at high temperature due
to low thermal expansion.
Smaller size of the systems means less space requirements.
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4. S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
This allows the packaging of more functional components in a single
device.
Less material requirements mean low cost of production and transportation.
Ready mass production in batches.
Higher surface to volume ratio.
Limitations:
Friction is greater than inertia. Capillary, electrostatic and atomic forces as
well as stiction at a micro-level can be significant.
Heat dissipation is greater than heat storage and consequently thermal
transport properties could be a problem or, conversely, a great benefit.
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5. S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
Fluidic or mass transport properties are extremely important. Tiny flow spaces
are prone to blockages but can conversely regulate fluid movement.
Material properties (Young’s modulus, Poisson’s ratio, grain structure) and
mechanical theory (residual stress, wear and fatigue etc.) may be size dependent.
Integration with on-chip circuitry is complex and device/domain specific. Lab-
on-a-chip systems components may not scale down comparably.
Miniature device packaging and testing is not straightforward. Certain MEMS
sensors require environmental access as well as protection from other
external influences.
Testing is not rapid and is expensive in comparison with conventional IC
devices.
Cost – for the success of a MEMS device, it needs to leverage its IC batch
fabrication resources and be mass-produced. Hence mass-market drivers must
be found to generate the high volume production.
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6. • Automobile Industry
Tire pressure sensor
Engine oil sensor
Combustion sensor
Fuel rail pressure sensor
• Safety
Air Bag Deployment system
Antilock braking systems
Navigation (micro gyroscope)
• Engine and power train
Airflow control
Fuel pump pressure and fuel injection
control
Crankshaft positioning
• Health care Industry
Disposable blood pressure transducer (DPT)
Intrauterine pressure sensor (IUP)
Angioplasty pressure sensor
Infusion pump pressure sensor
Sphygmomanometer
Lung capacity meters
Kidney dialysis equipment
• Aerospace Industry
Cockpit Instrumentation
Micro gyroscope
Micro satellite
• Industrial Products
Water level controls
Refrigeration systems
Manufacturing process sensor
• Consumer products
Smart Toys
Sport shoes with automatic cushioning
control
Washers with water level controls
Vacuum cleaning
• Telecommunications
Optical switching and fiber-optic couplings
RF switches
Tunable resonators
Applications
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7. Applications
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8. Applications
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9. Applications
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10. Applications
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11. Applications
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12. Applications
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13. Applications
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14. Applications
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15. Applications
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16. Applications
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17. Applications
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18. Visual Examples
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Accelerometers

19. Visual Examples
19S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Micro Flying Robot

20. Visual Examples
20S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
World’s Smallest Car

21. Visual Examples
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22. Visual Examples
22S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
World’s Smallest Guitar

23. Visual Examples
23S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Pressure Sensors

24. Visual Examples
24S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
LIGA
German words for lithography, electroplating, and molding - High Aspect Ratio
Micromachining Technique
Low cost coplanar waveguide

25. Visual Examples
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