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2. Table of Contents
īŽ Market and Business Development Second Quarter FY 2014
īŽ Business Focus
īŽ Segments, Products and Technology
īŽ General Company Information
Page 22014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
3. Table of Contents
īŽ Market and Business Development Second Quarter FY 2014
īŽ Business Focus
īŽ Segments, Products and Technology
īŽ General Company Information
Page 32014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
5. 84 78
90
123
91 90
107
135
144
156
163 169
149
189 194 193 197
206
219
1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Positive Growth Outlook
for Global Semiconductor Market
1 ToMM: Global semiconductor market w/o Memory, w/o Microprocessor; nearly 2/3 of the total semiconductor market are
relevant for our 4 segments
Source: WSTS for historical data. Forecast: ī of WSTS, IHS, Gartner, IC Insights; last update April 17, 2014
Global Semiconductor Market w/o Memory, w/o Microprocessor
in Billion US-Dollar
Forecast revenue rangeMarket size (revenue)
214
22335%
Memory
& MPU
65%
ToMM1
2013: $ 306 bn
Page 52014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
6. Infineon Holds Top Positions in All Major
Product Categories
Discrete power semiconductors
and power modules.
Source: IHS, December 2013.
Microcontroller-based smart
card ICs.
Source: IHS, September 2013.
Automotive semiconductors incl.
semiconductor sensors.
Source: Strategy Analytics,
April 2014.
Automotive
semiconductors
total market in 2013:
$25.1bn
6.5%
7.4%
7.9%
9.6%
13.3%
NXP
Freescale
STMicro
Infineon
Renesas
Power
semiconductors
total market in 2012:
$15.0bn
Smart card ICs
total market in 2012:
$2.24bn
6.3%
17.1%
21.5%
23.8%
24.1%
SHHIC
STMicro
Samsung
NXP
Infineon
5.6%
5.6%
6.9%
7.0%
11.8%
Fairchild
STMicro
Mitsubishi
Toshiba
Infineon
Page 62014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
7. The Company
īŽ Infineon provides semiconductor and system solutions, focusing
on three central needs of our modern society:
Energy Efficiency, Mobility and Security
īŽ Revenue in FY 2013: âŦ 3.843 billion
īŽ Around 28,100 employees worldwide (as of March 2014)
īŽ Strong technology portfolio with more than 18,650 patents and
patent applications (as of September 2013)
īŽ 21 R&D locations; 12 manufacturing locations
īŽ Germany's largest and Europe's second largest
semiconductor company
Infineon at a Glance
Page 72014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
8. Infineon Group
Results for Q1 FY14 vs Q2 FY14
Segment Result (SR) 116 146
[âŦ Million] Q1 14 Q2 14
Net Income 87 124
SR Margin 11.8% 13.9%
Gross Cash Position 2,279 2,198
Free Cash Flow 30 51
Net Cash 2,048 2,010
Revenues 984 1,051
124
984
87
+7%
Q1 FY14 Q2 FY14
1,051
Revenues Net
Income
Page 82014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
9. Infineon Group
Results for Q2 FY13 vs Q2 FY14
Segment Result (SR) 68 146
[âŦ Million] Q2 13 Q2 14
Net Income 33 124
SR Margin 7.4% 13.9%
Gross Cash Position 2,016 2,198
Free Cash Flow 73 51
Net Cash 1,705 2,010
Revenues 918 1.051
124
918
33
+ 14%
1,051
Revenues Net
Income
Q2 FY13 Q2 FY14
Page 92014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
10. Infineon Segment Revenues
Q1 FY14 vs Q2 FY14
Revenue* in âŦ Million Share of Total
* Total Revenue (Q1 FY14: 984m âŦ; Q2 FY14: 1,053m âŦ) includes Other Operating Segment (Q1FY14: 6m âŦ, Q2 FY14: 6m âŦ),
Corporate & Eliminations (Q1 FY14: 1m âŦ, Q2 FY14: 3m âŦ).
