3. Desired Substrate Properties
High electrical resistivity
High thermal conductivity
Resistance to temperature
Inert to chemical corrosion
Cost
4. Selected Ceramics
Table 4.1 Melting Point of Selected Ceramics
Material Melting Point °C
SiC 2700
BN 2732
AlN 2232
BeO 2570
Al3O2 2000
5. Substrate Fabrication
Roll compaction; large parallel rollers to form sheet.
Tape casting; moving belt that flows under a knife
edge.
Powder pressing; powder into hard die cavity with
high pressure through sintering process.
Isostatic powder pressing; flexible die surrounded
with water or glycerin and pressed up to 10,000 lb/in2
Extrusion; forced through a die. Very economical and
produces thinner part.
6. Definitions
Surface roughness; measure of the
surface microstructure
Camber; measure of the deviation from
flatness (red line).
deviation
7. Substrates Rules:
Thicker substrates – less
camber
Squares are better than
rectangles
Pressed methods are better.
8. Thermal Properties
Thermal conductivity (W/m-°C):
q = -k (dT/dx)
Specific heat (W-s/g-°C):
c = dQ/dT
Temp. coeff. of expansion (ppm/°C):
α= [L 2) – L 1)] /[L 1)(T –T)]
(T (T (T 2 1
9. Mechanical Properties
Modulus of elasticity: E = TCE * ∆T
Modulus of rapture (MPa): σ = Mx/I
This can be used to measure tensile strength of
thinned Si wafers.
Maximum stress at the tip of crack:
SM = 2 So < (a / ρt)0.5
Ratio of max. stress to applied stress:
Kt = SM/S0 = 2 (a / ρt)0.5
Plain strain fracture toughness:
KIC = Z Sc (pi * a)0.5
Critical force to cause breakage:
Sc = KIC / [Z (pi * a)0.5]
10. Electrical Properties
Resistivity: ρ= (1/σ) (Ω.cm)
Current Density: J = σ E (A/cm2)
Breakdown Voltage: (Volt)
Dielectrics constant: ε (ratio)
r
Dielectric loss: tan(δ)
11. Metallization of Ceramic Substrates
Thick film – additive process by which conductive,
resistive, and dielectric patterns in the form of a viscous
paste are screen printed, dried, and fired onto a
ceramic substrate at an elevated temperature to
promote adhesion of the film
Thin film – subtractive process such that entire
substrate is coated with several layers of metallization
and unwanted material is etched away in a succession
of selective photoetching processes.
Copper
1) Direct bond copper
2) Plated copper
3) Active metal braze
12. Example of Thick Film
Screen printing leaves metallic
conductor, metal oxide resistor or
dielectric insulator.
Active element powders range
from 1 to 10 µm in size.
Adhesion element (glass and
metal oxides) are used to bond
active element on substrate.
Organic binder is used to hold
active and adhesion elements.
Solvent is used to dilute thick
organic binder.
13. Thin Films
Several layers of metal are formed by vacuum deposition techniques –
sputtering or evaporation, or by electro-plating. One example method is
DC sputtering as shown in figure.
14. Copper Metallization
Direct bond copper: bonded to alumina ceramic
by placing Cu film heating to a temperature of
1065°C.
Plated copper: Cu may be vacuum deposited by
thin-film methods, screen printed by thick-film
processes, or deposited by aid of a catalyst.
Patterns formed by dry or wet photolithographic
process.
Active metal braze: one or more metals in the IV-
B column are used. Braze formed of paste,
powder, or a film. Ex. 70% Ti/15% Cu/15% Ni.
15. Substrate Materials
Al2O3 – most common ceramic
BeO – high thermal conductivity
AlN – TCE matched with Si, high
thermal conductivity
Diamond – low specific heat
BN – easily machinable, low TCE
SiC – resistant to acids and bases, high
thermal conductivity, low TCE
16. Composite Materials
AlSiC – conductive with low TCE, softer than
SiC, thermal conductivity 12 times greater
than SiC
Dymalloy – diamond with Cu20%/Ag80%
alloy, melts at 800°C lower than Cu
Composite materials is combination of metal
and ceramics.
17. Multilayer Substrates Structures
Thick films – limited to 3 layers
Thin films – expensive
Cu – single layers
Types of Multilayer substrates
- HTCC
- LTCC
- AlN
18. Chapter – 5
Flexible Printed
Circuits
They are printed circuits that are fabricated on a
thin flexible-based material and are usually
constructed with a non-reinforced polymeric
material.
