Apple A7 Processor

2. APL0698 APL5698 APL5598 ARM® ARMv8 DC, 28nm HKMG ARM® ARMv7 DC, 32nm HKMG DC 32nm HKMG APL0598 APL5498 ARM® ARMv7 DC, 32nm HKMG ARM® CortexTM‐A9 DC, 45nm APL0498 APL2498 APL7498 ARM® CortexTM‐A9 DC, 45nm ARM® CortexTM‐A9 DC, 32nm HKMG ARM® CortexTM‐A9 SC, 32nm HKMG APL0398 ARM® CortexTM‐A8 SC, 45nm 2010 2011 2012 2013 2014

3. Graphics performance up to up to CPU performance up to up to ARM® v8 architecture, DC Imagination PowerVR 6 series Faster Faster ARM® v7 architecture, DC Imagination PowerVR SGX543MP3 ARM® CortexTM‐A9, SC Imagination PowerVR SGX543MP2 339S0073 339S0030 ARM11, SC Imagination MBX Lite 2007 339S0036 ARM11, SC Imagination MBX Lite ARM® CortexTM‐A8, SC Imagination PowerVR SGX535 ARM® CortexTM‐A8, SC Imagination PowerVR SGX535 2013

5. Apple A7 Apple A7 APL0698 SAMSUNG 28nm HKMG process SAMSUNG 28 HKMG Dual Core, ARM ARMv8 architecture, 1.3GHz Imagination PowerVR 6 series GPU Dual channel LPDDR3 memory controller Dual channel LPDDR3 memory controller I2C I2S SDIO High‐speed UART MIPI‐DSI/eDP MIPI CSI MIPI‐CSI USB Apple M7 coprocessor

6. Apple A7 Apple A7 APL5698 SAMSUNG 28nm HKMG process SAMSUNG 28 HKMG Dual Core, ARM ARMv8 architecture, 1.4GHz Imagination PowerVR 6 series GPU Dual‐channel LPDDR3 memory controller Dual channel LPDDR3 memory controller I2C I2S SDIO High‐speed UART eDP MIPI CSI MIPI‐CSI USB Apple M7 coprocessor

7. Apple M7 Apple M7 NXP LPC18A1 NXP LPC1800 based microcontroller NXP LPC1800 b d i t ll ARM® CortexTM‐M3 Core

8. 338S1216‐A2 PMIC 338S1201 Audio Codec 338S1202 Class‐D Amplifier

10. Model A1533 Model A1530 PCB Photo Source: Techinsights & iFixit

11. PCB Photo Source: Techinsights & iFixit Model A1533 Model A1530 Skyworks SKY77355 AVAGO A7900720 TriQuint TQM6M6224 Skyworks SKY77810 AVAGO A7900 Different model (different band support) has different band support) has different PA design.

12.  Texas Instruments 36ATLC1 65730A0P; unknown function  WiFi module from Murata. Broadcom BCM4334 WiFi/BT SoC  Texas Instruments 37CCVHI 343S0645  Broadcom BCM5976A0KUB2G  Bosch Sensortech BMA220 3‐axis accelerometer  SK Hynix E2NAND 3.0  STM 3‐axis gyroscope  Apple 338S1216‐A2 PMIC (Dialog Semiconductor)  Apple 338S1201 audio codec (Cirrus Logic)  Apple 338S1202 Class D audio amplifier (Cirrus Logic) NXP 1610A1, unknown function  Qualcomm PM8018, PMIC for MDM9615M  PA chips for Model A1533 PCB Photo Source: Techinsights, iPhone 5S Model A1533

13.  AKM AK8963 compass AKM AK8963 compass  Apple M7 coprocessor, NXP LPC1800 series micro processor  Apple A7 application Processor, PoP package  ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package  Qualcomm MDM9615M baseband processor  Qualcomm WTR1605L transceiver PCB Photo Source: Techinsights, iPhone 5S Model A1533

14. Touch Screen Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976 Rear facing camera, 4.0” 1366x640 ALS MIPI I2C STM Front facing camera LPDDR3 Gyroscope Elpida AKM I2C/SPI AK8963 Bosch LPDDR3 NXP F8164A1PD‐GD‐F 8Gb LPDDR3, PoP LPC18A1 NAND Flash Apple M7 Apple M7 I2C/SPI BMP220 16/32/64GB NAND Flash Apple Apple 338S1202 Class D AMP 338S1216‐A2 PMIC Apple 338S1201 Audio Codec NXP 6416A UART NXP PA chips Qualcomm WTR1605L Qualcomm PM8018 PA chips are model dependent Qualcomm 1610A1 MDM9615M Lightning SDIO Broadcom BCM4334

15. Device Manufacturer Function Apple A7 Microprocessor (Apple APL0698) ‧Dual‐core, ARMv8 architecture, 1.3GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process ‧PoP package PoP package NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 F8164A1PD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600 ‧PoP package ▼Processor Apple NXP ▼Memory Elpida Storage ECC free NAND Flash Murata 339S00205 (BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC) ‧16GB/32GB/64GB ‧Supplier: SK Hynix E2NAND 3.0 ▼Radio Frequency ▼Radio Frequency Qualcomm Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonass

16. Device Function Apple 338S1216 (Dialog D2045) PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple 338S1201(Cirrus Logic) Audio Codec Apple 338S1202(Cirrus Logic) Low Power Class‐D Audio Amplifiers 37CCVHI 343S0645 Line Driver BCM5976A0KUB2G Touch Screen Controller Package markings B329 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AKM AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output SONY Exmor‐RS sensor Front Camera, 8 Mp CMOS Image Sensor 36ATLC1 65730A0P Unknown function 1610A1 Unknown function 6416A Unknown function Manufacturer ▼PMIC Apple Qualcomm ▼Audio Apple ▼Touch Screen Controller Texas Instruments Broadcom ▼MEMs STMicroelectronics Bosch Sensortech ▼Camera ▼Others Texas Instruments NXP

17. 338S0655‐A1 PMIC 338S1116 Audio Codec

19.  Skyworks SKY73614  TriQuint TQF6514 Skyworks SKY77575‐13/Skyworks SKY77493‐19/Skyworks SKY77494‐22 Avago A7920720  Qualcomm WTR1605L transceiver  Qualcomm MDM9615M baseband processor  Qualcomm PM8018, PMIC for MDM9615M  STM 3 axis gyroscope STM 3‐axis gyroscope  Bosch Sensortech BMA220 3‐axis accelerometer  Apple 338S1116 audio codec (Cirrus Logic)  Apple M7 coprocessor, NXP LPC1800 series micro processor  Apple 343S0655‐A1 PMIC (Dialog Semiconductor)  Apple A7 application Processor  ElpidaF8164A1MD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb  Main storage 16/32/64/128GB density Main storage, 16/32/64/128GB density NXP 1610A1, unknown function Broadcom BCM8976A0KUB2G touch screen controller  WiFi module from USI. Broadcom BCM43241 WiFi/BT SoC  Maxim MAX98304 Mono 3.2W Class D Audio Amplifier

20. OmniVision OV2C2BBB Broadcom BCM5976 Broadcom BCM5976 9.7” 2048x1536 Touch Screen iSight Front camera, ALS Parade OmniVision OV2E0BNN DP655 FaceTime camera I2C STM eDP Gyroscope LPDDR3 Elpida AKM NXP I2C/SPI AK8963 LPDDR3 LPC18A1 Bosch BMP220 I2C/SPI Maxim MAX98304 Apple M7 A l M7 NAND Flash F8164A1MD‐GD‐F 8Gb LPDDR3 16/32/64GB NAND Flash Apple Apple 338S1116 Audio Codec 343S0655‐A1 PMIC UART SDIO For 4G LTE model Skyworks Avago A7920720 Skyworks SKY77493‐19 TriQuint TQF6514 Qualcomm SKY77575‐13 Skyworks SKY77494‐12 MDM9615M NXP 1610A1 Qualcomm WTR1605L Qualcomm PM8018 Lightning USI 339S0213 Broadcom BCM43241 Dialog Semiconductor D2089A

21. Device Manufacturer Function Apple A7 Microprocessor (Apple APL5698) ‧Dual‐core, ARMv8 architecture, 1.4GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process NXP LPC18A1 NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 i NXP LPC1800 series micro processor i ‧ARM Cortex‐M3 F8164A1MD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600 NAND Flash ‧16GB/32GB/64GB 343S0655‐A1 PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple 338S1116(Cirrus Logic) Audio Codec MAX98304 Mono 3.2W Class D Audio Amplifier 331 microphones BCM5976C1KUB6G Touch Screen Controller Package markings B329 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output OV2C2BBB iSight camera front , 5 Mp CIS OV2E0BNN FaceTime camera front , 1.2 Mp CIS ▼Processor Apple NXP ▼Memory Elpida Storage ▼PMIC Apple Qualcomm ▼Audio Apple Maxim STMicroelectronics ▼Touch Screen Controller Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera OmniVision

22. Device Function 339S0213 (Broadcom BCM43241) Broadcom BCM43241 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ 2x2 multiple input/multiple output (MIMO) dual‐band combo chip ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 300 Mbps for typical upper‐layer throughput in excess of 200 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧Bluetooth Class 1 or Class 2 transmitter operation Bluetooth Class 1 or Class 2 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonas TQF6514 RF Power Amplifier/Duplexer Module SKY77575‐13 SKY77575 13 RF Power Amplifier/Duplexer Module RF Power Amplifier/Duplexer Module SKY77493‐19 RF Power Amplifier/Duplexer Module SKY77494‐22 RF Power Amplifier/Duplexer Module SKY73614 RF Power Amplifier/Duplexer Module A7920720 RF Power Amplifier/Duplexer Module E50 filter bank AWH Manufacturer switch/filter module TPS65143 LCD Bias with Integrated Gamma Reference for Notebook PCs, Tablet PCs and Monitors Parade Technologies DP655 LCD timing controller (Tcon) 1610A1 Unknown function ▼Radio Frequency USI Qualcomm TriQuint Skyworks Skyworks Avago Murata ▼Others Texas Instruments Parade Technologies NXP