Q1 FY 14
Q2 FY 14
+7%
452
484
Q1 FY 14
Q2 FY 14
+12%
108
121
Q1 FY 14
Q2 FY 14
+3%
179
185
Q1 FY 14
Q2 FY 14
+6%
238
252
CCS
IPC
ATV
PMM
18%
11%
46%
24%
12%
Page 102014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
12. Infineon Group
Results for FY 2013 vs FY 2012
Segment Result (SR) 527 377
[âŦ Million] 2012 2013
Net Income 427 272
SR Margin 13.5% 9.8%
Investments 890 378
Free Cash Flow -219 235
Market capitalization ~5,335 ~7,995*
Net Cash 1,940 1,983
Revenues Net
Income
FY12 FY13 FY12 FY13
272
3,904
427
3,843
Revenues 3,904 3,843
*share price as of September 30th, 2012: 4,938 Euro; share price as of September 30th, 2013: 7,395 Euro
-2%
Page 122014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
13. Revenue Split by Regions
FY 2013 vs FY 2012
Americas
12%
13%
Europe, Middle East,
Africa (EMEA)
44%
41%
Asia / Pacific
38% 40%
Japan
6% 6%
FY 2012 FY 2013
23% 21%
therein:
Germany
16% 18%therein:
China
Page 132014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
14. Table of Contents
īŽ Market and Business Development Second Quarter FY 2014
īŽ Business Focus
īŽ Segments, Products and Technology
īŽ General Company Information
Page 142014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
15. We Focus on Our Target Markets
Core Competencies
īŽ Analog/Mixed Signal
īŽ Power
īŽ Embedded Control
īŽ Manufacturing Competence
Focus Areas
īŽ Energy Efficiency
īŽ Mobility
īŽ Security
Our Target Markets
īŽ Automotive Electronics
īŽ Industrial Electronics
īŽ Information and Communications
Technology
īŽ Security
Page 152014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
16. We Focus on Three Central Needs
of Modern Society
Energy Efficiency Mobility Security
Industrial Power Control
Automotive
Power Management & Multimarket
Chip Card & Security
Page 162014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
17. Key Trends
īŽ Soaring total energy demand across the
globe amid dwindling fossil energy
resources
īŽ Strong CO2 policies to achieve
climate goals
īŽ Tapping renewable energies as
sustainable energy sources
īŽ Electrification of the drivetrain of
commercial and passenger vehicles
īŽ Infineon delivers semiconductor innovations playing a valuable role in minimizing power
loss and maximizing power savings along the entire energy supply chain, extending from
generation through distribution to actual consumption.
īŽ Our products are the basis for intelligent and optimal use of energy resources in
industrial, computing and consumer applications, and in cars.
Our Contribution
Energy Efficiency
Page 172014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
18. Key Trends
īŽ Rigid CO2 regulations and rising oil price
īŽ Increasing rules on safety, focusing on
preventive measures
īŽ Rising new requirements in cars for
emerging markets
īŽ Urbanization, globalization and
demographic change
īŽ Strong investments in local and long
distance public transportation systems
īŽ Leading semiconductor solutions contributing to a more sustainable mobility in terms of
reduced fuel consumption/emissions, improved safety and affordability.
īŽ As an innovation driver and supplier of key components for electric and hybrid vehicles,
Infineon will actively help to shape the paradigm shift towards electro mobility on the
road.
īŽ Innovative public transportation solutions for traction and electronic tickets.
Our Contribution
Mobility
Page 182014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
19. Key Trends
īŽ Secure communication everywhere
utilizing mobile phone and internet
īŽ Move to electronic identification of
documents and products
īŽ Contactless cards for payment and
electronic tickets
īŽ Increased intercommunication in cars,
calling for secure data handling
īŽ Introduction of smart grids calling for
advanced data security
īŽ Tailored security according to system requirements, enabling the implementation of
transparent security in everyday systems.
īŽ Leverage our worldwide leadership in security know-how for smart cards in automotive
and industrial applications increasingly demanding security.
īŽ Combining both hardware security and cryptography, our products build the basis for
privacy and security while maintaining personal freedom and facilitating extended
communication capabilities.