22. Traditional flexible circuits
Traditional flexible circuits
#Single side
#Double side
#Multi-layer rigid/flex with MIL
#Multi-layer rigid/flex for consumer
(#Multi-layer flex)
#Flex with stiffeners
23. HDI Flexible Circuits
Traditional
200 Flexible Circuits
150
Via
Diameter HDI Flex Circuits
(micron) 100
50
Ultra HDI Flex Circuits
0 50 100 150 200
Circuit Density (micron pitch)
Definition of HDI Flex Circuits
36. Fluorocarbons
Unmatched chemical inertness
High thermal resistance
Outstanding dielectric properties
Tough mechanical properties
Plated through-hole process difficult
Electroless Cu do not adhere well
Dimensional stability not as good as
polyimide film
37. PET (Polyethylene terephthalate)
Low cost compared to polyimide films
Higher insulation resistance
Greater tear strength
Lower dielectric constant
Lower moisture absorption
Better dimensional stability
Lower lamination temperature
Melts below soldering temperature
Difficult to bond to other laminates
38. PEN (Polyethylene Naphthalate)
Tg = 120°C.
Can withstand soldering temperature of
260°C for exposure of 5 to 10 seconds.
Reaction product of 2,6 naphthalate
dicarboxylate with ethylene glycol
39. Polyimide
Ability to withstand heat of manual and
automatic soldering
Excellent thermal resistance
Good insulators and high voltage
barriers
Absorb moisture
Weak link in the polyimide laminate
40. Aramids
Low initiating and propagation tear
strength
Dielectric constant of 1.6 to 2
Dissipation factor of 0.0015
Good dimensional stability
Absorbs water or else it blisters
seriously
41. Copper foils
Electrodeposited copper foils
Starts with Cu solution being plated at very high deposition
rates.
Rolled anneal copper
Starts with Cu ingot and that are hot rolled to an
intermediate gauge
Good flexural endurance
Resistance to fracturing in dynamic applications
Low temperature anneal foils
Better flexural properties compared to RAC.
Better handling
higher yield strength, resist denting and crazing
Resist foil damage
42. 5 Distinct Layers
Base dielectric film
Conductor layer
Cover-coat film
Two layers of adhesives
Accounts of 50% of total flexural
thickness
44. Adhesives- Mixtures of solvents,
polymers, and curing agents
Must be tack-free
Must be thin – 0.001 to 0.002 inch
Must have low residual volatile content
Must be resistant to attack by chemicals
Thermosetting to some degree
Cured in reasonable time
Limited shelf-life must be monitored
45. Types of Adhesives
Acrylic adhesives
High heat resistance and good electrical properties
Dimensional stability and small hole drilling decrease yield.
Polyimide and epoxy adhesives
Better heat resistance and electrical properties as good as
acrylics
Better dimensional stability, better process, lower overall
thickness
Increased laminate stiffness
Polyester and phenolics
Cost effective
Good electrical properties, flexibility, fair heat resistance
Butryal phenolics
Better heat resistance than polyester
Electrical properties poorer though, not as flexible
46. Problems with Adhesives
Adhesives become insulator rather than
insulator film
Lacking in resistance delamination
Poor moisture absorption
Poor resistance to heat aging,
discoloration, embrittlement, outgasing
Poor insulation at elevated temperature
47. Adhesiveless Films
Polyimide resin and Cu metal devoid of
any nonpolyimide adhesive
Thinner – 4 mils of savings
Better thermal conductivity
Greater flexibility and thinner circuits
Thermal stress resistance of higher
layer count rigid flexes is better as well.
48. Classification of Adhesiveless
Cast to foil
Involves casting a liquid solution of polyamic acid onto
surface of metal foil
Vapor deposition on film
Cu is vaporized in a vacuum chamber and the metal vapors
are deposited on polyimide film
Limited to a Cu thickness of 2µm.
Sputter to film (vacuum chamber with Cu cathode)
Base metal undercoating of Cr, Ni, oxide
Slower process
Plated on film (electroless metal chemistries)
Do not induce any thermal stresses
Much easier to handle
49. Cover Coat
Protects circuit against corrosion and
contamination
Affords protection against mechanical
damage
Puts Cu on a single-sided flex on the
neutral bending axis
Helps anchor the terminal pads to the
base dielectric