23. 338S0656‐A1 338S0656 A1 PMIC 338S1213 Audio Codec 338S1199 Class‐D Amplifier

25. Wi‐Fi Could be reserved area for optional WWAN module  Main storage, 16/32/64/128GB density  Apple M7 coprocessor, NXP LPC1800 series micro processor  Apple 338S1213 audio codec (Cirrus Logic)  Bosch Sensortech BMA220 3‐axis accelerometer  AKM AK8963 electronic compass  STM 3‐axis gyroscope Apple 338S11199(Cirrus Logic) Class D Audio Amplifier  A l A7 Apple A7 application Processor, APL0698, PoP package li ti P APL0698 P P k ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package  Apple 343S0656‐A1 PMIC (Dialog Semiconductor)  Fairchild FDMC6676BZ  Fairchild FDMC6683 NXP 1610A1, unknown function  USI WiFi/BT USI WiFi/BT combp module. Broadcom BCM43241 WiFi/BT SoC b d l B d BCM43241 WiFi/BT S C

26. Broadcom BCM5976 Broadcom BCM5976 7.9” 2048x1536 Touch Screen TI TPS65143A Parade DP675 iSight Front camera, TI ALS TPS65195 FaceTime camera I2C STM eDP Gyroscope LPDDR3 AKM NXP I2C/SPI AK8963 LPDDR3 LPC18A1 Bosch I2C/SPI BMP220 Apple 338S1199 Apple M7 A l M7 NAND Flash Apple Elpida F8164A1MD‐GD‐F 8Gb LPDDR3 PoP 16/32/64GB NAND Flash Apple 338S1213 Audio Codec 343S0656‐A1 PMIC Fairchild FDCM6683 Fairchild FDMC6676BZ For 4G LTE model Skyworks Avago A7920720 SKY77493‐19 TriQuint TQF6514 Qualcomm SKY77575‐13 Skyworks Skyworks SKY77494‐12 UART MDM9615M Qualcomm WTR1605L NXP 1610A1 Qualcomm PM8018 Lightning SDIO USI 339S0213 Broadcom BCM43241

27. Device Function Apple A7 Microprocessor (Apple APL0698) ‧Dual‐core, ARMv8 architecture, 1.3GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process NXP LPC18A1 NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 i NXP LPC1800 series micro processor i ‧ARM Cortex‐M3 F8164A1PD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600, PoP package NAND Flash ‧16GB/32GB/64GB 343S0656‐A1 PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple Apple 338S1213(Cirrus Logic) Audio Codec Apple Apple 338S1199(Cirrus Logic) Class D Audio Amplifier BCM5976C1KUB6G Touch Screen Controller Package markings B334 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output OV2C2BBB iSight camera front , 5 Mp CIS OV2E0BNN FaceTime camera front , 1.2 Mp CIS Manufacturer ▼Processor Apple NXP ▼Memory Elpida Storage ▼PMIC Apple Qualcomm ▼Audio ▼Touch Screen Controller Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera OmniVision

28. Device Function 339S0213 (Broadcom BCM43241) Broadcom BCM43241 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ 2x2 multiple input/multiple output (MIMO) dual‐band combo chip ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 300 Mbps for typical upper‐layer throughput in excess of 200 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧Bluetooth Class 1 or Class 2 transmitter operation Bluetooth Class 1 or Class 2 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonas TQF6514 RF Power Amplifier/Duplexer Module SKY77575‐13 SKY77575 13 RF Power Amplifier/Duplexer Module RF Power Amplifier/Duplexer Module SKY77493‐19 RF Power Amplifier/Duplexer Module SKY77494‐22 RF Power Amplifier/Duplexer Module SKY73614 Manufacturer RF Power Amplifier/Duplexer Module A7920720 RF Power Amplifier/Duplexer Module E50 filter bank AWH switch/filter module ▼Radio Frequency USI For 4G LTE model Qualcomm TriQuint Skyworks Skyworks Avago Murata

29. Device Function 1610A1 Unknown function TPS65143A LCD Bias with Integrated Gamma Reference for Notebook PCs, Tablet PCs and Monitors TPS65195 TPS65195 Manufacturer 8 Channel Level Shifter for TFT LCD Panel using ASG / GIP 8‐Channel Level Shifter for TFT‐LCD Panel using ASG / GIP DP675 LCD timing controller (T‐con) FDMC6676BZ MOSFET FDCM6683 MOSFET ▼Others NXP Texas Instruments Parade Technologies Fairchild Semiconductor

Apple A7 Processor

Apple A7 Processor

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