Our Contribution
Security
Page 192014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
20. Table of Contents
īŽ Market and Business Development Second Quarter FY 2014
īŽ Business Focus
īŽ Segments, Products and Technology
īŽ General Company Information
Page 202014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
21. Tight Customer Relationships are Based on
System Know-how and App Understanding
Page 212014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
Distribution partnersEMS partners
ATV IPC CCSPMM
22. Market-Oriented Business Structure
Customers
ApplicationsSegments
Chip Card &
Security
Automotive
Industrial
Power Control
Powertrain; Hybrid and electric vehicles; Chassis and
comfort electronics; Safety
Renewable energy generation; Energy transmission and
conversion; Uninterruptable power supplies; Industrial
drives; Industrial vehicles; Traction; Home appliances
Mobile communication; Payment systems; Near Field
Communication (NFC); Electronic passports, ID cards,
healthcare cards, driver's licenses; Ticketing, access
control; Trusted computing; Authentication
Power
Management
& Multimarket
Power supplies for IT and telecom, server, PC, notebook,
tablet, smart phones, consumer electronics; Mobile
devices (smartphones, tablets, navigation devices);
Cellular network infrastructure; Light management incl.
LED lighting; Inverters for photovoltaic rooftop systems
(< 3kW)
Page 222014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
23. Product Range
Industrial Power
Control (IPC)
īŽ IGBT module
solutions incl. IGBT
stacks
īŽ IGBT modules (high-
power, medium-
power and low-
power)
īŽ Discrete IGBTs
īŽ Bare die business
īŽ Driver ICs
Power Management
& Multimarket
(PMM)
īŽ Discrete high-voltage
power transistors
īŽ Discrete low-voltage
power transistors
īŽ Driver ICs
īŽ Control ICs
īŽ RF power transistors
īŽ Small-signal
components
īŽ CMOS RF switches
for antenna modules
īŽ MEMS and ASICs for
silicon microphones
īŽ Customized chips
(ASICs)
Chip Card & Security
(CCS)
īŽ Contact-based
security controller
īŽ Contactless security
controller
īŽ Dual-interface
security controller
(contact-based and
contactless)
Automotive
(ATV)
īŽ Microcontrollers
(8-bit, 16-bit, 32-bit)
for automotive and
industrial applications
īŽ Software development
platform DAVETM
īŽ Discrete power
semiconductors
īŽ IGBT modules
īŽ Voltage regulators
īŽ Power ICs
īŽ Bus interface devices
(CAN, LIN, FlexRay)
īŽ Magnetic sensors
īŽ Pressure sensors
īŽ Wireless transmit and
receive ICs (RF, radar)
Page 232014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
24. New Era:
Driving Demand for Power Semiconductors
īŽ Shift towards renewable energies
requires significantly more high-power
semiconductors per MW of power
generated.
'90 â '10
īŽ Electrification in cars with Internal
Combustion Engine as well as the trend
towards emobility drives the demand for
power semiconductors.
īŽ Higher efficiency in power conversion
reduces CO2 emission and total cost of
ownership.
īŽ Stronger demand for goods containing
power semiconductors due to increasing
standard of living in BRIC countries.
'10 â '30 Changes
Courtesy: Facebook
Courtesy: Tesla
Page 242014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
25. Automotive
Overview
Product Range
īŽ Sensors: pressure, magnetic, wireless
control ICs, radar
īŽ Microcontrollers: 8-bit, 16-bit, 32-bit
īŽ Power: MOSFETs, IGBTs, smart power ICs: voltage
regulators, bridges, driver ICs, CAN / LIN / FlexRayâĸ
transceiver*, DC-DC converters, power system ICs,
system-on chip, embedded power ICs
īŽ Hybrid & Electric Vehicle: HybridPACKâĸ modules,
Automotive Easy modules, gate driver ICs, MOSFETs,
IGBTs
Core Competencies/
Value Proposition
īŽ Automotive commitment: More than 40 years of
automotive system and application expertise
īŽ Complete automotive system provider
īŽ Hybrid and Electro mobility: industry leading
expertise and product portfolio
īŽ Functional Safety (ISO26262) and Security
enabling car solutions
īŽ Worldwide development, production and support
sites for automotive semiconductors
īŽ Next Level of Zero Defect: most comprehensive
quality program of the industry
Market Positions
īŽ No. 2 in Automotive semiconductors worldwide
īŽ No. 1 Europe
īŽ No. 1 Korea
īŽ No. 2 North America
īŽ No. 4 Japan
īŽ No. 1 in automotive power semiconductors
(21.3%)
Source: Strategy Analytics (April 2014)
* FlexRay is a trademark licensed by FlexRay Consortium GbR
Page 252014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
26. Market Trends
â Dwindling energy resources
â Urbanization
â Stricter CO2 emission legislations
â Growing environmental awareness
Infineon's Opportunities
īŽ Infineon components are key enabler for
car manufacturers to meet challenging
targets for CO2 emission reduction, e.g. in
the EU 95g CO2/km in 2020.
