5. Technical investments Laser vias filling line Router with CCD camera and Z axis control Drilling (OIR & 300KT/MN) LDI (Paragon 8W) Laser plotter (LP5008) DES line AOI & AOR (Automatic Optical Repair) Electroless nickel-gold line 2009 2008 2007
14. Main technology in the case of “large” BGA’s (number of balls from 800 to 1800) Main markets : Avionics, Military, Industriel, “big” computers Evolutions : high number of layers (+ 40% in 4 years) Base copper thickness of 35µ (Low voltage ; “differential” signals) Controlled impedances “ Sequential” boards
15. High Density PCB’s Designs & examples for HDI boards (Advanced technology)
16. High Density PCB’s The packaging “orientation” is mainly due to : - the market segment (”consumer” vs “professional”...) - the BGA pitch - the “matrix” size (number of balls) - the electrical constraints (impedance, signal quality ...) - the assembly constraints (thermal shocks, finishes ...)
19. High Density PCB’s Example Thru holes drilled at 0.25 mm Laser holes drilled at 0.1 mm 100 µ lines Thickness : 1 mm BGA pitch 0.5 mm External Layer Internal Layer
23. High Density PCB’s Main packaging when BGA pitch =< 0.5 mm Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...) Future : high packages matrix (more balls) stacked vias Less total plated thru holes thinner lines & spacing
24. High Density PCB’s Advanced technology for Specific Needs (close to silicon devices)
26. High Density PCB’s BGA at 0.5 mm pitch : one line between 2 pads sequential board Drilled holes at 150µ 60 µ lines
27. High Density PCB’s Double sided board : - Flip-chip at 250 µ pitch - 165 µ pad - Drilling at 100 µ - Base material : Hitachi 679F 100µ 200µ Cuivre Nickel-Or chimique