īŽ We offer Hybrid and electric drivetrain
products (HybridPACKâĸ).
īŽ No electric vehicle without semiconductors:
electric drive and control, battery
management, on-board battery charging
and power grid communication.
We Focus on Future Business
Making Cars Clean
Page 262014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
27. Easy
Modules
Target Applications for Electric Drive Train
Product Portfolio
10kW
20kW
30kW
40kW
50kW
60kW
70kW
80kW
Power
Aux Drives, Aux DC/DC, Charger
90kW
100kW
Inverter / Generator for
Mild Hybrids, Battery
Charger
Inverter / Generator for
Full Hybrids and Electric
Vehicles
Aux Drives, Aux DC&DC,
Charger
HybridPACKTM 2
HybridPACKTM 1
Pin-Fin
HybridPACKTM 1
Easy Modules
BareDie:IGBTs,Diodes,MOSFETs
DriverIC:IGBTs,MOSFETs
Discretesolutions:IGBTs,
Diodes,MOSFETs
Application Product Solutions
HybridPACKâĸ
Light
Page 272014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
28. Power module
BMW and Infineon: Working together to
shape the future of electro mobility
īŽ 75 semiconductors ensure a highly efficient electric drive in the
BMW i3, e.g. Microcontroller AUDO Future, IGBT Power Module
HybridPACKâĸ 2, EiceDRIVERâĸ Products, CoolMOSâĸ High
voltage MOSFETs.
īŽ Further components: airbag control, LED light modules,
steering locks, windshield wipers and seatbelt retractors.
Page 282014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
29. Industrial Power Control
Overview
īŽ No.1 in Discrete IGBTs with 19.4%
market share
īŽ No. 2 in IGBT modules with 20.3%
market share
Source: IHS Research, January 2014
Market Positions
Core Competencies/
Value Proposition
īŽ High quality products and services
īŽ Leading edge technology and IP portfolio
īŽ System expertise with broad application
competence
īŽ Strong worldwide presence with local sales and
application support
īŽ Dedicated account teams and distributors
Page 292014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
30. Power Components for Drive Control of
Train Systems
Infineon Parts
Metro TrainsHigh-Speed Trains
īŽ Power: 5 to 10MW per train
īŽ 80 to 120 IGBT modules
per train
īŽ Semiconductor content:
~ âŦ 100,000 per train
īŽ Power: 0.5 to 1MW per train
īŽ 25 to 50 IGBT modules
per train
īŽ Semiconductor content:
~ âŦ 10,000 per train
Page 302014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
31. Product Range
Market Positions
Power Management & Multimarket
Overview
īŽ Digital Control ICs, Drivers and Power Discretes for
Voltage Regulators
īŽ LED Drivers
īŽ RF Diodes and Transistors, RF Power
īŽ Chips for Silicon Microphones, TVS Diodes
īŽ ASIC design solutions for authentication and battery
management
īŽ Technology Leadership in Power & RF:
ī¯ Energy Efficiency
ī¯ Power Density, system size and weight reduction
ī¯ Connectivity and reliable, clean Data
Transmission for 50bn devices in 2020
īŽ Revolutionary Innovation made "easy to use"
ī¯ Application centric Innovation
ī¯ Integration competence: Power/RF, Digital
Power, Discretes, chip embedding
īŽ No. 1 in Power Discretes with 9.3% market share
(IHS: The World Market for Power Semiconductor Discretes & Modules â
Nov 2013)
īŽ No. 2 in Discrete MOSFETs with 12.7% market share
(IHS: The World Market for Power Semiconductor Discretes & Modules â
Nov 2013)
īŽ No. 2 in Chips for Silicon Microphones with 30%
market share
(IHS: MEMS Microphones Reportâ April 2014)
īŽ No. 3 in RF Power Devices with 15.7% market share
(ABI Research: RF Power Amplifiers â Dec 2012)
Core Competencies/
Value Proposition
Page 312014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
32. Power Components for Servers and
RF Devices for Cellular Infrastructure
Infineon Components
Cellular InfrastructureEnergy Efficient Server
īŽ Efficiency values of 95% and higher
īŽ Technology leadership in silicium and
silicumcarbide products
īŽ Highest power density enabling best
cost-performance ratios
īŽ Unique system solutions with
MOSFETs, power ICs and driver
products
īŽ Applicable for all standard frequencies
of 2G, 3G, 4G (450 MHz to 2.7 GHz)
īŽ Industry leading power efficiency for
LTE
īŽ Wide range of devices with power
levels from 4 â 700 W
īŽ Best-in-class thermal performance
Page 322014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
33. Social Networks and Cloud Computing Driving
Demand for Highest Efficient Power Supplies
īŽ Globally, we see one new data
center per week with up to 100
MW of power consumption
īŽ Efficiency of power supply (AC/DC,
DC/DC) of utmost importance.
īŽ DPM best solution for flexible load
dynamics
īŽ Change in value chain: servers no
longer from the shelf but designed
by ODMs according to specification
of data center operator
Digital Power Management (DPM) Gaining Traction in Server Market
īŽ DPM opens the door for bundling
with other products
īŽ Recent design win: Infineon offers
DPM controllers along with driver ICs
and MOSFETs to Taiwanese ODM
CoolMOSâĸ OptiMOSâĸ
Controller &
Driver IC
Page 332014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
34. Chip Card & Security
Overview
Product range
īŽ Contactless and contact-based security products
for Communication, Payment, Government ID,
Transport, Access, Object ID, Entertainment and
Platform Security
īŽ Extensive packaging and service portfolio
īŽ Innovative solutions from basic security RFID and
memories to high-end security controllers
(including the award winning SLE 78 family)
Market positions
īŽ No. 1 in the Microcontroller Smart Card IC market
with 24%1 market share in 2012 by revenue
īŽ Market leader in Payment2 with 33% market share
in 2012 in terms of volume
īŽ Market leader in Gov ID. Only IC provider shipping
to the ePass projects of the world's five biggest
countries. Providing chips for more than 70% of
National eID projects in Europe
īŽ Market leader in Embedded Digital Security (TPM
and Authentication) IC volumes with 58,4%3
Core competencies/
Value proposition
īŽ Tailored security: right level of security at the
best cost-performance ratio
īŽ Contactless excellence: focus on interoperability
and dual interface
īŽ Embedded control: right trade-off between
computing power, power consumption, level
of security and cost
Source: 1IMS Research, Okt 2013; 2IHS, Sep2013. 3IHS Okt 2013
Page 342014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
35. Security of electronic devices in connected systems:
Infineonâs OPTIGAâĸ Trust P Security Chip Solution
Infineon's OPTIGAâĸ embedded security chips
provide different levels of security for electronic
systems, ranging from complex IT-infrastructures
with many servers and computers to single
systems that consist of the device and the
suitable accessory, such as a MP3 player and
headphones.
īŽ IFX announced its programmable solution in
addition to the OPTIGA Trust family, providing
robust device authentication.
īŽ Any product that stores and exchanges
confidential data, whether used in smart homes
or factoriers, can rely on the encrypted
communications capability of OPTIGA Trust P
to enable information privacy. This helps to
defend from attackers trying to obtain personal
or company data or attempting to tamper with
programming through Internet connections or
machine-to-machine (M2M) communications
links.
īŽ The OPTIGA Trust P is a Common Criteria EAL
5+ (high) certified secure trust anchor that
addresses counterfeiting, privacy and security
concerns. It uses public key cryptography to
support both one-way and mutual authentication
for anticloning applications.
īŽ On-board key generation, key storage and
secure key exchange allow creation of a
secure communications channel and
encryption of transmitted data. This can
provide data privacy as well as the information
verification between senders and receivers.
Programmable solution provides robust authentification
Published on March 31, 2014
Page 352014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
36. Identity Protection on the Internet: Majority of
European States Trust Infineonâs Security Solutions
20 among the 35 countries worldwide that
have introduced eIDs with online function
are in Europe. More than 70 percent of
these European states trust in Infineonâs
security solutions.
īŽ Not only e-commerce is continuously
growing, online services from public
sector are also increasingly used
throughout Europe.
īŽ The eID with online function can serve
as the proof of identification when
opening a bank account, shopping online
or enrolling an insurance policy.
īŽ Infineonâs security chips such as the
SLE78 product family with the digital
security technology âIntegrity Guardâ
allow secured storage of the personal
data of eID card holders and thereby help
to protect the sovereign documents
effectively against counterfeit,
manipulation and fraud.
īŽ They offer state-of-the-art data
encryption mechanisms that make it
possible to protect the entire data flow
from sender to recipient from
unauthorized access by third parties.
EU promotes the implementation of online public services for all citizens by 2015
Published on January 23, 2014
Page 362014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
38. Package Technology Portfolio
1) for specialities only 2) phase-out
Through
Hole
ī§ TO, DIP
SMD
ī§ TO
ī§ DSO
ī§ SSOP
Leadless
ī§ ThinPAK
ī§ TDSON
ī§ TSDSON
ī§ CanPAKâĸ
ī§ TISON
ī§ WISON
ī§ IQFN
ī§ HSOF
High Power
Power
Modules
ī§ Easy
ī§ 34mm
ī§ 62mm
ī§ Econo
ī§ Econo-
PACKâĸ+
ī§ Prime-
PACKâĸ
ī§ IHM
ī§ IHV
ī§ Hybrid-
PACKâĸ
SMD leaded
ī§ SOT
ī§ SOD
ī§ TSOP
ī§ TSSOP
Flat lead
ī§ TSFP
ī§ SC
Leadless
ī§ TSLP
ī§ TSSLP
ī§ TSNP
Wafer level
ī§ WLP
ī§ WLL
Discretes
Power
Sensors
Through
Hole
ī§ PSSO
SMD
Leaded
ī§ DSOSP
Open
cavity
ī§ DSOF
Mold on LF
ī§ P-MCCx
Mold
ī§ P-Mx.x
Chip on
Flex
ī§ FTM
UV Globe
top
ī§ T-Mx.x
PRELAM
ī§ PPxx
Flip Chip
ī§ S-MFCx.x
ī§ S-COMx.x
Wafer
ī§ Bumped
ī§ Diced
Chip Card
Leadframe
based
Packages
Wafer Level
Packages,
Bare Die
Surface
Mount
Technology
(SMD)
Wafer Level
w/o
redistribution
ī§ WLP (fan-in)
w/redistribution
ī§ WLB (fan-in)
ī§ eWLB
(fan-out)
ī§ Blade
Bare Die
ī§Wirebond
ī§Flip chip
Through
Hole
ī§ DIP 2)
SMD
ī§ PLCC 2)
ī§ TSSOP
ī§ TQFP
ī§ LQFP
ī§ MQFP
Leadless
ī§ VQFN
ī§ WQFN
ī§ O-LQFN 1)
ī§ XSON
ī§ USON
PowerIC
Laminate
based
Packages
SMD
ī§ OCCN 1,2)
ī§ BGA
ī§ LBGA
ī§ xFBGA,
xFSGA
Page 382014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
39. Table of Contents
īŽ Market and Business Development Second Quarter FY 2014
īŽ Business Focus
īŽ Segments, Products and Technology
īŽ General Company Information
Page 392014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
40. Decisive Competitive Advantage:
Quality at Infineon
Our
aspiration
Our path
Our
standards
īŽ Preferred partner for our customers
īŽ Smooth production and delivery
īŽ We focus on stability and the
100 percent fulfillment of our
commitments
īŽ Integrated approach along the entire
value chain
īŽ Proactive Quality Management for
products and processes
īŽ International Standards, e.g.
TS16949, ISO 9001, IEC 17025
īŽ Specific customer requirements
Page 402014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
41. R&D Network in Europe
Warstein
Duisburg
Bristol
Augsburg
Munich,
Neubiberg
Padua Villach
Graz
Regensburg
Dresden
Bucharest
Linz
Page 412014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
42. Worldwide R&D Network
(Excluding Europe)
Malacca
Kulim
Beijing
Morgan Hill
Seoul
Shanghai
Bangalore
Torrance
Singapore
Page 422014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
43. Worldwide Manufacturing Sites
Frontend and Backend
Frontend Backend
Morgan Hill Dresden Beijing WuxiKulim
Batam
Warstein
Regensburg Villach CeglÊd Malacca
Singapore
Page 432014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
44. Sales Offices in Europe
Moscow
Stockholm,
Kista
Dublin
Bristol
Saint Denis Madrid Toulouse Milan
Zurich
Vienna
Erlangen
Stuttgart,
Ditzingen
Munich,
Neubiberg
HanoverWarsteinDuisburgRotterdam
Nuremberg
Espoo
MarseilleGroÃostheim
Page 442014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
45. Sales Offices Worldwide (Excluding Europe)
SÃŖo Paulo
Kokomo
Livonia Bangalore Seoul
Singapore
Lebanon
Beijing
Milpitas
Melbourne,
Blackburn
Osaka
Shenzhen
Taipei
Tokyo
Nagoya
Hong KongShanghai
Page 452014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
46. Corporate Social Responsibility:
Our Commitment
United Nations Global Compact
10 Principles
Human Rights
Principle 1: support and respect the protection of internationally proclaimed
human rights
Principle 2: make sure they are not complicit in human rights abuses
Labor
Principle 3: uphold the freedom of association and the effective recognition of
the right to collective bargaining
Principle 4: uphold the elimination of all forms of forced and compulsory labor
Principle 5: uphold the effective abolition of child labor
Principle 6: uphold the elimination of discrimination in respect of employment
and occupation
Environment
Principle 7: support a precautionary approach to environmental challenges
Principle 8: undertake initiatives to promote greater environmental responsibility
Principle 9: encourage the development and diffusion of environmentally friendly
technologies
Anti-Corruption
Principle 10: work against corruption in all its forms, including extortion and
bribery
Page 462014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
47. Corporate Social Responsibility:
Our Understanding
Corporate
Social
Responsibility
at Infineon
Citizenship
Activities
Business
Ethics
Occupational
Health and
Safety
Environ-
mental
Sustain-
abilityHuman
Resources
Management,
Human
Rights
CSR Supply
Chain
Management
CSR at Infineon comprises our voluntary commitment and
contributions in the areas:
Page 472014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
48. Corporate Social Responsibility:
Successful CSR Approach
Continuous
CSR
Approach
FTSE4 Good
Index
UN
Global
Compact
Infineon
IMPRES*)
since
2004
since
2005
since
2001
Company Foundation
Worldwide certified environmental
management system according to
ISO 14001
Dow Jones
Sustainability
Index
since
2010
since
2011
2013
oekom
classification
as âPrimeâ
since
2012
īŽ According to
RobecoSAM,
Infineon is among
the top 15% most
sustainable
companies
worldwide and
therefore listed in
the Sustainability
Yearbook
īŽ RobecoSAM
âRunners-upâ
Award (2013)
Energy
Management
System,
integrated in
IMPRES *)
Sustainability
Yearbook
2013
*) Infineon Integrated Management Program for Environment, Energy, Safety and Health (Energy since 2012)
Page 482014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
49. Based on our efforts for resources management, safety and health
standards, Infineon received the EN ISO 14001, OHSAS 18001 and
ISO 50001* multi-site certification.
Certifications
Corporate Social Responsibility:
Environmental Sustainability
īŽ We consume 33% less water to manufacture
one cm² wafer than the global average1).
īŽ We consume 42% less electricity to
manufacture one cm² wafer than the global
average1).
īŽ We generate 50% less waste to manufacture
one cm² wafer than the global average1).
* ISO 50001 in major EU sites
1) According to "World Semiconductor Councilâ
Page 492014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
50. Our CO2 Balance: Emission Reduction
Enabled by Our Products and Solutions
CO2 savings2)
More than
15.8
million
tons
CO2 burden1)
1.2
million
tons
Ratio
1:13
Net ecological benefit :
more than 14.6 million tons of CO2 emission reduction
1) including manufacturing, transport, material, chemistry, emissions, water, waste and waste water, energy
consumption; values are based on internal figures as well as official data for one year.
2) considering only automotive products, lighting, PC power supply, regenerative energy production (photovoltaic, wind)
and drives, calculation based on average lifetime and Infineon market-share.
Page 502014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.
51. Business Continuity
ISO 27001 BS 25999
ISO 14001 OHSAS 18001
ISO 50001
Integrated Business Continuity
Management
Loss & Fraud
Investigations
Real Estate
& Facility
Management
Business &
Operations
Support
Environmental
Affairs,
Sustainability &
Energy
Management
Information
Security &
IT Security
Management
Corporate
Social
Responsibility
Export
Compliance
Business
Continuity
Planning
Security &
Crisis
Management
Asset
Protection
Page 512014-04-29 Copyright Š Infineon Technologies AG 2014. All rights reserved.